A vacuum adsorption pre-alignment mechanism for a wafer frame

Abstract

This utility model discloses a vacuum adsorption pre-alignment mechanism for a wafer chute, including a base, a vacuum assembly including a vacuum chuck and a vacuum connector, the vacuum chuck being embedded in a circular groove on the top of the placement stage, and a vacuum channel being provided inside the base, one end of which is connected to the vacuum chuck and the other end to the vacuum connector. The centering assembly includes a base frame and an annular centering ring, the centering ring being detachably installed on the inner side of the base frame, and its inner wall being a conical guide surface. This utility model allows the wafer to slide down the conical guide surface to the placement stage and be centered to complete the initial centering through the centering ring. An external vacuum generator can evacuate the vacuum chuck through the vacuum connector and vacuum channel, so that it firmly adsorbs the wafer to complete the pre-alignment. Thus, through the above structure, rapid centering and stable adsorption of the wafer can be achieved, which can not only adapt to wafers of different sizes and simplify the alignment operation, but also ensure reliable wafer fixation, thereby improving the pre-alignment efficiency and applicability.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment technology, specifically to a vacuum adsorption pre-alignment mechanism for a wafer fabrication machine. Background Technology

[0002] In the semiconductor industry, the wafer is the "mother" of the chip. Through a series of precision processes such as photolithography, etching, ion implantation, and thin film deposition, hundreds of millions of electronic components such as transistors, resistors, and capacitors are fabricated on the surface and inside of the wafer, and complex circuit structures are built. The processed wafer is then cut into individual chip dies, and after packaging and testing, it is made into the final semiconductor chip, which is widely used in various electronic products such as mobile phones, computers, automotive electronics, and Internet of Things devices.

[0003] In the semiconductor wafer processing, a pre-alignment mechanism is needed to adjust the wafer to a designated position so that the subsequent machine can process it accurately. Among the existing wafer pre-alignment mechanisms, some use optical alignment components in combination with mechanical structures. Although the alignment accuracy is high, the structure is complex, the cost is high, and the debugging is difficult. Others rely on manual assistance to adjust the wafer position, which has low alignment efficiency and is prone to wafer displacement due to operational errors. Therefore, it is necessary to design a vacuum adsorption type pre-alignment mechanism for wafer processing machines to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to provide a vacuum adsorption pre-alignment mechanism for wafer assemblies to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a vacuum adsorption pre-alignment mechanism for a wafer assemblies, comprising a base, a vacuum assembly, and a centering assembly. The base has a placement stage on its top surface, with a circular groove on its top surface. The vacuum assembly includes a vacuum chuck and a vacuum connector. The vacuum chuck is embedded in the circular groove, and its top surface is flush with the placement surface of the placement stage. The base has a vacuum channel inside, one end of which communicates with the vacuum chuck, and the other end extends to the outside of the base and connects to a vacuum connector connected to an external vacuum generator. The centering assembly includes a base frame and an annular centering ring. The base frame is located at the top edge of the placement stage, and the centering ring is detachably installed on the inner side of the base frame, with its inner wall being a tapered guide surface.

[0006] Preferably, the top diameter of the tapered guide surface is larger than the bottom diameter, and the bottom diameter is adapted to the standard wafer diameter.

[0007] Preferably, the inner wall of the basic frame is provided with four sets of positioning grooves evenly distributed around its circumference, and the outer wall of the centering ring is provided with a positioning block that matches the position of the positioning groove.

[0008] Preferably, the centering ring is made of aluminum alloy and has an anodized layer on its surface, with two sets of grooves symmetrically opened on the top.

[0009] Preferably, the bottom of the basic frame has four sets of support columns evenly distributed around its circumference, which are adapted to the four sets of insertion slots located on the top of the base.

[0010] Preferably, the bottom of the base is provided with a mounting base for connecting to the wafer rig, the mounting base and the base are integrally formed, and the surface of the mounting base is provided with four sets of evenly distributed mounting holes.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] 1. This utility model installs a matching size annular centering ring inside the base frame. The wafer is placed from the top of the centering ring and can slide down the conical guide surface to the fitting stage and be centered to complete the initial centering. The external vacuum generator is activated, and the vacuum suction cup can be evacuated through the vacuum connector and the vacuum channel inside the base to firmly adsorb the wafer and complete the pre-alignment. Thus, through the above structure, the wafer can be quickly centered and stably adsorbed, which can not only adapt to wafers of different sizes and simplify the alignment operation, but also ensure reliable wafer fixation, thereby improving the pre-alignment efficiency and applicability. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0014] Figure 2 This is a side view and a top view of the present invention;

[0015] Figure 3 This is a schematic diagram showing the structural breakdown of the centering component.

[0016] Figure 4 A top view showing the structural breakdown of the centering component;

[0017] Figure 5 for Figure 3 Enlarged view of part A in the image.

[0018] In the diagram: 1. Base, 2. Mounting base, 3. Mounting hole, 4. Placement platform, 5. Vacuum suction cup, 6. Vacuum connector, 7. Basic frame, 8. Support column, 9. Insertion groove, 10. Positioning groove, 11. Centering ring, 12. Positioning block, 13. Conical guide surface, 14. Groove. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Example 1

[0021] Please refer to Figure 1-5 As shown, this utility model provides a vacuum adsorption pre-alignment mechanism for a wafer assemblies, including a base 1, a vacuum assembly, and a centering assembly. The base 1 has a placement stage 4 on its top, and a circular groove is formed on its top surface. The vacuum assembly includes a vacuum chuck 5 and a vacuum connector 6. The vacuum chuck 5 is embedded in the circular groove, and the top surface of the chuck is flush with the placement surface of the placement stage 4. The base 1 has a vacuum channel inside, one end of which is connected to the vacuum chuck 5, and the other end extends to the outside of the base 1 and is connected to the vacuum connector 6, which is connected to an external vacuum generator. The centering assembly includes a base frame 7 and an annular centering ring 11. The base frame 7 is located at the top edge of the placement stage 4, and the centering ring 11 is detachably installed on the inner side of the base frame 7. Its inner wall is a conical guide surface 13.

[0022] Specifically, firstly, an annular centering ring 11 adapted to the wafer size is installed inside the base frame 7. Then, the wafer is placed from the top of the centering ring 11. The wafer can slide down along the conical guide surface 13 on the inner wall of the centering ring 11 until it fits against the placement surface of the placement stage 4 and is in the center position, thus completing the initial centering. Next, the external vacuum generator is activated. The vacuum generator can evacuate the vacuum chuck 5 embedded in the circular groove on the top surface of the placement stage 4 through the vacuum connector 6 and the vacuum channel inside the base 1, so that the vacuum chuck 5 can firmly adsorb the wafer, thus completing the pre-alignment. Thus, through the above structure, the wafer can be quickly pre-centered and stably adsorbed, which can not only adapt to wafers of different sizes and simplify the alignment operation, but also ensure reliable wafer fixation, thus improving the efficiency and applicability of pre-alignment.

[0023] The tapered guide surface 13 has a larger top diameter than its bottom diameter, and the bottom diameter is compatible with the standard wafer diameter. The larger top diameter of the tapered guide surface 13 makes it easy to place the wafer, and the compatible bottom diameter with the standard wafer diameter can guide the wafer to slide precisely to the center of the placement stage 4, ensuring the accuracy and convenience of the initial centering.

[0024] The base frame 7 has four sets of positioning grooves 10 evenly distributed around its inner wall. The outer wall of the centering ring 11 has a positioning block 12 that matches the positioning grooves 10. The four sets of positioning grooves 10 on the inner wall of the base frame 7 match the positioning block 12 on the outer wall of the centering ring 11. This allows for quick alignment and installation of the centering ring 11. The evenly distributed positioning structure also ensures the coaxiality of the centering ring 11 after installation, preventing the centering ring from shifting and affecting the centering accuracy of the wafer. It also facilitates the disassembly and replacement of the centering ring 11 to adapt to wafers of different sizes.

[0025] The centering ring 11 is made of aluminum alloy and has an anodized layer on its surface. Two sets of slots 14 are symmetrically opened on the top. The centering ring 11 is made of aluminum alloy and has an anodized layer on its surface, which can balance lightweight, corrosion resistance and wear resistance. The two sets of slots 14 on the top make it easy to disassemble and replace the centering ring 11, which improves the usability of the mechanism and the durability of the centering ring.

[0026] The base frame 7 has four sets of support columns 8 evenly distributed around its bottom circumference, which are adapted to the four sets of insertion slots 9 on the top of the base 1. The four sets of support columns 8 evenly distributed around the bottom circumference of the base frame 7 and the four sets of insertion slots 9 on the top of the base 1 can quickly align and complete the installation of the base frame 7. The evenly distributed support structure can also ensure the coaxiality of the base frame 7 with the base 1 and the placement platform 4 after installation, and prevent the base frame 7 from shifting and affecting the guiding accuracy of the centering ring 11. At the same time, the insertion structure also facilitates the disassembly and maintenance of the base frame 7.

[0027] The base 1 has a mounting base 2 at its bottom for connecting to the wafer rig. The mounting base 2 and the base 1 are integrally formed, and the surface of the mounting base 2 has four sets of evenly distributed mounting holes 3. The integrally formed mounting base 2 at the bottom of the base 1 and the four sets of evenly distributed mounting holes 3 on the surface not only ensure the structural strength of the connection between the base 1 and the mounting base 2, but also enable the entire mechanism to be quickly and securely connected to the wafer rig through the mounting holes, thereby improving installation efficiency and connection reliability.

[0028] Working principle: First, the base frame 7 is installed at the top edge of the placement stage 4. Then, the annular centering ring 11 with positioning blocks 12 on its outer wall is installed inside the base frame 7 through the positioning blocks 12 and the positioning groove 10 on the inner wall of the base frame 7. The wafer is then placed from the top of the centering ring 11. The wafer can slide down along the conical guide surface 13 until it fits against the placement surface of the placement stage 4 and is in the center position, thus completing the initial centering. Next, the external vacuum generator is activated. The vacuum generator can evacuate the vacuum chuck 5 embedded in the circular groove on the top surface of the placement stage 4 through the vacuum connector 6 and the vacuum channel inside the base 1, so that the vacuum chuck 5 can firmly adsorb the wafer to complete the pre-alignment. The entire mechanism can be connected and fixed to the wafer machine through the bottom of the base 1 and the integrally formed mounting base 2. When it is necessary to change to a different size wafer, the centering ring 11 can be removed and replaced by lifting it up through the slot 14 on the top of the centering ring 11, thus completing the entire operation process.

[0029] The contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0030] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A vacuum adsorption pre-alignment mechanism for a wafer assemblies, comprising a base (1), a vacuum assembly, and a centering assembly, characterized in that: The base (1) has a placement platform (4) on its top surface, and a circular groove is provided on its top surface. The vacuum assembly includes a vacuum suction cup (5) and a vacuum connector (6). The vacuum suction cup (5) is embedded in the circular groove, and the top surface of the suction cup is flush with the placement surface of the placement platform (4). The base (1) has a vacuum channel inside, one end of which is connected to the vacuum suction cup (5), and the other end extends to the outside of the base (1) and is connected to the vacuum connector (6) which is connected to an external vacuum generator. The centering assembly includes a base frame (7) and an annular centering ring (11). The base frame (7) is located at the top edge of the placement platform (4). The centering ring (11) is detachably installed on the inner side of the base frame (7), and its inner wall is a conical guide surface (13).

2. The wafer assemblies vacuum adsorption pre-alignment mechanism according to claim 1, characterized in that: The top diameter of the tapered guide surface (13) is larger than the bottom diameter, and the bottom diameter is adapted to the standard wafer diameter.

3. The wafer assemblies vacuum adsorption pre-alignment mechanism according to claim 2, characterized in that: The inner wall of the basic frame (7) is evenly provided with four sets of positioning grooves (10), and the outer wall of the centering ring (11) is provided with a positioning block (12) that matches the position of the positioning groove (10).

4. The wafer assemblies vacuum adsorption pre-alignment mechanism according to claim 3, characterized in that: The centering ring (11) is made of aluminum alloy and has an anodized layer on its surface. Two sets of grooves (14) are symmetrically opened on the top.

5. The wafer assemblies vacuum adsorption pre-alignment mechanism according to claim 3, characterized in that: The bottom of the basic frame (7) is evenly distributed with four sets of support columns (8), which are adapted to the four sets of insertion slots (9) on the top of the base (1).

6. The wafer assemblies vacuum adsorption pre-alignment mechanism according to claim 5, characterized in that: The base (1) has a mounting base (2) at its bottom for connecting to a wafer rig. The mounting base (2) and the base (1) are integrally formed, and the surface of the mounting base (2) has four sets of evenly distributed mounting holes (3).

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