A surface mount switch

Abstract

This utility model discloses a surface mount switch, including a switch body. At least two fixing posts are provided at the bottom of the switch body, which are used to mechanically fix the switch to a pre-drilled hole on a PCB board. The bottom of the switch body also has leads, which are bent and have a copper foil layer on the bent section. The copper foil layer is used to form a current loop with the PCB board during reflow soldering. By setting the fixing posts, this application effectively solves the problem of positional shifting and wobbling that commonly occurs in conventional switches during SMT placement, ensuring the stability and positioning accuracy of the switch during the placement process. The bent design of the leads and the copper foil layer on the bent section are compatible with reflow soldering processes, enhancing the reliability of the electrical connection between the switch and the PCB board and reducing the occurrence of poor contact. This surface mount switch is well-suited to the characteristics of SMT processes and meets the high performance requirements of modern electronic devices.

Description

Technical Field

[0001] This utility model relates to the technical field of electronic components, and in particular to a surface mount switch. Background Technology

[0002] With the rapid development of electronic technology, SMT (Surface Mount Technology) has been widely used in the electronics manufacturing industry due to its advantages such as high assembly density, small size and light weight of electronic products, high reliability and strong vibration resistance. Switches, as an indispensable electronic component in electronic devices, also need to adapt to the requirements of SMT technology.

[0003] However, due to the limitations of their structural design, conventional switches are prone to positional misalignment and wobbling during SMT placement, leading to reduced placement accuracy and affecting product quality. Furthermore, the bottom terminal design of conventional switches is unsuitable for reflow soldering processes, resulting in poor electrical connection reliability between the switch and the PCB board, easily causing contact problems and failing to meet the high performance requirements of modern electronic devices. Utility Model Content

[0004] This invention aims to at least partially solve one of the problems in related technologies. Therefore, one objective of this invention is to provide a surface mount switch that adapts to the characteristics of SMT processes, improving fixation stability, positioning accuracy, and electrical connection reliability.

[0005] A surface mount switch includes a switch body, at least two fixing posts at the bottom of the switch body for mechanical fixing by engaging with pre-drilled holes on a PCB board on which the surface mount switch is mounted; the bottom of the switch body has pins, which are bent and have a copper foil layer on the bent section, which is used to reflow solder with the PCB board to form a current loop.

[0006] Furthermore, there are two fixing posts, which are symmetrically arranged on both sides of the bottom of the switch body.

[0007] Furthermore, the height of the fixing column is 1mm-3mm.

[0008] Furthermore, the bending angle of the pin is 88°-95°.

[0009] Furthermore, the thickness of the copper foil layer is 0.05mm-0.1mm.

[0010] Furthermore, the fixing post is made of insulating material.

[0011] Furthermore, the cross-sectional shape of the fixed column is circular, square, or polygonal.

[0012] Furthermore, there are multiple pins, which are evenly distributed on the bottom of the switch body.

[0013] Furthermore, the copper foil layer completely covers the outer surface of the bent section of the pin.

[0014] Furthermore, the outer wall of the fixing column is provided with anti-slip texture.

[0015] Compared with the prior art, the technical solution provided in this application has the following advantages: By setting two fixing posts at the bottom of the switch and cooperating with the pre-reserved holes on the PCB board, this application can effectively fix the switch during the surface mount process, improve the stability of the surface mount process, and avoid the switch from displacement during the surface mount process; the special bending design of the bottom pins of the switch and the copper foil layer of the bent pin section support the reflow soldering process, ensuring a reliable electrical connection between the switch and the PCB, solving the stability and electrical connection reliability problems of traditional switches in the SMT surface mount process, and meeting the needs of modern electronic equipment production. Attached Figure Description

[0016] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the present invention and, together with the description, serve to explain the principles of the present invention.

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] In the attached image:

[0019] Figure 1 This is a schematic diagram of the structure of a surface mount switch according to an embodiment of the present application;

[0020] Figure 2 This is a schematic diagram of the structure of a surface mount switch according to another embodiment of the present application.

[0021] Figure label:

[0022] 1. A surface mount switch; 10. Switch body; 11. Fixing post; 13. Pin; 131. Copper foil layer. Detailed Implementation

[0023] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0024] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0025] like Figure 1 , Figure 2 As shown, this application provides a surface mount switch 1, including a switch body 10. The bottom of the switch body 10 is provided with at least two fixing posts 11, which are used to cooperate with reserved holes on the PCB board on which the surface mount switch is mounted to achieve mechanical fixation. The bottom of the switch body 10 is provided with pins 13, which are bent. The bent section of the pins 13 is provided with a copper foil layer 131, which is used to reflow solder with the PCB board to form a current loop.

[0026] The switch body 10 is the basic load-bearing structure of the entire surface mount switch. Its design must provide a stable mounting base for other functional components while adapting to the internal installation space of the electronic device. As the mounting carrier for various functional components, the structural stability of the switch body 10 directly affects the performance of the entire switch. It needs to firmly integrate components such as posts and terminals to ensure that no components become loose or fall off during SMT placement and subsequent use. From an overall structural perspective, the size and shape of the switch body 10 need to be designed according to the specific application scenario to adapt to the internal space layout of different electronic devices.

[0027] The core function of the fixing post 11 is to provide mechanical fixation for the switch by embedding it into the pre-drilled holes at corresponding positions on the PCB board. In SMT (Surface Mount Technology) assembly, the equipment generates vibrations during operation. Conventional switches, lacking this fixing structure, are prone to positional shifts during vibration, leading to decreased placement accuracy and affecting subsequent soldering and circuit connections. The mechanical connection formed by the post embedded in the hole effectively resists the external forces generated by vibration, firmly fixing the switch in the preset position. This solves the stability problem of the switch during placement, ensuring the accuracy of the placement position and creating favorable conditions for subsequent reflow soldering. Secondly, this fixing method is simple to operate, requiring no additional fixing devices, and is compatible with the automated production process of SMT, improving production efficiency. Furthermore, the cooperation between the post and the PCB board enhances the switch's vibration resistance during use, reducing the risk of switch loosening due to equipment vibration and extending the switch's lifespan.

[0028] The bottom terminal is a key component for achieving electrical connection between the switch and the PCB board. Its special bending design is to better adapt to the PCB board surface. Conventional switch terminals are often straight-through or simply flat, making it difficult to achieve a tight fit with the PCB board surface during SMT placement, resulting in a small soldering area and low electrical connection reliability. The special bending design allows the terminal pin 13 to form a reasonable contact angle and area with the PCB board surface, ensuring that the solder can fully fill the contact area during reflow soldering. The main benefit of this design is improved electrical connection reliability. The appropriate bending angle ensures close contact between the terminal and the PCB board pads, increasing the conductive path area between them, reducing contact resistance, and facilitating stable current transmission. Simultaneously, this structural design facilitates terminal positioning on the PCB board, is compatible with automated placement equipment in SMT processes, and improves placement consistency and efficiency. Furthermore, the bending structure can also buffer external forces on the terminal to a certain extent, reducing the possibility of damage due to excessive force and enhancing the switch's durability.

[0029] The copper foil layer 131 is located at the bend of the terminal pin 13 primarily because this area is the main contact and soldering point between the terminal and the PCB board pads. Copper has excellent electrical and thermal conductivity; during reflow soldering, the copper foil layer 131 can quickly absorb heat, allowing the solder to melt evenly and fully bond with the terminal and PCB board pads, forming a strong solder joint. Conventional switch terminals typically do not have a dedicated copper foil layer 131 in this area, which may result in weak soldering and poor conductivity.

[0030] The beneficial effects of this design are crucial. First, the copper foil layer 131 improves the soldering quality between the terminal and the PCB board, reducing defects such as cold solder joints and false solder joints, ensuring the reliability of the electrical connection, enabling stable current transmission, and preventing circuit failures caused by poor contact. Second, the presence of the copper foil layer 131 enhances the conductivity of the terminal, reduces resistance loss in the circuit, and contributes to the overall performance improvement of the electronic device. Furthermore, the copper foil layer 131 also protects the bent section of the terminal lead 13 from corrosion, extending the terminal's lifespan and further ensuring the long-term stable operation of the switch.

[0031] The surface mount switch includes a switch body 10, with at least two fixing posts 11 at its bottom and leads 13 that are bent with copper foil layers 131 in the bent sections. The fixing posts 11 engage with pre-drilled holes on the PCB board to achieve mechanical fixation. This design addresses the problem of conventional switches easily shifting during SMT placement. During SMT placement, the equipment operation generates vibrations. Without effective fixation, the switch is prone to deviating from its intended position. The fixing posts 11 embedded in the pre-drilled holes form a stable mechanical connection, providing a fundamental guarantee for the placement process.

[0032] The bending design of pin 13 and the copper foil layer 131 of the bent section focus on electrical connection. The bending design allows pin 13 to better fit the PCB board pads, increasing the contact area; the copper foil layer 131 has excellent conductivity and solderability, promoting uniform melting of the solder and bonding with the pads during reflow soldering. Compared to conventional switch terminals, this design significantly reduces the risk of poor contact and ensures a stable current loop. The combination of these two features allows the surface mount switch to be both stably fixed and reliably electrically connected, meeting the basic requirements of SMT processes for switches and laying the foundation for subsequent designs with superior performance.

[0033] Furthermore, there are two fixing posts 11, which are symmetrically arranged on both sides of the bottom of the switch body 10.

[0034] There are two fixing posts 11, symmetrically arranged on both sides of the bottom of the switch body 10. The symmetrical layout is based on the principle of mechanical balance, which can make the switch evenly stressed on the PCB board. When the switch is subjected to external forces, such as the placement force of the surface mount equipment or the vibration during operation, the two symmetrical fixing posts 11 can distribute the force to different positions on the PCB board, avoiding the switch from tilting or shifting due to concentrated force.

[0035] If a conventional switch has an asymmetrical mounting structure, one side may experience excessive force while the other side becomes loose, affecting the mounting accuracy. This symmetrical design, however, ensures the switch maintains a stable posture throughout the mounting process, improving the accuracy of the mounting position. Furthermore, the number of the two mounting posts 11 is carefully chosen to ensure effective mounting without excessively increasing the number of PCB openings, reducing the space occupied by PCB wiring. This balances mounting performance with the convenience of PCB design, making the switch more practical in real-world applications.

[0036] Furthermore, the height of the fixing column 11 is 1mm-3mm.

[0037] The height of the fixing post 11 is within a certain range. If the height of the fixing post 11 is too high, it may pass through the PCB board or interfere with other components on the back of the board, affecting the overall assembly; if the height is too low, it cannot penetrate into the reserved hole, the fixing effect is weakened, and it is difficult to resist the external force during the placement process.

[0038] The selection of this height range took into account common PCB board thicknesses and SMT process environments. A suitable height ensures that the mounting post 11 has sufficient length to fit the pre-drilled hole, enhancing connection strength and preventing the switch from loosening during surface mounting and subsequent use. Compared to mounting posts 11 of unsuitable height, this design guarantees reliable fixation while avoiding interference with the installation of other components, allowing the switch to better integrate into the overall structure of the electronic device and improving product assembly compatibility.

[0039] Furthermore, the bending angle of the pin 13 is 88°-95°.

[0040] The bending angle of pin 13 is within a specific range. If the bending angle of pin 13 is too small, the contact area between pin 13 and the pad may be insufficient, affecting the stability of the electrical connection; if the angle is too large, the end of pin 13 may be lifted up and unable to fit tightly with the pad.

[0041] This angle range design allows pin 13 to contact the PCB pads in the optimal position, increasing the contact area and facilitating the flow and filling of solder between pin 13 and the pads during reflow soldering. During reflow soldering, a suitable angle allows the solder to fully cover the bent section of pin 13, forming a strong solder joint and reducing cold solder joints and other defects. Compared to pin 13 with an unreasonable angle, this design significantly improves soldering quality, ensures the durability of electrical connections, maintains stable conductivity of the switch during long-term use, and meets the high reliability requirements of electronic equipment.

[0042] Furthermore, the thickness of the copper foil layer 131 is 0.05mm-0.1mm.

[0043] The thickness of the copper foil layer 131 is within a certain range. If the copper foil layer 131 is too thin, there may be a risk of localized damage, affecting conductivity and welding performance; if the thickness is too thick, it will increase material costs and may lead to uneven heat distribution during welding, affecting welding quality.

[0044] The choice of this thickness range takes into account both performance and cost factors. The appropriate thickness allows the copper foil layer 131 to provide an excellent conductive path, ensuring smooth current flow, while also enabling good bonding with the solder during reflow soldering to form a reliable solder joint. Compared to copper foil layers 131 with an unsuitable thickness, this design controls production costs while maintaining electrical performance, making the switch more competitive in the market and suitable for mass production applications.

[0045] Furthermore, the fixing post 11 is made of insulating material.

[0046] The fixing post 11 is made of insulating material. There are many circuits and conductive components distributed on the PCB board. If the fixing post 11 is made of conductive material, it may short-circuit with the surrounding circuits, causing electronic equipment failure or even safety hazards.

[0047] The insulating material effectively blocks current conduction between the mounting post 11 and the PCB circuitry, preventing short-circuit risks. This design provides a safety guarantee for the use of the switch, ensuring that it does not interfere with other circuits when installed on a PCB in a complex circuit environment. Compared to mounting posts 11 using conductive materials, this design significantly improves the electrical safety of the switch, enhances the overall stability and reliability of the electronic equipment, and is an important measure to ensure safe operation of the equipment.

[0048] Furthermore, the cross-sectional shape of the fixed column 11 is circular, square, or polygonal.

[0049] The cross-sectional shape of the fixing post 11 can be circular, square, or polygonal. Different electronic devices have different PCB designs, including the shape and layout of the pre-drilled holes. The diverse design of the fixing post 11 shape allows the switch to match pre-drilled holes of different shapes, improving the versatility of the switch.

[0050] For example, some PCBs have square pre-drilled holes due to wiring requirements, in which case square fixing posts 11 fit better; while round pre-drilled holes can be paired with round fixing posts 11. This flexible shape design avoids the problem of fixing posts 11 being unable to adapt to specific PCBs due to their single shape, thus expanding the application range of switches. At the same time, the diverse shapes also provide PCB designers with more choices, enabling them to optimize the PCB layout according to actual conditions and improve the flexibility and rationality of the overall design.

[0051] Furthermore, there are multiple pins 13, and the multiple pins 13 are evenly distributed on the bottom of the switch body 10.

[0052] The number of pins 13 is multiple and evenly distributed on the bottom of the switch body 10. Different electronic devices have different circuit complexities, and therefore different requirements for the number of switch pins 13. Multiple pins 13 can meet the needs of multi-loop connections, allowing the switch to be used in more complex circuits.

[0053] A uniformly distributed design ensures that the force and current distribution on pin 13 are even when connected to the PCB board pads. Uneven distribution of pin 13 may cause some pins to be damaged due to excessive force, or current to concentrate on a few pins, affecting normal circuit operation. Uniform distribution avoids these problems, improving the switch's lifespan and circuit stability. This design allows the switch to adapt to different circuit requirements, enhancing its functional expandability and practicality, and meeting diverse electronic device application scenarios.

[0054] Furthermore, the copper foil layer 131 completely covers the outer surface of the bent section of the pin 13.

[0055] The copper foil layer 131 completely covers the outer surface of the bent section of the pin 13. This complete coverage maximizes the function of the copper foil layer 131, allowing the solder to contact the copper foil layer 131 throughout the bent section during reflow soldering, resulting in a more comprehensive and robust solder joint.

[0056] If the copper foil layer 131 is not fully covered, and some areas of the bent section lack copper foil, the soldering in that area may be weak, increasing the risk of poor contact. The complete coverage design ensures that every part of the bent section bonds well with the solder, improving the reliability and stability of the soldering. This design further optimizes electrical connection performance, making the solder joints less prone to detachment during long-term use, even under the influence of vibration or temperature changes, ensuring continuous and stable circuit operation and enhancing the switch's durability.

[0057] Furthermore, the outer wall of the fixing column is provided with anti-slip texture.

[0058] The outer wall of the column is provided with anti-slip texture. The anti-slip texture increases the friction between the fixed column 11 and the inner wall of the reserved hole, reducing the relative sliding between the two when the switch is subjected to external force.

[0059] During the use of electronic equipment, it undergoes transportation, installation, and daily operation, inevitably experiencing vibration and impact. Without anti-slip textures, the fixing post 11 may gradually loosen within the pre-drilled hole, affecting the stability of the switch. The anti-slip textures effectively prevent this loosening, ensuring a tight fit between the fixing post 11 and the pre-drilled hole. This design, based on the original fixing structure, further enhances the reliability of the switch's fixation, ensuring stable operation throughout the entire product lifecycle, reducing equipment failures caused by switch loosening, and lowering maintenance costs.

[0060] It is understood that the above embodiments only illustrate preferred embodiments of the present utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the present utility model patent. It should be noted that for those skilled in the art, the above technical features can be freely combined, and several modifications and improvements can be made without departing from the concept of the present utility model, all of which fall within the protection scope of the present utility model. Therefore, all equivalent transformations and modifications made within the scope of the claims of the present utility model should fall within the coverage of the claims of the present utility model.

Claims

1. A paddle switch comprising a switch body, characterized in that, The bottom of the switch body is provided with at least two fixing posts, which are used to cooperate with the reserved holes on the PCB board on which the surface mount switch is installed to achieve mechanical fixation; the bottom of the switch body is provided with pins, which are bent, and the bent section of the pins is provided with a copper foil layer, which is used to reflow solder with the PCB board to form a current loop.

2. The patch switch of claim 1, wherein: The number of fixing posts is two, and the two fixing posts are symmetrically arranged on both sides of the bottom of the switch body.

3. The patch switch of claim 1, wherein: The height of the fixing column is 1mm-3mm.

4. The patch switch of claim 1, wherein: The bending angle of the pin is 88°-95°.

5. A surface mount switch according to claim 1, characterized in that, The thickness of the copper foil layer is 0.05mm-0.1mm.

6. The patch switch of claim 1, wherein: The fixing column is made of insulating material.

7. The patch switch of claim 1, wherein: The cross-sectional shape of the fixed column is circular, square, or polygonal.

8. The patch switch of claim 1, wherein: The number of pins is multiple, and the multiple pins are evenly distributed on the bottom of the switch body.

9. The patch switch of claim 1, wherein, The copper foil layer completely covers the outer surface of the bent section of the pin.

10. The patch switch of claim 1, wherein, The outer wall of the fixed column is provided with anti-slip texture.

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