An electromagnetic shielding protection structure for an optical module

Abstract

The application discloses an electromagnetic shielding protection structure of an optical module, and relates to the technical field of optical communication.The electromagnetic shielding protection structure comprises a supporting mechanism, an external connecting mechanism is fixedly connected to the top surface of the supporting mechanism, and a network cable interface is formed in the left side of the external connecting mechanism.The electromagnetic shielding protection structure solves the problem that the existing protection structure lacks a split protection structure for key components, and when a single module in a PCB needs to be maintained, the whole shell needs to be disassembled, which may cause damage to other components of the circuit board due to accidental touch, and the safety hazard problem is solved.Through the cooperation of the linkage structure of the limiting plug and the top rod assembly, the split protection and targeted maintenance of the single module in the PCB are realized, the whole shell does not need to be disassembled, the safety hazard problem of accidental touch and damage to other components during maintenance is effectively avoided, and the problem of inconvenient maintenance caused by the lack of a split protection structure in the prior art is solved.

Description

An electromagnetic shielding protection structure for optical modules Technical Field

[0001] This invention relates to the field of optical communication technology, specifically to an electromagnetic shielding protection structure for an optical module. Background Technology

[0002] Optical modules, as the core components for photoelectric signal conversion in optical communication systems, directly determine the data transmission rate, stability, and reliability. They are widely used in critical scenarios such as data centers, 5G base stations, and fiber optic broadband networks. With the rapid development of communication technology, the transmission rate of optical modules has jumped from the early 10G and 25G to 100G, 400G, and even 800G, with high frequency and miniaturization becoming the mainstream trends in the industry. However, this increase in speed is accompanied by a significant increase in the operating frequency of internal electronic components, making electromagnetic radiation issues increasingly prominent. High-frequency signals are prone to leakage through gaps in the casing during transmission, while radio frequency interference and electrostatic pulses from the external environment can also intrude into the module, leading to an increase in the signal transmission error rate and, in severe cases, even communication interruptions.

[0003] In the prior art, such as Chinese Patent Publication No. CN115867012A, a novel electromagnetic shielding optical module shell structure is disclosed, including a protective shell and a motherboard assembly. The motherboard assembly is disposed inside the protective shell assembly. The protective shell assembly is composed of an upper shell and a lower shell. Connecting members are provided on both the front and rear sides of the bottom of the upper shell. Connecting grooves are provided at the corresponding positions of the connecting members on both sides of the lower shell. Three sets of limiting blocks are provided on one side of each of the two sets of connecting grooves. Grooves are provided at the corresponding positions of the two sets of connecting members and the three sets of limiting blocks. Two sets of plug-in members are provided on both sides of the interior of the upper shell. Plug-in grooves are provided at the corresponding positions of the four sets of plug-in members on the lower shell. A first elastic component is provided on one side of the plug-in groove. Compared with the existing electromagnetic shielding optical module shell structure, the present invention improves the convenience and practicality of the existing electromagnetic shielding optical module shell structure through design.

[0004] Existing electromagnetic shielding structures for optical modules mostly employ a single metal casing. While this can block electromagnetic radiation to some extent, it has the following drawbacks: First, the fit between the casing and the internal components of the optical module is insufficient, easily leading to gaps that leak electromagnetic signals. Second, there is a lack of separate protective structures for critical components. If a single module on the PCB needs to be repaired, the entire casing must be disassembled. However, this disassembly method can easily damage other components on the circuit board that do not require repair due to accidental contact, posing a safety hazard.

[0005] Therefore, we propose an electromagnetic shielding protection structure for optical modules to address the lack of separate protection structures for key components in the existing protection structures mentioned in the background. When it is necessary to repair individual modules in the PCB circuit board, the entire outer shell needs to be disassembled. However, this disassembly method can easily cause damage to other components on the circuit board that do not need repair due to accidental contact, posing a safety hazard. Summary of the Invention

[0006] The purpose of this invention is to provide an electromagnetic shielding protection structure for optical modules, in order to solve the problem that the existing protection structures mentioned in the background art lack a separate protection structure for key components. When it is necessary to repair a single module in the PCB circuit board, the entire outer shell needs to be disassembled. However, this disassembly method is prone to damage to other components of the circuit board that do not need to be repaired due to accidental contact, which poses a safety hazard.

[0007] To achieve the above objectives, the present invention provides the following technical solution: an electromagnetic shielding protection structure for an optical module, comprising: a support mechanism, wherein an external mechanism is fixedly connected to the top surface of the support mechanism, and a network cable interface is provided on the left side of the external mechanism, wherein there are two network cable interfaces, and the two network cable interfaces are arranged in a linear array;

[0008] A heat-conducting substrate is fixedly connected to the top surface of the support mechanism. Two positioning holes are arranged in a linear array inside the heat-conducting substrate. Slot assemblies are arranged in a linear array on both the front and rear sides of the external mechanism. A spring rod is fixedly connected to the inner side of the slot assembly. The main body of the spring rod is a telescopic rod structure with a spring. A limit block is fixedly connected to the side of the spring rod away from the slot assembly. The limit block is a rectangular plate structure. A groove is opened at the top of the limit block. A magnetic attraction assembly is fixedly connected inside the groove. The magnetic attraction assembly is a ring structure.

[0009] Preferably, the outer side of the support mechanism is provided with a transverse groove, which is a guide groove. There are two guide grooves, which are respectively opened on the front and rear sides of the support mechanism. The support mechanism is a hollow structure, and a circulation pipe is installed on the inner side of the support mechanism.

[0010] Preferably, the circulation tube is a copper tube structure, and an inlet pipe and an outlet pipe are fixedly connected to the right side of the circulation tube. The inlet pipe and the outlet pipe together form a circulation structure for the circulation tube. A PCB board is placed on the top of the heat-conducting substrate, and two mounting holes are opened in a linear array inside the PCB board.

[0011] Preferably, a fixing bolt is screwed into the inside of the mounting hole, and the fixing bolt is connected to the positioning hole opened in the heat-conducting substrate on the downward side. The control assembly and gold fingers are fixedly connected to the top surface of the PCB board.

[0012] Preferably, a connecting component is fixedly connected to the top surface of the PCB board. The connecting component is perpendicular to the PCB board, and a light receiving component and a light emitting component are fixedly connected from front to back on the left side of the connecting component. Both the light receiving component and the light emitting component are used to connect to an external mechanism fixedly connected to the top surface of the support mechanism.

[0013] Preferably, the top of the support mechanism is fitted with a housing mechanism. There are three housing mechanisms in total, and the three housing mechanisms are installed in a linear array on the top of the support mechanism. A shielding baffle is fixedly connected to the right side of the housing mechanism located on the right side, and the shielding baffle is located above the gold finger. A positioning guide rod is fixedly connected to the top surface of the housing mechanism.

[0014] Preferably, the positioning guide rod is a cylindrical structure, and the positioning guide rod is perpendicular to the housing mechanism. The housing mechanism and the positioning guide rod together form a guiding structure. A base plate assembly is fixedly connected to the inner side of the housing mechanism. The base plate assembly is perpendicular to the inner wall of the housing mechanism. Two pop-out components are fixedly connected in a linear array on the bottom end face of the base plate assembly. The pop-out components are used to insert into the limiting plug. Two slots for matching the limiting plug are opened in a linear array on both the front and rear sides of the housing mechanism.

[0015] Preferably, a displacement mechanism is installed inside the guide groove. There are two displacement mechanisms, which are arranged opposite to each other. Two protruding plug assemblies are fixedly connected to the outer sides of the two displacement mechanisms. A connecting base plate is fixedly connected to the side of the displacement mechanism away from the support mechanism. The connecting base plate is vertically arranged, and a guide socket is fixedly connected to the front end face of the connecting base plate. A guide slot is opened at the top of the guide socket.

[0016] Preferably, a guide rod mechanism is inserted inside the connecting base plate. The guide rod mechanism is a cylindrical structure, and a baffle assembly is fixedly connected to the outside of the guide rod mechanism. A return spring is fixedly connected between the baffle assembly and the connecting base plate. The return spring is used to promote the baffle assembly to move away from the connecting base plate. A balance plate is fixedly connected to the side of the guide rod mechanism away from the baffle assembly. Two top rod assemblies are fixedly connected in a linear array on the side of the balance plate away from the guide rod mechanism.

[0017] Preferably, the top rod assembly is a cylindrical structure, and the top rod assembly is used to arrange the limiting blocks. The inner side of the guide slot is inserted with a block mechanism, the outer side of the block mechanism is fixedly connected with a guide slider, and the top surface of the block mechanism is fixedly connected with a reinforcing bracket. Each pair of longitudinally adjacent block mechanisms forms a group, and there are two reinforcing brackets. The front and rear sides of the two reinforcing brackets are fixedly connected with connecting baffles. The center of the transverse component in the reinforcing bracket is fixedly connected with a magnetic collar of an annular structure, and the magnetic collar matches the positioning guide rod.

[0018] Compared with the prior art, the beneficial effects of the present invention are:

[0019] 1. When using this invention, by setting up three independent housing mechanisms, in conjunction with the linkage structure of the limiting plug and the top rod assembly, it realizes the separate protection and targeted maintenance of individual modules in the PCB circuit board. It does not require disassembling the entire housing, effectively avoiding the safety hazard of accidentally damaging other components during maintenance, and solving the problem of inconvenience in maintenance caused by the lack of a separate protection structure in the prior art.

[0020] 2. When the present invention is used, the tight fit between the shell mechanism and the support mechanism, the auxiliary fixation of the magnetic attraction component, and the sealing effect of the reinforcement bracket greatly improve the fit between the shell and the internal components, reduce electromagnetic signal leakage caused by gaps, enhance electromagnetic shielding performance, and overcome the defects of poor shielding effect of traditional structures.

[0021] 3. When using this invention, a heat dissipation design combining a copper tube circulation pipe and a heat-conducting substrate is adopted, which can quickly conduct and dissipate the heat generated by the PCB board, avoiding the impact of high temperature on the operational stability of the optical module. Compared with the existing structure that only relies on the outer shell for heat dissipation, the heat dissipation efficiency is higher, further ensuring the reliable operation of the optical module at high transmission rates.

[0022] 4. In use, this invention achieves precise protection and independent maintenance of key components of the optical module through its innovatively designed split-shell mechanism and linkage unlocking component. Compared to existing integral shell structures, its core advantage lies in the fact that maintenance does not require disassembling the entire protective shell. Only the displacement mechanism needs to drive the push rod assembly to open the corresponding limiting block, allowing the target shell mechanism to be removed individually. This design fundamentally solves the safety hazard of accidental damage to non-maintainable components due to complete disassembly during traditional maintenance processes, while also avoiding damage to the shell's shielding performance from repeated disassembly. Furthermore, the dual fixing structure of the limiting block and magnetic component ensures stable installation of the shell while simplifying the disassembly and assembly process, significantly shortening the maintenance time per operation. This is particularly suitable for scenarios with high requirements for equipment maintenance efficiency, such as data centers, balancing protection reliability and maintenance convenience.

[0023] 5. In use, this invention addresses the electromagnetic compatibility challenges of high-frequency operation of optical modules by constructing a multi-layered collaborative shielding system, significantly superior to existing single-shell shielding methods. Firstly, three shell structures provide independent shielding spaces for key modules on the PCB board, such as the central control component and the optical transceiver component, reducing electromagnetic interference between modules. Secondly, the shielding baffle specifically reinforces the protection of the gold finger area, blocking the intrusion path of external interference signals. More importantly, the tight fit between the limiting plug and the shell slot, the gap compensation effect of the magnetic component, and the sealing treatment of the shell gaps by the reinforcing bracket completely eliminate electromagnetic leakage paths caused by assembly errors in traditional structures. This multi-dimensional shielding design effectively improves the optical module's ability to suppress electromagnetic radiation, ensuring signal integrity at high transmission rates of 100G and above, and reducing the risk of communication interruptions due to electromagnetic interference.

[0024] 6. In use, the heat-conducting substrate is bonded to the PCB board over a large area, rapidly dissipating the heat generated by the components. Within the hollow support structure, copper circulation pipes are in close contact with the heat-conducting substrate, efficiently carrying away heat through the flowing medium. Its heat dissipation efficiency is far superior to the natural heat dissipation of traditional metal casings. Simultaneously, air convection between the casing structure and the PCB board forms an auxiliary heat dissipation path, further enhancing heat diffusion. This active heat dissipation design can respond in real-time to heat changes in the optical module under high load, effectively controlling the operating temperature of the core components on the PCB board and avoiding performance degradation due to localized overheating. Compared to existing technologies, its heat dissipation capacity is significantly improved, meeting the heat dissipation requirements of high-speed optical modules such as 400G and 800G, extending the equipment's lifespan and stable operating cycle. Attached Figure Description

[0025] Figure 1 is a front perspective view of the disassembled electromagnetic shielding protection structure of an optical module according to the present invention.

[0026] Figure 2 is a top-view perspective view of the disassembled electromagnetic shielding protection structure of an optical module according to the present invention.

[0027] Figure 3 is an overall axial side perspective view of an electromagnetic shielding protection structure for an optical module according to the present invention.

[0028] Figure 4 is a perspective view of the combination of the support mechanism and the circulation tube of an electromagnetic shielding protection structure for an optical module according to the present invention.

[0029] Figure 5 is a perspective view of the housing mechanism and positioning guide rod combination of an electromagnetic shielding protection structure for an optical module according to the present invention.

[0030] Figure 6 is a perspective view of the combination of the plug mechanism and the guide slider of the electromagnetic shielding protection structure of the optical module according to the present invention.

[0031] Figure 7 is a perspective view of the PCB board and mounting holes of an electromagnetic shielding protection structure for an optical module according to the present invention.

[0032] Figure 8 is a perspective view of the displacement mechanism and plug assembly combination of an electromagnetic shielding protection structure for an optical module according to the present invention.

[0033] Figure 9 is an enlarged perspective view of point A in Figure 2 of an electromagnetic shielding protection structure for an optical module according to the present invention.

[0034] In the diagram: 1. Support mechanism; 101. Guide groove; 1011. Circulation pipe; 1012. Liquid inlet pipe; 1013. Liquid outlet pipe; 2. External mechanism; 201. Network cable interface; 2011. Thermal conductive substrate; 2012. Positioning hole; 2013. Slot assembly; 2014. Spring rod; 2015. Limiting insert; 2016. Magnetic suction assembly; 3. PCB board; 301. Mounting hole; 3011. Fixing bolt; 3012. Central control assembly; 3013. Gold finger; 3014. Connection assembly; 3015. Optical receiving assembly; 3016. 4. Housing mechanism; 401. Positioning guide rod; 4011. Base plate assembly; 4012. Pop-out assembly; 4013. Shielding baffle; 5. Displacement mechanism; 501. Insertion block assembly; 5011. Connecting base plate; 5012. Guide socket; 5013. Guide slot; 6. Guide rod mechanism; 601. Block assembly; 6011. Return spring; 6012. Balance plate; 6013. Top rod assembly; 7. Insertion block mechanism; 701. Guide slider; 7011. Reinforcing bracket; 7012. Connecting baffle; 7013. Magnetic collar. Detailed Implementation

[0035] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0036] Example 1

[0037] Please refer to Figures 1-9. The present invention provides a technical solution: an electromagnetic shielding protection structure for an optical module, including a support mechanism 1. An external mechanism 2 is fixedly connected to the top surface of the support mechanism 1. A network cable interface 201 is provided on the left side of the external mechanism 2. There are two network cable interfaces 201, and the two network cable interfaces 201 are arranged in a straight line array.

[0038] A heat-conducting substrate 2011 is fixedly connected to the top surface of the support mechanism 1. Two positioning holes 2012 are arranged in a linear array inside the heat-conducting substrate 2011. Slot assemblies 2013 are arranged in a linear array on both the front and rear sides of the external connection mechanism 2. A spring rod 2014 is fixedly connected to the inner side of the slot assembly 2013. The main body of the spring rod 2014 is a telescopic rod structure with a spring, and a limit block 2015 is fixedly connected to the side of the spring rod 2014 furthest from the slot assembly 2013. The positioning block 2015 has a rectangular plate structure, and a groove is provided at the top of the positioning block 2015. A magnetic suction component 2016 is fixedly connected inside the groove. The magnetic suction component 2016 has a ring structure. A transverse groove is provided on the outer side of the support mechanism 1. The transverse groove is a guide groove 101. There are two guide grooves 101, and the two guide grooves 101 are respectively provided on the front and rear sides of the support mechanism 1. The support mechanism 1 has an internal hollow structure, and a circulation pipe 1011 is installed on the inner side of the support mechanism 1.

[0039] In this embodiment, during use, the support mechanism 1 serves as the load-bearing foundation of the entire structure. Its top surface provides stable support for the PCB board 3 through the fixedly connected heat-conducting substrate 2011. The PCB board 3 forms a rigid connection with the positioning hole 2012 of the heat-conducting substrate 2011 through its own mounting hole 301 and the internally screwed fixing bolt 3011, ensuring that the PCB board 3 will not be displaced during operation.

[0040] Inside the slot assembly 2013 on both the front and rear sides of the external mechanism 2, the spring rod 2014 is in a naturally extended state, and the limiting plug 2015 connected to its end maintains an outward extension tendency under the action of spring force. When the housing mechanism 4 is inserted along the top of the support mechanism 1, the pop-out assembly 4012 will extend downward and insert into the limiting plug 2015. When the housing mechanism 4 is fully in place, the spring rod 2014 returns to its original position, and the limiting plug 2015 is inserted into the slot. At the same time, the magnetic attraction assembly 2016 in the groove at the top of the limiting plug 2015 generates a magnetic attraction force with the corresponding position of the housing mechanism 4, forming a double fixation.

[0041] When it is necessary to inspect individual modules such as the central control component 3012 and the optical receiving component 3015 on the PCB board 3, the operator can push the displacement mechanism 5 so that it slides in the guide groove 101 of the support mechanism 1 through the plug assembly 501 until the connecting substrate 5011 drives the guide rod mechanism 6 to move to the outside of the limit plug 2015 corresponding to the target housing mechanism 4.

[0042] At this time, the resistance plate assembly 601 is pressed towards the support mechanism 1, the reset spring 6011 is compressed, the guide rod mechanism 6 drives the balance plate 6012 and the push rod assembly 6013 to move synchronously, the push rod assembly 6013 is inserted into the gap between the limit plug 2015 and the slot assembly 2013, pushes the limit plug 2015 back into the slot assembly 2013, and releases the lock on the housing mechanism 4;

[0043] Subsequently, the pop-out component 4012 at the bottom of the inner bottom plate assembly 4011 of the housing mechanism 4 will push the housing mechanism 4 upward slightly due to the loss of the constraint of the limiting block 2015, making it easier for the operator to directly remove the housing mechanism 4 and expose the parts that need to be repaired, while the other two housing mechanisms 4 still maintain the protective state for other parts.

[0044] Example 2

[0045] As shown in Figures 1-5, the circulation pipe 1011 is a copper pipe structure, and an inlet pipe 1012 and an outlet pipe 1013 are fixedly connected to the right side of the circulation pipe 1011. The inlet pipe 1012 and the outlet pipe 1013 together form a circulation structure for the circulation pipe 1011. A PCB board 3 is placed on the top of the heat-conducting substrate 2011. Two mounting holes 301 are arranged in a linear array inside the PCB board 3. Fixing bolts 3011 are screwed into the mounting holes 301. The fixing bolts 3011 are connected downward to the positioning holes 2012 in the heat-conducting substrate 2011. A control assembly 3012 and a gold finger 3013 are fixedly connected to the top surface of the PCB board 3. A connecting assembly 3 is also fixedly connected to the top surface of the PCB board 3. 014, the connecting component 3014 is vertically set to the PCB board 3, and the light receiving component 3015 and the light emitting component 3016 are fixedly connected from front to back on the left side of the connecting component 3014. The light receiving component 3015 and the light emitting component 3016 are both used to connect to the external mechanism 2 fixedly connected to the top surface of the support mechanism 1. The top of the support mechanism 1 is fitted with a housing mechanism 4. There are three housing mechanisms 4, and the three housing mechanisms 4 are installed in a linear array on the top of the support mechanism 1. The right side of the housing mechanism 4 is fixedly connected to a shielding baffle 4013, and the shielding baffle 4013 is located above the gold finger 3013. The top surface of the housing mechanism 4 is fixedly connected to a positioning guide rod 401.

[0046] In this embodiment, during use, the three housing mechanisms 4 are arranged in a straight array along the top of the support mechanism 1. Each housing mechanism 4 corresponds to a specific functional module on the PCB board 3, such as the control component 3012, the light receiving component 3015, and the light emitting component 3016, forming a physical isolation barrier. The housing mechanism 4 is made of a high conductivity metal material, which can directly reflect and absorb the electromagnetic radiation generated by the internal components, preventing the radiation from spreading outward.

[0047] The shielding baffle 4013 of the right housing mechanism 4 extends vertically downward, completely covering the area above the gold finger 3013. As a high-frequency signal transmission interface, the gold finger 3013 is susceptible to external electromagnetic interference. The shielding baffle 4013 forms a closed space by tightly fitting with the top surface of the support mechanism 1, blocking the influence of external radio frequency signals, static electricity and other interference sources on the gold finger 3013.

[0048] During the installation of the housing mechanism 4, the slots on its front and rear sides form a fitting structure with the limiting plug 2015 of the external mechanism 2. Under the elastic force of the spring rod 2014, the limiting plug 2015 is tightly inserted into the slot, eliminating the assembly gap between the housing mechanism 4 and the external mechanism 2. At the same time, the magnetic attraction component 2016 at the top of the limiting plug 2015 and the metal surface at the bottom of the housing mechanism 4 generate a magnetic attraction, further reducing the gap and preventing electromagnetic signals from leaking from the connection part.

[0049] After the displacement mechanism 5 slides to the designated position in the guide groove 101 through the insert assembly 501, the insert mechanism 7 is inserted along the guide slot 5013 of the guide socket 5012. The reinforcing bracket 7011 at its top covers the top edge of the housing mechanism 4 laterally. The connecting baffle 7012 on the inner side of the reinforcing bracket 7011 fits tightly with the outer wall of the housing mechanism 4, filling the gap between adjacent housing mechanisms 4 and forming a continuous shielding surface.

[0050] The magnetic collar 7013 at the center of the reinforcing bracket 7011 is precisely aligned with the positioning guide rod 401 at the top of the housing mechanism 4 and magnetically connected, so that the connecting baffle 7012 always remains in contact with the housing mechanism 4. Even when the equipment vibrates or the temperature changes cause slight deformation of the components, the gap can still be compensated by magnetic attraction to ensure the continuity of shielding.

[0051] Example 3

[0052] As shown in Figures 2-7, the positioning guide rod 401 has a cylindrical structure and is perpendicular to the housing mechanism 4. The housing mechanism 4 and the positioning guide rod 401 together form a guide structure. A base plate assembly 4011 is fixedly connected to the inner side of the housing mechanism 4. The base plate assembly 4011 is perpendicular to the inner wall of the housing mechanism 4. Two pop-out components 4012 are fixedly connected in a linear array on the bottom end face of the base plate assembly 4011. The pop-out components 4012 are used to insert into the limiting plug 2015. Two points for interlocking with the limiting plug 2015 are also provided in a linear array on both the front and rear sides of the housing mechanism 4. The guide groove 101 houses a matching slot 015, and a displacement mechanism 5 is installed inside. Two displacement mechanisms 5 are provided, facing each other. Two protruding insert assemblies 501 are fixedly connected to the outer sides of each displacement mechanism 5, also facing each other. A connecting base plate 5011 is fixedly connected to the side of the displacement mechanism 5 furthest from the support mechanism 1. The connecting base plate 5011 is vertically positioned, and a guide socket 5012 is fixedly connected to its front end. A guide slot 5013 is provided at the top of the guide socket 5012. A guide rod mechanism 6 is inserted into the interior of the connecting base plate 5011. The guide rod mechanism 6 has a cylindrical structure, and a baffle assembly 601 is fixedly connected to the outer side of the guide rod mechanism 6. A return spring 6011 is fixedly connected between the baffle assembly 601 and the connecting base plate 5011. The return spring 6011 is used to promote the baffle assembly 601 to move away from the connecting base plate 5011. A balance plate 6012 is fixedly connected to the side of the guide rod mechanism 6 away from the baffle assembly 601. Two push rod assemblies 6013 are fixedly connected in a linear array on the side of the balance plate 6012 away from the guide rod mechanism 6. The push rod assemblies 6013 have a cylindrical structure and are used for... The limiting blocks 2015 are arranged in a row, and the inner side of the guide slot 5013 is inserted with the block mechanism 7. The outer side of the block mechanism 7 is fixedly connected with the guide slider 701. The top surface of the block mechanism 7 is fixedly connected with the reinforcing bracket 7011. Each pair of longitudinally adjacent block mechanisms 7 forms a group, and there are two reinforcing brackets 7011. The front and rear sides of the two reinforcing brackets 7011 are fixedly connected with connecting baffles 7012. The center of the transverse component in the reinforcing bracket 7011 is fixedly connected with a ring-shaped magnetic collar 7013. The magnetic collar 7013 matches the positioning guide rod 401.

[0053] In this embodiment, during use, the PCB board 3 is rigidly connected to the thermally conductive substrate 2011 by the fixing bolt 3011. Thermal grease is applied to the contact surface between the two to ensure that the heat generated by the PCB board 3 during operation, such as the heat generated by the operation of the control component 3012 and the heat generated by the electro-optical conversion of the light emitting component 3016, is quickly conducted to the thermally conductive substrate 2011. The thermally conductive substrate 2011 is made of a material with high thermal conductivity, such as aluminum alloy, and the heat is diffused to the entire substrate surface through the uniformly distributed thermal conduction path inside it.

[0054] The support mechanism 1 is a hollow structure. The circulation pipe 1011 installed inside it is in close contact with the bottom of the heat-conducting substrate 2011. The circulation pipe 1011 is made of copper pipe. The inner wall of the copper pipe is smooth and has excellent thermal conductivity, which can quickly absorb the heat transferred by the heat-conducting substrate 2011.

[0055] Cooling medium, such as special heat dissipation fluid, enters circulation pipe 1011 through inlet pipe 1012 and flows along the inside of the pipe in an S-shaped path. Because circulation pipe 1011 is arranged in a curved manner inside support mechanism 1, it is in full contact with the inner wall of copper pipe. During the flow, cooling medium absorbs heat from copper pipe, its own temperature rises, and it is discharged from support mechanism 1 through outlet pipe 1013, completing one heat dissipation cycle.

[0056] The liquid inlet pipe 1012 is connected to an external heat dissipation device to continuously input low-temperature cooling medium; the liquid outlet pipe 1013 leads the high-temperature medium after heat absorption to an external device for cooling, forming a dynamic circulation. Through this continuous flow, the circulation pipe 1011 can remove the heat from the heat-conducting substrate 2011 in real time, avoiding the local accumulation of heat on the PCB board 3.

[0057] The base plate assembly 4011 inside the housing mechanism 4 maintains a small gap with the components on the PCB board 3, which does not affect the operation of the components, and can conduct the radiative heat from the surface of the components to the housing mechanism 4 through air convection. The housing mechanism 4 transfers heat to the circulation pipe 1011 through contact with the support mechanism 1, thereby improving the overall heat dissipation efficiency.

[0058] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An electromagnetic shielding protection structure for an optical module, comprising a support mechanism (1), characterized in that, An external mechanism (2) is fixedly connected to the top surface of the support mechanism (1). A network cable interface (201) is provided on the left side of the external mechanism (2). There are two network cable interfaces (201), and the two network cable interfaces (201) are arranged in a linear array. A heat-conducting substrate (2011) is fixedly connected to the top surface of the support mechanism (1). Two positioning holes (2012) are arranged in a linear array inside the heat-conducting substrate (2011). Slot assemblies (2013) are arranged in a linear array on both the front and rear sides inside the external mechanism (2). A spring rod (2014) is fixedly connected to the inner side of the slot assembly (2013). The main body of the spring rod (2014) is a telescopic rod structure with a spring. A limiting plug (2015) is fixedly connected to the side away from the slot assembly (2013). The limiting plug (2015) is a rectangular plate structure, and a groove is provided at the top of the limiting plug (2015). A magnetic suction assembly (2016) is fixedly connected inside the groove. The magnetic suction assembly (2016) is a ring structure. A transverse groove is provided on the outer side of the support mechanism (1). This transverse groove is a guide groove (101). There are two guide grooves (101), and the two guide grooves (101) are respectively opened on the front and rear sides of the support mechanism (1). The support mechanism (1) is a hollow structure. A circulation pipe (1011) is installed on the inner side of the support mechanism (1). A PCB board is placed on the top of the heat-conducting substrate (2011). 3) The PCB board (3) has two mounting holes (301) arranged in a linear array inside. The control assembly (3012) and the gold finger (3013) are fixedly connected to the top surface of the PCB board (3). The top of the support mechanism (1) is fitted with a housing mechanism (4). There are three housing mechanisms (4), and the three housing mechanisms (4) are arranged in a linear array on the top of the support mechanism (1). The right side of the housing mechanism (4) is fixedly connected with a shielding baffle (4013), and the shielding baffle (4013) is located above the gold finger (3013). The top surface of the housing mechanism (4) is fixedly connected with a positioning guide rod (401). The guide groove (101) is equipped with a displacement mechanism (5). There are two displacement mechanisms (5), and the two displacement mechanisms (5) are arranged opposite to each other. The outer sides of the two displacement mechanisms (5) are fixedly connected to two protruding plug assemblies (501). The side of the displacement mechanism (5) away from the support mechanism (1) is fixedly connected to a connecting base plate (5011). The connecting base plate (5011) is vertically arranged, and a guide socket (5012) is fixedly connected to the front end face of the connecting base plate (5011). A guide slot (5013) is opened at the top of the guide socket (5012). A guide rod mechanism (6) is inserted into the inside of the connecting base plate (5011). The guide rod mechanism (6) is a cylindrical structure, and a baffle assembly (601) is fixedly connected to the outer side of the guide rod mechanism (6).A return spring (6011) is fixedly connected between the baffle assembly (601) and the connecting substrate (5011). The return spring (6011) is used to promote the movement of the baffle assembly (601) toward the side away from the connecting substrate (5011). A balance plate (6012) is fixedly connected to the side of the guide rod mechanism (6) away from the baffle assembly (601). Two push rod assemblies (6013) are fixedly connected in a straight array on the side of the balance plate (6012) away from the guide rod mechanism (6). The push rod assembly (6013) is a cylindrical structure and is used to arrange the limiting insert (2015) and guide it. A plug mechanism (7) is inserted into the inner side of the slot (5013). A guide slider (701) is fixedly connected to the outer side of the plug mechanism (7). A reinforcing bracket (7011) is fixedly connected to the top surface of the plug mechanism (7). Each pair of longitudinally adjacent plug mechanisms (7) forms a group, and there are two reinforcing brackets (7011). Connecting baffles (7012) are fixedly connected to the front and rear sides of the interior of the two reinforcing brackets (7011). A magnetic chuck (7013) with an annular structure is fixedly connected to the center of the transverse component in the reinforcing bracket (7011). The magnetic chuck (7013) matches the positioning guide rod (401).

2. The electromagnetic shielding protection structure for an optical module according to claim 1, characterized in that: The circulation pipe (1011) is a copper pipe structure, and the right side of the circulation pipe (1011) is fixedly connected to the inlet pipe (1012) and the outlet pipe (1013). The inlet pipe (1012) and the outlet pipe (1013) together form the circulation structure for the circulation pipe (1011).

3. The electromagnetic shielding protection structure for an optical module according to claim 1, characterized in that: A fixing bolt (3011) is screwed into the inside of the mounting hole (301), and the fixing bolt (3011) is connected to the positioning hole (2012) opened in the heat-conducting substrate (2011) on the downward side.

4. The electromagnetic shielding protection structure for an optical module according to claim 1, characterized in that: A connecting component (3014) is fixedly connected to the top surface of the PCB board (3). The connecting component (3014) is perpendicular to the PCB board (3). A light receiving component (3015) and a light emitting component (3016) are fixedly connected from front to back on the left side of the connecting component (3014). Both the light receiving component (3015) and the light emitting component (3016) are used to connect to the external mechanism (2) fixedly connected to the top surface of the support mechanism (1).

5. The electromagnetic shielding protection structure for an optical module according to claim 1, characterized in that: The positioning guide rod (401) is a cylindrical structure, and the positioning guide rod (401) is perpendicular to the housing mechanism (4). The housing mechanism (4) and the positioning guide rod (401) together form a guide structure. The inner side of the housing mechanism (4) is fixedly connected to the base plate assembly (4011). The base plate assembly (4011) is perpendicular to the inner wall of the housing mechanism (4). Two pop-out components (4012) are fixedly connected in a straight line array on the bottom end face of the base plate assembly (4011). The pop-out components (4012) are used to be inserted into the limiting plug (2015). Two slots for matching the limiting plug (2015) are opened in a straight line array on both the front and rear sides of the housing mechanism (4).

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