A lead frame that is more material efficient

Abstract

The utility model discloses a lead frame that is more material saving belongs to lead frame field, including frame body, and the inside frame body is arranged and set up with a plurality of chip mounting area through longitudinal edge and horizontal edge, and each chip mounting area is set up with a plurality of chip mounting unit through the connecting rib, and each chip mounting unit is composed of two groups of base island board of symmetrical setting, and each group of base island board includes three base islands of different area size, and can be used for installing the chip of different size, and each base island is independently provided with a pin.

Description

Technical Field

[0001] This utility model relates to the field of lead frame, and more specifically to a lead frame that saves more materials. Background Technology

[0002] Leadframes are a fundamental material for the molding and packaging of semiconductor ICs and devices. As the chip carrier of integrated circuits, and as the "skeleton" and "terminal" of the chip, leadframes are a key structural component that uses bonding materials (gold wire, aluminum wire, copper wire) to electrically connect the internal circuit leads (bonding points) of the chip with the external leads through internal leads, forming an electrical circuit. It acts as a bridge to connect with external wires and is usually a precision structure made of a thin metal sheet (such as copper alloy or iron-nickel alloy) through stamping or etching processes.

[0003] In traditional leadframes, when the components to be packaged are long, multiple individually packaged shorter chip mounting units are often required. In leadframe design, this means that for leadframes of the same area, the design of the side ribs or connecting ribs integrates multiple chip mounting units with longer base islands. Compared to more individually packaged shorter chip mounting units, the packaging material required is more economical, directly reducing the amount of raw materials required per unit product. In mass production, even if the material saved per chip is small, the total cost will be significantly reduced. Utility Model Content

[0004] To address the technical problem in traditional lead frames that require multiple individually packaged shorter chip mounting units when the components to be packaged are long, resulting in higher material consumption and costs, this invention provides a lead frame that saves more materials.

[0005] A more material-saving lead frame includes a frame body. The frame body has multiple chip mounting areas arranged and separated by longitudinal and transverse side ribs. Each chip mounting area has multiple chip mounting units arranged by connecting ribs. Each chip mounting unit consists of two sets of symmetrically arranged base islands. Each set of base islands includes three base islands of different sizes, which can be used to mount chips of different sizes. Each base island has an independent pin.

[0006] More preferably, the interior of the frame body is divided into three rows and thirty columns of chip mounting areas by longitudinal and transverse ribs. Each column of chip mounting area has a longitudinal rib on one side consisting of several round holes, and the transverse ribs are set between the rows.

[0007] More preferably, the frame body has several circular positioning holes of different sizes on the outer side along the length direction, and the four corners of the frame body are set as rounded corner structures, with an arc-shaped inner groove on each rounded corner structure.

[0008] More preferably, each chip mounting area is divided into a column of chip mounting units by connecting ribs, with seven rows of chip mounting units in the first and third rows of chip mounting areas and six rows of chip mounting units in the second row of chip mounting areas.

[0009] More preferably, the two sets of base island boards are symmetrical from left to right. Each set of base island boards has one base island at the top and two base islands at the bottom. The pins of the upper base island face upwards, and the pins of the two lower base islands face downwards. Each chip mounting unit can mount three sets of chips of different sizes.

[0010] Compared with the prior art, the beneficial effects of this utility model are: by setting multiple base islands and pins in a chip mounting unit, while meeting the long packaging requirements, the unit volume can be reduced. In terms of the production of the frame body, more base islands and pins can be accommodated without increasing the package size, meeting the packaging requirements of chips of different sizes, further saving materials and reducing production costs. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the structural frame body 1 of this utility model; Figure 2 This is a schematic diagram of the chip mounting area 2 of the present invention. Figure 3 This is a schematic diagram of the chip mounting unit 6 of this utility model. Figure 4 This is a schematic diagram of part A of the structure of this utility model; Figure 5 This is a schematic diagram of part B of the structure of this utility model; Figure 6 This is a schematic diagram of part C of the present utility model.

[0012] In the diagram: 1. Frame body; 2. Chip mounting area; 3. Longitudinal side rib; 4. Transverse side rib; 5. Connecting rib; 6. Chip mounting unit; 7. Base island board; 8. Base island; 9. Pin; 10. Circular positioning hole; 11. Arc-shaped inner groove. Detailed Implementation

[0013] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0014] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of the utility model described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0015] In this invention, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this invention and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0016] Furthermore, some of the aforementioned terms, besides indicating location or positional relationships, may also have other meanings. For example, the term "above" may, in certain circumstances, indicate a dependency or connection. Those skilled in the art can understand the specific meaning of these terms in this utility model based on the specific circumstances. Additionally, the term "multiple" should mean two or more.

[0017] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments of the present invention can be combined with each other. The following will refer to the accompanying drawings. Figures 1-6 The present invention will be described in detail with reference to the embodiments.

[0018] A more material-saving lead frame includes a frame body 1. The frame body 1 has multiple chip mounting areas 2 arranged inside by longitudinal side ribs 3 and transverse side ribs 4. The frame body 1 is divided into three rows and thirty columns of chip mounting areas 2 by the longitudinal side ribs 3 and transverse side ribs 4. The longitudinal side rib 3 on one side of each column of chip mounting area 2 consists of several round holes, and the transverse side ribs 4 are arranged between the rows.

[0019] On the longitudinal side ribs 3 on both sides of each chip mounting area 2, there are several round holes on one side and a normal side rib structure on the other side. The transverse side ribs 4 are separated between the three rows of chip mounting areas 2, forming two rows of narrow side ribs. The upper row has more ribs than the lower row. Both can support each chip mounting area 2, which can enhance the mechanical strength of the overall frame body 1 and ensure the stability during the packaging process.

[0020] The entire frame body 1 has a total of 90 chip mounting areas 2. Since each chip mounting area 2 is divided into a row of chip mounting units 6 by connecting ribs 5, the first and third rows of chip mounting areas 2 have seven rows of chip mounting units 6, and the second row of chip mounting areas 2 has six rows of chip mounting units 6. That is to say, the first and third rows of chip mounting areas 2 have seven chip mounting units 6, and the second row of chip mounting areas 2 has six chip mounting units 6. The entire frame body 1 has a total of 600 chip mounting units 6, and each chip mounting unit 6 has 6 base islands 8, which can be used to install 6 chips.

[0021] When it is not necessary to package 6 chips at once, the two sets of base island boards 7 in the single chip mounting unit 6 can be divided and used separately. In other words, the package that installs 3 chips can be divided into 1200 base island boards 7 for use.

[0022] Each chip mounting area 2 is equipped with multiple chip mounting units 6 through connecting ribs 5. The connecting ribs 5 can disperse stress and enhance structural stability. The frame body 1 has several circular positioning holes 10 of different sizes on the outer side along the length direction, which can play a role in positioning assistance.

[0023] The four corners of the frame body 1 are set as rounded corner structures, and each rounded corner structure is provided with an arc-shaped inner groove 11. The angle between the arc-shaped segment at the lower end of the rounded corner structure and the horizontal line is preferably 30 degrees. The arc-shaped inner groove 13 is set at the upper end of the rounded corner structure, which can improve mechanical strength and prevent stress concentration. The rounded corner structure and the arc-shaped inner groove 13 can smoothly disperse these stresses and prevent them from accumulating at the corners. This prevents the material strip from tearing or breaking due to stress concentration during production and transportation, thereby ensuring the continuity of production and the yield rate.

[0024] Each chip mounting unit 6 consists of two symmetrically arranged base island boards 7, which are symmetrical from left to right. Each base island board 7 includes three base islands 8 of different sizes, which can be used to install chips of different sizes. Each base island 8 has an independent pin 9. Each base island board 7 has one base island 8 at the top and two base islands 8 at the bottom. The two base islands 8 on each base island board 7 have a larger area and can install larger chips, while the other base island 8 has a smaller area and can install smaller chips. The pin 9 of the upper base island 8 faces upward, while the pin 9 of the two lower base islands 8 faces downward. Each chip mounting unit 6 can install three sets of chips of different sizes.

[0025] By placing multiple base islands 8 and pins 9 in a single chip mounting unit 6, the unit volume can be reduced while meeting the requirements for longer packaging. In terms of the production of the frame body 1, more base islands 8 and pins 9 can be accommodated without increasing the size of the package, thus meeting the packaging requirements of chips of different sizes, further saving materials and reducing production costs.

[0026] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A lead frame which is more material saving, comprising a frame body (1), characterized in that: The frame body (1) is divided and arranged with multiple chip mounting areas (2) by longitudinal side ribs (3) and transverse side ribs (4). Each chip mounting area (2) is provided with multiple chip mounting units (6) by connecting ribs (5). Each chip mounting unit (6) is composed of two sets of base island plates (7) arranged symmetrically. Each set of base island plates (7) includes three base islands (8) of different sizes, which can be used to install chips of different sizes. Each base island (8) is independently provided with a pin (9).

2. The lead frame according to claim 1, characterized in that: The frame body (1) is divided into three rows and thirty columns of chip mounting areas (2) by longitudinal side ribs (3) and transverse side ribs (4). Each column of chip mounting area (2) has several round holes on one side of the longitudinal side rib (3), and the transverse side ribs (4) are set between the rows.

3. A more material-saving lead frame according to claim 2, characterized in that: The frame body (1) has several circular positioning holes (10) of different sizes on the outer side along the length direction. The four corners of the frame body (1) are set as rounded corner structures, and each rounded corner structure is provided with an arc-shaped inner groove (11).

4. A more material-saving lead frame according to claim 3, characterized in that: Each chip mounting area (2) is divided into a row of chip mounting units (6) by connecting ribs (5). The first and third rows of chip mounting areas (2) are provided with seven rows of chip mounting units (6), and the second row of chip mounting areas (2) is provided with six rows of chip mounting units (6).

5. A more material-saving lead frame according to claim 4, characterized in that: The two sets of base island boards (7) are symmetrical from left to right. Each set of base island boards (7) has one base island (8) at the top and two base islands (8) at the bottom. The pins (9) of the upper base island (8) face upwards, and the pins (9) of the two lower base islands (8) face downwards. Each chip mounting unit (6) can mount three sets of chips of different sizes.

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