A portable dual-pulse testing device

Abstract

This utility model relates to the field of pulse testing technology, specifically disclosing a portable dual-pulse testing device, including a top cover, a housing, and module fasteners. The top cover houses a wiring panel, a dual-pulse controller, a dual-pulse emulator, and an HPD driver board. The dual-pulse controller is connected to both the HPD driver board and the wiring panel, and the dual-pulse emulator is connected to the wiring panel. The housing includes a support base, a DC filter capacitor, a DC busbar, an absorption capacitor, and a dual-pulse testing platform. The DC filter capacitor and the dual-pulse testing platform are both fixed to the support base. The absorption capacitor is soldered to the output end of the DC busbar. The DC busbar has six inductor wires and is fixed to the DC filter capacitor. Module fasteners are located on the top of the dual-pulse testing platform. The power input line, six inductor wires, and AC output terminal inductor wires of the DC busbar are all connected to the wiring panel. This design solves the problems of high cost, poor adaptability, and insufficient portability of existing testing equipment.

Description

Technical Field

[0001] This utility model relates to the field of pulse testing technology, specifically to a portable dual-pulse testing device. Background Technology

[0002] In the field of electronic power, double-pulse testing of semiconductor power modules is a key means of evaluating their dynamic performance. It plays an irreplaceable role in accurately measuring switching characteristics, obtaining device model parameters, evaluating performance limits, and optimizing drive circuit design.

[0003] However, current semiconductor power module testing equipment on the market has many drawbacks, primarily its high cost. A single high-precision testing device can cost over a million yuan, placing enormous financial pressure on small and medium-sized manufacturers and forcing them to simplify their testing projects, thus focusing solely on dual-pulse testing. Furthermore, current dual-pulse testing equipment platforms suffer from poor closed systems and incompatibility: equipment manufacturers' testing platforms are mostly closed systems, with inconsistent interfaces between EDA tools and ATE, requiring code reconstruction for cross-platform portability of test programs, further increasing usage costs and operational complexity. For power modules with specific packages (such as HPD / HPD_L packages), existing dual-pulse testing equipment lacks dedicated clamping structures, resulting in time-consuming clamping and low positioning accuracy during testing, affecting test accuracy. Finally, traditional dual-pulse testing equipment lacks portability, being bulky and poorly integrated, making it difficult to meet the needs of field testing and mobile verification.

[0004] Therefore, there is an urgent need for a low-cost, portable, modular dual-pulse test platform specifically adapted to HPD / HPD_L packaged power modules to address the testing pain points of small and medium-sized manufacturers and improve testing efficiency and accuracy. Utility Model Content

[0005] The purpose of this invention is to provide a portable dual-pulse testing device that solves the problems of high cost, poor adaptability, and insufficient portability of existing testing equipment, and meets the needs of small and medium-sized manufacturers for efficient and accurate dual-pulse testing of HPD / HPD_L packaged power modules.

[0006] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: A portable dual-pulse testing device includes a top cover, a housing, and module fasteners. The top cover includes a cover body, inside which are embedded a wiring panel, a dual-pulse controller, a dual-pulse emulator, and an HPD driver board. The dual-pulse controller is connected to both the HPD driver board and the wiring panel, and the dual-pulse emulator is connected to the wiring panel. The housing includes a support plate, at least two DC filter capacitors, a DC busbar, at least three absorption capacitors, and a dual-pulse testing platform. The dual-pulse testing platform is mounted on the support plate, the DC filter capacitors are fixed to the base plate of the dual-pulse testing platform, the absorption capacitors are soldered to the output terminals of the DC busbar, and the DC busbar has six inductor wires and is fixed to the DC filter capacitors. The module fasteners are located on the top of the dual-pulse testing platform and are used for positioning and clamping the module under test. The power input line, the six inductor wires, and the AC output terminal inductor wires of the DC busbar are all connected to the wiring panel.

[0007] A further technical solution is that the cover body has a panel base inside, and the panel base has a mounting groove. The dual-pulse controller and the dual-pulse emulator are respectively installed in the mounting groove on the left and right sides. The wiring panel is installed on the upper surface of the panel base and is located above the dual-pulse controller. The wiring panel has a through hole, through which the button of the dual-pulse controller passes. The wiring of the dual-pulse controller is connected to the wiring panel. The HPD driver board is installed on the lower surface of the panel base and is located below the dual-pulse emulator. The signal wiring of the dual-pulse controller is connected to the HPD driver board through the internal space of the panel base, and the power wiring of the dual-pulse emulator is connected to the wiring panel through the internal space of the panel base.

[0008] A further technical solution is that the DC filter capacitor and the DC busbar are located below the dual-pulse controller, and the module fastener is located below the HPD driver board; the module fastener is provided with multiple limiting holes and multiple limiting posts, the limiting holes corresponding to the pins and mounting posts of the power module under test, for passing through the pins and mounting posts of the power module under test; The top of the dual-pulse test platform is provided with three inductor terminals, and the limiting post is connected to the power module under test and the inductor terminals through it.

[0009] A further technical solution is that the DC busbar is fixed with six inductor wires by welding through power terminal connecting pins. The power terminal connecting pins pass through the mounting holes of the DC busbar and the ends of the inductor wires, and are fixed by welding.

[0010] A further technical solution is that the DC filter capacitor is vertically fixed on the base plate of the dual-pulse test platform, the HPD driver board is fixed on the support plate, and the signal terminals of the module under test are vertically downward connected to the HPD driver board.

[0011] A further technical solution is that the DC filter capacitor is horizontally mounted on the base plate of the dual-pulse test platform and connected to the DC busbar via wires.

[0012] Compared with the prior art, the beneficial effects of this utility model are: This portable dual-pulse test device is specifically designed for HPD / HPD_L packaged semiconductor power modules. It eliminates the need to purchase a complete test system, significantly reducing equipment investment and making it suitable for small and medium-sized manufacturers focusing on dual-pulse testing. The entire device is integrated, facilitating transportation and on-site testing. It also allows for easy replacement of the driver board and simulator components, flexibly adapting to different testing needs. The module fasteners enable efficient clamping and precise testing, reducing signal terminal position tolerances. The clamping process eliminates the need for repeated adjustments to external wiring, shortening test preparation time. Integrated absorption capacitors and optimized busbar layout reduce parasitic interference and improve test accuracy. Operation is convenient; when used for testing, the HPD driver board automatically engages with the signal terminals of the semiconductor power module, and test wiring is completed uniformly through an external wiring board, simplifying the operation process. Attached Figure Description

[0013] Figure 1 A schematic diagram of the structure of a portable dual-pulse testing device provided by this utility model; Figure 2 This is a schematic diagram of the structure of the upper cover in this utility model; Figure 3 This is a schematic diagram of the structure of the box in this utility model; Figure 4 This is a structural diagram showing the installation position of the module fastener in this utility model; Figure 5 This is a structural schematic diagram of the modular fastener in this utility model.

[0014] Icons: 1. Top cover, 2. Cover plate, 3. Hinge, 4. Top cover filler, 5. Wiring panel, 6. Panel base, 7. Dual pulse controller, 8. Dual pulse emulator, 9. HPD driver board, 10. Enclosure, 11. Enclosure filler, 12. Support plate, 13. DC filter capacitor, 14. DC busbar, 15. Absorption capacitor, 16. Power terminal connection pin, 17. Module fastener, 18. Limiting post. Detailed Implementation

[0015] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0016] Example 1 like Figure 1 As shown, this utility model embodiment provides a portable dual-pulse testing device, adapted to HPD / HPD_L packaged semiconductor power modules, and applied to dual-pulse testing of HPD / HPD_L packaged semiconductor power modules. The portable dual-pulse testing device comprises three parts: a top cover 1, a housing 10, and module fasteners 17; specifically, as shown... Figure 2 As shown, the top cover 1 can be made of aluminum alloy and includes a cover body. The cover body has a wiring panel 5, a dual-pulse controller 7, a dual-pulse emulator 8, and an HPD driver board 9 embedded inside. The wiring panel 5 has various terminals for connecting external power supplies and testing equipment such as oscilloscopes. A cover plate 2 is also provided on the cover body at a position corresponding to the wiring panel 5. This cover plate 2 is connected to the cover body via a hinge 3 and serves to protect the wiring panel 5. For example, six M4*6 Phillips head countersunk screws and six M4 hexagonal thin nuts are used to fix the hinge 3 to the cover body and cover plate 2. The dual-pulse controller 7 and dual-pulse emulator 8 are both embedded with... Inside the cover, the wiring of the dual-pulse controller 7 is connected to the HPD driver board 9 and the wiring panel 5 respectively. The wiring of the dual-pulse simulator 8 is connected to the wiring panel 5. The inductor wire, positive power line and negative power line led out from the housing 10 are all fixed to the bottom of the wiring panel 5. For example, nine M5*12 cross-slot recessed hexagonal head bolts and M5 hexagonal nuts are used to fix the inductor wire led out from the housing 10 to the bottom of the wiring panel 5. For example, two sets of M5*12 cross-slot recessed hexagonal head bolts and M5 hexagonal nuts are used to fix the positive and negative power lines led out from the housing 10 to the bottom of the wiring panel 5.

[0017] In one implementation, such as Figure 2As shown, a panel base 6 is fixed inside the cover. The panel base 6 has mounting slots. The dual-pulse controller 7 and dual-pulse emulator 8 are embedded into the mounting slots, one on the left and one on the right. A wiring panel 5 is installed on the upper surface of the panel base 6, above the dual-pulse controller 7. The wiring panel 5 has through holes through which the buttons on the dual-pulse controller 7 pass. The wiring of the dual-pulse controller 7 is connected to the wiring panel 5. An HPD driver board 9 is installed on the lower surface of the panel base 6, below the dual-pulse emulator 8. For example, eight M4*8 hexagonal flathead screws are used to secure the wiring panel 5 and the HPD driver board 9. The drive board 9 is fixed on the upper and lower surfaces of the panel base 6 respectively. The cover body is also filled with an upper cover 1. After the wiring panel 5, dual pulse controller 7, dual pulse emulator 8 and HPD drive board 9 are installed on the panel base 6, they are embedded into the upper cover 1 as a whole to fix the above components and reduce vibration interference. The signal wiring of the dual pulse controller 7 is connected to the HPD drive board 9 through the internal space of the panel base 6. Other wirings from the dual pulse controller 7 are connected to the bottom of the wiring panel 5. The power wiring of the dual pulse emulator 8 is connected to the bottom of the wiring panel 5 through the internal space of the panel base 6.

[0018] In the embodiments of this utility model, such as Figure 3As shown, the enclosure 10 includes a support plate 12, at least two DC filter capacitors 13, a DC busbar 14, at least three absorption capacitors 15, and a dual-pulse test platform. The dual-pulse test platform is mounted on the support plate 12. The DC filter capacitors 13 are fixed to the base plate of the dual-pulse test platform. The absorption capacitors 15 are soldered to the output terminals of the DC busbar 14. The DC busbar 14 has six inductor wires and is fixed to the DC filter capacitors 13. The DC filter capacitors 13 and the DC busbar 14 are located below the dual-pulse controller 7. The module fastener 17 is located below the HPD drive board 9. The power input line, the six inductor wires, and the AC output terminal inductor wires of the DC busbar 14 are all connected to the wiring panel 5. The enclosure 10 also has an enclosure 10 filler, which is used to fix the internal components and lead out the cables through the internal space. For example, the enclosure 10 is made of aluminum alloy aviation housing. Inside the enclosure 10 are two DC filter capacitors 13 and three absorption capacitors 15. The DC filter capacitors 13 are aluminum-cased dry-type DC filter capacitors. The DC bus 14 is an HPD DC bus. The two aluminum-cased dry-type DC filter capacitors 13 are fixed to the base plate of the dual-pulse test platform using two M12 hexagonal nuts and M12 flat washers. The two leads of the three absorption capacitors 15 are respectively soldered to the positive and negative terminals of the three output terminals of the HPD DC bus to form three output units. Six inductor wires are soldered onto the HPD DC bus. Four sets of M6*12 cross-slot recessed hexagonal head combination bolts are used to fix the two aluminum shell dry-type DC filter capacitors 13; at the power input terminal of the HPD DC bus, two sets of M5*12 cross-slot recessed hexagonal head combination bolts and M5 hexagonal nuts are used to fix the input power line and lead it out through the internal space filled by the housing 10; on the support plate 12, three inductor wire terminals are provided at the positions corresponding to the AC output terminals of the HPD / HPD_L packaged semiconductor power module, which are concentric with the three inner / outer blind holes and lead out through the internal space filled by the housing 10. The above components are embedded in the housing 10 and then the whole assembly is installed into the aluminum alloy aviation housing 10.

[0019] In one implementation, such as Figure 3 As shown, six inductor wires are welded to the DC bus 14 via power terminal connecting pins 16. The power terminal connecting pins 16 pass through the mounting holes of the DC bus 14 and the ends of the inductor wires, and are fixed by welding. For example, using six power terminal connecting pins 16, the six power terminal connecting pins 16 are inserted from bottom to top into one end of the six inductor wires and the output mounting hole of the HPD DC bus. The power terminal connecting pins 16, the inductor wires and the HPD DC bus are fixed by welding, and the other ends of the six inductor wires are led out. Then, the welded HPD DC bus is fixed to two aluminum shell dry-type DC filter capacitors 13 using four sets of M6*12 cross-slot recess hexagonal head combination bolts.

[0020] In the embodiments of this utility model, such as Figure 4 and Figure 5 As shown, the module fastener 17 is located on the top of the dual-pulse test platform. During use, the HPD / HPD_L packaged semiconductor power module under test is placed on the dual-pulse test platform, and then the module fastener 17 is placed on the semiconductor power module under test for positioning and clamping. The module fastener 17 has multiple limiting holes and multiple limiting posts. The limiting holes correspond to the pins and mounting posts of the power module under test. The limiting blocks are used to pass through the pins and mounting posts of the power module under test. The top of the dual-pulse test platform has three inductor terminals. The limiting posts pass through the power module under test and the inductor terminals before connecting to the dual-pulse test platform. Specifically, through holes are opened on the dual-pulse test platform at positions corresponding to the limiting posts. The limiting posts of the module fastener can be inserted into these through holes. Therefore, the limiting posts of the module fastener pass through the power module under test and the inductor terminals before being inserted into the dual-pulse test platform. The test platform has through holes to allow the limiting posts to connect with the dual-pulse test platform. When the module fastener 17 clamps the semiconductor power module under test, the limiting posts 18 of the module fastener 17 pass through the three inner / outer blind holes of the AC output terminal and the three inductor wire terminals of the semiconductor power module under test, respectively. This allows the limiting posts 18 of the module fastener 17, the AC output terminal and the three inner / outer blind holes of the three inductor wire terminals of the semiconductor power module under test to contact and fix each other, ensuring that the AC output terminal of the semiconductor power module under test is accurately connected to the inductor wire port of the housing 10 and reducing the positional tolerance of the signal terminals. This allows the two positive and negative power lines at the power input end of the DC busbar 14, the six inductor wires at the power output end of the DC busbar 14 and the three inductor wires at the AC output terminal position to be led out through the internal space filled by the housing 10 to the top cover 1 and fixed to the bottom of the wiring panel 5 of the top cover 1.

[0021] In one embodiment, the DC filter capacitor 13 is vertically fixed on the base plate of the dual-pulse test platform, the HPD driver board 9 is fixed on the support plate 12, and the signal terminals of the semiconductor power module under test are vertically downward connected to the HPD driver board 9; in another embodiment, the DC filter capacitor 13 is horizontally mounted on the base plate of the dual-pulse test platform and can be connected to the DC busbar 14 through wires.

[0022] Working Principle: When testing HPD / HPD_L packaged semiconductor power modules using the portable dual-pulse testing device provided by this utility model, open the top cover, place the semiconductor power module in the corresponding hole on the dual-pulse testing platform on the support plate, and use the module fastener to fix it in place, ensuring that the positive and negative terminals of its DC bus are in contact with the power terminal connection pins of the HPD DC bus, and the AC output terminal is connected to the inductor terminal; close the top cover to allow the HPD driver board to engage with the signal terminals of the semiconductor power module; open the cover plate and connect the DC power supply and oscilloscope probe through the wiring panel; start the dual-pulse controller and dual-pulse emulator to perform dual-pulse testing, and record the voltage and current waveforms through the oscilloscope to calculate dynamic parameters; when replacing the semiconductor power module, simply open the top cover, remove the old semiconductor power module and place the new semiconductor power module, close the top cover, and continue testing without readjusting the external wiring.

[0023] Compared with existing technologies, the portable dual-pulse test device provided by this utility model has the following advantages: It is specifically designed for HPD / HPD_L packaged semiconductor power modules, eliminating the need to purchase a complete test system, significantly reducing equipment investment, and is suitable for small and medium-sized manufacturers focusing on dual-pulse testing needs; it is portable and modular: the entire device is integrated into a housing, facilitating transportation and on-site testing; it supports the replacement of components such as driver boards and simulators, flexibly adapting to different testing requirements; the module fasteners reduce signal terminal position tolerances, eliminating the need for repeated adjustments to external wiring during clamping, shortening test preparation time; integrated absorption capacitors and optimized busbar layout reduce parasitic parameter interference and improve test accuracy; and it is easy to operate: when the top cover is closed, the HPD driver board automatically engages with the semiconductor power module signal terminals, and test wiring is completed uniformly through the wiring panel, simplifying the operation process.

[0024] Although the present invention has been described herein with reference to several illustrative embodiments, it should be understood that many other modifications and implementations can be devised by those skilled in the art, which will fall within the scope and spirit of the principles disclosed herein. More specifically, various variations and modifications can be made to the components and / or layout of the subject matter combination within the scope of the drawings and claims disclosed herein. Besides variations and modifications to the components and / or layout, other uses will be apparent to those skilled in the art.

Claims

1. A portable dual-pulse testing device, characterized in that, Includes top cover (1), box body (10) and module fastener (17); The top cover (1) includes a cover body, and the cover body is embedded with a wiring panel (5), a dual pulse controller (7), a dual pulse emulator (8) and an HPD drive board (9). The dual pulse controller (7) is connected to the HPD drive board (9) and the wiring panel (5) respectively, and the dual pulse emulator (8) is connected to the wiring panel (5). The enclosure (10) includes a support plate (12), at least two DC filter capacitors (13), a DC busbar (14), at least three absorption capacitors (15), and a dual-pulse test platform. The dual-pulse test platform is mounted on the support plate (12). The DC filter capacitors (13) are fixed on the base plate of the dual-pulse test platform. The absorption capacitors (15) are soldered to the output end of the DC busbar (14). The DC busbar (14) has six inductor wires and is fixed on the DC filter capacitors (13). The module fastener (17) is located on the top of the dual-pulse test platform and is used to position and clamp the module under test. The power input line, six inductor lines and AC output terminal inductor lines of the DC bus (14) are all connected to the wiring panel (5).

2. The portable double-pulse testing device according to claim 1, characterized in that, The cover body is provided with a panel base (6), the panel base (6) is provided with an installation slot, and the dual pulse controller (7) and the dual pulse simulator (8) are provided in the installation slot on the left and right respectively; The wiring panel (5) is installed on the upper surface of the panel base (6) and is located above the dual pulse controller (7). The wiring panel (5) has a through hole, and the button of the dual pulse controller (7) passes through the through hole. The wiring of the dual pulse controller (7) is connected to the wiring panel (5). The HPD driver board (9) is mounted on the lower surface of the panel base (6) and located below the dual-pulse emulator (8). The signal wiring of the dual-pulse controller (7) is connected to the HPD driver board (9) through the internal space of the panel base (6), and the power wiring of the dual-pulse emulator (8) is connected to the wiring panel (5) through the internal space of the panel base (6).

3. The portable double-pulse testing device according to claim 2, characterized in that, The DC filter capacitor (13) and the DC busbar (14) are located below the dual-pulse controller (7), and the module fastener (17) is located below the HPD drive board (9); The module fastener (17) is provided with multiple limiting holes and multiple limiting posts (18). The limiting holes correspond to the pins and mounting posts of the power module under test and are used to pass through the pins and mounting posts of the power module under test. The top of the dual-pulse test platform is provided with three inductor terminals, and the limiting post (18) passes through the power module under test and the inductor terminals and connects to the dual-pulse test platform.

4. A portable double-pulse testing device according to claim 3, characterized in that, The DC bus (14) has six inductor wires welded and fixed by power terminal connecting pins (16). The power terminal connecting pins (16) pass through the mounting holes of the DC bus (14) and the ends of the inductor wires, and are fixed by welding.

5. A portable dual-pulse testing device according to claim 1, characterized in that, The DC filter capacitor (13) is vertically fixed on the base plate of the dual-pulse test platform, the HPD drive board (9) is fixed on the support plate (12), and the signal terminals of the module under test are vertically downward connected to the HPD drive board (9).

6. A portable double-pulse testing device according to claim 1, characterized in that, The DC filter capacitor (13) is horizontally mounted on the base plate of the dual-pulse test platform and connected to the DC busbar (14) via wires.

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