Method for encapsulating a device with adjustable vacuum, mems structure and sensor
By placing a getter in the MEMS sensor cavity and combining it with vacuum filling, the problem of difficult vacuum control in MEMS sensors is solved, achieving precise vacuum adjustment and a simplified packaging process.
CN119370795BActive Publication Date: 2026-06-02MT MICROSYST
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- MT MICROSYST
- Filing Date
- 2024-12-25
- Publication Date
- 2026-06-02
AI Technical Summary
Technical Problem
Existing technologies struggle to precisely control the vacuum level of MEMS sensor cavities, and methods for adjusting different vacuum levels are cumbersome.
Method used
A getter is placed in the cavity of the MEMS sensor, and the vacuum level is adjusted by evacuating and filling with a specific gas, combined with the type of getter and the volume pressure of the gas. The getter absorbs the gas to achieve the required vacuum level.
Benefits of technology
It enables precise control of the vacuum level of the MEMS sensor cavity, meets the packaging requirements of different vacuum levels, and simplifies the adjustment process.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN119370795B_ABST
Abstract
The application is suitable for the technical field of device packaging, and provides a device packaging method with adjustable vacuum degree, a MEMS structure and a sensor. The method comprises the following steps: placing a getter in a cavity of a target device; vacuumizing the cavity of the target device; filling a target gas into the cavity of the target device to complete packaging of the target device; wherein the target gas at least comprises a gas that can be absorbed by the getter, the type and / or mass of the getter are determined according to the vacuum degree requirement of the target device, or the volume and pressure of the target gas are determined according to the vacuum degree requirement of the target device. The application can accurately control the vacuum degree of the device and realize adjustment of the vacuum degree.
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