A jack device for an epoxy resin wiring board

CN224697988UActive Publication Date: 2026-08-28KUNSHAN LANBOTEL ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202521988770.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-16
Publication Date
2026-08-28
Estimated Expiration
2035-09-16

AI Technical Summary

Technical Problem

[0004]本实用新型提供了一种环氧树脂线路板的塞孔装置,解决了现有技术中手动塞孔存在的效率低以及无法保证成品合格率的缺陷

Benefits of technology

本实用新型环氧树脂线路板的塞孔装置通过夹持结构来夹持待塞孔的线路板,将两组塞孔组件安装在升降板的底部,升降板下降过程中,由塞孔组件将树脂填充在线路板的孔内,从而完成线路板的塞孔,与人工塞孔相比,提高了塞孔的效率,从而满足批量生产的需求,同时可以保证塞孔的饱满度,避免出现漏塞的情况,提高了成品的合格率。

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Abstract

The utility model relates to a kind of hole filling device of epoxy resin circuit board, it includes: box;Clamping structure, the clamping structure is fixed in the top of the box, for clamping circuit board;Hole filling structure, the hole filling structure includes liftablely installed in the box lifting plate, through the through slot of the lifting plate and is fixed in the hole filling assembly of lifting plate bottom, the hole filling assembly is used to fill resin into the hole of the circuit board inside.The utility model hole filling device of epoxy resin circuit board is clamped by clamping structure to the circuit board to be filled with hole, installs two groups of hole filling assembly in the bottom of lifting plate, resin is filled in the hole of the circuit board by hole filling assembly during the descent of lifting plate, to complete the hole filling of circuit board, compared with artificial hole filling, improve the efficiency of hole filling, to meet the demand of mass production, while it can guarantee the fullness of hole filling, avoid the situation of leakage, improve the qualified rate of finished product.
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