Support components, probe station and wafer transfer device

Abstract

This utility model discloses a support assembly, a probe station, and a wafer transfer device. The support assembly includes a support fixture with a support surface for adsorbing a blue film attached to the wafer. The support fixture is adapted to be detachably fixed to the probe base of the probe station and to be detachably fixed to the transfer bracket of the wafer transfer device. According to the support assembly of this utility model, the precision of the probe station does not need to be set too high, reducing the manufacturing difficulty of the probe station, lowering the production cost of the probe station, and reducing the wafer testing cost. It also allows the probe station to be used for testing wafers of different thicknesses, improving its applicability. Simultaneously, it effectively reduces the risk of wafer breakage during transfer, effectively ensuring the integrity of the wafer during transfer, improving the safety of the wafer transfer process, and enhancing the reliability of the wafer transfer device.

Description

Technical Field

[0001] This utility model relates to the field of wafer testing technology, and in particular to a support component, probe station and wafer transfer device. Background Technology

[0002] In the field of wafer testing, the performance specifications of probe stations vary depending on the wafer thickness. For thin wafers less than 150µm thick, the thinness and high material hardness of the wafer increase the risk of fragmentation during testing and handling. Therefore, specialized probe stations are required for thin wafer testing to ensure proper wafer movement and testing within the station, minimizing fragmentation. However, the specific nature of the products limits the versatility of the testing equipment, and the high cost of these equipment results in high testing costs. Utility Model Content

[0003] This invention aims to at least solve one of the technical problems existing in the prior art. Therefore, one objective of this invention is to provide a support component that allows for a less demanding precision setting on the probe station, reducing the manufacturing difficulty and production cost of the probe station, lowering wafer testing costs, enabling the probe station to be used for testing wafers of different thicknesses, improving its applicability, and simultaneously effectively reducing the risk of wafer breakage during transfer, ensuring wafer integrity during transfer, improving the safety of wafer transfer, and enhancing the reliability of the wafer transfer device.

[0004] This invention also proposes a probe station having the above-mentioned support components.

[0005] This invention also proposes a wafer transfer device having the aforementioned support components.

[0006] According to a first aspect of the present invention, a support assembly is used to support a wafer. The support assembly includes: a support fixture having a support surface for adsorbing a blue film connected to the wafer; the support fixture is adapted to be detachably fixed to a probe base of a probe station; and the support fixture is adapted to be detachably fixed to a transfer bracket of a wafer transfer device.

[0007] According to the support assembly of this utility model, by setting a support surface on the support fixture to adsorb the blue film connected to the wafer, and setting the support fixture to be detachably fixed to the probe base of the probe station, when it is necessary to use the probe station to perform parameter testing on the wafer, the blue film can be first connected to the wafer, then the side of the blue film facing away from the wafer can be connected to the support surface, and then the support fixture can be connected to the probe base to perform parameter testing on the wafer. This completes the parameter testing of the wafer by the probe station, so that the accuracy of the probe station does not need to be set too high, reducing the manufacturing process difficulty of the probe station, reducing the production cost of the probe station, and reducing the cost of wafer testing. The reduced cost of wafer testing allows the probe station to be used for testing wafers of different thicknesses, improving its applicability. Simultaneously, by detachably fixing the support fixture to the transfer bracket of the wafer transfer device, the transfer bracket connects to and drives the support fixture, indirectly driving the wafer transfer. This avoids the problem of uneven wafer stress caused by the transfer bracket directly applying force to the wafer during transfer, effectively reducing the risk of wafer breakage during transfer, ensuring wafer integrity, improving wafer transfer safety, and enhancing the reliability of the wafer transfer device.

[0008] According to some embodiments of the present invention, the supporting fixture further has a vacuum surface, which is adjacent to or opposite to the supporting surface. The supporting surface has a first opening, and the vacuum surface has a second opening. The supporting fixture also has an adsorption channel that connects the first opening and the second opening.

[0009] In some embodiments of this utility model, there are multiple first openings, and the multiple first openings are arranged at intervals on the supporting surface.

[0010] In some embodiments of this utility model, a plurality of the first openings are arranged in a star-shaped pattern on the supporting surface.

[0011] In some embodiments of this utility model, the diameter of the first opening is less than or equal to 0.5 mm.

[0012] In some other embodiments of this utility model, the support assembly further includes a vacuum pump, which is connected to the second opening to extract air between the support surface and the blue film.

[0013] In some other embodiments of this utility model, there are multiple first openings, and the adsorption channel includes a first channel, a second channel, and a confluence cavity. The number of first channels is the same as the number of first openings and they correspond one-to-one. Each first channel connects the confluence cavity to the corresponding first opening, and the second channel connects the confluence cavity to the second opening.

[0014] According to some embodiments of the present invention, the support component further includes: a blue film, which is adsorbed onto the support surface and is adapted to be connected to the wafer.

[0015] According to some other embodiments of the present invention, the support assembly further includes: a fixing ring, which is detachably connected to the support surface to press the blue film when fixed to the support surface, and the wafer is adapted to be placed in the annular hole of the fixing ring.

[0016] A probe station according to a second aspect of the present invention includes: a probe base; and a support assembly according to the first aspect of the present invention, wherein the support assembly is detachably connected to the probe base.

[0017] According to the probe station of this utility model, by setting the above-mentioned support component, when it is necessary to use the probe station to perform parameter testing on the wafer, the blue film can be first connected to the wafer, then the surface of the blue film facing away from the wafer can be connected to the support surface, and then the support fixture can be connected to the probe base to perform parameter testing on the wafer. This completes the parameter testing of the wafer by the probe station, so that the accuracy of the probe station does not need to be set too high, reducing the manufacturing process difficulty of the probe station, reducing the production cost of the probe station, reducing the wafer testing cost, and making the probe station applicable to wafer testing of different thicknesses, thus improving the applicability of the probe station.

[0018] A wafer transfer apparatus according to a third aspect of the present invention includes: a support component according to the first aspect of the present invention described above; and a transfer component including a transfer track and a transfer bracket, wherein the transfer bracket is movably disposed on the transfer track and is used to connect with the support fixture to drive the support component to move, thereby moving the support component to the probe base of the probe station and to the processing station.

[0019] According to the wafer transfer device of this utility model, by setting the above-mentioned support component, the transfer bracket can be connected to the support fixture and drive the support fixture, thereby indirectly driving the wafer transfer. In this way, the problem of uneven force on the wafer caused by the transfer bracket directly applying force to the wafer during the transfer process is avoided, effectively reducing the risk of wafer breakage during the transfer process, effectively ensuring the integrity of the wafer during the transfer process, improving the safety of the wafer transfer process, and improving the reliability of the wafer transfer device.

[0020] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0021] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0022] Figure 1 This is a perspective view of a support component according to some embodiments of the present invention, wherein a wafer is placed on a blue film;

[0023] Figure 2 yes Figure 1 Top view of the supporting components in the middle;

[0024] Figure 3 yes Figure 2 Sectional view along line AA;

[0025] Figure 4 yes Figure 1 A three-dimensional view of the support fixture in the middle;

[0026] Figure 5 yes Figure 4 Top view of the supporting fixture in the middle;

[0027] Figure 6 yes Figure 5 Sectional view along line BB;

[0028] Figure 7 This is a schematic diagram of the probe station and transfer assembly assembled according to some embodiments of the present invention;

[0029] Figure 8 yes Figure 7 A schematic diagram from another perspective when the probe station and transfer assembly are assembled;

[0030] Figure 9 yes Figure 7 Another perspective of the diagram showing the probe station and transfer assembly assembled together;

[0031] Figure 10 yes Figure 9 A side view of the probe station and transfer assembly assembled together.

[0032] Figure label:

[0033] 10. Supporting components;

[0034] 1. Support fixture; 11. Support surface; 12. Vacuuming surface; 13. First opening; 14. Second opening; 15. Adsorption channel; 151. First channel; 152. Second channel; 153. Combination cavity;

[0035] 2. Blue membrane;

[0036] 3. Fixing ring;

[0037] 40. Probe station; 41. Probe base;

[0038] 50. Transfer assembly; 51. Transfer track; 52. Transfer bracket;

[0039] 60. Wafer. Detailed Implementation

[0040] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0041] The support component 10 according to an embodiment of the present invention is described below with reference to the accompanying drawings.

[0042] Reference Figures 1-6 According to a first aspect embodiment of the present invention, a support assembly 10 is used to support a wafer 60. The support assembly 10 includes a support fixture 1, which has a support surface 11 for adsorbing a blue film 2 connected to the wafer 60. It should be understood that, in order to ensure that the blue film 2 can be reliably adsorbed on the support surface 11, the flatness of the support surface 11 is less than or equal to 10 μm to meet the flatness requirements for wafer 60 testing. Specifically, the flatness of the support surface 11 can be 10 μm, 9 μm, 8 μm, 7 μm, 6 μm, 5 μm, 4 μm, 3 μm, 2 μm, or 1 μm.

[0043] The support fixture 1 is adapted to be detachably fixed to the probe base 41 of the probe station 40. For example, the support fixture 1 can be detachably connected to the probe base 41 by a snap-fit ​​structure, or the support fixture 1 can be detachably fixed to the probe base 41 by vacuum adsorption.

[0044] Furthermore, the support fixture 1 is adapted to be detachably fixed to the transfer bracket 52 of the wafer transfer device. For example, the support fixture 1 can be detachably connected to the transfer bracket 52 by a snap-fit ​​structure, or the support fixture 1 can be detachably fixed to the transfer bracket 52 by vacuum adsorption.

[0045] When it is necessary to perform parameter testing on wafer 60, the blue film 2 can be connected to wafer 60 first, then the side of the blue film 2 facing away from wafer 60 can be connected to the support surface 11, and then the support fixture 1 can be connected to the probe stage 41 to perform parameter testing on wafer 60, thus completing the parameter testing of wafer 60 by probe stage 40.

[0046] This configuration allows for parameter testing of the thin wafer 60 by adding a support component 10 to a standard testing machine. This makes the standard testing machine suitable for testing the thin wafer 60, improving its applicability and reducing testing costs. Specifically, by using the aforementioned support fixture 1, the precision of the probe station 41 does not need to be set too high, reducing the manufacturing difficulty and production cost of the probe station 41. This, in turn, lowers the cost of testing the probe station 41 and the wafer 60, making the probe station 40 suitable for testing wafers of different thicknesses and improving its applicability.

[0047] When transferring the wafer 60 using the wafer transfer device (such as when transferring the wafer 60 to the probe stage 41, when removing the wafer 60 from the probe stage 41, and during the transfer of the wafer 60 between processing steps), the wafer 60 can first be connected to the blue film 2 and the blue film 2 can be attached to the support fixture 1. Then, by connecting the transfer bracket 52 to the support fixture 1, the transfer bracket 52 drives the support fixture 1 to move, and the wafer 60 is moved to the preset position by moving the support fixture 1.

[0048] Compared to the existing technology that uses a transfer bracket 52 to vacuum-adsorb the wafer 60 for transfer, this invention uses the transfer bracket 52 to connect to and drive the support fixture 1 during the transfer of the wafer 60, thereby indirectly driving the transfer of the wafer 60. During the transfer process, the problem of uneven force on the wafer 60 caused by the transfer bracket 52 directly applying force to the wafer 60 can be avoided, effectively reducing the risk of wafer 60 breakage during the transfer process, effectively ensuring the integrity of the wafer 60 during the transfer process, improving the safety of the wafer 60 transfer process, and improving the reliability of the wafer transfer device.

[0049] For example, the support fixture 1 can be made of metal to ensure its structural strength, reduce deformation when it is connected to the moving support and the probe base 41, and reliably ensure the flatness of the support surface 11, thereby effectively reducing the risk of wafer 60 breakage. Specifically, the support fixture 1 can be made of iron, copper, aluminum, or their alloys.

[0050] According to the support assembly 10 of this utility model, by setting a support surface 11 on the support fixture 1 to adsorb the blue film 2 connected to the wafer 60, and setting the support fixture 1 to be detachably fixed on the probe base 41 of the probe station 40, when it is necessary to use the probe station 40 to perform parameter testing on the wafer 60, the blue film 2 can be first connected to the wafer 60, then the side surface of the blue film 2 facing away from the wafer 60 can be connected to the support surface 11, and then the support fixture 1 can be connected to the probe base 41 to perform parameter testing on the wafer 60. This completes the parameter testing of the wafer 60 by the probe station 40, so that the accuracy of the probe station 40 does not need to be set too high, reducing the manufacturing process difficulty of the probe station 40 and reducing the production cost of the probe station 40. This reduces the testing cost of wafer 60 and allows probe station 40 to be used for testing wafers 60 of different thicknesses, improving the applicability of probe station 40. At the same time, by setting the support fixture 1 to be detachably fixed to the transfer bracket 52 of the wafer transfer device, the transfer bracket 52 can be used to connect to and drive the support fixture 1, indirectly driving the transfer of wafer 60. This avoids the problem of uneven force on wafer 60 caused by the transfer bracket 52 directly applying force to wafer 60 during the transfer process, effectively reducing the risk of wafer 60 breakage during the transfer process, effectively ensuring the integrity of wafer 60 during the transfer process, improving the safety of wafer 60 transfer process, and improving the reliability of wafer transfer device.

[0051] Reference Figures 3-6 According to some embodiments of the present invention, the supporting fixture 1 also has a vacuum surface 12, which is adjacent to the supporting surface 11 or opposite to the supporting surface 11. The supporting surface 11 is provided with a first opening 13, and the vacuum surface 12 is provided with a second opening 14. The supporting fixture 1 is also provided with an adsorption channel 15, which connects the first opening 13 and the second opening 14.

[0052] When the blue film 2 is attached to the support surface 11, the air between the blue film 2 and the support surface 11 can be discharged through the adsorption channel 15, reducing or preventing air bubbles between the blue film 2 and the support surface 11. This effectively ensures the flatness of the blue film 2 when it is attached to the support surface 11, reduces the risk of wafer 60 cracking due to air bubbles between the blue film 2 and the support surface 11, effectively ensures the integrity of the wafer 60, and improves the reliability of the support assembly 10.

[0053] In some other embodiments of this invention, the support assembly 10 further includes a vacuum pump, which communicates with the second opening 14 to extract air between the support surface 11 and the blue film 2. For example, the vacuum pump can be a vacuum pump. Specifically, when the support assembly 10 is applied to the probe station 40, the vacuum pump can be a vacuum pump in the probe station 40; when the support assembly 10 is applied to the wafer transfer device 60, the vacuum pump can be a vacuum pump in the wafer transfer device 60.

[0054] This allows the vacuum pump to actively remove air between the support surface 11 and the blue film 2, reliably eliminating air bubbles between the blue film 2 and the support surface 11. This more effectively ensures the flatness of the blue film 2 when it is attached to the support surface 11, reduces the risk of wafer 60 cracking due to air bubbles between the blue film 2 and the support surface 11, effectively ensures the integrity of the wafer 60, and improves the reliability of the support assembly 10.

[0055] Reference Figures 3-6 In some embodiments of this utility model, there are multiple first openings 13, which are arranged at intervals on the supporting surface 11. This can more effectively reduce air bubbles between the blue film 2 and the supporting surface 11 or avoid the generation of air bubbles between the blue film 2 and the supporting surface 11, thereby reliably ensuring the flatness of the blue film 2 when it is attached to the supporting surface 11.

[0056] It should be explained that in this utility model, "multiple" refers to two or more.

[0057] Reference Figure 4 and Figure 5 In some embodiments of this utility model, multiple first openings 13 are arranged in a star-shaped pattern on the supporting surface 11. When the air between the supporting surface 11 and the blue film 2 is extracted using a vacuum pump, this makes the adsorption force of the blue film 2 more evenly distributed, more reliably eliminating air bubbles between the blue film 2 and the supporting surface 11, effectively avoiding the risk of wrinkles caused by excessive local adsorption force, and ensuring that the blue film 2 can be reliably adsorbed onto the supporting surface 11, thus more effectively guaranteeing the flatness of the blue film 2 when it is attached to the supporting surface 11.

[0058] Reference Figure 5In some embodiments of this utility model, the diameter R of the first opening 13 is less than or equal to 0.5 mm. For example, the diameter R of the first opening 13 can be 0.5 mm, 0.49 mm, 0.48 mm, 0.47 mm, 0.46 mm, 0.45 mm, 0.44 mm, 0.43 mm, 0.42 mm, 0.41 mm, 0.4 mm, 0.39 mm, 0.38 mm, 0.37 mm, 0.36 mm, 0.35 mm, 0.34 mm, 0.33 mm, 0.32 mm, 0. 31mm, 0.3mm, 0.29mm, 0.28mm, 0.27mm, 0.26mm, 0.25mm, 0.24mm, 0.23mm, 0.22mm, 0.21mm, 0.2mm, 0.19mm, 0.18mm, 0.17mm, 0.16mm, 0.15mm, 0.14mm, 0.13mm, 0.12mm, 0.11mm, 0.1mm.

[0059] When the wafer 60 is subjected to force at the position corresponding to the first opening 13, this allows the supporting surface 11 to reliably support the wafer 60, reducing the magnitude of deformation of the wafer 60 under force, reducing the risk of the wafer 60 breaking due to excessive deformation caused by the diameter R of the first opening 13 being too large, and improving the reliability of the supporting fixture 1.

[0060] Reference Figure 3 and Figure 6 In some other embodiments of this utility model, there are multiple first openings 13, and the adsorption channel 15 includes a first channel 151, a second channel 152, and a confluence cavity 153. The number of first channels 151 is the same as the number of first openings 13 and corresponds one-to-one. Each first channel 151 connects the confluence cavity 153 to the corresponding first opening 13, and the second channel 152 connects the confluence cavity 153 to the second opening 14. In this way, a vacuuming effect can be achieved at multiple first openings 13 by connecting a vacuuming component to the second opening 14.

[0061] Reference Figures 1-3 According to some embodiments of this utility model, the support component 10 further includes a blue film 2, which is adsorbed onto the support surface 11 and is adapted to be connected to the wafer 60. In this way, the wafer 60 can be connected and fixed to the support surface 11 through the blue film 2, ensuring the accuracy and safety of the wafer 60 dicing process.

[0062] Reference Figures 1-3According to some other embodiments of the present invention, the support assembly 10 further includes a fixing ring 3, which is detachably connected to the support surface 11. The fixing ring 3 can press the blue film 2 when fixed to the support surface 11, and the wafer 60 is adapted to be placed in the annular hole of the fixing ring 3. For example, the fixing ring 3 can be connected to the support fixture 1 by a snap-fit ​​structure, or the fixing ring 3 can be connected to the support fixture 1 by fasteners.

[0063] By setting a fixing ring 3 to press the blue film 2, the blue film 2 can always be kept under tension, so that the blue film 2 can fit tightly when covering the wafer 60, reducing the risk of defects such as wrinkles and bubbles between the blue film 2 and the wafer 60. This also allows the blue film 2 to fit tightly on the support surface 11, greatly improving the flatness and uniformity of the film application and effectively ensuring the safety of the wafer 60.

[0064] Reference Figures 7-10 According to a second aspect embodiment of the present invention, the probe station 40 includes a probe base 41 and a support assembly 10 according to the first aspect embodiment of the present invention, wherein the support assembly 10 is detachably connected to the probe base 41. For example, the support fixture 1 can be detachably connected to the probe base 41 by a snap-fit ​​structure, or the support fixture 1 can be detachably fixed to the probe base 41 by vacuum adsorption.

[0065] When it is necessary to perform parameter testing on wafer 60, the blue film 2 can be connected to wafer 60 first, then the side of the blue film 2 facing away from wafer 60 can be connected to the support surface 11, and then the support fixture 1 can be connected to the probe stage 41 to perform parameter testing on wafer 60, thus completing the parameter testing of wafer 60 by probe stage 40.

[0066] This configuration allows for parameter testing of the thin wafer 60 by adding a support component 10 to a standard testing machine. This makes the standard testing machine suitable for testing the thin wafer 60, improving its applicability and reducing testing costs. Specifically, by using the aforementioned support fixture 1, the precision of the probe station 41 does not need to be set too high, reducing the manufacturing difficulty and production cost of the probe station 41. This, in turn, lowers the cost of testing the probe station 41 and the wafer 60, making the probe station 40 suitable for testing wafers of different thicknesses and improving its applicability.

[0067] For example, a probe station 40 can be configured with multiple support components 10. When performing batch testing on wafers 60, after one wafer 60 is tested, its corresponding support component 10 can be removed from the probe station 41 to move the wafer 60 to a preset position (such as the wafer 60 processing station or the wafer 60 storage station). This allows the next wafer 60 to be tested to be mounted on the probe station 41 under the action of its corresponding support component 10. This ensures that the completed wafer 60 does not need to be removed from its corresponding support component 10 to place the next wafer 60 to be tested, effectively guaranteeing the safety of the wafer 60 testing process.

[0068] According to the probe station 40 of this utility model, by setting the aforementioned support component 10, when it is necessary to use the probe station 40 to perform parameter testing on the wafer 60, the blue film 2 can be first connected to the wafer 60, then the side of the blue film 2 facing away from the wafer 60 can be connected to the support surface 11, and then the support fixture 1 can be connected to the probe base 41 to perform parameter testing on the wafer 60. This completes the parameter testing of the wafer 60 by the probe station 40, so that the accuracy of the probe station 40 does not need to be set too high, reducing the manufacturing process difficulty of the probe station 40, reducing the production cost of the probe station 40, reducing the testing cost of the wafer 60, and making the probe station 40 applicable to testing wafers 60 of different thicknesses, thus improving the applicability of the probe station 40.

[0069] A wafer transfer apparatus according to a third aspect embodiment of the present invention includes: a support assembly 10 and a transfer assembly 50 according to the first aspect embodiment of the present invention, with reference to... Figures 7-10 The transfer assembly 50 includes a transfer track 51 and a transfer bracket 52. The transfer bracket 52 is movably mounted on the transfer track 51 and is used to connect with the support fixture 1 to drive the support assembly 10 to move it onto the probe base 41 of the probe station 40 and to the processing station. For example, the transfer track 51 can pass through the mounting position of the probe base 41 and the processing station of the wafer 60.

[0070] For example, refer to Figures 7-10 The transfer support 52 may include a slider, a lifting structure and a support arm. The slider is disposed on the transfer track 51 and can slide along the extension direction of the transfer track 51. The lifting structure is connected between the support arm and the slider to drive the support arm to rise and fall relative to the slider. The support arm is rotatably disposed on the lifting structure so that the transfer support 52 can expand its working range through the lifting movement of the lifting structure and the rotation movement of the support arm.

[0071] After the probe station 40 completes the parameter testing process on the wafer 60, it can be moved to the next process station by the transfer bracket 52 to carry out the testing and processing of the next process station. This effectively ensures the integrity of the wafer 60 during the inter-process transfer process, reduces the risk of wafer 60 breakage during the transfer process, improves the safety of the wafer 60 transfer process, and improves the reliability of the wafer transfer device.

[0072] When transferring the wafer 60 using the wafer transfer device (such as when transferring the wafer 60 to the probe stage 41, when removing the wafer 60 from the probe stage 41, and during the transfer of the wafer 60 between processing steps), the wafer 60 can first be connected to the blue film 2 and the blue film 2 can be attached to the support fixture 1. Then, by connecting the transfer bracket 52 to the support fixture 1, the transfer bracket 52 drives the support fixture 1 to move, and the wafer 60 is moved to the preset position by moving the support fixture 1.

[0073] Compared to the existing technology that uses a transfer bracket 52 to vacuum-adsorb the wafer 60 for transfer, this invention uses the transfer bracket 52 to connect to and drive the support fixture 1 during the transfer of the wafer 60, thereby indirectly driving the transfer of the wafer 60. During the transfer process, the problem of uneven force on the wafer 60 caused by the transfer bracket 52 directly applying force to the wafer 60 can be avoided, effectively reducing the risk of wafer 60 breakage during the transfer process, effectively ensuring the integrity of the wafer 60 during the transfer process, improving the safety of the wafer 60 transfer process, and improving the reliability of the wafer transfer device.

[0074] According to the wafer transfer device of this utility model, by setting the aforementioned support component 10, the transfer bracket 52 can be connected to the support fixture 1 and drive the support fixture 1, thereby indirectly driving the wafer 60 to transfer. This avoids the problem of uneven force on the wafer 60 caused by the transfer bracket 52 directly applying force to the wafer 60 during the transfer process, effectively reducing the risk of the wafer 60 breaking during the transfer process, effectively ensuring the integrity of the wafer 60 during the transfer process, improving the safety of the wafer 60 during the transfer process, and improving the reliability of the wafer transfer device.

[0075] In the description of this utility model, it should be understood that relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0076] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0077] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0078] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A support assembly for supporting a wafer, comprising: include: A support fixture having a support surface for adsorbing a blue film connected to the wafer, the support fixture being adapted to be detachably fixed to a probe base of a probe station, and the support fixture being adapted to be detachably fixed to a transfer bracket of a wafer transfer device.

2. The bolster assembly of claim 1, wherein, The support fixture also has a vacuum surface, which is adjacent to or opposite to the support surface. The support surface has a first opening, and the vacuum surface has a second opening. The support fixture also has an adsorption channel that connects the first opening and the second opening.

3. The bolster assembly of claim 2, wherein, There are multiple first openings, and the multiple first openings are arranged at intervals on the supporting surface.

4. The bolster assembly of claim 2, wherein, The diameter of the first opening is less than or equal to 0.5 mm.

5. The bolster assembly of claim 2, wherein, Also includes: A vacuum pumping component, which is connected to the second opening, is used to extract air between the supporting surface and the blue film.

6. The bolster assembly of claim 5, wherein, The first opening is multiple, and the adsorption channel includes a first channel, a second channel and a confluence cavity. The number of the first channels is the same as the number of the first openings and they correspond one-to-one. Each first channel connects the confluence cavity and the corresponding first opening, and the second channel connects the confluence cavity and the second opening.

7. The bolster assembly of claim 1, wherein, Also includes: The blue film is adsorbed onto the support surface and is suitable for connection with the wafer.

8. The bolster assembly of any one of claims 1-7, wherein, Also includes: A retaining ring, detachably connected to the support surface, is provided to press the blue film when fixed to the support surface, and the wafer is adapted to be placed in the annular hole of the retaining ring.

9. A probe station characterized by include: Detection base; The support assembly according to any one of claims 1-8 is detachably connected to the probe base.

10. A wafer transfer device, comprising: include: Support component according to any one of claims 1-8; The transfer assembly includes a transfer track and a transfer bracket, the transfer bracket being movably disposed on the transfer track and connected to the support fixture to drive the support assembly to move the support assembly to the probe base of the probe station and to the processing station.

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