A solder paste blowing and collecting device

Abstract

This utility model discloses a solder paste blowing and collecting device, comprising: a collecting box, spaced apart from the solder paste nozzle, for collecting excess solder paste from the solder paste nozzle; and a blowing assembly, located on the side of the collecting box near the solder paste nozzle, for providing high-pressure gas to blow excess solder paste from the solder paste nozzle into the collecting box. This solder paste blowing and collecting device actively blows away excess solder paste from the solder paste nozzle through the blowing assembly, ensuring that excess solder paste on the nozzle is accurately guided into the collecting box, rather than splashing onto products, carriers, fixtures, or workbenches; fundamentally eliminating batch defects caused by solder paste splashing and contaminating products, and significantly reducing product scrap rates.

Description

Technical Field

[0001] This utility model belongs to the field of electronic component assembly and surface mount technology, and specifically relates to a solder paste blowing and collecting device. Background Technology

[0002] In the current electronics manufacturing industry, soldering or dotting with solder paste is a common process. When using syringe-type dispensing / paste application equipment, excess or splattered solder paste inevitably remains on the needle tip. This excess solder paste is scattered around the product, with some splattering onto the product surface, easily contaminating the product and causing batch defects and a high scrap rate. It also accumulates on fixtures, jigs, carriers, and workbenches, making the work surface dirty and messy. Cleaning up the scattered solder paste increases the operator's workload and disrupts the normal production rhythm. Contaminated fixtures require frequent shutdowns for cleaning, reducing the overall efficiency of the equipment. Existing cleaning methods, such as manual wiping, are inefficient, difficult to collect, and cannot fundamentally solve the problem. Existing solutions may be too complex, space-consuming, costly, or unsuitable for existing high-speed production lines. There is a lack of a simple, efficient method that can be seamlessly integrated into existing production lines. Utility Model Content

[0003] To address the aforementioned problems, the primary objective of this invention is to provide a solder paste blowing and collecting device, which solves the technical problem that existing equipment cannot remove excess solder paste before solder paste contamination occurs.

[0004] To achieve the above objectives, the technical solution of this utility model is as follows:

[0005] This utility model provides a solder paste blowing and collecting device, comprising:

[0006] A collection box, spaced apart from the solder paste syringe, is used to collect excess solder paste from the solder paste syringe.

[0007] A blow-off assembly, located on the side of the collection box near the solder paste needle tube, is used to provide high-pressure gas to blow excess solder paste from the solder paste needle tube into the collection box.

[0008] By actively blowing away excess solder paste from the solder paste nozzles, it ensures that excess solder paste on the nozzles is precisely guided into the collection box, rather than splashing onto products, carriers, fixtures, or workbenches. This fundamentally eliminates batch defects caused by solder paste splashing and contamination of products, significantly reducing product scrap rates. It also keeps fixtures and workbenches clean, solving the problem of messy and disorganized work sites and meeting the 5S or 6S management standards of modern factories. Furthermore, it automates the cleaning process, freeing operators from tedious cleaning tasks and reducing downtime for cleaning.

[0009] Furthermore, the collection box is provided with a receiving cavity, and the collection box is provided with a hole on the side near the solder paste needle tube. The hole communicates with the receiving cavity. There are multiple holes arranged at intervals. The holes are used for the solder paste needle tube to pass through and extend into the collection box.

[0010] The orifice serves as a guide and limiter, ensuring that the solder paste needle can be precisely inserted into the predetermined position within the collection box. Simultaneously, it limits the leakage of gas and trace amounts of splashing material from the inlet during the purging process, improving collection efficiency and reducing the possibility of secondary contamination.

[0011] Furthermore, it also includes:

[0012] An exhaust assembly, located in the collection box and on the side of the solder paste needle tube away from the blow-off assembly, is used to exhaust excess gas in the collection box.

[0013] When high-pressure gas is blown into a sealed or semi-sealed collection box, positive pressure is generated. The exhaust component can promptly and smoothly discharge excess gas from the collection box, preventing excessive pressure inside the collection box from causing gas carrying solder paste particles to be sprayed out in reverse from the needle inlet hole, thus preventing new contamination and ensuring stable direction and force of the blowing airflow, resulting in consistent and reliable cleaning effect.

[0014] Furthermore, the blowing assembly includes multiple blowing nozzles, each corresponding to and spaced apart from the solder paste needle tube. The blowing nozzles extend into the collection box and blow out high-pressure gas to remove excess solder paste from the solder paste needle tube.

[0015] Each solder paste nozzle is equipped with an independent blow-off nozzle, which can simultaneously blow off multiple solder paste nozzles. This is highly matched to the production cycle. Each blow-off nozzle can be adjusted to the optimal angle and distance for its corresponding solder paste nozzle, ensuring that the high-pressure gas can accurately and centrally act on the residual solder paste on the nozzle. The blowing force is strong and there are no dead angles, avoiding the problems of airflow dispersion and insufficient force caused by using a large blow-off nozzle.

[0016] Furthermore, the blow-off assembly includes multiple air pipes, each corresponding to a solder paste needle tube. The blow-off nozzle is located on the side of each air pipe near the solder paste needle tube and is connected to the air pipe. The air pipe is used to provide high-pressure gas to the nozzle.

[0017] Independent air tubes ensure that each blow-off nozzle receives sufficient and stable pressure gas, and the purging effect between each solder paste needle tube does not interfere with each other, thus ensuring a stable gas supply. The modular design allows for easy replacement of individual blow-off nozzles or air tubes when they are damaged, without affecting the entire system, making it easy to maintain.

[0018] Furthermore, the collection box has an absorption layer on the side away from the blow-off assembly.

[0019] The absorbent layer effectively adsorbs and contains the blown-off, sticky liquid or semi-liquid solder paste, preventing excess solder paste from rolling in the collection box or adhering to the box wall. When solder paste particles impact the absorbent layer at high speed, the energy of the solder paste particles is absorbed, effectively preventing rebound and secondary splashing. Replacing the absorbent layer periodically completes the waste cleaning, which is very convenient and quick, greatly reducing the workload of maintenance.

[0020] Furthermore, it also includes:

[0021] Carrier fixture base, used for mounting products;

[0022] A positioning base, wherein the collection box is disposed on the side of the positioning base near the solder paste needle tube.

[0023] By installing the collection box on the positioning base, the narrow space between the fixtures is fully utilized without requiring major changes to the production line layout, resulting in high space utilization. The cooperation between the carrier fixture base and the positioning base ensures that the relative positions between the product and the solder paste needle tube, and between the solder paste needle tube and the collection box are always accurate. This is a prerequisite for achieving automated purging and the goal of accurate positioning.

[0024] Furthermore, it also includes:

[0025] A three-axis machine carrier platform is used to mount the solder paste needle and the blow-off assembly, and is used to move along the first direction, the second direction and the third direction respectively;

[0026] The triaxial machine carrier platform is used to drive the solder paste needle to apply solder paste to the product; and to drive the solder paste needle to extend into the collection box, and to bring the solder paste needle close to the blow-off nozzle to blow off excess solder paste from the solder paste needle; and to drive the exhaust assembly to discharge excess gas from the collection box, and to drive the solder paste needle to move out of the collection box.

[0027] By integrating all actions such as the movement of the solder paste needle, the triggering of air blowing, and the coordination of exhaust into a system formed by a three-axis machine carrier platform, carrier fixture base, and positioning base, the system becomes a complete and automated production process without human intervention. The entire purging process includes the movement of the solder paste needle, the insertion of the solder paste needle into the collection box, the blowing component blowing excess solder paste, and the removal of the solder paste needle from the collection box. The time taken is fixed, perfectly integrated into the original production rhythm, ensuring cleaning effect while having zero negative impact on production efficiency.

[0028] Furthermore, the distance between the blow-off nozzle and the solder paste needle tube ranges from 1.9mm to 2.1mm.

[0029] The optimal distance between the blower nozzle and the solder paste needle is 2mm. If the distance is too far, the airflow will weaken, making it difficult to effectively remove the viscous solder paste. If the distance is too close, there is a risk of excessive splashing that could contaminate other parts of the box, or even collide with or damage the delicate needle. A reasonable distance ensures that the airflow has the best impact force when it reaches the solder paste needle, which can thoroughly remove residue while ensuring safety and reliability.

[0030] Furthermore, the solder paste needle extends to a depth of 11.5 mm to 12.5 mm into the collection box.

[0031] The depth to which the solder paste needle extends into the collection box is preferably 12mm. If the depth of the solder paste needle extension into the collection box is insufficient, the needle tip may still be near the orifice, and there is a risk that a small amount of solder paste will still splash outside the box during purging. If the depth of the solder paste needle extension into the collection box is excessive, it may increase the solder paste needle travel or interfere with the structure inside the collection box. The reasonable design of the depth range of the solder paste needle extension into the collection box ensures that the part of the solder paste needle that needs to be cleaned is completely inside the effective volume of the collection box, so that all the blown-off solder paste can be safely captured in the collection box.

[0032] Compared with the prior art, the beneficial effects of this application are as follows: The solder paste blowing and collecting device includes: a collecting box, spaced apart from the solder paste needle tube, for collecting excess solder paste from the solder paste needle tube; and a blowing component, located on the side of the collecting box near the solder paste needle tube, for providing high-pressure gas to blow excess solder paste from the solder paste needle tube into the collecting box. This solder paste blowing and collecting device actively blows away excess solder paste from the solder paste needle tube through the blowing component, ensuring that excess solder paste on the solder paste needle tube is accurately guided into the collecting box, rather than splashing onto products, carriers, fixtures, or workbenches; fundamentally eliminating batch defects caused by solder paste splashing and contaminating products, significantly reducing product scrap rates; maintaining the cleanliness of fixtures and workbenches, solving the problem of a dirty and messy work environment, and meeting the 5S or 6S management standards of modern factories; and automating the cleaning process, freeing operators from tedious cleaning work and reducing downtime for cleaning. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of the overall structure of a solder paste blowing and collecting device according to this utility model.

[0034] Figure 2 yes Figure 1 A magnified schematic diagram of the structure at point A in the middle.

[0035] Figure 3 This is a partial structural diagram of a solder paste blowing and collecting device after the collection box has been removed.

[0036] Figure 4 This is a cross-sectional schematic diagram of the collection box of a solder paste blowing and collecting device according to this utility model.

[0037] In the figure: 1. Solder paste needle tube; 10. Collection box; 11. Receiving cavity; 12. Hole; 13. Absorption layer; 20. Blow-out assembly; 21. Blow-out nozzle; 22. Air pipe; 30. Exhaust assembly; 40. Positioning base; 50. Triaxial machine carrier platform. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0039] To achieve the above objectives, the technical solution of this utility model is as follows:

[0040] It should be noted that, based on the existing deficiencies in the current technology, the problems that need to be solved include: how to proactively and automatically remove excess solder paste before it causes contamination, thus eliminating the possibility of product and work environment contamination at the source; how to cleverly integrate the collection system into the narrow space between the existing three-axis platform and fixture without changing the existing production process, occupying additional space, or affecting the production cycle; how to design a structure that can effectively collect the blown-off, sticky solder paste and handle the high-pressure airflow generated during blowing to prevent secondary splashing; and how to design a modular system that is easy to install and maintain to be suitable for products and production processes with similar structures.

[0041] To solve the above problem, see Figures 1-4 As shown, this utility model provides a solder paste blowing and collecting device, including: a collecting box 10, which is spaced apart from the solder paste needle tube 1, for collecting excess solder paste from the solder paste needle tube 1; and a blowing assembly 20, which is disposed on the side of the collecting box 10 near the solder paste needle tube 1, for providing high-pressure gas to blow excess solder paste from the solder paste needle tube 1 into the collecting box 10.

[0042] By actively blowing away excess solder paste from the solder paste nozzle 1 using the blow-off component 20, it ensures that excess solder paste on the nozzle 1 is precisely guided into the collection box 10, rather than splashing onto products, carriers, jigs, or workbenches. This fundamentally eliminates batch defects caused by solder paste splashing and contaminating products, significantly reducing product scrap rates. It also keeps jigs and workbenches clean, solving the problem of messy and dirty work sites and meeting the 5S or 6S management standards of modern factories. Furthermore, it automates the cleaning process, freeing operators from tedious cleaning work and reducing downtime for cleaning.

[0043] Furthermore, the collection box 10 is provided with a receiving cavity 11. The collection box 10 is provided with a hole 12 on the side near the solder paste needle tube 1. The hole 12 communicates with the receiving cavity 11. Multiple holes 12 are provided and arranged at intervals. The holes 12 are used for the solder paste needle tube 1 to pass through and extend into the collection box 10.

[0044] The hole 12 serves as a guide and limiter, ensuring that the solder paste needle 1 can be accurately inserted into the predetermined position within the collection box 10. Simultaneously, it limits the leakage of gas and trace amounts of splashing material from the inlet during the purging process, improving collection efficiency and reducing the possibility of secondary contamination.

[0045] Furthermore, the solder paste blowing and collecting device also includes:

[0046] The exhaust assembly 30 is located in the collection box 10 and on the side of the solder paste needle tube 1 away from the blow-out assembly 20, and is used to exhaust excess gas in the collection box 10.

[0047] After the high-pressure gas provided by the blowing assembly 20 is blown into the sealed or semi-sealed collection box 10, positive pressure is generated. The exhaust assembly 30 is provided with an exhaust port located in the collection box 10 to safely discharge the high-pressure gas. It can timely and smoothly discharge excess gas in the collection box 10, avoiding excessive pressure in the collection box 10 that would cause the gas to carry solder paste particles and spray out in reverse from the inlet hole of the solder paste needle tube 1, thereby preventing new contamination and ensuring that the direction and force of the blowing airflow are stable, so that the cleaning effect is consistent and reliable.

[0048] Furthermore, the blow-off assembly 20 includes a plurality of blow-off nozzles 21, which correspond one-to-one with the solder paste needle tubes 1 and are spaced apart. The blow-off nozzles 21 are used to extend into the collection box 10 and to blow out high-pressure gas to remove excess solder paste from the solder paste needle tubes 1.

[0049] Each solder paste nozzle 1 is equipped with an independent blow-off nozzle 21, which can simultaneously blow off multiple solder paste nozzles 1. This is highly compatible with the production cycle. Each blow-off nozzle 21 can be adjusted to the optimal angle and distance for its corresponding solder paste nozzle 1, ensuring that the high-pressure gas can accurately and centrally act on the residual solder paste on the solder paste nozzle 1. The blowing force is strong and there are no dead angles, avoiding the problems of airflow dispersion and insufficient force caused by using a large blow-off nozzle.

[0050] Furthermore, the blow-off assembly 20 includes multiple air pipes 22, each corresponding to a solder paste needle tube 1. A blow-off nozzle 21 is provided on the side of the air pipe 22 near the solder paste needle tube 1. The blow-off nozzle 21 is connected to the air pipe 22, and the air pipe 22 is used to provide high-pressure gas to the blow-off nozzle 21.

[0051] Independent air tubes 22 ensure that each blow-off nozzle 21 receives sufficient and stable pressure gas, and the purging effect between each solder paste needle tube 1 does not interfere with each other, thus ensuring stable gas supply; the modular design allows for easy replacement of a single blow-off nozzle 21 or air tube 22 if it is damaged, without affecting the entire system, making it easy to maintain.

[0052] Furthermore, the collection box 10 has an absorption layer 13 on the side away from the blow-off assembly 20.

[0053] The absorbent layer 13 is preferably a sponge or other porous adsorbent material. The absorbent layer 13 can effectively adsorb and contain the blown-off, sticky liquid or semi-liquid solder paste, preventing excess solder paste from rolling in the collection box 10 or adhering to the wall of the collection box 10. When solder paste particles hit the absorbent layer 13 at high speed, the energy of the solder paste particles is absorbed, effectively preventing rebound and secondary splashing. The waste cleaning can be completed by replacing the absorbent layer regularly, which is very convenient and quick, and greatly reduces the maintenance workload.

[0054] Furthermore, the solder paste blowing and collecting device also includes:

[0055] Carrier fixture base, used for mounting products;

[0056] The positioning base 40 and the collection box 10 are located on the side of the positioning base 40 near the solder paste needle tube 1.

[0057] By installing the collection box 10 on the positioning base 40, the narrow space between the fixtures is fully utilized without requiring major changes to the production line layout, resulting in high space utilization. The cooperation between the carrier fixture base and the positioning base 40 ensures that the relative positions between the product and the solder paste needle tube 1, and between the solder paste needle tube 1 and the collection box 10 are always accurate. This is a prerequisite for achieving automated purging and the purpose of accurate positioning.

[0058] Furthermore, the solder paste blowing and collecting device also includes:

[0059] The three-axis machine carrier platform 50 is used to mount the solder paste needle tube 1 and the blow-off assembly 20, and is used to move along the first direction, the second direction and the third direction respectively; the three-axis machine carrier platform 50 is used to drive the solder paste needle tube 1 to apply solder paste to the product; and is used to drive the solder paste needle tube 1 to extend into the collection box 10, and to bring the solder paste needle tube 1 close to the blow-off nozzle 21 to blow off the excess solder paste of the solder paste needle tube 1; and is used to drive the exhaust assembly 30 to discharge the excess gas in the collection box 10, and to drive the solder paste needle tube 1 to move out of the collection box 10.

[0060] By integrating all actions such as the movement of the solder paste needle tube 1, the triggering of air blowing, and the coordination of exhaust into a system formed by the three-axis machine carrier platform 50, the carrier fixture base, and the positioning base 40, the system becomes a complete and automated production step without human intervention. The entire purging process includes the movement of the solder paste needle tube 1, the insertion of the solder paste needle tube 1 into the collection box 10, the blowing component 20 blowing air onto the excess solder paste, and the solder paste needle tube 1 exiting the collection box 10. The time consumption is fixed, perfectly integrated into the original production rhythm, ensuring the cleaning effect while having zero negative impact on production efficiency.

[0061] Furthermore, the distance between the blow-off nozzle 21 and the solder paste needle tube 1 ranges from 1.9mm to 2.1mm. Preferably, the distance is 2mm. If the distance between the blow-off nozzle 21 and the solder paste needle tube 1 is too far, the airflow force will weaken, making it impossible to effectively remove the viscous solder paste. If the distance is too close, there is a risk of excessive splashing that could contaminate other parts of the box, or even collide with or damage the delicate solder paste needle tube 1. The reasonable distance range between the blow-off nozzle 21 and the solder paste needle tube 1 ensures that the airflow has optimal impact force when it reaches the solder paste needle tube 1, thoroughly removing residue while remaining safe and reliable.

[0062] Furthermore, the depth to which the solder paste needle 1 extends into the collection box 10 ranges from 11.5mm to 12.5mm. Preferably, the depth is 12mm. If the depth is insufficient, the tip of the solder paste needle 1 may still be near the orifice, posing a risk of a small amount of solder paste splashing outside the collection box 10 during cleaning. If the depth is excessive, it may increase the stroke of the solder paste needle 1 or interfere with the structure inside the collection box 10. A reasonable design of the depth range ensures that the portion of the solder paste needle 1 that needs cleaning completely enters the effective volume of the collection box 10, allowing all blown-off solder paste to be safely captured within the collection box 10.

[0063] This application's solder paste blowing and collection device creatively integrates the cleaning station as a standard step in the production cycle into the motion program of a three-axis platform. After completing the application of solder paste to a product, the platform does not return directly to the starting point, but controls the solder paste nozzle to move precisely to a dedicated, fixed collection box station for cleaning, and then returns, achieving "online" synchronous cleaning and collection. The entire process includes the movement of the solder paste needle 1, the positioning of the solder paste needle 1 by the hole 12, the insertion of the solder paste needle 1 into the collection box 10, the blowing nozzle 21 blowing excess solder paste from the solder paste needle 1, and the removal of the solder paste needle 1 from the collection box 10. It is seamlessly integrated with the machine's original motion control, taking approximately 14.2 seconds, perfectly matching the original production rhythm, achieving rapid cleaning without any negative impact on production efficiency. High-pressure gas blowing technology is applied to the field of precision cleaning, rather than traditional dust removal or cooling. The parameters of blowing pressure, blowing time, angle, and distance are clearly defined. These are key process parameters that have been verified to effectively remove solder paste without damaging the needle tip. For example, the single blowing time is 2 seconds.

[0064] Therefore, the solder paste blowing and collecting device of this application includes: a collecting box 10, spaced apart from the solder paste needle tube 1, for collecting excess solder paste from the solder paste needle tube 1; and a blowing component 20, located on the side of the collecting box 10 near the solder paste needle tube 1, for providing high-pressure gas to blow excess solder paste from the solder paste needle tube 1 into the collecting box 10. This solder paste blowing and collecting device actively blows away excess solder paste from the solder paste needle tube 1 through the blowing component 20, ensuring that excess solder paste on the solder paste needle tube 1 is accurately guided into the collecting box 10, rather than splashing onto products, carriers, fixtures, or workbenches; fundamentally eliminating batch defects caused by solder paste splashing and contaminating products, significantly reducing product scrap rates; maintaining the cleanliness of fixtures and workbenches, solving the problem of messy and dirty work sites, and meeting the 5S or 6S management standards of modern factories; and automating the cleaning process, freeing operators from tedious cleaning work and reducing downtime for cleaning.

[0065] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A solder paste blow-off collection device characterized by comprising: include: A collection box, spaced apart from the solder paste syringe, is used to collect excess solder paste from the solder paste syringe. A blow-off assembly, located on the side of the collection box near the solder paste needle tube, is used to provide high-pressure gas to blow excess solder paste from the solder paste needle tube into the collection box.

2. The solder paste blowing and collecting device as described in claim 1, characterized in that, The collection box has a receiving cavity, and the collection box has a hole on the side near the solder paste needle tube. The hole communicates with the receiving cavity. There are multiple holes arranged at intervals. The holes are used for the solder paste needle tube to pass through and extend into the collection box.

3. The solder paste blowing and collecting device as described in claim 1, characterized in that, Also includes: An exhaust assembly, located in the collection box and on the side of the solder paste needle tube away from the blow-off assembly, is used to exhaust excess gas in the collection box.

4. The solder paste blowing and collecting device as described in claim 3, characterized in that, The blowing assembly includes multiple blowing nozzles, each corresponding to a solder paste needle tube and spaced apart. The blowing nozzles extend into the collection box and blow out high-pressure gas to remove excess solder paste from the solder paste needle tube.

5. The solder paste blowing and collecting device as described in claim 4, characterized in that, The blow-off assembly includes multiple air pipes, each corresponding to a solder paste needle tube. A blow-off nozzle is provided on the side of each air pipe near the solder paste needle tube. The blow-off nozzle is connected to the air pipe, and the air pipe is used to supply the high-pressure gas to the nozzle.

6. The solder paste blowing and collecting device as described in claim 1, characterized in that, The collection box has an absorption layer on the side away from the blow-off assembly.

7. The solder paste blowing and collecting device as described in claim 4, characterized in that, Also includes: Carrier fixture base, used for mounting products; A positioning base, wherein the collection box is disposed on the side of the positioning base near the solder paste needle tube.

8. The solder paste blowing and collecting device as described in claim 7, characterized in that, Also includes: A three-axis machine carrier platform is used to mount the solder paste needle and the blow-off assembly, and is used to move along the first direction, the second direction and the third direction respectively; The three-axis machine carrier platform is used to drive the solder paste needle to apply solder paste to the product; And is used to drive the solder paste needle tube to extend into the collection box, and to bring the solder paste needle tube close to the blow-off nozzle to blow away excess solder paste from the solder paste needle tube; And for driving the exhaust assembly to expel excess gas from the collection box, and for driving the solder paste needle to move out of the collection box.

9. The solder paste blowing and collecting device as described in claim 4, characterized in that, The distance between the blow-off nozzle and the solder paste needle tube ranges from 1.9 mm to 2.1 mm.

10. The solder paste blowing and collecting device as described in claim 1, characterized in that, The solder paste needle extends to a depth of 11.5 mm to 12.5 mm into the collection box.

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