A multi-channel high-integration low-cost tile type transmitting assembly

Abstract

The utility model provides a kind of multi-channel high integration low-cost tile type transmitting assembly, including tile type shell, input interface, microstrip line located in tile type shell interior and input interface are sequentially connected, microwave composite multilayer board, two branch networks are connected on microwave composite multilayer board and with microstrip line output end connection, first drive power amplifier, second drive power amplifier are respectively connected with the two output ends of two branch networks, first eight branch networks are connected with the output end of first drive power amplifier, second eight branch networks are connected with the output end of second drive power amplifier, 16-way transmitting channel and radio frequency output port connected with transmitting channel output end are respectively connected with the output end of first eight branch networks, second eight branch networks, the number of radio frequency output port is 16.The utility model is X frequency band 16 channel tile type high integration, high reliability, high consistency and with power amplification, numerical control phase shift and output detection etc. The utility model discloses a kind of multi-channel high integration low-cost tile type transmitting assembly, including tile type shell, output interface, microstrip line located in tile type shell interior and output interface are sequentially connected, microwave composite multilayer board, two branch networks are connected on microwave composition multilayer board and with microstrip line output end connection, first drive power amplifier, second power amplifier are respectively connected with the two output ends of two branch networks, first eight branch networks is connected with the output end of first drive power amplifier, second eight branch networks is connected with the output end of second drive power amplifier, 16-way transmitting channel and radio frequency input port connected with transmitting channel output end are respectively connected with the output end of first eight branch networks and second eight branch networks, the number of radio frequency input port is 16.

Description

Technical Field

[0001] This utility model relates to the field of electrical component technology, specifically to a multi-channel, highly integrated, low-cost tile-type transmitter assembly. Background Technology

[0002] Phased array antennas are widely used in radar, communications and other fields due to their unique beam control capabilities. Their transmitting system generates a high-power radio frequency signal with a certain transmit waveform, which is fed to all antenna elements. Their operation mainly depends on controlling the phase of each antenna element in the array, thereby realizing electronic scanning and directional radiation of the beam.

[0003] The transmitting component is located between the phased array transmitting antenna and the upconversion component. Its input port is connected to the upconversion component and its output port is connected to the transmitting antenna. It is the core component of the phased array antenna and plays a key role in processing the transmitted signal. It can amplify the low-power transmitted signal output by the upconversion component and realize the phase shift and beam control functions required for antenna beam scanning.

[0004] The transmitting component occupies a critical position in the phased array antenna and plays a decisive role in the performance of the entire phased array system. Therefore, it is crucial to achieve high integration, high performance and high consistency of the transmitting component. Summary of the Invention

[0005] This invention aims to address the issues of integration, reliability, and consistency in phased array antenna transmitting components. It provides a multi-channel, highly integrated, low-cost tile-type transmitting component, which is a 16-channel tile-type transmitting component for the X-band with high integration, high reliability, high consistency, and functions such as power amplification, digitally controlled phase shifting, and output detection.

[0006] This utility model provides a multi-channel, highly integrated, low-cost tile-type transmitter assembly, including a tile-type housing, an input interface connected to the side of the tile-type housing, a microstrip line and a microwave composite multilayer board located inside the tile-type housing and sequentially connected to the input interface, a two-way network connected to the microwave composite multilayer board and connected to the output end of the microstrip line, a first drive power amplifier and a second drive power amplifier respectively connected to the two output ends of the two-way network, a first eight-way network connected to the output end of the first drive power amplifier, a second eight-way network connected to the output end of the second drive power amplifier, 16 transmission channels respectively connected to the output ends of the first eight-way network and the second eight-way network, and RF output ports connected to the output ends of the transmission channels, with the number of RF output ports being 16.

[0007] The present invention discloses a multi-channel, highly integrated, low-cost tile-type transmitter assembly. In a preferred embodiment, the transmitter channel includes a radio frequency switch, a phase shifter, a final stage power amplifier, and a directional coupler connected in sequence, with the main path output port of one directional coupler connected to a radio frequency output port.

[0008] In the preferred embodiment of the multi-channel, highly integrated, low-cost tile-type transmitter assembly described in this utility model, the radio frequency output ports are all vertically connected to the top surface of the tile-type housing, so that the radio frequency signal is vertically output upward to the antenna unit.

[0009] The multi-channel, highly integrated, low-cost tile-type transmitting component of this utility model, as a preferred embodiment, also includes a detector connected to the output end of the coupling path of the directional coupler, and the detector is connected to a microwave composite multilayer board.

[0010] The multi-channel, highly integrated, low-cost tile-type transmitter assembly described in this utility model, as a preferred embodiment, further includes a 16-to-1 switch, an operational amplifier, and a power / control module connected in sequence to the detector.

[0011] The multi-channel, highly integrated, low-cost tile-type transmitter assembly described in this utility model, as a preferred embodiment, also includes a video interface recessed and connected to the other side of the tile-type housing. The video interface is vertically interconnected to the power / control module via a cable plug.

[0012] In the present invention, a multi-channel, highly integrated, low-cost tile-type transmitter assembly is preferably provided in which the devices in the 16 transmitter channels are identical and use the same topology.

[0013] The present invention discloses a multi-channel, highly integrated, low-cost tile-type transmitter assembly, in which, as a preferred embodiment, 16 transmitter channels are arranged into 4 groups, and the output radio frequency signal is an X-band radio frequency signal.

[0014] The multi-channel, highly integrated, low-cost tile-type transmitter assembly described in this utility model, as a preferred embodiment, has a single-layer structure shell for the tile-type shell.

[0015] The multi-channel, highly integrated, low-cost tile-type transmitter assembly described in this utility model, as a preferred embodiment, includes an input interface comprising an airtight glass insulator and an SMA RF connector.

[0016] The technical solution of this utility model is as follows: The component adopts a low-cost design suitable for mass production and testing, utilizing all-solid-state chips and microwave composite multilayer boards. It employs a vertical interconnect structure, rationally designing external interfaces and transmission line layouts, and using a single-layer tile-type structure design to transition planar RF signals to vertical transmission, directly connecting to the two-dimensional phased array antenna unit. The 16-channel circuit network and structural design of each component are highly consistent, integrating power amplifiers, branch networks, phase shifters, coupling detector networks, and other circuits, achieving a highly integrated and highly consistent transmission component with power amplification, digitally controlled phase shifting, and output detection functions. Specific implementation measures are as follows:

[0017] (1) This utility model adopts a single-layer tile-type structure design. The RF input port is located on the side of the component, directly receiving the RF signal output from the up-conversion component. The RF output port is perpendicular to the structural surface and is vertically interconnected upwards with the antenna unit via an RF connector. The video socket is located on the side and recessed into the end face of the component, and is vertically interconnected downwards with the power supply and control module via a cable plug. This solution compresses the thickness of the module while maximizing the utilization of the structural area, thus achieving a highly integrated design.

[0018] (2) The circuit network and structural design of each channel of this utility model follow the principle of high consistency. The functions of each channel of this utility model are completely the same, the channels are independent of each other, the circuit adopts the same topology and process, and the transmission lines of each segment are not only consistent in length, but also adopt symmetrical, mirror or rotated layout; each stage of each channel selects the same specification of device, and through unified circuit layout and layout design and good inter-stage matching, the high consistency of the emission amplitude / phase of different channels between components is guaranteed on the basis of high integration.

[0019] (3) This utility model can achieve the requirements of 0.3W transmission power and 30% or more in the broadband range of 8GHz to 12GHz. The component's transmission input adopts a design of hermetically sealed glass insulators with SMA RF connectors. After the RF signal enters the component, it is output to 16 channels through a split network. Each channel achieves power amplification, digital phase shifting and other functions through independent customized transmission chips to ensure high operating efficiency. At the same time, each channel can be controlled separately. The output signal is vertically output through a vertical transition structure and externally through an SMP connector to reduce system feeder loss.

[0020] (4) The branching network of this utility model is implemented by a four-stage Wilkins splitter. The stripline wiring form is used in the circuit, which has better anti-interference ability than the commonly used microstrip line form and achieves good isolation between different channels. The ports of the branching network adopt the same layer microstrip to stripline transition structure. Compared with the surface microstrip line to inner layer stripline form, each port reduces one layer transition and reduces transmission line loss. The same layer microstrip line to stripline transition structure is implemented by a gradient transmission line to achieve good impedance matching between different transmission lines and minimize transmission loss.

[0021] (5) This utility model can realize the coupling detection function of output power. After the transmission signal of each channel passes through the power amplifier, it is transmitted to the power detector through the coupling line directional coupler circuit. The detector converts the power signal into a voltage signal. The 16-channel voltage signal 16-to-1 switch and operational amplifier output the detected signal to the power supply and control module for amplification and processing, thereby realizing the coupling detection function of output power.

[0022] The principle behind the above solution is as follows: Due to the limitations of the system structure, the size of the transmitting component is strictly limited, making the traditional brick-like structure unusable. Simultaneously, due to the special location of the transmitting component, the structural design should facilitate the sequential connection of the transmitting antenna, up-converter component, and power supply and control module. This invention adopts a single-layer tile-like structural design, placing the output port connected to the transmitting antenna on the front, the output port connected to the up-converter component on the side, and the video port connected to the power supply and control module on the back. The ports and internal wiring are rationally arranged, and a vertical interconnection structure allows for signal transmission across both sides of the component, achieving miniaturization and high integration of the transmitting component.

[0023] This invention amplifies the RF signal output from the upconversion component and implements phase control for each channel before outputting it to the antenna unit. The component internally uses a customized GaAs MMIC chip, including a driver power amplifier, RF switch, phase shifter, and final stage power amplifier, increasing integration density, reducing circuit area, and simplifying off-chip circuitry, thereby reducing assembly workload. Key performance indicators of the transmitting component include: active gain, output power, input VSWR, phase shift range, phase shift RMS, and amplitude-phase consistency.

[0024] This utility model relates to a phased array antenna transmitting assembly, specifically an X-band 16-channel tile-type integrated transmitting assembly. It primarily performs amplification, phase shifting, and splitting functions for the uplink signals of 16 channels, as well as detection functions for the transmitted signals, while ensuring high integration and consistency of signal transmission across all channels. It can serve as a standardized series of transmitting assemblies for X-band phased array antennas.

[0025] This utility model has the following advantages:

[0026] (1) This utility model adopts a tile-type structure, which minimizes the module thickness compared to the brick-type structure and greatly saves the module's Z-direction volume. When designing the transmission line layout, the vertical interconnection structure is used flexibly to transition the planar transmission signal output to the vertical transmission direction in one step, greatly reducing the design complexity. The RF circuit, power supply circuit, and control circuit are integrated on a microwave composite multilayer board, greatly reducing the module's XY-direction volume. Each channel has the same function and uses the same components. The channels are independent of each other, and each channel circuit adopts the same topology. Each channel can be controlled independently, achieving a high degree of integration design for the 16-channel transmitting component. The circuit network and structure design of each channel follow the principle of high consistency, maximizing the consistency of the 16-channel signal transmission. The integrated power amplifier, branch network, phase shifter, and coupling detector network circuits realize the functions of power amplification, digitally controlled phase shifting, and output power coupling detection of the transmitting component.

[0027] (2) The transmitting component of this utility model uses a single-layer tile structure, and a single component integrates 16 channels. Compared with the brick structure, which requires 4 components to achieve 16 channels, the number of components is reduced. Compared with the multi-layer tile structure, the complexity of the product and the difficulty of design and manufacturing are greatly reduced. The radio frequency circuit, power supply circuit and control circuit are integrated on a microwave composite multilayer board. The microwave composite multilayer board is fixed to the component box by screws, which replaces the common soldering method of high frequency circuit boards and greatly reduces the assembly difficulty. The component uses a customized GaAs MMIC chip, which increases the integration density, reduces the circuit area and simplifies the off-chip circuit, thereby reducing the assembly workload of the component. The 16 channels use completely identical components and the circuit layout is highly uniform, which is convenient for mass production using automated equipment. Attached Figure Description

[0028] Figure 1 A front view of a multi-channel, highly integrated, low-cost tile-type transmitter assembly;

[0029] Figure 2 A rear view of a multi-channel, highly integrated, low-cost tile-type transmitter assembly;

[0030] Figure 3 A bottom view of a multi-channel, highly integrated, low-cost tile-type transmitter assembly;

[0031] Figure 4 Right view of a multi-channel, highly integrated, low-cost tile-type transmitter assembly;

[0032] Figure 5A schematic diagram of the tile structure of a multi-channel, highly integrated, low-cost tile-type transmitter assembly;

[0033] Figure 6 This is a block diagram illustrating the principle of a multi-channel, highly integrated, low-cost tile-type transmitter assembly.

[0034] Figure 7 This is an internal circuit layout diagram of a multi-channel, highly integrated, low-cost tile-type transmitter assembly.

[0035] Figure label:

[0036] 1. Tile-shaped housing; 2. Input interface; 3. Microstrip line; 4. Microwave composite multilayer board; 5. Two-way network; 6. First drive power amplifier; 7. Second drive power amplifier; 8. First eight-way network; 9. Second eight-way network; 10. Transmit channel; 101. RF switch; 102. Phase shifter; 103. Final stage power amplifier; 104. Directional coupler; 11. RF output port; 12. Video interface. Detailed Implementation

[0037] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0038] Example 1

[0039] like Figures 1-4 The image shown is an outline of a multi-channel, highly integrated, low-cost tile-type transmitter assembly. Figure 5 This is a schematic diagram of the tile-type structure of the launch component. Figure 6 This is a block diagram of the transmitting component. Figure 7 This is a diagram showing the internal circuit layout of the transmitting component.

[0040] The transmitter assembly of this utility model has external dimensions of 110mm×120mm×12mm and has one radio frequency input interface 2, 16 radio frequency output interfaces 11, and one video interface 12.

[0041] Figure 1 To receive the front top view of the component structure, Figure 2 This is a diagram showing the internal circuit layout of the receiving component structure from the reverse side. Figure 1 After flipping along the central axis, we get Figure 2 There are 4 rows of RF output interfaces 11, with 4 interfaces in each row, for a total of 16 RF output interfaces 11.

[0042] like Figure 5 , 6As shown in Figure 7, when the component is in the transmit state, the 10GHz RF signal output by the upconversion component enters the transmit component through the side input interface 2. The RF signal is transmitted through the microstrip line 3. The microwave composite multilayer board 4 integrates a two-way network 5, a first eight-way network 8, and a second eight-way network 9. The signal is first split into two paths, I and II, through the two-way network 5. Signal I is amplified in the first stage by the first driving power amplifier 6, and then the RF signal is divided into the first eight paths through the first eight-way network 8. Signal II is amplified in the first stage by the second driving power amplifier 7, and then the RF signal is divided into the last eight paths through the second eight-way network 9. The 16 divided signals each pass through a separate RF link (transmit channel 10). Each RF link includes an RF switch 101, a phase shifter 102, and a final stage power amplifier 103. After amplification, the RF signal enters the RF output port 11 through the main path of the coupling line directional coupler 104 and is vertically output to the antenna element. The coupled signal enters the detector through the coupling path of the coupling line directional coupler 104. The video interface 12 is located on the side and recessed into the end face of the component, and is vertically interconnected downwards with the power supply and control module via a cable plug.

[0043] When the component is in standby mode, the 10GHz RF signal output by the upconversion component enters the transmitting component through input interface 2. The RF signal is transmitted through microstrip line 3. The microwave composite multilayer board 4 integrates a two-way network 5, a first eight-way network 8, and a second eight-way network 9. The signal is first split into two paths, I and II, through the two-way network 5. Signal I is amplified in the first stage by the first driver power amplifier 6, and then the RF signal is divided into the first eight paths through the corresponding first eight-way network 8. Signal II is amplified in the first stage by the second driver power amplifier 7, and then the RF signal is divided into the last eight paths through the second eight-way network 9. The 16 divided signals are disconnected when each signal passes through the RF switch 101 in the transmitting channel 10, preventing the RF signal from being transmitted further, and there is no output signal at this time.

[0044] like Figure 1 , 2 As shown in Figures 3 and 4, the input signal received by the transmitting component enters from the side, passes through the branch network, RF switch 101, phase shifter 102, final stage power amplifier 103, coupling detector network, and other circuits, and then undergoes a vertical transition before being output to the RF output port 11 on the front. It can be seen that this transmitting component uses a vertical interconnect transition structure, replacing the traditional brick-like component with a single-layer tile-like structure, greatly reducing the product thickness. Through highly integrated circuit design, the wiring layout is more compact, and the layout and structural design of each channel's circuit network are highly consistent, thus achieving high integration and high consistency of the transmitting component. At the same time, the product design and assembly difficulty and assembly workload are greatly reduced, facilitating mass production using automated equipment and further reducing product costs.

[0045] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A multi-channel, highly integrated, low-cost tile-type transmitter assembly, characterized in that: The device includes a tile-shaped housing (1), an input interface (2) connected to the side of the tile-shaped housing (1), a microstrip line (3) and a microwave composite multilayer board (4) located inside the tile-shaped housing (1) and connected in sequence to the input interface (2), a two-way network (5) connected to the microwave composite multilayer board (4) and connected to the output end of the microstrip line (3), a first driving power amplifier (6) and a second driving power amplifier (7) respectively connected to the two output ends of the two-way network (5), a first eight-way network (8) connected to the output end of the first driving power amplifier (6), a second eight-way network (9) connected to the output end of the second driving power amplifier (7), a 16-channel transmit channel (10) respectively connected to the output ends of the first eight-way network (8) and the second eight-way network (9), and a radio frequency output port (11) connected to the output end of the transmit channel (10). The number of radio frequency output ports (11) is 16.

2. The multi-channel, highly integrated, low-cost tile-type transmitter assembly according to claim 1, characterized in that: The transmission channel (10) includes a radio frequency switch (101), a phase shifter (102), a final stage power amplifier (103), and a directional coupler (104) connected in sequence. The main path output port of one of the directional couplers (104) is connected to one of the radio frequency output ports (11).

3. The multi-channel, highly integrated, low-cost tile-type transmitter assembly according to claim 1, characterized in that: The radio frequency output ports (11) are all vertically connected to the top surface of the tile-shaped housing (1) and output radio frequency signals vertically upward to the antenna unit.

4. The multi-channel, highly integrated, low-cost tile-type transmitter assembly according to claim 2, characterized in that: It also includes detectors that are connected to the output terminals of the coupling paths of the directional coupler (104), and the detectors are connected to the microwave composite multilayer board (4).

5. A multi-channel, highly integrated, low-cost tile-type transmitter assembly according to claim 4, characterized in that: It also includes a 16-to-1 switch, an operational amplifier, and a power / control module that are connected in sequence to the detector.

6. The multi-channel, highly integrated, low-cost tile-type transmitter assembly according to claim 5, characterized in that: It also includes a video interface (12) that is recessed and connected to the other side of the tile-shaped housing (1), the video interface (12) being vertically interconnected to the power / control module via a cable plug.

7. The multi-channel, highly integrated, low-cost tile-type transmitter assembly according to claim 1, characterized in that: The devices in the 16 transmission channels (10) are the same and use the same topology.

8. The multi-channel, highly integrated, low-cost tile-type transmitter assembly according to claim 7, characterized in that: The 16 transmission channels (10) are arranged into 4 groups.

9. A multi-channel, highly integrated, low-cost tile-type transmitter assembly according to claim 1, characterized in that: The tile-type shell (1) is a single-layer structure shell, and the output radio frequency signal is an X-band radio frequency signal.

10. A multi-channel, highly integrated, low-cost tile-type transmitter assembly according to claim 1, characterized in that: The input interface (2) includes an airtight glass insulator and an SMA radio frequency connector.

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