A chip testing apparatus

Abstract

The utility model provides a kind of chip testing equipment, it is related to chip testing technical field.The utility model discloses chip testing equipment includes test mechanism and at least one preheating device, the first heating piece of preheating device can be measured chip preheating to preset temperature, measured chip is fixed on the grain of metal base.In measured chip preheating to preset temperature again shift to test seat, test seat again continues to heat to required test temperature to measured chip, when test seat is connected with testing machine, testing machine carries out electrical property test to measured chip in test seat.The above-mentioned technical scheme can preheat measured chip fixed on metal base by newly added preheating device, then again shift to test seat continues to heat, can reduce the heating time length of measured chip in test seat, to can improve test efficiency.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and in particular to a chip testing device. Background Technology

[0002] Existing conventional silicon carbide (SiC) chips are square dies cut from wafers. A new chip structure exists where the chip is first soldered onto a copper block, and then the chip containing the copper block is subjected to electrical performance testing. For high-temperature testing, the test fixture typically includes a heating module to heat the chip. However, heating a chip containing a copper block from room temperature to high temperatures takes a long time, increasing the overall testing time and impacting efficiency. Therefore, there is an urgent need for a chip testing device that can improve testing efficiency. Utility Model Content

[0003] One objective of this invention is to provide a chip testing device that solves the technical problem in the prior art where the heating time of chips containing copper blocks on the test socket is too long, affecting the testing efficiency.

[0004] Specifically, this utility model provides a chip testing device, comprising:

[0005] At least one preheating device, each of the preheating devices including a heat sink and a first heating element, the heat sink being used to place the chip under test, the first heating element being used to heat the heat sink to preheat the chip under test to a preset temperature, the chip under test including a die and a metal base, the die being fixed on the metal base, the metal base being a copper base or an aluminum base;

[0006] The testing mechanism is located beside the preheating device and includes a test socket and a testing machine. The test socket is used to receive the preheated chip under test and has a second heating element for heating the chip under test. The testing machine is configured to perform electrical performance testing on the chip under test in the test socket when connected to the test socket.

[0007] Optionally, the bottom of the heat sink is provided with a mounting groove, and the first heating element is installed in the mounting groove;

[0008] The heat sink has a first air inlet and at least one adsorption hole. The adsorption hole is located on the top of the heat sink and communicates with the first air inlet. The chip under test is placed at the adsorption hole. The first air inlet is located on the side wall of the heat sink and is connected to a vacuum pump.

[0009] Optionally, each of the preheating devices further includes:

[0010] The base has the heat sink mounted on its top and has a second air inlet and at least one air outlet. The second air inlet communicates with the air outlet and is connected to an air supply device for providing protective gas.

[0011] A cover is provided around the heat sink and part of the base to form a protective cavity; protective gas, which is filled through the second air inlet, enters the protective cavity through the air outlet.

[0012] Optionally, the base includes a first portion and a second portion arranged from top to bottom, the heat sink is mounted on top of the first portion, and the housing includes:

[0013] The housing covers the outer periphery of the heat sink and the first part, and there is a predetermined distance between the housing and the first part;

[0014] A top plate is provided above the housing and has an opening for placing and removing the chip under test, through which gas in the protective cavity is discharged.

[0015] Optionally, the second part is provided with a second air inlet and a heating chamber communicating with the second air inlet, the heating chamber communicating with the air outlet; each of the preheating devices further includes:

[0016] The second heating element is installed inside the heating chamber and is used to heat the protective gas.

[0017] Optionally, the test fixture includes a lower base and an upper cover plate rotatably connected to the lower base. The lower base has a mounting position for placing the chip under test and a third heating element for heating the chip under test. The test mechanism further includes:

[0018] The first mold closing mechanism is installed on one side of the test seat and includes a first driving member and a first pressure plate. The first pressure plate rotates under the drive of the first driving member to abut against the upper cover plate and drive the upper cover plate to rotate to a pre-mold closing state at a preset angle with the lower base.

[0019] Optionally, the testing facility further includes:

[0020] A slide rail is arranged along a preset direction. The test seat and the first mold closing mechanism are both mounted on the slide rail and are configured to slide synchronously along the slide rail.

[0021] The second mold closing mechanism is installed on one side of the slide rail and includes a second driving member and a second pressure plate. When the test seat moves to the bottom of the second mold closing mechanism, the second pressure plate moves downward under the drive of the second driving member to drive the upper cover plate to continue rotating, thereby switching from the pre-mold closing state to the final mold closing state.

[0022] Optionally, the lower base includes a snap-fit ​​element, and the upper cover plate includes a locking element; when the upper cover plate is in the final mold-closed state, the snap-fit ​​element engages with the locking element; the testing mechanism further includes:

[0023] The mold opening mechanism is installed on one side of the slide rail and includes a third driving member and an unlocking member. When the test seat moves to the mold opening mechanism, the unlocking member abuts against the latching member under the drive of the third driving member and applies pressure to the latching member, so that the latching member unlocks from the locking member, thereby opening the upper cover plate.

[0024] Optionally, the test socket further includes an elastic component installed below the lower base, the lower base being provided with a current-conducting module electrically connected to the chip under test;

[0025] The testing machine includes a fourth driving component, a test plate, and a first adapter probe assembly, wherein the first adapter probe assembly is mounted on the test plate; when the test seat moves along the slide rail to above the first adapter probe assembly, the fourth driving component controls the test seat to move downward and compresses the elastic component, so that the flow guiding module contacts the first adapter probe assembly.

[0026] Optionally, it also includes:

[0027] A visual correction mechanism is installed on one side of the slide rail and is used to correct the position of the chip under test on the test stand.

[0028] This invention relates to a chip testing device comprising a testing mechanism and at least one preheating device. The first heating element of the preheating device preheats the chip under test (DUT), which is a die fixed to a metal substrate, to a preset temperature. After the DUT is preheated to the preset temperature, it is transferred to a testing socket, where it continues to heat the DUT. When the testing socket is connected to a testing machine, the testing machine performs electrical performance testing on the DUT within the testing socket. This technical solution, by adding a preheating device, preheats the DUT fixed to the metal substrate before transferring it to the testing socket for further heating to the required test temperature. This reduces the heating time of the DUT within the testing socket, thereby improving testing efficiency.

[0029] The above and other objects, advantages and features of this utility model will become more apparent to those skilled in the art from the following detailed description of specific embodiments of this utility model in conjunction with the accompanying drawings. Attached Figure Description

[0030] The following sections will describe some specific embodiments of the present invention in a detailed manner by way of example and not limitation, with reference to the accompanying drawings. The same reference numerals in the drawings denote the same or similar parts or components. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings:

[0031] Figure 1 This is a schematic structural diagram of a chip testing device according to an embodiment of the present invention, taken from one angle.

[0032] Figure 2 This is a schematic structural diagram of a preheating device according to an embodiment of the present invention, with the top plate concealed.

[0033] Figure 3 This is a schematic cross-sectional view of a preheating device according to an embodiment of the present invention;

[0034] Figure 4 This is a schematic structural diagram of a chip testing device according to one embodiment of the present invention from another angle;

[0035] Figure 5 This is another schematic cross-sectional view of a preheating device according to an embodiment of the present invention;

[0036] Figure 6 This is a schematic structural diagram of a test seat and a first mold clamping mechanism according to an embodiment of the present invention;

[0037] Figure 7 This is a schematic structural diagram of the second mold closing mechanism and the mold opening mechanism according to an embodiment of the present utility model.

[0038] Figure label:

[0039] 100-Chip testing equipment, 200-Chip under test, 10-Preheating device, 20-Test holder, 30-Slide rail, 40-First mold closing mechanism, 50-Visual correction mechanism, 60-Mold opening mechanism, 70-Second mold closing mechanism, 80-Testing machine, 11-Heat sink, 12-First heating element, 13-Base, 111-First air inlet, 112-Adsorption hole, 113-Mounting slot, 131-First part, 132-Second part, 133-Air outlet, 134-Second air inlet, 135-Heating chamber, 136-Third air inlet, 14-Protective chamber, 15-Cover, 151-Housing shell, 15 2-Top plate, 153-Opening, 16-Third heating element, 17-First temperature sensor, 18-Second temperature sensor, 19-Insulation sleeve, 21-Upper cover plate, 22-Lower base, 221-Mounting position, 23-Elastic component, 24-Snap-fit ​​component, 25-Locking component, 26-Flow guiding module, 81-Test plate, 82-First adapter probe assembly, 83-Fourth driving component, 41-First driving component, 42-First pressure plate, 61-Third driving component, 62-Unlocking component, 71-Second driving component, 72-Second pressure plate, 73-Pressure rod, 161-Third temperature sensor, 162-Fourth temperature sensor. Detailed Implementation

[0040] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0041] In the description of this utility model, it should be understood that the terms "upper" and "lower" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0042] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature, that is, include one or more of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified. When a feature "includes or contains" one or more of the features it encompasses, unless otherwise specifically described, this indicates that other features are not excluded and may be further included.

[0043] Unless otherwise expressly specified and limited, the terms "connection," "installation," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art should be able to understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0044] Unless otherwise specified, all terms (including technical and scientific terms) used in the description of this embodiment have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0045] Figure 1 This is a schematic structural diagram of a chip testing device 100 according to an embodiment of the present invention, taken from one angle. Figure 2 This is a schematic structural diagram of a preheating device 10 according to an embodiment of the present invention, with the top plate 152 omitted. Figure 3 This is a schematic cross-sectional view of a preheating device 10 according to an embodiment of the present invention. Figure 4 This is a schematic structural diagram of a chip testing device 100 according to one embodiment of the present invention from another angle.

[0046] like Figures 1 to 4 As shown, in one specific embodiment, the chip testing equipment 100 includes a testing mechanism and at least one preheating device 10. Each preheating device 10 includes a heat sink 11 and a first heating element 12. The heat sink 11 is used to place the chip under test 200, and the first heating element 12 is used to heat the heat sink 11 to preheat the chip under test 200 to a preset temperature. The chip under test 200 includes a die and a metal substrate, with the die fixed on the metal substrate, which may be a copper substrate or an aluminum substrate. The testing mechanism is located beside the preheating device 10 and includes a test stand 20 and a testing machine 80. The test stand 20 is used to receive the heated chip under test 200 and has a second heating element for heating the chip under test 200. The testing machine 80 is configured to perform electrical performance testing on the chip under test 200 within the test stand 20 when connected to the test stand 20. In a preferred embodiment, the metal substrate is a copper substrate. Here, the chip under test 200, heated on the preheating device 10, is manually picked up by the operator and placed on the test holder 20. The operator then uses a suction pen to pick up the chip under test 200. Alternatively, a suction mechanism can be designed to automatically pick up the chip under test 200 on the preheating device 10 and place it on the test holder 20. Here, the die is fixed to the metal base by welding.

[0047] This embodiment can preheat the chip under test 200 fixed on the metal base by adding a preheating device 10, and then transfer it to the test socket 20 to continue heating to the required test temperature. This can reduce the heating time of the chip under test 200 in the test socket 20, thereby improving the test efficiency.

[0048] In some embodiments, the heat sink 11 has a mounting groove 113 at its bottom, and the first heating element 12 is installed in the mounting groove 113. The heat sink 11 has a first air inlet 111 and at least one adsorption hole 112. The adsorption hole 112 is located on the top of the heat sink 11 and communicates with the first air inlet 111. The chip under test 200 is placed at the adsorption hole 112. The first air inlet 111 is located on the side wall of the heat sink 11 and is connected to a vacuum pump. It can be understood that the chip under test 200 is adsorbed onto the top of the heat sink 11 by drawing a vacuum through the first air inlet 111. Here, the first heating element 12 is a ceramic heating plate. There are four adsorption holes 112, arranged in a square array, which can hold the four corners of the chip under test 200.

[0049] In some embodiments, the number of preheating devices 10 is five; in other embodiments, the number of preheating devices 10 may be determined according to specific design requirements.

[0050] In some embodiments, each preheating device 10 further includes a base 13 and a housing 15. A heat sink 11 is mounted on the top of the base 13, and the base 13 has a second air inlet 134 and at least one air outlet 133. The second air inlet 134 communicates with the air outlet 133 and is connected to a gas supply device for providing protective gas. The housing 15 covers the heat sink 11 and part of the base 13 to form a protective cavity 14. Protective gas introduced through the second air inlet 134 enters the protective cavity 14 through the air outlet 133. Here, the protective gas is nitrogen; in this embodiment, the introduction of nitrogen can prevent or mitigate chip oxidation and copper oxidation.

[0051] In some embodiments, the base 13 includes a first portion 131 and a second portion 132 arranged from top to bottom. A heat sink 11 is mounted on top of the first portion 131. The housing 15 includes a housing 151 and a top plate 152. The housing 151 covers the outer periphery of the heat sink 11 and the first portion 131, and there is a predetermined distance between the housing 151 and the first portion 131. The top plate 152 covers the housing 151 and has an opening 153 for picking up and placing the chip under test 200. Gas in the protective cavity 14 is discharged from the opening 153. It can be understood that protective gas enters the protective cavity 14 from the second air inlet 134 of the base 13, and the original gas in the protective cavity 14 is discharged from the opening 153 of the top plate 152, forming a flow loop.

[0052] In some embodiments, each preheating device 10 further includes a heat insulation sleeve 19, which is embedded in the heat sink 11 and located at the bottom of the chip under test 200.

[0053] In some embodiments, the preheating device 10 further includes a first temperature sensor 17 and a second temperature sensor 18. The end of the first temperature sensor 17 passes through the heat sink 11 and contacts the heat insulation sleeve 19, and is used to obtain the actual temperature of the chip under test 200. The end of the second temperature sensor 18 passes through the heat insulation sleeve 19 and is located at the bottom of the chip under test 200. The second temperature sensor 18 is used to issue an alarm when the actual temperature of the chip under test 200 exceeds a first set temperature, so as to protect the chip under test 200.

[0054] Figure 5 This is another schematic cross-sectional view of a preheating device 10 according to an embodiment of the present invention. Figure 5 As shown, in some embodiments, the second part 132 is provided with a second air inlet 134 and a heating chamber 135 communicating with the second air inlet 134, and the heating chamber 135 communicating with the air outlet 133. Each preheating device 10 also includes a third heating element 16, which is installed in the heating chamber 135 for heating the protective gas. Here, the third heating element 16 is a 220V heater.

[0055] See Figure 5 In some embodiments, a third air inlet 136 is provided on the inner wall of the heating chamber 135. The third air inlet 136 is connected to the air outlet 133. The protective gas enters the heating chamber 135 from the second air inlet 134 for heating, and then flows from the third air inlet 136 to the air outlet 133, thereby entering the protective chamber 14.

[0056] In some embodiments, each preheating device 10 further includes a third temperature sensor 161 and a fourth temperature sensor 162. The end of the third temperature sensor 161 is located inside the heating chamber 135 and is used to obtain the actual temperature of the protective gas. The end of the fourth temperature sensor 162 is located in the channel communicating with the third air inlet 136 and the air outlet 133, and is used to issue an alarm when the actual temperature in the channel exceeds a second set temperature, so as to protect the chip under test 200.

[0057] Figure 6 This is a schematic structural diagram of the test seat 20 and the first mold clamping mechanism 40 according to an embodiment of the present invention. Figure 6 As shown, and see Figure 4In some embodiments, the test base 20 includes a lower base 22 and an upper cover plate 21 rotatably connected to the lower base 22. The lower base 22 has a mounting position 221 for placing the chip under test 200 and a second heating element. The test mechanism also includes a first mold closing mechanism 40, which is mounted on one side of the test base 20 and includes a first driving member 41 and a first pressure plate 42. The first pressure plate 42 rotates under the drive of the first driving member 41 to abut against the upper cover plate 21 and drive the upper cover plate 21 to rotate to a pre-mold closing state at a preset angle with the lower base 22. At this time, the first pressure plate 42 is in a horizontal state, i.e. Figure 6 The state in the diagram. Here, the first driving element 41 is a rotary motor. In other embodiments, the first driving element 41 may also be other types of power sources.

[0058] Figure 7 This is a schematic structural diagram of the second mold-closing mechanism 70 and the mold-opening mechanism 60 according to an embodiment of the present invention. Figure 7 As shown, and see Figure 4 In some embodiments, the testing mechanism further includes a slide rail 30 and a second mold-closing mechanism 70, wherein the slide rail 30 is arranged along a preset direction, i.e. Figure 4 In the direction of the arrow, the test seat 20 and the first mold closing mechanism 40 are both mounted on the slide rail 30 and are configured to slide synchronously along the slide rail 30. The second mold closing mechanism 70 is mounted on one side of the slide rail 30 and includes a second drive member 71 and a second pressure plate 72. When the test seat 20 moves below the second mold closing mechanism 70, the second pressure plate 72 moves downward under the drive of the second drive member 71, thereby causing the upper cover plate 21 to continue rotating, thus switching from the pre-mold closing state to the final mold closing state. Here, the second drive member 71 is an electric slide table, which is arranged vertically. The second pressure plate 72 is mounted on the electric slide table and moves up and down with the electric slide table. A pressure rod 73 is provided at the bottom of the second pressure plate 72, which abuts against the upper cover plate 21 during mold closing.

[0059] In some embodiments, the lower base 22 includes a snap-fit ​​member 24, and the upper cover 21 includes a locking member 25. When the upper cover 21 is in the final mold-closed state, the snap-fit ​​member 24 engages with the locking member 25. The testing mechanism also includes a mold-opening mechanism 60, which is mounted on one side of the slide rail 30 and includes a third drive member 61 and an unlocking member 62. When the test seat 20 moves to the mold-opening mechanism 60, the unlocking member 62, driven by the third drive member 61, abuts against the snap-fit ​​member 24 and applies pressure to the snap-fit ​​member 24, thereby unlocking the snap-fit ​​member 24 from the locking member 25 and opening the upper cover 21. Here, the third drive member 61 is a cylinder, and the unlocking member 62 is mounted on the end of the piston rod of the cylinder. When the chip under test 200 needs to be opened after the test is completed, the cylinder drives the unlocking part 62 to extend, so that the unlocking part 62 applies pressure to the snap-fit ​​part 24, thereby causing the locking part 25 to separate from the snap-fit ​​part 24, realizing the unlocking of the upper cover plate 21 and the lower base 22.

[0060] In some embodiments, the test socket 20 further includes an elastic component 23 mounted below a lower base 22, the lower base 22 having a flow guiding module 26 electrically connected to the chip under test 200. The test machine 80 includes a fourth drive member 83, a test board 81, and a first adapter probe assembly 82, the first adapter probe assembly 82 being mounted on the test board 81. When the test socket 20 moves along the slide rail 30 above the first adapter probe assembly 82, the fourth drive member 83 controllably drives the test socket 20 downwards and compresses the elastic component 23, causing the flow guiding module 26 to contact the first adapter probe assembly 82.

[0061] In some embodiments, the upper cover plate 21 of the test socket 20 is provided with a test probe assembly, a second adapter probe assembly, and an adapter PCB board, both of which are connected to the adapter PCB board. When the upper cover plate 21 and the lower base 22 are in the closed mold state, the test probe assembly contacts the top of the chip under test 200, the second adapter probe assembly contacts the top of the current guiding module 26, and the bottom of the current guiding module 26 contacts the first adapter probe assembly 82, forming a test circuit, thereby enabling the test machine 80 to acquire the signal from the chip under test 200.

[0062] In some embodiments, the chip testing equipment 100 further includes a visual correction mechanism 50, which is mounted on one side of the slide rail 30 and is used to correct the position of the chip under test 200 on the test holder 20. Here, the visual correction mechanism 50 is prior art and will not be described in detail.

[0063] This embodiment takes into account that when the die is soldered to the copper base, the die may be misaligned because the die may be deviated from its position on the copper base. Therefore, the test probe may be misaligned when it is directly inserted into the die, resulting in abnormal contact. Therefore, a visual correction mechanism 50 is introduced to adjust the position of the chip under test 200, which is equivalent to adjusting the position of the die on the test socket 20, thereby improving the accuracy of the probe insertion.

[0064] In some embodiments, the preheating device 10, the visual correction mechanism 50, the second mold closing mechanism 70, the mold opening mechanism 60, and the testing machine 80 are all located on the same side of the slide rail 30.

[0065] along Figure 4 Along the direction of the arrow in the middle, along the extension direction of the slide rail 30, a preheating device 10, a visual correction mechanism 50, a mold opening mechanism 60, a second mold closing mechanism 70 and a testing machine 80 are arranged in sequence.

[0066] The high-temperature test procedure for chip 200 is as follows:

[0067] First, the chip under test 200 is placed on the preheating device 10 for preheating. After heating to the preset temperature, the operator uses a suction pen to pick up the chip under test 200 and places it on the lower base 22 of the test holder 20. At this time, the upper cover 21 and the lower base 22 are in the open state. Then, the test holder 20 is slid along the slide rail 30 to the visual correction mechanism 50. The visual correction mechanism 50 corrects the position of the chip under test 200. At this time, the first mold closing mechanism 40 also moves to the visual correction mechanism 50. At this time, the first pressure plate 42 is located on the back of the upper cover 21. After the correction is completed, the first drive member 41 of the first mold closing mechanism 40 drives the first pressure plate 42 to rotate, so as to rotate the upper cover 21 to a pre-mold closing state with the lower base 22 at a preset angle. The test stand 20 is then moved to the second mold-closing mechanism 70 under control. The second drive member 71 of the second mold-closing mechanism 70 drives the second pressure plate 72 downward, causing the pressure rod 73 to press against the upper cover plate 21 and apply pressure to the upper cover plate 21, causing the upper cover plate 21 to continue rotating until it closes with the lower base 22. The test stand 20 is then moved to the testing machine 80 under control. The fourth drive member 83 of the testing machine 80 applies downward pressure to the test stand 20, compressing the elastic component 23, causing the test stand 20 to move downward until the flow guiding module 26 on the test stand 20 contacts the first adapter probe assembly 82, thereby allowing the testing machine 80 to perform electrical performance testing on the chip under test 200. After the chip under test 200 completes the electrical performance test, the fourth drive member 83 releases the pressure applied to the test stand 20 under control, the elastic component 23 returns to its original state, causing the test stand 20 to move upward, thereby separating the flow guiding module 26 from the first adapter probe assembly 82. The test stand 20 is then moved to the mold opening mechanism 60 under control. The first driving component 41 drives the first pressure plate 42 to rotate in the opposite direction, restoring the first pressure plate 42 to its original position, i.e., in a vertical state. Then, the third driving component 61 of the mold opening mechanism 60 drives the unlocking component 62 to move, causing the unlocking component 62 to abut against the latching component 24 and apply pressure to the latching component 24, causing the latching component 24 to separate from the locking component 25, thereby allowing the upper cover plate 21 to rotate and open. Finally, the test stand 20 is moved to the unloading station under control for unloading the chip 200 under test. Furthermore, when the chip 200 under test is tested at room temperature, the only difference from the high-temperature testing process is that it does not require preheating by the preheating device 10.

[0068] Therefore, those skilled in the art should recognize that although many exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications conforming to the principles of the present invention can be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and recognized as covering all such other variations or modifications.

Claims

1. A chip testing device, characterized in that, include: At least one preheating device, each of the preheating devices including a heat sink and a first heating element, the heat sink being used to place the chip under test, the first heating element being used to heat the heat sink to preheat the chip under test to a preset temperature, the chip under test including a die and a metal base, the die being fixed on the metal base, the metal base being a copper base or an aluminum base; The testing mechanism is located beside the preheating device and includes a test socket and a testing machine. The test socket is used to receive the preheated chip under test and has a second heating element for heating the chip under test. The testing machine is configured to perform electrical performance testing on the chip under test in the test socket when connected to the test socket.

2. The chip testing equipment according to claim 1, characterized in that, The bottom of the heat sink is provided with a mounting groove, and the first heating element is installed in the mounting groove; The heat sink has a first air inlet and at least one adsorption hole. The adsorption hole is located on the top of the heat sink and communicates with the first air inlet. The chip under test is placed at the adsorption hole. The first air inlet is located on the side wall of the heat sink and is connected to a vacuum pump.

3. The chip testing equipment according to claim 2, characterized in that, Each of the preheating devices further includes: The base has the heat sink mounted on its top and has a second air inlet and at least one air outlet. The second air inlet communicates with the air outlet and is connected to an air supply device for providing protective gas. A cover is provided around the heat sink and part of the base to form a protective cavity; protective gas, which is filled through the second air inlet, enters the protective cavity through the air outlet.

4. The chip testing equipment according to claim 3, characterized in that, The base includes a first part and a second part arranged from top to bottom, the heat sink is installed on top of the first part, and the housing includes: The housing covers the outer periphery of the heat sink and the first part, and there is a predetermined distance between the housing and the first part; A top plate is provided above the housing and has an opening for placing and removing the chip under test, through which gas in the protective cavity is discharged.

5. The chip testing equipment according to claim 4, characterized in that, The second part is provided with a second air inlet and a heating chamber communicating with the second air inlet, the heating chamber communicating with the air outlet; each of the preheating devices further includes: The third heating element is installed inside the heating chamber and is used to heat the protective gas.

6. The chip testing equipment according to any one of claims 1-5, characterized in that, The test fixture includes a lower base and an upper cover plate rotatably connected to the lower base. The lower base has a mounting position for placing the chip under test and the second heating element. The test mechanism further includes: The first mold closing mechanism is installed on one side of the test seat and includes a first driving member and a first pressure plate. The first pressure plate rotates under the drive of the first driving member to abut against the upper cover plate and drive the upper cover plate to rotate to a pre-mold closing state at a preset angle with the lower base.

7. The chip testing equipment according to claim 6, characterized in that, The testing facility also includes: A slide rail is arranged along a preset direction. The test seat and the first mold closing mechanism are both mounted on the slide rail and are configured to slide synchronously along the slide rail. The second mold closing mechanism is installed on one side of the slide rail and includes a second driving member and a second pressure plate. When the test seat moves to the bottom of the second mold closing mechanism, the second pressure plate moves downward under the drive of the second driving member to drive the upper cover plate to continue rotating, thereby switching from the pre-mold closing state to the final mold closing state.

8. The chip testing equipment according to claim 7, characterized in that, The lower base includes a snap-fit ​​component, and the upper cover plate includes a locking component. When the upper cover plate is in the final mold-closed state, the snap-fit ​​component engages with the locking component. The testing mechanism further includes: The mold opening mechanism is installed on one side of the slide rail and includes a third driving member and an unlocking member. When the test seat moves to the mold opening mechanism, the unlocking member abuts against the latching member under the drive of the third driving member and applies pressure to the latching member, so that the latching member unlocks from the locking member, thereby opening the upper cover plate.

9. The chip testing equipment according to claim 7, characterized in that, The test socket also includes an elastic component installed below the lower base, and the lower base is provided with a current-conducting module electrically connected to the chip under test; The testing machine includes a fourth driving component, a test plate, and a first adapter probe assembly, wherein the first adapter probe assembly is mounted on the test plate; when the test seat moves along the slide rail to above the first adapter probe assembly, the fourth driving component controls the test seat to move downward and compresses the elastic component, so that the flow guiding module contacts the first adapter probe assembly.

10. The chip testing equipment according to claim 9, characterized in that, Also includes: A visual correction mechanism is installed on one side of the slide rail and is used to correct the position of the chip under test on the test stand.

Images