A wafer cleaning device for semiconductor production

Abstract

This utility model discloses a wafer cleaning device for semiconductor production, relating to the field of wafer cleaning technology. Addressing the problems raised in the background art, the following solution is proposed: a cleaning chamber with an end cap fixedly connected to its upper surface by four mounting bolts. A liquid supply assembly is fixedly connected to the upper surface of the end cap. A positioning frame is fixedly connected to the inner bottom wall of the cleaning chamber, and a swing assembly is fixedly connected to the inner top wall of the positioning frame. Through the coordinated arrangement of the liquid supply assembly and the swing assembly, this utility model allows a servo motor to drive the circular frame to rotate, which in turn drives several gear sleeves to rotate. This ensures that each wafer placed in a gear sleeve is specifically cleaned. Furthermore, due to the transmission effect of the positioning gears, each gear sleeve can rotate around its own axis, causing the wafer's angle to continuously change, thus further improving the cleaning effect on the wafer.

Description

Technical Field

[0001] This utility model relates to the field of wafer cleaning technology, and in particular to a wafer cleaning device for semiconductor production. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits; its raw material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon crystal seed crystals, and then slowly pulled out to form a cylindrical single-crystal silicon wafer. After grinding, polishing, and slicing, the silicon crystal ingot is formed into a silicon wafer. To ensure production quality after production, wafers generally need to undergo cleaning, thus requiring the use of cleaning equipment.

[0003] Existing wafer cleaning equipment typically uses nozzles to spray cleaning fluid to rinse wafers that are stationary in a sealed space. Due to the large number of wafers, it is difficult for the nozzles to clean each wafer specifically, resulting in poor rinsing effect and room for improvement. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a wafer cleaning device for semiconductor production.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A wafer cleaning apparatus for semiconductor production includes a cleaning chamber. An end cap is fixedly connected to the upper surface of the cleaning chamber via four mounting bolts. A liquid supply assembly is fixedly connected to the upper surface of the end cap. A positioning frame is fixedly connected to the inner bottom wall of the cleaning chamber. A swing assembly is fixedly connected to the inner top wall of the positioning frame. The swing assembly includes a waterproof frame. A servo motor is fixedly connected to the inner bottom wall of the waterproof frame. A circular frame is fixedly connected to the output end of the servo motor. Several circular grooves are formed on the upper surface of the circular frame. A rotating shaft is rotatably connected to the inner bottom wall of the circular grooves. A gear sleeve is fixedly connected to the top of the rotating shaft. A rinsing groove is formed on the upper surface of the gear sleeve. Circular grooves are formed on the upper surface of the circular frame. A connecting rod is fixedly connected to the inner top wall of the end cap. A positioning gear is fixedly connected to the bottom end of the connecting rod. Several drainage holes are formed on the lower surface of the circular frame and the upper surface of the positioning frame.

[0007] Preferably, the positioning gear meshes with a plurality of gear sleeves.

[0008] Preferably, the lower surface of the cleaning tank and the inner bottom wall of the positioning frame are provided with drainage holes, and two triangular guide blocks are fixedly connected to the inner bottom wall of the positioning frame at positions corresponding to the drainage holes.

[0009] Preferably, two right-angled frames are fixedly connected to the lower surface of the cleaning tank, and a collection frame is slidably connected to the inner wall of the two right-angled frames.

[0010] Preferably, the liquid supply assembly includes a strip frame, a liquid storage tank is fixedly connected to the upper surface of the strip frame, an inlet pipe is connected to the upper surface of the liquid storage tank, a diverter is fixedly connected to the inner top wall of the end cap, and two flushing nozzles are connected to the lower surface of the diverter.

[0011] Preferably, a delivery pump is fixedly connected to the inner bottom wall of the strip frame, the input end of the delivery pump is connected to the inside of the liquid storage tank, and the output end is connected to the inside of the distributor.

[0012] The beneficial effects of this utility model are as follows:

[0013] By combining the liquid supply component and the swing component, during use, the servo motor can drive the circular frame to rotate, which in turn drives several gear sleeves to rotate, allowing each wafer placed in the gear sleeve to be rinsed in a targeted manner. In addition, due to the transmission effect of the positioning gear, each gear sleeve can rotate around the rotation axis, causing the wafer itself to rotate and change angle continuously, thus further improving the rinsing effect on the wafer. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of a wafer cleaning device for semiconductor production proposed in this utility model;

[0015] Figure 2 This utility model proposes a wafer cleaning device for semiconductor production. Figure 1 Enlarged schematic diagram of the structure at point A in the middle;

[0016] Figure 3 This is a cross-sectional view of a wafer cleaning device for semiconductor production proposed in this utility model.

[0017] In the diagram: 1. Cleaning tank; 2. Mounting bolts; 3. End cap; 4. Positioning frame; 5. Waterproof frame; 6. Servo motor; 7. Circular frame; 8. Rotating shaft; 9. Gear sleeve; 10. Connecting rod; 11. Positioning gear; 12. Triangular guide block; 13. Right-angle frame; 14. Collection frame; 15. Strip frame; 16. Liquid storage tank; 17. Inlet pipe; 18. Diverter; 19. Rinsing nozzle; 20. Transfer pump. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0019] Example:

[0020] Reference Figure 1-3 A wafer cleaning apparatus for semiconductor production includes a cleaning tank 1. An end cap 3 is fixedly connected to the upper surface of the cleaning tank 1 by four mounting bolts 2. A liquid supply assembly is fixedly connected to the upper surface of the end cap 3. A positioning frame 4 is fixedly connected to the inner bottom wall of the cleaning tank 1. A swing assembly is fixedly connected to the inner top wall of the positioning frame 4. The swing assembly includes a waterproof frame 5. A servo motor 6 is fixedly connected to the inner bottom wall of the waterproof frame 5. A circular frame 7 is fixedly connected to the output end of the servo motor 6. A plurality of circular grooves are formed on the upper surface of the circular frame 7. A rotating shaft 8 is rotatably connected to the inner bottom wall of the circular grooves. A gear sleeve 9 is fixedly connected to the top end of the rotating shaft 8. A rinsing groove is formed on the upper surface of the gear sleeve 9. A circular groove is formed on the upper surface of the circular frame 7. A connecting rod 10 is fixedly connected to the inner top wall of the end cap 3. A positioning gear 11 is fixedly connected to the bottom end of the connecting rod 10. A plurality of drainage holes are formed on the lower surface of the circular frame 7 and the upper surface of the positioning frame 4.

[0021] The positioning gear 11 meshes with several gear sleeves 9 respectively. Drainage holes are provided on the lower surface of the cleaning tank 1 and the inner bottom wall of the positioning frame 4. Two triangular guide blocks 12 are fixedly connected to the inner bottom wall of the positioning frame 4 at the position corresponding to the drainage holes. Two right-angle frames 13 are fixedly connected to the lower surface of the cleaning tank 1. A collection frame 14 is slidably connected to the inner wall of the two right-angle frames 13.

[0022] The wafers are placed in each gear sleeve 9. After the servo motor 6 is turned on, the servo motor 6 can drive the circular frame 7 to rotate. The gear sleeves 9 in the circular frame 7 rotate, thereby continuously changing the position of each gear sleeve 9 relative to the liquid supply component, so that the wafers in each gear sleeve 9 can be rinsed. In addition, during the rotation of the circular frame 7, due to the transmission effect of the positioning gear 11, each gear sleeve 9 can rotate around the rotating shaft 8, thus further improving the rinsing effect on the wafers.

[0023] The liquid supply assembly includes a strip frame 15, with a liquid storage tank 16 fixedly connected to the upper surface of the strip frame 15. An inlet pipe 17 is connected to the upper surface of the liquid storage tank 16. A distributor 18 is fixedly connected to the inner top wall of the end cap 3. Two rinsing nozzles 19 are connected to the lower surface of the distributor 18. A delivery pump 20 is fixedly connected to the inner bottom wall of the strip frame 15. The input end of the delivery pump 20 is connected to the inside of the liquid storage tank 16, and the output end is connected to the inside of the distributor 18. The delivery pump 20 can pump the cleaning liquid in the liquid storage tank 16 to the distributor 18 and spray it out through the two rinsing nozzles 19. In conjunction with the rotating circular frame 7 and the rotating gear sleeve 9, the rinsing effect on the wafer can be improved.

[0024] Working principle: First, the wafer is placed in the rinsing tank of each gear sleeve 9. After aligning the positioning gear 11 with each gear sleeve 9, the end cover 3 is pressed down and fixed by the mounting bolt 2. At this time, the servo motor 6 and the delivery pump 20 are turned on. The delivery pump 20 can pump the cleaning solution in the storage tank 16 to the distributor 18 and then spray it out through the two rinsing nozzles 19. At this time, the servo motor 6 can drive the circular frame 7 to rotate, thereby driving several gear sleeves 9 to rotate, so that the wafer in each gear sleeve 9 can accurately correspond to the rinsing nozzle 19, so that the wafer can be rinsed in a targeted manner, improving the rinsing effect of the wafer. In addition, during the rotation of the circular frame 7, since the positioning gear 11 cannot rotate, each gear sleeve 9 rotates around the rotating shaft 8 due to the transmission effect of the positioning gear 11, thereby changing the position of the wafer in the gear sleeve 9, further improving the rinsing effect of the wafer. The rinsed wastewater flows into the collection frame 14 through the drain hole and the drain hole, completing the rinsing effect of the wafer.

[0025] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A wafer cleaning apparatus for semiconductor manufacturing, comprising a cleaning chamber (1), characterized in that, The upper surface of the cleaning tank (1) is fixedly connected to an end cap (3) by four mounting bolts (2). A liquid supply assembly is fixedly connected to the upper surface of the end cap (3). A positioning frame (4) is fixedly connected to the inner bottom wall of the cleaning tank (1). A swing assembly is fixedly connected to the inner top wall of the positioning frame (4). The swing assembly includes a waterproof frame (5). A servo motor (6) is fixedly connected to the inner bottom wall of the waterproof frame (5). A circular frame (7) is fixedly connected to the output end of the servo motor (6). The upper surface of the circular frame (7) is... The surface has several circular grooves, and the inner bottom wall of the circular grooves is rotatably connected to a rotating shaft (8). The top end of the rotating shaft (8) is fixedly connected to a gear sleeve (9). The upper surface of the gear sleeve (9) is provided with a rinsing groove. The upper surface of the circular frame (7) is provided with a circular groove. The inner top wall of the end cap (3) is fixedly connected to a connecting rod (10). The bottom end of the connecting rod (10) is fixedly connected to a positioning gear (11). The lower surface of the circular frame (7) and the upper surface of the positioning frame (4) are both provided with several drainage holes.

2. The wafer cleaning apparatus for semiconductor production according to claim 1, characterized in that, The positioning gear (11) meshes with several gear sleeves (9).

3. The wafer cleaning apparatus for semiconductor production according to claim 1, characterized in that, The lower surface of the cleaning tank (1) and the inner bottom wall of the positioning frame (4) are provided with drainage holes. Two triangular guide blocks (12) are fixedly connected to the inner bottom wall of the positioning frame (4) at the position corresponding to the drainage holes.

4. A wafer cleaning apparatus for semiconductor production according to claim 1, characterized in that, The lower surface of the cleaning tank (1) is fixedly connected to two right-angle brackets (13), and the inner walls of the two right-angle brackets (13) are slidably connected to a collection frame (14).

5. A wafer cleaning apparatus for semiconductor production according to claim 1, characterized in that, The liquid supply assembly includes a strip frame (15), a liquid storage tank (16) is fixedly connected to the upper surface of the strip frame (15), an inlet pipe (17) is connected to the upper surface of the liquid storage tank (16), a diverter (18) is fixedly connected to the inner top wall of the end cap (3), and two flushing nozzles (19) are connected to the lower surface of the diverter (18).

6. A wafer cleaning apparatus for semiconductor production according to claim 5, characterized in that, A delivery pump (20) is fixedly connected to the inner bottom wall of the strip frame (15). The input end of the delivery pump (20) is connected to the inside of the liquid storage tank (16), and the output end is connected to the inside of the distributor (18).

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