Anti-interference photoelectric PCB board with electromagnetic shielding cover

Abstract

The utility model relates to an anti -interference photoelectric PCB board with electromagnetic shield cover, including shielding shell, its surrounds in circuit board circumference, and the one end of direction away from circuit board extension, its wiring port setting has the through groove to the circuit board, and the inside of through groove has the connecting portion, the inside of through groove has the connecting portion, the inside of through groove has the connecting portion, the inside of through groove has the connecting portion, the inside of through groove has the connecting portion, the inside of through groove has the connecting portion, the inside of through groove has the connecting portion, the inside of through groove has the connecting portion, the inside of through groove has the connecting portion, the inside of through groove has the connecting portion, the inside of through groove has the connecting portion, the inside of through groove has the connecting portion, the inside of through groove has the connecting portion, the inside of through groove has the connecting portion, the inside of through groove has the connecting portion, the inside of through groove has the connecting portion, the inside of through groove has the connecting portion, the inside of through groove has the connecting portion, the inside of through groove has the connecting portion, the inside of through groove has the connecting portion, the inside of through groove has the connecting portion, the inside of through groove has the connecting portion, the inside of through groove has the connecting portion, the inside of through groove has the connecting portion, the inside of through groove has the connecting portion,

Description

Technical Field

[0001] This utility model relates to the field of optoelectronic PCB technology, and more specifically to an anti-interference optoelectronic PCB with an electromagnetic shielding cover. Background Technology

[0002] With the rapid development of 5G communication, industrial IoT, and high-performance computing, optoelectronic PCBs, as the core carrier of signal transmission, have seen their electromagnetic interference (EMI) immunity become a key factor restricting the reliability of electronic systems. Current technological development exhibits the following significant characteristics:

[0003] High frequency and high speed: The signal transmission frequency of modern electronic devices has generally reached the GHz level (such as 16GHz under the PCIe 5.0 protocol), resulting in a significant skin effect, and traditional surface shielding layers are difficult to effectively suppress high frequency electromagnetic leakage;

[0004] 3D integration: The 3D stacked structure achieved through advanced packaging technologies such as through-silicon vias (TSV) increases the complexity of electromagnetic field distribution by 3-5 times compared to planar PCBs;

[0005] Severe dynamic operating conditions: In scenarios such as industrial automation (vibration frequency > 200Hz) and automotive electronics (temperature shock range -40℃ to 125℃), the deformation of the shielding structure caused by mechanical stress has become the main cause of EMI failure.

[0006] One of the technical bottlenecks of existing solutions is the lack of shielding integrity. Conventional solutions using vacuum-deposited or surface-mount shielding covers cannot effectively block electromagnetic interference from all directions in complex and variable electromagnetic environments. Due to insufficient tightness between the shielding layer and the PCB board, gaps and holes exist, resulting in a shielding effectiveness (SE) typically below 40dB in the 1-3GHz frequency band. Furthermore, electromagnetic leakage windows exist due to connector openings. These problems severely restrict the application and development of optoelectronic PCBs in high-performance electronic devices.

[0007] Therefore, how to provide a more effective optoelectronic PCB board for solving interference is a problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0008] Therefore, the purpose of this utility model is to propose an anti-interference optoelectronic PCB board with an electromagnetic shielding cover, which can more effectively solve the anti-interference problem.

[0009] The technical solution of this utility model is an anti-interference optoelectronic PCB board with an electromagnetic shielding cover, including:

[0010] A shielding shell surrounds the circuit board circumferentially and extends toward one end away from the circuit board; it has a through groove corresponding to the wiring port of the circuit board, and the inside of the through groove has a connecting part;

[0011] An inner curved plate is initially arranged vertically along the top of the connecting part, and in a bent state faces the circuit board and is welded to the circuit board. It has a wire clamp on it.

[0012] The outer cover has one end that can be opened and closed with the shielding shell, and the other end that can be bent outside the through slot, which can open or close the through slot, and has a wire groove on it;

[0013] The shielding cover is located at the top of the extended end of the shielding shell and forms a fully enclosed electromagnetic shielding cover with the shielding shell.

[0014] According to the anti-interference optoelectronic PCB board of this utility model, the inner bending plate can be bent at 90 degrees along the top of the connecting part, and after the inner bending plate is bent, it forms a stepped welding structure with the inner side of the connecting part, thereby increasing the contact area between the shielding shell and the circuit board.

[0015] According to the anti-interference optoelectronic PCB board of this utility model, the wire clamp is an L-shaped groove that fixes the wires of the wiring terminals on the circuit board.

[0016] According to the anti-interference optoelectronic PCB board of this utility model, the inner bending plate is bent to form a Z-shaped avoidance bend at the position opposite to the wiring terminal, and the open end of the wire clamp is located on one side of the avoidance bend.

[0017] According to the anti-interference optoelectronic PCB board of this utility model, the shielding shell has a slot below the through slot, and one end of the outer cover extends out a locking block that is interference-fitted with the slot; the wire groove is opened vertically along the outer cover to avoid the wires extending from the circuit board.

[0018] According to the anti-interference optoelectronic PCB board of this utility model, both the shielding shell and the shielding cover are made of conductive metal materials.

[0019] According to the anti-interference optoelectronic PCB board of this utility model, the width of the L-shaped groove of the wire clamp is 1.0-1.5mm, which matches the diameter of the wire, and the height of the avoidance bend is 2-3mm, forming a stress-warming space for the wire.

[0020] According to the anti-interference optoelectronic PCB board of this utility model, the width of the groove is 1.0-1.5mm, and the electromagnetic leakage attenuation value between it and the shielding shell in the closed state is less than 0.5dB.

[0021] According to the anti-interference optoelectronic PCB board of this utility model, the depth of the slot is 1.0-1.5mm, the height of the card block is 1.2-1.7mm, and the interference fit tolerance between the two is controlled within 0.05-0.1mm.

[0022] According to the present invention, the height of the shielding shell is 3-5mm higher than the height of the tallest electronic component in the circuit board, the width of the through slot is 3-5mm and the height is 5-8mm; the circuit board is made of FR-4 substrate with a thickness of 1.0-2.0mm; the shielding shell and shielding cover are made of aluminum or copper alloy.

[0023] As can be seen from the above technical solution, compared with the prior art, the present invention has the following technical effects:

[0024] 1. Improved Electromagnetic Shielding Performance: The fully enclosed shielding device (shielding shell + shielding cover) improves the shielding effectiveness (SE) of the 1-6GHz frequency band to over 65dB, which is 80% higher than that of traditional planar shielding layers. After the through-slot is closed by the outer cover, the gap leakage attenuation value is <0.5dB.

[0025] 2. Enhanced mechanical connection reliability: The 90° bend of the inner bending plate forms a stepped welding structure with the connecting part, increasing the contact area with the circuit board by 3.2 times and achieving a tensile strength of 380 N / mm². 2 (Traditional solution 120N / mm) 2 The interference fit tolerance between the slot and the block is 0.05-0.1mm to ensure that the displacement is <8um under 5Grms vibration.

[0026] 3. Optimization of conductor protection and stability: The L-shaped groove clamp (groove width 1.0-1.5mm) and the avoidance bend (height 2-3mm) work together to improve the shear stress dispersion rate of the conductor.

[0027] 4. Dynamic operating condition adaptability: The cable trays (1.0-1.5mm wide) of the outer cover allow the wires to expand and contract freely when closed, while maintaining the integrity of the shield. The contact impedance remains <2mΩ even under temperature shocks of -40℃ to 125℃. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0029] Figure 1A half-sectional structural diagram of the anti-interference optoelectronic PCB board with an electromagnetic shielding cover provided by this utility model.

[0030] Figure 2 A schematic diagram of the anti-interference optoelectronic PCB board with an electromagnetic shielding cover provided by this utility model from a bottom view.

[0031] Figure 3 The schematic diagram shows the structure of the inner and outer sides of the through groove;

[0032] Figure 4 The diagram illustrates the connection between the outer cover and the shielding shell. Detailed Implementation

[0033] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0034] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0035] As the core carrier of signal transmission, the electromagnetic interference (EMI) immunity of optoelectronic PCBs has become a key factor restricting the reliability of electronic systems. Existing conventional solutions using vacuum-deposited or surface-mount shielding covers cannot effectively block EMI from all directions in the face of complex and variable electromagnetic environments. Furthermore, due to insufficient tightness between the shielding layer and the PCB board, gaps and holes exist, resulting in a shielding effectiveness (SE) typically below 40dB in the 1-3GHz frequency band, and electromagnetic leakage windows due to connector openings also exist. These problems severely restrict the application and development of optoelectronic PCBs in high-performance electronic devices.

[0036] In view of this, the present invention provides an anti-interference optoelectronic PCB board with an electromagnetic shielding cover, see attached figure. Figure 1-4The shielding system includes a shielding shell 2, a shielding cover 3, a connecting part 5, an inner curved plate 6, and an outer cover 9. The shielding shell 2 surrounds the circuit board 1 circumferentially and extends towards one end away from the circuit board 1. The shielding cover 3 is located at the top of the extended end of the shielding shell 2 and forms a fully enclosed electromagnetic shielding cover with the shielding shell 2. In order to better fix the shielding shell 2 to the circuit board 1, reduce the splitting of the shielding cover 3 caused by vibration, and reduce the incomplete shielding caused by connecting wires, through slots 4 are provided at the corresponding wiring ports of the circuit board 1 on the shielding shell 2, and the connecting part 5 is provided inside the through slot 4.

[0037] The inner bending plate 6 (integrated with the connecting part) is normally located within the through groove 4. When needed, the inner bending plate 6 is bent inward at a 90-degree angle to form a stepped structure with the inner side of the connecting part. At this time, the shielding shell 2 is welded to the circuit board 1, increasing the tightness of the connection between the circuit board 1 and the shielding shell 2 (i.e., initially the inner bending plate is vertically arranged along the top of the connecting part 5, and the bent state faces the top of the circuit board 1). The inner bending plate 6 has a wire clamp 7.

[0038] One end of the outer cover 9 is openable and closable with the shielding shell 2, and the other end can be bent outside the through groove 4. When the outer cover 9 is bent downwards, it closes the outside of the through groove 4. The outer cover 9 has a wire groove 10 to avoid wires extending from the circuit board 1. This increases the overall shielding effectiveness and the smooth connection between the inside and outside of the shielding cover.

[0039] Advantageously, see appendix. Figure 3 The wire clamp 7 has an L-shaped groove to fix the wires of the terminals on the circuit board 1, reducing the possibility of the wires and terminals becoming detached due to vibration. The inner bending plate 6 is bent to form a Z-shaped avoidance bend 8 opposite to the terminal. The open end of the wire clamp 7 is located on one side of the avoidance bend 8. The avoidance bend 8 can fix the wires while protecting them from interference damage caused by the downward pressure of the inner bending plate 6.

[0040] The width of the L-shaped groove of the wire clamp 7 can be 1.0-1.5mm, matching the diameter of the wire, and the height of the avoidance bend 8 can be 2-3mm, forming a stress-relieving space for the wire.

[0041] See appendix Figure 4 In order to maintain a closed and stable seal after the outer cover 9 is closed, the shielding shell 2 is provided with a slot 11 below the through groove 4, and a locking block 12 that is interference-fitted with the slot 11 extends from one end of the outer cover 9 at the position of the slot 11; the wire groove 10 is opened vertically along the outer cover 9 to avoid the wires extending from the circuit board 1.

[0042] Advantageously, the end of the locking block 12 can protrude towards the bottom of the shielding shell 2, making it easy to open and close the outer cover 9.

[0043] The outer cover 9 is also made of the same or compatible metal material as the shielding shell 2.

[0044] In the above embodiments, both the shielding shell 2 and the shielding cover 3 are made of conductive metal materials.

[0045] Specifically, the shielding shell 2 and the shielding cover 3 can be made of aluminum or copper alloy.

[0046] In this invention, it is recommended that the width of the wire groove 10 be 1.0-1.5mm, and that the electromagnetic leakage attenuation value between it and the shielding shell 2 in the closed state be less than 0.5dB. The depth of the slot 11 is 1.0-1.5mm, and the height of the locking block 12 is 1.2-1.7mm, with the interference fit tolerance between the two controlled within 0.05-0.1mm.

[0047] The height of the shielding shell 2 is 3-5 mm higher than the height of the tallest electronic component in the circuit board 1. The width of the through slot 4 is 3-5 mm and the height is 5-8 mm. The circuit board 1 uses FR-4 substrate with a thickness of 1.0-2.0 mm.

[0048] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0049] In the specific embodiments of this utility model, the following are for illustrative purposes only and are not intended to limit the utility model. The following parameters are selected in conjunction with the materials and structural assembly:

[0050] Shielding shell forming: The aluminum / copper alloy sheet (thickness 0.8mm) is processed into a frame-shaped shielding shell 2 (fitted with the shape of the outer wall of the circuit board) by stamping process. The height is 3-5mm higher than the tallest component (such as capacitor) on the circuit board 1, and the side wall spacing tolerance is ±0.1mm.

[0051] Through-slot processing: A through-slot 4 (3-5mm wide, 5-8mm high) is opened on the side wall of the shield shell 2. A connecting part 5 (2mm wide) is formed on the inside of the through-slot 4 by etching. An inner bending plate 6 (0.3mm thick, 8mm long) is reserved at the top.

[0052] Shielding cover installation: The stamped shielding cover 3 (material is the same as shielding shell 2) is closed to the top of the shielding shell 2 by laser welding to form a fully enclosed cavity, and the weld width is ≤0.2mm.

[0053] Welding process for inner bent plates:

[0054] Bending operation: Using a precision bending fixture (angle error ±0.5°), bend the inner bending plate 6 (thickness 0.3mm) 90° towards the circuit board 1 to form a horizontal section. After bending, the horizontal section covers the grounding copper foil area of ​​the circuit board 1 (3.2mm wide).

[0055] Laser welding: A fiber laser (wavelength 1070nm, power 300W) can be used in pulse mode (frequency 20Hz, pulse width 5ms). The laser power is adjusted to 250-350W to form a weld point with a spacing of 1.2-1.8mm between the horizontal section of the inner curved plate 6 and the circuit board 1. The weld point diameter is 0.4mm and the penetration depth is 0.25mm. Welding strength requirement: tensile strength 380N / mm2.

[0056] Wire fixing and shielding closure: Embed the wire (0.8mm in diameter) into the L-shaped groove (1.2mm wide) of the wire clip 7, with a bending radius > 3 times the diameter. Avoid the Z-shaped space (2.5mm high) of the bend 8. The outer cover 9 bends downward 90° to cover the through groove 4, and the wire passes through the wire groove 10 (1.2mm wide). The locking block 12 (1.5mm high) is pressed into the locking groove 11 (1.2mm deep), with an interference fit of 0.08mm, and the gap width after closure is <0.05mm.

[0057] Material selection: Circuit board 1: FR-4 substrate, dielectric constant 4.5@1GHz, thickness 1.6mm; Shielding shell 2, shielding cover 3, and outer cover can be made of 5052 aluminum alloy (conductivity 30% IACS) or C1100 copper (conductivity 98% IACS).

[0058] This invention enhances connection stability:

[0059] The connection design between the inner bending plate 6 and the circuit board 1 significantly enhances the stability of the overall structure. The inner bending plate 6 is bent inward at a 90-degree angle to form a stepped structure with the inner side of the connecting part 5 before being welded to the circuit board 1. This unique connection method greatly increases the contact area and connection strength between the two. Compared to traditional simple fixing methods, it can more effectively resist external forces such as vibration. In some industrial automation equipment, strong vibrations often occur during operation, and this design ensures that the shielding shell 2 and the circuit board 1 are always tightly connected. This not only ensures the integrity of the electromagnetic shielding cover but also provides a solid physical foundation for the stable operation of the optoelectronic PCB board, avoiding signal interference and equipment failure caused by structural loosening, and improving the reliability and stability of the entire system.

[0060] This invention improves the reliability of wire connections:

[0061] The design of the wire clamp 7 and the avoidance bend 8 plays a crucial role in improving the reliability of wire connections. The wire clamp 7, with its L-shaped groove structure, firmly secures the wires connected to the terminals on the circuit board 1, effectively limiting wire displacement. During equipment operation, even under external forces such as vibration, the wires are unlikely to detach from the terminals, significantly reducing the risk of desoldering. The avoidance bend 8 cleverly protects the wires from interference damage when the inner bending plate 6 presses down. When the inner bending plate 6 bends to fix the wires, the Z-shaped structure of the avoidance bend 8 provides ample space for the wires, preventing damage such as compression and abrasion. In the optoelectronic PCB boards of data center servers, numerous wires, through the synergistic effect of the wire clamp 7 and the avoidance bend 8, can maintain a stable long-term connection to the terminals, ensuring reliable signal transmission, reducing signal interruptions and data errors caused by wire connection problems, and improving the server's operating efficiency and stability.

[0062] This invention improves the shielding effect:

[0063] The design of the outer cover 9, wire groove 10, slot 11, and locking block 12 comprehensively improves the overall shielding effect of the shielding cover. The outer cover 9 can be bent on the through groove 4, and when bent downwards, it can close the outside of the through groove 4, effectively blocking external electromagnetic interference from entering the interior of the shielding cover through the through groove 4. The wire groove 10 not only reasonably avoids the wires extending from the circuit board 1, but also further optimizes the shielding structure and reduces the possibility of electromagnetic leakage. The interference fit of the slot 11 and locking block 12 allows the outer cover 9 to be tightly fixed on the shielding shell 2, ensuring the airtightness of the shielding cover. In consumer electronic devices such as mobile phones, this design can effectively shield external electromagnetic interference, improve the reception quality and stability of mobile phone signals, reduce the occurrence of problems such as call interruption and weak signal, and provide users with a better user experience.

[0064] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0065] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. An anti-interference optoelectronic PCB board with an electromagnetic shielding cover, characterized in that, include: The shielding shell (2) extends around the circuit board (1) in the circumferential direction and toward one end away from the circuit board (1); it is provided with a through groove (4) corresponding to the wiring port of the circuit board (1), and the inside of the through groove (4) has a connecting part (5); The inner bending plate (6) is initially arranged vertically along the top of the connecting part (5), and in a bent state faces the circuit board (1) and is welded to the circuit board (1), and has a wire clamp (7) on it; The outer cover (9) has one end that can be opened and closed with the shielding shell (2), and the other end that can be bent outside the through groove (4), which can open or close the through groove (4) and has a wire groove (10) on it; The shielding cover (3) is located at the top of the extended end of the shielding shell (2) and forms a fully enclosed electromagnetic shielding cover with the shielding shell (2).

2. The anti-interference optoelectronic PCB board with an electromagnetic shielding cover according to claim 1, characterized in that, The inner bending plate (6) can be bent at 90 degrees along the top of the connecting part (5), and after the inner bending plate (6) is bent, it forms a stepped welding structure with the inner side of the connecting part (5), thereby increasing the contact area between the shielding shell (2) and the circuit board (1).

3. The anti-interference optoelectronic PCB board with an electromagnetic shielding cover according to claim 1, characterized in that, The wire clamp (7) has an L-shaped groove and fixes the wires of the terminals on the circuit board (1).

4. The anti-interference optoelectronic PCB board with an electromagnetic shielding cover according to claim 3, characterized in that, The inner bending plate (6) is bent to form a Z-shaped avoidance bend (8) opposite the terminal block, and the open end of the wire clamp (7) is located on one side of the avoidance bend (8).

5. The anti-interference optoelectronic PCB board with an electromagnetic shielding cover according to claim 1, characterized in that, The shielding shell (2) has a slot (11) below the through slot (4), and one end of the outer cover (9) extends out a block (12) that is interference-fitted with the slot (11); the wire groove (10) is opened vertically along the outer cover (9) to avoid the wires extending from the circuit board (1).

6. The anti-interference optoelectronic PCB board with an electromagnetic shielding cover according to any one of claims 1-5, characterized in that, Both the shielding shell (2) and the shielding cover (3) are made of conductive metal materials.

7. The anti-interference optoelectronic PCB board with an electromagnetic shielding cover according to claim 4, characterized in that, The width of the L-shaped groove of the wire clamp (7) is 1.0-1.5mm, which matches the diameter of the wire, and the height of the avoidance bend (8) is 2-3mm, forming a stress-relieving space for the wire.

8. The anti-interference optoelectronic PCB board with an electromagnetic shielding cover according to claim 5, characterized in that, The width of the cable groove (10) is 1.0-1.5mm, and the electromagnetic leakage attenuation value between it and the shielding shell (2) in the closed state is less than 0.5dB.

9. The anti-interference optoelectronic PCB board with an electromagnetic shielding cover according to claim 5, characterized in that, The depth of the slot (11) is 1.0-1.5mm, and the height of the block (12) is 1.2-1.7mm. The interference fit tolerance between the two is controlled at 0.05-0.1mm.

10. The anti-interference optoelectronic PCB board with an electromagnetic shielding cover according to claim 6, characterized in that, The height of the shielding shell (2) is 3-5 mm higher than the highest electronic component in the circuit board (1), the width of the through slot (4) is 3-5 mm and the height is 5-8 mm; the circuit board (1) is made of FR-4 substrate with a thickness of 1.0-2.0 mm; the shielding shell (2) and the shielding cover (3) are made of aluminum or copper alloy.

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