A diode bridge stack pin

Abstract

The utility model discloses a diode bridge stack pin relates to electronic component technical field, and its specific structure includes: semiconductor main part, a plurality of pins, one end is arranged in the semiconductor main part inside, and the pin interval distribution, the part of pin is located the outside of semiconductor main part all is equipped with the buffer groove, and the buffer groove is arranged respectively in the both sides of pin. The utility model solves the diode bridge stack in the prior art, and the stress concentration is caused to the pin design to occupy the space of big, the cost high technical problem of high cost.

Description

Technical Field

[0001] This utility model relates to the field of electronic component technology, and in particular to a diode bridge rectifier pin. Background Technology

[0002] In the field of electronic components, diode bridge rectifiers are widely used as key rectifier elements in various power modules and industrial equipment. However, the leads of traditional bridge rectifiers are usually designed with a straight strip structure. In actual use, especially under harsh temperature cycling conditions (e.g., -40℃ to 125℃), due to the significant difference in the coefficient of thermal expansion (CTE) between the bridge rectifier body material and the printed circuit board (PCB) substrate, significant stress concentration occurs at the root of the leads (usually marked as area 101). Long-term application of this stress can easily lead to fatigue cracking of the solder joints and even cause PCB pad peeling failure, seriously affecting the reliability and lifespan of the product.

[0003] To alleviate the above situation, the existing operating method is usually to design the pins in a complete shape. Although this absorbs thermal stress to some extent, its structure will significantly increase the lateral space occupied by the component on the PCB, which is not conducive to high-density assembly. Another method is to thicken the pins to improve their fatigue resistance. However, this approach leads to a significant increase in raw material costs and poor economic efficiency. Utility Model Content

[0004] The purpose of this invention is to provide a diode bridge rectifier pin design that solves the technical problem of large pin space and high cost caused by stress concentration in existing diode bridge rectifiers.

[0005] This application discloses a diode bridge rectifier pin configuration, including: Semiconductor body; Multiple pins are provided, one end of which is located inside the semiconductor body and the pins are spaced apart. The portion of each pin located outside the semiconductor body is provided with a buffer groove, and the buffer grooves are respectively located on both sides of the pin.

[0006] This application has multiple pins and a buffer groove on each pin, which can handle stress and reduce the occurrence of stress concentration affecting the quality of the diode bridge rectifier.

[0007] Based on the above technical solution, the present application can be further improved as follows: Furthermore, the thickness of the pin is D, and the depth of the buffer groove is d, where 2 / 5D ≤ d < 1 / 2D. The beneficial effect of this step is that it allows for the design of the size of the buffer groove, thus avoiding any impact on the function of the pin itself.

[0008] Furthermore, the width of the pin is W, and the width of the buffer groove is w, where w = (2 / 5~3 / 5)W. The beneficial effect of this step is that by designing the size of the buffer groove, the function of the pin itself is not affected.

[0009] Furthermore, the buffer groove is a triangular groove or an oblong groove. The advantage of this step is that the buffer groove with a specific shape is easy to process.

[0010] Furthermore, the distance between the buffer groove and the semiconductor body is 0.8-1.2mm. The advantage of this step is that it ensures that the buffer groove is located in a relatively central position of the pin, thereby ensuring the stress reduction effect.

[0011] Furthermore, a connecting through hole is provided in the middle of the semiconductor body. The advantage of this step is that it facilitates subsequent use.

[0012] This application also discloses a diode bridge rectifier, including the aforementioned diode bridge rectifier pins.

[0013] One or more technical solutions provided in the embodiments of this application have at least the following technical effects or advantages: 1. This application designs the pins with buffer grooves to disperse and release thermal stress at the edge of the grooves, thereby reducing the stress coefficient and ensuring product quality.

[0014] 2. The design of the size and shape of the buffer groove in this application can further improve the stress reduction effect. Attached Figure Description

[0015] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the pin structure of a diode bridge rectifier according to a specific embodiment of the present invention; Figure 2 for Figure 1 The left view; The attached figures are labeled as follows: 1-Semiconductor body; 2-Pin; 3-Buffer groove; 4-Connecting through hole. Detailed Implementation

[0017] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings. These embodiments are merely illustrative of the present invention and should not be construed as limiting the scope of protection of the present invention. It should be noted that, unless otherwise stated, the technical or scientific terms used in this application shall have the ordinary meaning as understood by one of ordinary skill in the art to which this utility model pertains.

[0018] In the description of this application, it should be understood that the terms "upper", "lower", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0019] In this application, unless otherwise expressly specified and limited, the terms "installation," "setup," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0020] To better understand the above technical solutions, the following will provide a detailed description of the technical solutions in conjunction with the accompanying drawings and specific embodiments.

[0021] Example 1: like Figure 1 As shown, this application discloses a diode bridge rectifier pin, which is designed for existing pins. Existing pins are generally made of stamped copper strips. Under temperature cycling (-40℃ to 125℃), due to the difference in thermal expansion coefficients, the pin roots are prone to concentrated stress, which can lead to solder joint cracking or PCB pad peeling, affecting product quality. This application reduces the occurrence of the above situations by creating grooves on the pins to form a buffer.

[0022] The specific structure in this application includes: Semiconductor body 1, which is an existing component, will not be described in detail here; Multiple pins 2 are disposed at one end inside the semiconductor body 1 and are spaced apart. Each pin 2 located outside the semiconductor body 1 has a buffer groove 3, which is respectively disposed on both sides of the pin 2. Specifically, in this application, the pins 2 are designed such that, during actual processing, one part of the pin 2 is located inside the semiconductor body 1, and the other part extends outward from the semiconductor body 1. To avoid stress concentration at the root of the pin, this application provides buffer grooves in the part extending outward from the semiconductor body 1, thereby dispersing and releasing thermal stress at the edge of the groove and reducing the stress coefficient. In this application, the buffer groove 3 is located on both sides of the pin 2. In order to avoid the buffer groove 3 affecting the use of the pin, the thickness of the pin 2 is D and the depth of the buffer groove 3 is d, where 2 / 5D≤d<1 / 2D. This way, the groove can be opened while minimizing the impact on the use of the pin.

[0023] Meanwhile, this application requires further design of the width of the buffer groove, wherein the width of the pin 2 is W, the width of the buffer groove 3 is w, w=(2 / 5~3 / 5)W, and the center line of the buffer groove 3 is consistent with the center line of the pin 2, so as to avoid the buffer groove 3 from affecting the pin 2.

[0024] To facilitate the processing of pin 2, the buffer groove 3 in this application is a triangular groove or a waist-shaped hole groove, which facilitates the subsequent stamping to form the corresponding structure.

[0025] The distance between the buffer groove 3 and the semiconductor body 1 is 0.8-1.2mm, which allows the buffer groove 3 to be positioned in a relatively central position on the pin, thereby improving the stress reduction effect.

[0026] Specifically, the semiconductor body 1 described in this application has a connecting through hole 4 in the middle, which facilitates further use in the future.

[0027] This application also discloses a diode bridge rectifier, including the aforementioned diode bridge rectifier pins.

[0028] Further explanation is provided regarding this application: To prevent concentrated stress at the pin root that could lead to solder joint cracking or PCB pad peeling, this application provides a buffer groove 3 on the pin, allowing thermal stress to be dispersed and released at the edge of the groove, thus reducing the stress coefficient. Specifically, the pin substrate is first formed by stamping copper strip, then the corresponding groove is stamped on the pin using a mold, and finally the pin is bent into shape after injection molding.

[0029] The diode bridge rectifier of this application showed no cracking after 1000 temperature cycles (-40℃~125℃), which meets the product quality requirements. Numerous specific details are set forth in this specification. However, it will be understood that embodiments of this invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification. In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0030] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model, and they should all be covered within the scope of the claims and specification of this utility model.

Claims

1. A diode bridge rectifier pinout, characterized in that, include: Semiconductor body (1); Multiple pins (2) are provided, one end of which is located inside the semiconductor body (1), and the pins (2) are spaced apart. The portion of the pins (2) located outside the semiconductor body (1) is provided with a buffer groove (3), and the buffer groove (3) is provided on both sides of the pins (2).

2. The diode bridge rectifier pinout according to claim 1, characterized in that, The thickness of the pin (2) is D, and the depth of the buffer groove (3) is d, where 2 / 5D≤d<1 / 2D.

3. The diode bridge rectifier pinout according to claim 2, characterized in that, The width of the pin (2) is W, and the width of the buffer groove (3) is w, where w = (2 / 5~3 / 5)W.

4. The diode bridge rectifier pinout according to claim 3, characterized in that, The buffer groove (3) is a triangular groove or a waist-shaped hole groove.

5. The diode bridge rectifier pinout according to claim 1, characterized in that, The distance between the buffer groove (3) and the semiconductor body (1) is 0.8-1.2 mm.

6. The diode bridge rectifier pinout according to claim 1, characterized in that, A connecting through hole (4) is provided in the middle of the semiconductor body (1).

7. A diode bridge rectifier, characterized in that, Includes the diode bridge rectifier pins as described in any one of claims 1-6.

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