A mud removing mechanism for a slicing machine and the slicing machine

Abstract

The application relates to a mud removing mechanism for a slicing machine and the slicing machine, the slicing machine comprising a cutting cavity and a lifting platform which is located below the top surface of the cutting cavity and can be lifted, and the mud removing mechanism is used for removing silicon mud on the side surface of the lifting platform; the mud removing mechanism comprises a hanging plate frame, a scraper assembly and a pressure spring; the hanging plate frame is installed on the top surface of the cutting cavity, extends along at least part of the side surface of the lifting platform, and the extending direction intersects with the lifting direction of the lifting platform; one end of the scraper assembly is rotationally connected to the side of the hanging plate frame facing the lifting platform, and the other end is obliquely abutted against at least part of the side surface of the lifting platform; one end of the pressure spring is connected to the scraper assembly, and the other end is connected to the inner side of the hanging plate frame; when the scraper assembly is obliquely abutted against at least part of the side surface of the lifting platform, the pressure spring generates elastic force opposite to the oblique direction of the scraper assembly, so that the scraper assembly forms a compressive stress on at least part of the side surface of the lifting platform. The mud removing mechanism can effectively remove the silicon mud on the side surface around the lifting platform.

Description

Technical Field

[0001] This application relates to the field of silicon wafer processing technology, and in particular to a descaling mechanism for a wafer slicing machine and a wafer slicing machine. Background Technology

[0002] A slicing machine typically includes a cutting chamber, a lifting platform that can be raised and lowered on the top surface of the cutting chamber, a crystal tray installed on the lifting platform, a silicon wafer attached to the bottom of the crystal tray, and a diamond wire mesh placed below the silicon wafer. The lifting platform raises and lowers the silicon wafer, causing it to come into contact with the diamond wire mesh below, and the diamond wire mesh cuts the silicon wafer into silicon wafers.

[0003] During the wire cutting process, a large amount of silica sludge is thrown at high speed onto the side of the lifting platform by the diamond wire mesh inside the cutting cavity. When the silica sludge adheres to a certain extent, it will fall off and fall onto the diamond wire mesh below. The silica sludge clumps are relatively large in diameter, which will cause defects such as wire skipping and wire breakage relative to the diamond wire and roller groove, and have a huge impact on production capacity.

[0004] Existing slicing machines use a sealing strip as a scraper between the lifting platform and the top surface of the cutting cavity. During the lifting process, the scraper removes the silica mud adhering to the side of the lifting platform. However, the scraper has low contact pressure on the side of the lifting platform, resulting in a small removal effect on the silica mud and poor cleaning efficiency. Utility Model Content

[0005] This application provides a sludge removal mechanism and a slicing machine for a slicing machine, which can effectively remove silica sludge from the sides of the lifting platform and improve the removal effect.

[0006] To address the above problems, this application provides a descaling mechanism for a slicing machine. The slicing machine includes a cutting chamber and a liftable platform located below the top surface of the cutting chamber. The descaling mechanism is used to remove silica sludge from the side of the liftable platform. The descaling mechanism includes a hanging plate frame, a scraper assembly, and a pressure spring. The hanging plate frame is installed on the top surface of the cutting chamber and extends along at least a portion of the side of the liftable platform, with the extension direction intersecting the lifting direction of the liftable platform. One end of the scraper assembly is rotatably connected to the side of the hanging plate frame facing the liftable platform, and the other end is inclined against at least a portion of the side of the liftable platform. One end of the pressure spring is connected to the scraper assembly, and the other end is connected to the inner side of the hanging plate frame. When the scraper assembly is inclined against at least a portion of the side of the liftable platform, the pressure spring generates a spring force opposite to the inclination direction of the scraper assembly, causing the scraper assembly to form compressive stress on at least a portion of the side of the liftable platform.

[0007] An alternative is that the bottom of the hanging plate frame bends upward toward the lifting platform to form a mud receiving groove, wherein the mud receiving groove is located below the position where the scraper assembly abuts against at least part of the side of the lifting platform.

[0008] An optional solution is that the sludge removal mechanism further includes a sludge-gathering pipe and an air extraction pipe; the sludge-gathering pipe is located at the bottom of the hanging plate frame and extends in the same direction as the hanging plate frame, and the sludge-gathering pipe and the sludge receiving trough are connected by multiple branch pipes; the air extraction pipe is configured as multiple pipes and extends along the lifting direction of the lifting platform, with one end of each air extraction pipe connected to the sludge-gathering pipe and the other end connected to the air extraction device.

[0009] Alternatively, when the lifting platform rises relative to the sludge removal mechanism, the scraper assembly tilts upward and abuts against at least a portion of the side of the lifting platform, and the pressure spring is stretched to generate a downward elastic force; when the lifting platform descends relative to the sludge removal mechanism, the scraper assembly tilts downward and abuts against at least a portion of the side of the lifting platform, and the pressure spring is compressed to generate an upward elastic force.

[0010] An alternative embodiment is that the scraper assembly includes a movable clamping plate and a scraper. The movable clamping plate is rotatably connected to the hanging plate frame on the side near the hanging plate frame, and a movable clamping groove is provided on the side of the movable clamping plate away from the hanging plate frame. One end of the scraper is clamped in the movable clamping groove, and the other end is inclined and abuts against at least a portion of the side of the lifting platform.

[0011] Alternatively, the end of the scraper that abuts against at least a portion of the side of the lifting platform has an upper inclined surface that is located on the upper side and slopes downward and / or a lower inclined surface that is located on the lower side and slopes upward.

[0012] An alternative is that the movable clamp is provided with a transition block on the side near the hanging plate frame; the hanging plate frame is provided with oppositely arranged ear plates, the transition block is disposed between the two ear plates, and the transition block and the ear plates are hinged together by a hinge shaft.

[0013] An alternative solution is that a fixing clamp is fixed to the inner side of the hanging plate frame, and a fixing groove is provided on the side of the fixing clamp facing away from the inner side of the hanging plate frame; a top sealing strip is held in the fixing groove, and the top sealing strip is located above the scraper and abuts against at least part of the side of the lifting platform.

[0014] An alternative solution is to provide multiple hanging plate fixing blocks on the outer side of the hanging plate frame, and to fix the hanging plate fixing blocks to the top surface of the cutting cavity through fasteners.

[0015] This application also provides a slicing machine, including a cutting cavity, a lifting platform located below the top surface of the cutting cavity that can be raised and lowered, a roller located below the lifting platform, a diamond wire mesh wound on the roller, a lifting mechanism for driving the lifting platform to rise and fall, and a rotating mechanism for driving the roller to rotate. The slicing machine also includes a plurality of descaling mechanisms according to the above-described method for slicing, the plurality of descaling mechanisms being arranged around the lifting platform such that the scraper assembly is inclined against all sides of the lifting platform.

[0016] Beneficial effects:

[0017] This application provides a descaling mechanism for a slicing machine and the slicing machine itself. The descaling mechanism is provided on at least a portion of the side of the lifting platform. The hanging plate frame of the descaling mechanism is installed on the top surface of the cutting cavity. One end of the scraper assembly of the descaling mechanism is rotatably connected to the hanging plate frame, and the other end is inclined against at least a portion of the side of the lifting platform. When the scraper assembly is inclined against the side of the lifting platform, the pressure spring generates a spring force opposite to the tilting direction of the scraper assembly. After cutting is completed, the lifting platform will rise. During the rising process of the lifting platform, the scraper assembly will scrape off the silica mud on the side of the lifting platform. At the same time, the scraper assembly can rotate. During the rising process of the lifting platform, it tilts, and the pressure spring generates a spring force opposite to the tilting direction of the scraper assembly. This will cause the scraper assembly to form a large compressive stress on the side of the lifting platform, thereby greatly improving the removal effect of silica mud, ensuring the effectiveness of silica mud removal, reducing the risk of silica mud falling onto the diamond wire mesh and roller groove below, and avoiding wire breakage and skipping. In addition, the scraper assembly of this application is rotatably connected to the mounting bracket, causing it to swing up and down when the lifting platform rises or falls, thereby changing the contact position with the lifting platform, reducing wear, and improving the sealing effect. Attached Figure Description

[0018] Figure 1 A front view of the scraper with a simple sealing strip installed at the gap between the top surface of the cutting cavity and the side of the lifting platform in the existing slicer.

[0019] Figure 2 A three-dimensional structural diagram of a simple sealing strip installed as a scraper at the gap between the top surface of the cutting cavity and the side of the lifting platform in a slicer in the prior art;

[0020] Figure 3 This is a schematic diagram illustrating the adhesion and detachment of silica sludge on the side of a lifting platform in existing technology.

[0021] Figure 4 This is a front view of the mud removal mechanism installed at the gap between the top surface of the cutting cavity and the side of the lifting platform in this embodiment;

[0022] Figure 5 This is a three-dimensional structural diagram of the mud removal mechanism installed at the gap between the top surface of the cutting cavity and the side of the lifting platform in this embodiment.

[0023] Figure 6 This is a partially enlarged schematic diagram of the mud removal mechanism installed at the gap between the top surface of the cutting cavity and the side of the lifting platform in this embodiment;

[0024] Figure 7 This is a schematic diagram showing the scraper assembly tilting upwards during the lifting process of the lifting platform in this embodiment, with only the lower tilted surface included.

[0025] Figure 8 This is a schematic diagram showing the scraper assembly tilting downwards during the descent of the lifting platform in this embodiment, with only the upper tilted surface included.

[0026] Figure 9 This is a schematic diagram showing the scraper assembly tilting downwards during the descent of the lifting platform in this embodiment, including the upper and lower tilting surfaces.

[0027] Figure 10 This is a three-dimensional structural diagram of the sludge removal mechanism in this embodiment;

[0028] Figure 11 This is a schematic diagram of the installation of the movable clamping plate and scraper in this embodiment;

[0029] Figure 12 This is a schematic diagram of the outer side of the scraper and the mounting plate fixing block in this embodiment.

[0030] Figure label:

[0031] 1. Slicer; 11. Cutting cavity top surface; 12. Lifting platform; 13. Sealing strip; 14. Crystal holder; 15. Roller; 16. Diamond wire mesh; 2. Silicon square; 3. Sludge removal mechanism; 31. Hanging plate frame; 311. Ear plate; 312. Hanging plate fixing block; 3121. Fixing hole; 313. Fixing component; 32. Scraper; 33. Pressure spring; 34. Sludge receiving trough; 35. Sludge gathering pipe; 351. Branch pipe; 36. Air extraction pipe; 37. Movable clamping plate; 371. Movable clamping groove; 372. Clamping component; 373. Adapter block; 38. Top sealing strip; 39. Fixed clamping plate; 391. Fixed clamping groove. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0033] like Figure 1As shown, in the process of cutting silicon wafers 2 using a slicing machine 1, a wafer holder 14 is typically used to attach the silicon wafer 2 for positioning. The wafer holder 14 is then installed and fixed by a lifting platform 12 on the slicing machine 1, ensuring the stability of the silicon wafer 2's position during the slicing process. The silicon wafer 2 is a structure formed by squaring a silicon rod, having a near-square cross-section along its length perpendicular to the silicon rod. The slicing machine 1 has a cutting cavity where the wire cutting process is completed. The lifting platform 12 is located below the top surface 11 of the cutting cavity and can be raised and lowered relative to the top surface 11. A diamond wire mesh 16 is located below the lifting platform 12. Specifically, diamond wire is wound around three rollers 15, forming a diamond wire mesh 16 tightly arranged along the length of the silicon wafer 2. The rotation of the rollers 15 drives the diamond wire mesh 16 to reciprocate. The raising and lowering of the lifting platform 12 causes the wafer holder 14 to rise and fall, which in turn causes the silicon wafer 2 to rise and fall. After the silicon wafer 2 comes into contact with the diamond wire mesh 16, the diamond wire mesh 16 wire-cuts the silicon wafer 2 into silicon wafers.

[0034] In existing technologies, such as Figure 1 and Figure 2 As shown, a simple sealing strip 13 is installed at the gap between the top surface 11 of the cutting cavity of the slicer 1 and the side of the lifting platform 12. The simple sealing strip 13 is usually made of rubber. When the lifting platform 12 is raised and lowered, the sealing strip 13 acts as a scraper to remove the silica sludge from the side of the lifting platform 12. However, the lower edge of the sealing strip 13 exerts relatively little pressure on the side of the lifting platform 12. Since the silica sludge is highly viscous and the rubber itself has low hardness, the scraping effect is poor. After processing for a period of time, the silica sludge adhering to the lifting platform 12 becomes increasingly thick. Simultaneously, during the processing of the silicon square 2, the roller 15 rotates at a very high speed, reaching 1500 r / min. The silica sludge and water on the diamond wire mesh 16 are thrown onto the side of the lifting platform 12 (e.g., Figure 3 As shown), and impacts the silica sludge on the side of the lifting platform 12. If the silica sludge on the side is thick, the outermost part of the silica sludge will fall off after being impacted (as shown). Figure 3 As shown, when the diamond wire falls onto the diamond wire mesh 16 and the roller groove, the diamond wire is very thin (<0.045mm) and the roller groove is very narrow (<0.175mm), resulting in very high tension on the diamond wire, which will directly cause the diamond wire to break and skip wires.

[0035] like Figure 4 and Figure 5 As shown, in order to better remove the silica sludge on the side of the lifting platform 12, this application provides a sludge removal mechanism for a slicing machine. The sludge removal mechanism 3 is installed on the top surface 11 of the cutting cavity of the slicing machine 1 and close to the side of the lifting platform 12. The sludge removal mechanism 3 cleans and collects the silica sludge adhering to the side of the lifting platform 12 in a timely manner. The sludge removal mechanism 3 provided in this application has a large contact force with the side of the lifting platform 12, and the effect of scraping the silica sludge is better, reducing the risk of silica sludge falling onto the diamond wire mesh 16 and the roller groove below, and avoiding wire breakage and skipping.

[0036] The following describes in detail, with reference to the accompanying drawings, a mud removal mechanism for a slicer provided in this embodiment. Please refer to the accompanying drawings. Figure 5 and Figure 6 As shown, the slicer includes a cutting chamber and a lifting platform 12 located below the top surface 11 of the cutting chamber. A descaling mechanism 3 is used to remove silica sludge from the side of the lifting platform 12. The descaling mechanism 3 includes a hanging plate frame 31, a scraper assembly, and a pressure spring 33. The hanging plate frame 31 is installed on the top surface 11 of the cutting chamber and extends along at least a portion of the side of the lifting platform 12, with the extension direction intersecting the lifting direction of the lifting platform 12. One end of the scraper assembly is rotatably connected to the side of the hanging plate frame 31 facing the lifting platform 12, and the other end is inclined against at least a portion of the side of the lifting platform 12. One end of the pressure spring 33 is connected to the scraper assembly, and the other end is connected to the hanging plate frame 31. When the scraper assembly is inclined against at least a portion of the side of the lifting platform 12, the pressure spring 33 generates a spring force opposite to the inclined direction of the scraper assembly, so that the scraper assembly forms compressive stress on at least a portion of the side of the lifting platform 12.

[0037] In this embodiment, when the silicon wafer 2 is being processed, the lifting platform 12 lifts and lowers, which in turn lifts and lowers the crystal tray 14. The lifting and lowering of the crystal tray 14 in turn lifts and lowers the silicon wafer 2. After the silicon wafer 2 comes into contact with the diamond wire mesh 16, the diamond wire mesh 16 cuts the silicon wafer 2 into silicon wafers. During the cutting process, silicon sludge is thrown at high speed by the diamond wire mesh 16 to the side of the lifting platform 12. After cutting is completed, the lifting platform 12 will rise. During the rising process, the scraper assembly of the mud removal mechanism 3 will scrape off the silica mud on the side of the lifting platform 12. The scraper assembly is rotated. When the lifting platform 12 rises, the scraper assembly tilts due to the friction between the end of the scraper assembly and the side of the lifting platform 12. When the scraper assembly tilts, the pressure spring 33 connected to the scraper assembly will deform and generate an elastic force opposite to the tilting direction of the scraper assembly. This will cause the scraper assembly to form a large compressive stress on the side of the lifting platform 12. The scraper assembly has a great effect on removing silica mud during the scraping process, which can ensure the effect of removing silica mud, reduce the risk of silica mud falling onto the diamond wire mesh 16 and roller groove below, and avoid causing wire breakage and skipping.

[0038] Please refer to Figure 6 As shown, in this embodiment, it should be noted that the bottom of the hanging plate frame 31 bends upward toward the lifting platform 12 to form a mud-collecting groove 34, wherein the mud-collecting groove 34 is located below the position where the scraper assembly and at least part of the side of the lifting platform 12 abut. It should be noted that by bending the bottom of the hanging plate frame 31 toward the lifting platform 12 to form the mud-collecting groove 34, when silica mud is scraped off, it will fall directly into the mud-collecting groove 34 below for collection, thereby preventing it from falling onto the diamond wire mesh 16 at the bottom (e.g., Figure 3As shown, this reduces the risk of silicon sludge falling onto the diamond wire mesh 16 and roller grooves, avoids wire breakage and skipping, increases silicon wafer processing output, and reduces waste.

[0039] Please refer to Figure 6 and Figure 9 As shown in this embodiment, it should also be noted that the sludge removal mechanism 3 further includes a sludge-gathering pipe 35 and an air extraction pipe 36. The sludge-gathering pipe 35 is a circular pipe with both ends sealed. The sludge-gathering pipe 35 is located below the bottom of the hanging plate frame 31 and extends in the same direction as the hanging plate frame 31. Multiple branch pipes 351 are provided between the sludge-gathering pipe 35 and the sludge receiving trough 34 of the hanging plate frame 31. The multiple branch pipes 351 are spaced apart along the length of the sludge-gathering pipe 35 and connect the sludge-gathering pipe 35 and the sludge receiving trough 34. The air extraction pipes 36 are multiple and extend along the lifting direction of the lifting platform 12. The multiple air extraction pipes 36 are spaced apart along the length of the sludge-gathering pipe 35. One end of each air extraction pipe 36 is connected to the sludge-gathering pipe 35 and the other end is connected to the air extraction device. The air extraction pipes 36 are used to extract the silica sludge in the sludge receiving trough 34. By setting up a mud-collecting pipe 35 and an air extraction pipe 36, the air extraction pipe 36 can draw silica mud from the mud-collecting tank 34 from different positions through multiple branch pipes 351 to the mud-collecting pipe 35, and finally discharge it from the air extraction pipe 36 into the collector for collection. This setup allows for timely removal of silica mud from the mud-collecting tank 34 without affecting subsequent silica mud collection, and it also facilitates cleaning. It should be noted that by setting up multiple air extraction pipes 36, the silica mud in the mud-collecting pipe 35 can be drawn from different positions, improving the efficiency of extraction and cleaning.

[0040] Please continue to refer to Figure 6 and Figure 7As shown in this embodiment, it should also be noted that when the lifting platform 12 rises relative to the desludge removal mechanism 3, the scraper assembly tilts upward and abuts against at least a portion of the side surface of the lifting platform 12, and the pressure spring 33 is stretched to generate a downward elastic force; when the lifting platform 12 descends relative to the desludge removal mechanism 3, the scraper assembly tilts downward and abuts against at least a portion of the side surface of the lifting platform 12, and the pressure spring 33 is compressed to generate an upward elastic force. It should be noted that there is a margin between the scraper assembly and the side surface of the lifting platform 12, so that after both the scraper assembly and the lifting platform 12 are installed, the scraper assembly tilts relative to the lifting platform 12. For example, when the lifting platform 12 rises relative to the desludge removal mechanism 3, the scraper assembly rotates and tilts upward due to the frictional force of the side surface of the lifting platform 12. The upward tilting of the scraper assembly against the side surface of the lifting platform 12 stretches the pressure spring 33, which in turn generates a downward elastic force. This downward elastic force from the pressure spring 33 creates a large compressive stress on the side surface of the lifting platform 12, resulting in a significant effect on silica sludge removal and ensuring the effectiveness of silica sludge removal. As the lifting platform 12 descends relative to the desludge removal mechanism 3, the downward tilt of the scraper assembly compresses the pressure spring 33. This compression generates an upward elastic force, resulting in significant compressive stress on the side of the lifting platform 12. This effectively removes the silica sludge and ensures efficient removal. Furthermore, as the lifting platform 12 descends relative to the desludge removal mechanism 3, the scraper assembly rotates and tilts downwards due to friction on its side. This downward tilt compresses the pressure spring 33, generating an upward elastic force.

[0041] Please refer to Figure 6 , Figure 10 as well as Figure 11As shown in this embodiment, it should also be noted that the scraper assembly includes a movable clamping plate 37 and a scraper 32. The side of the hanging plate frame 31 facing the side of the lifting platform 12 is set as the inner side, and the opposite side is set as the outer side. The movable clamping plate 37 is rotatably connected to the hanging plate frame 31 on the side close to the hanging plate frame 31. The movable clamping plate 37 can be set to swing up and down within a small range. The length direction of the movable clamping plate 37 is consistent with the length direction of the hanging plate frame 31, and the side of the movable clamping plate 37 away from the hanging plate frame 31 is provided with a movable clamping groove 371. The movable clamping groove 371 extends along the length direction of the movable clamping plate 37. One end of the scraper 32 is clamped in the movable clamping groove 371, and the other end is inclined to abut against at least part of the side of the lifting platform 12. The scraper 32 and the movable clamping plate 37 are pressed and fixed together by a clamping member 372. On the one hand, the movable clamp 37 allows for the detachable operation of the scraper 32. After scraping away silica sludge for a period of time, the scraper 32 may become worn. The worn scraper 32 can be disassembled and replaced with a new one. On the other hand, the up-and-down swinging of the movable clamp 37 allows the scraper 32 to swing up and down, switching between downward and upward tilting states. If the lifting platform 12 encounters difficult-to-clean silica sludge during its ascent, the scraper 32 can swing up and down within a small range, preventing jamming due to unremoved silica sludge and ensuring the lifting platform 12 can continue to rise. Furthermore, the pressure spring 33 provides significant compressive stress to the scraper 32 on the side of the lifting platform 12, ensuring that easily cleanable silica sludge can be removed promptly.

[0042] In one possible implementation, the end of the scraper 32 that abuts against at least a portion of the side of the lifting platform 12 has an upwardly inclined surface located on the upper side and sloping downwards and / or a downwardly inclined surface located on the lower side and sloping upwards. It is understood that, as Figure 6 As shown, the end of the scraper 32 that abuts against at least a portion of the side of the lifting platform 12 has an upwardly inclined surface located on the upper side and sloping downwards; or, as Figure 7 As shown, the end of the scraper 32 that abuts against at least a portion of the side of the lifting platform 12 has a downwardly inclined surface located on the lower side and tilted upward; or, as Figure 9 As shown, the scraper 32, at the end abutting against at least a portion of the side of the lifting platform 12, has an upwardly inclined surface located on the upper side and tilting downwards, and a downwardly inclined surface located on the lower side and tilting upwards. Due to the inclined surfaces, when the lifting platform 12 rises, the scraper 32 tilts upwards, as... Figure 7 As shown, the downwardly inclined surface of the lower side of the scraper 32 makes surface contact with the side of the lifting platform 12, which can improve the sealing performance; when the lifting platform 12 descends, the scraper 32 tilts downward, as... Figure 8 As shown, the upper inclined surface of the scraper 32 at its upper end forms a surface contact with the side of the lifting platform 12, which can improve the sealing performance. Figure 9As shown, the scraper 32 has both an upper inclined surface and a lower inclined surface at its end. This ensures that when the lifting platform 12 rises, the lower inclined surface makes surface contact with the side of the lifting platform 12, and when the lifting platform 12 descends, the upper inclined surface makes surface contact with the side of the lifting platform 12. During the reciprocating lifting and lowering process of the lifting platform 12, this ensures that the scraper 32 contacts the side of the lifting platform 12 at different positions, reducing wear caused by contact at the same position, thereby increasing the service life of the scraper 32 and improving the sealing effect. Preferably, the scraper 32 is made of PP (polypropylene), but other hard resin materials are also acceptable.

[0043] like Figure 9 As shown, in this embodiment, the scraper 32, which abuts against at least a portion of the side of the lifting platform 12, has an upwardly inclined surface located on the upper side and sloping downwards, and a downwardly inclined surface located on the lower side and sloping upwards, thereby improving the sealing performance during lifting. Figure 6 The diagram shown illustrates the downward tilt of the scraper assembly during the descent of the lifting platform 12, and only includes the embodiment with the upper tilted surface. Figure 7 The diagram shown illustrates the upward tilt of the scraper assembly during the ascent of the lifting platform 12, and only includes the embodiment with the downward tilted surface.

[0044] Please refer to Figure 11 As shown, in one feasible embodiment, the upper and lower sides of the movable clamping plate 37 are symmetrically provided with connecting holes communicating with the movable clamping groove 371. The clamping member 372 includes a clamping bolt and a clamping nut. The clamping bolt passes through the connecting holes on the upper and lower surfaces of the movable clamping plate 37 and the scraper 32, and is then threadedly fixed by the clamping nut. The use of the clamping bolt and the clamping nut can stably fix the scraper 32 in the movable clamping groove 371 of the movable clamping plate 37, and also makes disassembly convenient and quick. Of course, the clamping member 372 in this embodiment is not limited to the combination of clamping bolt and clamping nut; other components that can achieve the fixing function can also be used.

[0045] Please refer to Figure 6 and Figure 11 As shown, in one possible implementation, the movable clamping plate 37 has several transition blocks 373 on the side near the hanging plate frame 31. Each transition block 373 has a shaft hole, the axis of which is aligned with the length direction of the movable clamping plate 37. Several sets of opposing ear plates 311 are fixed to the outer side of the hanging plate frame 31. Figure 12An embodiment is shown where the ear plate 311 is located on the outer side of the hanging plate frame 31. In this embodiment, the hanging plate frame 31 has a through hole through which the adapter block 373 passes and connects to the outer ear plate 311. Specifically, the adapter block 373 and the ear plate 311 are hinged together via a hinge shaft. It can be understood that the movable clamping plate 37 can achieve a small range of vertical swinging by rotating the adapter block 373 between the two ear plates 311. In other embodiments, the ear plate 311 can also be located on the inner side of the hanging plate frame 31 (not shown in the figure). Similarly, the adapter block 373 and the ear plate 311 are hinged together via a hinge shaft.

[0046] Please refer to Figure 6 and Figure 10 As shown in this embodiment, it should also be noted that a top sealing strip 38 is installed on the inner top side of the hanging plate frame 31. The top sealing strip 38 is horizontally arranged and extends along the length direction of the hanging plate frame 31, and abuts against the side of the lifting platform 12. The top sealing strip 38 helps to further scrape off silica sludge, while minimizing the amount of silica sludge and water entering the slicing machine 1, thus further protecting the equipment. Preferably, a fixing clamp 39 is fixed to the inner top side of the hanging plate frame 31. The fixing clamp 39 is horizontally arranged, and its length direction is consistent with the length direction of the hanging plate frame 31. A fixing groove 391 is provided on the side of the fixing clamp 39 away from the hanging plate frame 31, extending along the length direction of the fixing clamp 39. The end of the top sealing strip 38 away from the side of the lifting platform 12 is clamped and fixed in the fixing groove 391, and the top sealing strip 38 is located above the scraper assembly and abuts against at least part of the side of the lifting platform 12. Preferably, the top sealing strip 38 can be made of nitrile, but of course, other suitable materials can also be used as sealing strip structure materials.

[0047] Please refer to Figure 6 and Figure 12 As shown in this embodiment, it should also be noted that multiple hanging plate fixing blocks 312 are provided on the top outer side of the hanging plate frame 31. The multiple hanging plate fixing blocks 312 are distributed at intervals along the length direction of the hanging plate frame 31. The hanging plate fixing blocks 312 and the top surface 11 of the cutting cavity are fixed by fasteners 313. Preferably, the fasteners 313 include fixing bolts and fixing nuts. Fixing holes 3121 are symmetrically provided on the upper and lower surfaces of the hanging plate fixing blocks 312. After the fixing bolts pass through the fixing holes 3121 on the upper and lower surfaces of the hanging plate fixing blocks 312 and the top surface 11 of the cutting cavity, they are threaded and fixed by the fixing nuts.

[0048] In this embodiment, a slicing machine is also provided, including a cutting chamber, a lifting platform 12 located below the top surface 11 of the cutting chamber and movable, a roller 15 located below the lifting platform 12, a diamond wire mesh wound on the roller 15, a lifting mechanism for driving the lifting platform 12 to rise and fall, and a rotating mechanism for driving the roller 15 to rotate. The slicing machine 1 also includes multiple descaling mechanisms 3 as described above, arranged around the lifting platform 12 such that the scraper assembly is inclined against all sides of the lifting platform 12. It should be noted that the components of the slicing machine, such as the lifting platform 12, roller 15, diamond wire mesh 16, lifting mechanism, and rotating mechanism, are all conventional components in the art. The scraper assembly of the descaling mechanism 3 is inclined against all sides of the lifting platform 12, that is, it is positioned on the front and rear sides and the left and right sides of the lifting platform 12. This arrangement ensures that silica sludge is scraped off all four sides of the lifting platform 12.

[0049] The implementation principle of this embodiment is as follows: When the silicon wafer 2 is being processed, the lifting platform 12 that fixes the crystal tray 14 will slowly lower the silicon wafer 2 and bring it into contact with the diamond wire mesh 16 below. The diamond wire mesh 16 will wire cut the silicon wafer 2 into silicon wafers. During the cutting process, silicon sludge will be thrown at high speed by the diamond wire mesh to the side of the lifting platform 12. Taking the scraper 32 abutting against at least part of the side of the lifting platform 12 with an upwardly inclined surface located on the upper side as an example, after the cutting is completed, the lifting platform 12 will rise. When the lifting platform 12 rises, the scraper assembly will tilt upward under the action of friction. Because the scraper assembly tilts upward, it will stretch the pressure spring 33. Then, the pressure spring 33 will generate a downward elastic force due to being stretched, so that the scraper assembly will form a large compressive stress on the side of the lifting platform 12, which has a great effect on removing silicon sludge and can ensure the effect of removing silicon sludge. When the silica mud is scraped off, it falls into the mud receiving trough 34 below. The mud receiving trough 34 is connected to the air extraction pipe 36, which is used to extract the silica mud and discharge it into the collector.

[0050] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0051] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A desliming mechanism for a slicing machine, the slicing machine comprising a cutting chamber and a lifting platform (12) located below the top surface (11) of the cutting chamber, the desliming mechanism (3) being used to remove silica mud from the side of the lifting platform (12), characterized in that, The sludge removal mechanism (3) includes a hanging plate frame (31), a scraper assembly, and a pressure spring (33); The hanging plate frame (31) is installed on the top surface (11) of the cutting cavity. The hanging plate frame (31) extends along at least part of the side of the lifting platform (12), and the extension direction intersects the lifting direction of the lifting platform (12). One end of the scraper assembly is rotatably connected to the side of the hanging plate frame (31) facing the lifting platform (12), and the other end is inclined to abut against at least part of the side of the lifting platform (12); One end of the pressure spring (33) is connected to the scraper assembly, and the other end is connected to the hanging plate frame (31); When the scraper assembly is tilted against at least a portion of the side of the lifting platform (12), the pressure spring (33) generates a spring force opposite to the tilting direction of the scraper assembly, causing the scraper assembly to form compressive stress on at least a portion of the side of the lifting platform (12).

2. The mud removal mechanism for a slicer according to claim 1, characterized in that, The bottom of the hanging plate frame (31) bends upward toward the lifting platform (12) to form a mud receiving groove (34), wherein the mud receiving groove (34) is located below the scraper assembly and the lifting platform (12) at least part of the side abutment position.

3. The mud removal mechanism for a slicer according to claim 2, characterized in that, The sludge removal mechanism (3) also includes a sludge collection pipe (35) and an air extraction pipe (36); The mud-gathering pipe (35) is located at the bottom of the hanging plate frame (31) and extends in the same direction as the hanging plate frame (31). The mud-gathering pipe (35) and the mud-receiving trough (34) are connected by multiple branch pipes (351). The air extraction pipe (36) is configured as multiple pipes and extends along the lifting direction of the lifting platform (12). One end of each air extraction pipe (36) is connected to the mud-collecting pipe (35), and the other end is connected to the air extraction device.

4. The mud removal mechanism for a slicer according to claim 1, characterized in that, When the lifting platform (12) rises relative to the sludge removal mechanism (3), the scraper assembly tilts upward and abuts against at least part of the side of the lifting platform (12), and the pressure spring (33) is stretched to generate a downward elastic force; When the lifting platform (12) descends relative to the sludge removal mechanism (3), the scraper assembly tilts downward and abuts against at least part of the side of the lifting platform (12), and the pressure spring (33) is compressed to generate an upward elastic force.

5. The mud removal mechanism for a slicer according to claim 4, characterized in that, The scraper assembly includes a movable clamping plate (37) and a scraper (32). The movable clamp (37) is rotatably connected to the hanging plate frame (31) on the side close to the hanging plate frame (31), and the movable clamp (37) is provided with a movable clamping groove (371) on the side away from the hanging plate frame (31). One end of the scraper (32) is held in the movable clamping groove (371), and the other end is inclined against at least part of the side of the lifting platform (12).

6. The mud removal mechanism for a slicer according to claim 5, characterized in that, The end of the scraper (32) that abuts against at least part of the side of the lifting platform (12) has an upper inclined surface that is located on the upper side and tilted downward and / or a lower inclined surface that is located on the lower side and tilted upward.

7. The mud removal mechanism for a slicer according to claim 5, characterized in that, The movable clamp (37) is provided with a transition block (373) on the side near the hanging plate frame (31); The hanging plate frame (31) is provided with oppositely arranged ear plates (311), and the adapter block (373) is disposed between the two ear plates (311), and the adapter block (373) and the ear plates (311) are hinged together by a hinge shaft.

8. The mud removal mechanism for a slicer according to claim 5, characterized in that, A fixing clamp (39) is fixed inside the hanging plate frame (31), and a fixing groove (391) is provided on the side of the fixing clamp (39) away from the inside of the hanging plate frame (31). The top sealing strip (38) is held in the fixed clamping groove (391), and the top sealing strip (38) is located above the scraper (32) and abuts against at least part of the side of the lifting platform (12).

9. The mud removal mechanism for a slicer according to claim 1, characterized in that, Multiple hanging plate fixing blocks (312) are provided on the outside of the hanging plate frame (31); The mounting plate fixing block (312) and the top surface (11) of the cutting cavity are fixed together by a fastener (313).

10. A slicing machine, comprising a cutting cavity, a lifting platform (12) located below the top surface (11) of the cutting cavity and movable, a roller (15) located below the lifting platform (12), a diamond wire mesh wound on the roller (15), a lifting mechanism for driving the lifting platform (12) to rise and fall, and a rotating mechanism for driving the roller (15) to rotate, characterized in that, The slicer (1) further includes a plurality of desliming mechanisms for the slicer according to any one of claims 1-9, wherein the plurality of desliming mechanisms (3) are arranged around the lifting platform (12) such that the scraper assembly is inclined against all sides of the lifting platform (12).

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