Wafer heating device and wafer cleaning machine
CN224698253UActive Publication Date: 2026-08-28SHENZHEN PENGXIN MICRO INTEGRATED CIRCUIT MFG CO LTD
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Patent Information
- Application Number
- CN202522146072.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-10
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2035-10-10
AI Technical Summary
Technical Problem
[0002]在一些晶圆加热装置中，由于晶圆快速受热，导致晶圆在厚度方向上存在温度梯度，导致晶圆出现弯曲变形，导致晶圆底部向下凸起而与下方的加热器接触并产生刮伤，进而造成晶圆应力不均匀产生碎片、背面缺陷而污染下游机台，降低光刻套刻精度等问题，降低工艺良率
Benefits of technology
[0013]本公开实施例提供一种晶圆加热装置，包括加热组件，包括套设于加热组件外侧边缘的承载组件，承载组件用于在加热组件之上支撑并固定晶圆的边缘，承载组件可旋转以带动晶圆旋转，晶圆的底面从承载组件显露并面向加热组件的上表面；还包括固定连接在加热组件的上表面的边缘上的光传感器组，光接收器接收光发射器发射的光信号或者接收光发射器发射信号的反射信号；还包括设置在加热组件且与加热组件固定连接的升降轴，升降轴升降以带动加热组件升降；当光接收器接收的光信号因被晶圆遮挡而中断时，升降轴带动加热组件下降使加热组件远离晶圆，避免晶圆因向下弯曲而接触加热组件的表面，进而避免晶圆的刮伤、减少晶圆破片，提高制程良率。
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Abstract
The embodiments of the present disclosure disclose a wafer heating device and a wafer cleaning machine, the wafer heating device comprises: a heating assembly; a bearing assembly, which is arranged around the outer periphery of the heating assembly; the bearing assembly supports and fixes the edge of the wafer, and the bearing assembly can rotate to drive the wafer to rotate; the bottom surface of the wafer is exposed from the bearing assembly and faces the heating assembly; a light sensor group, which comprises a light emitter and a light receiver; the light sensor group is fixedly connected to the edge of the upper surface of the heating assembly; a lifting shaft, which is located at the bottom of the heating assembly; the lifting shaft is fixedly connected with the heating assembly, and the lifting shaft is lifted to drive the heating assembly to be lifted.
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