Heat sinks, heat dissipation modules and electronic devices

Abstract

This disclosure relates to a heat sink, a heat dissipation module, and an electronic device. The heat sink is designed for different temperature zones of a component to be cooled (e.g., a chip). Specifically, a first cooling zone with a larger cooling capacity cools the higher-temperature zones of the chip, while a second cooling zone with a smaller cooling capacity cools the lower-temperature zones, ensuring overall temperature uniformity of the chip. This heat sink addresses the problem of uneven temperature distribution on the chip by partitioning the heat sink according to different cooling capacities. Compared to related technologies, this reduces localized heat accumulation on the chip, improving its performance and reliability.

Description

Technical Field

[0001] This disclosure relates to the field of heat sink technology, specifically to a heat sink, a heat dissipation module, and an electronic device. Background Technology

[0002] With the technological advancements in chips (such as graphics processing chips), the increasing number of transistors not only doubles chip performance but also leads to higher chip power and power density. Therefore, heat sinks are needed to effectively dissipate heat from the chips, ensuring their performance and reliability.

[0003] In related technologies, the overall power density distribution of the chip is uneven, and the local power differences are very large, resulting in a severely uneven temperature distribution and local heat accumulation, creating hot spots. Therefore, traditional heat sinks cannot meet the heat dissipation requirements of the chip. Utility Model Content

[0004] The purpose of this disclosure is to provide a heat sink, a heat dissipation module, and an electronic device. To address the problem of uneven temperature distribution in chips, the heat sink is designed with different cooling capacities in zones. Compared with related technologies, this can reduce local heat accumulation on the chip and improve the chip's performance and reliability.

[0005] To achieve the above objectives, according to a first aspect of this disclosure, a radiator is provided, the radiator including a first cooling zone and a second cooling zone, wherein the cooling capacity of the first cooling zone is greater than the cooling capacity of the second cooling zone.

[0006] Optionally, the number of the first cooling zone and / or the second cooling zone may be multiple.

[0007] Optionally, the first cooling zone and the second cooling zone are connected in series or in parallel.

[0008] Optionally, the radiator includes a liquid inlet and a cooling channel communicating with the liquid inlet, wherein the liquid inlet is located in the first cooling zone or laterally to the first cooling zone.

[0009] Optionally, the radiator further includes heat dissipation fins disposed inside the radiator, wherein the total heat dissipation area of ​​the heat dissipation fins in the first cooling zone is greater than the total heat dissipation area of ​​the heat dissipation fins in the second cooling zone.

[0010] Optionally, the arrangement density of the heat dissipation fins in the first cooling zone is greater than the arrangement density of the heat dissipation fins in the second cooling zone.

[0011] Optionally, the height of the heat dissipation fins in the first cooling zone is greater than the height of the heat dissipation fins in the second cooling zone.

[0012] According to a second aspect of this disclosure, a heat dissipation module is provided, including a chip and the heat sink described above.

[0013] Optionally, the chip is a GPU chip, a CPU chip, or a SOC chip.

[0014] According to a third aspect of this disclosure, an electronic device is also provided, which includes the aforementioned heat sink or heat dissipation module.

[0015] The heat sink disclosed herein is designed for different temperature zones of the component to be cooled (e.g., a chip). This means that a first cooling zone with a larger cooling capacity cools the higher-temperature zones of the chip, while a second cooling zone with a smaller cooling capacity cools the lower-temperature zones, ensuring overall temperature uniformity of the chip. This heat sink addresses the problem of uneven temperature distribution in the chip by partitioning the heat sink according to different cooling capacities. Compared to related technologies, this reduces localized heat accumulation on the chip, improving its performance and reliability.

[0016] Other features and advantages of this disclosure will be described in detail in the following detailed description section. Attached Figure Description

[0017] The accompanying drawings are provided to further illustrate the present disclosure and form part of the specification. They are used together with the following detailed description to explain the present disclosure, but do not constitute a limitation thereof. In the drawings: Figure 1 This is a flowchart of a heat sink design method provided in some embodiments of this disclosure.

[0018] Figure 2 This is a temperature distribution map of the chip obtained through simulation analysis.

[0019] Figure 3 This is a schematic diagram of the hot spot, first temperature zone, and second temperature zone of a chip provided in some embodiments of this disclosure.

[0020] Figure 4 This is a schematic diagram of a heat sink structure provided in some embodiments of this disclosure, in which the chip is indicated by dashed lines.

[0021] Figure 5 This is a schematic diagram of the hot spot, first temperature zone, and second temperature zone of a chip provided in other embodiments of this disclosure.

[0022] Figure 6 This is a schematic diagram of a heat sink structure provided in some other embodiments of this disclosure, in which the chip is indicated by dashed lines.

[0023] Figure 7This is a schematic diagram of a hot spot, a first temperature zone, and a second temperature zone of a chip provided in some embodiments of this disclosure, wherein the hot spot is close to the edge of the chip.

[0024] Figure 8 This is a schematic diagram of a heat sink structure provided in some embodiments of the present disclosure, in which the chip is indicated by dashed lines, and the hot spot is close to the edge of the chip.

[0025] Figure 9 This is a schematic diagram of a hot spot, a first temperature zone, and a second temperature zone of a chip provided in some embodiments of this disclosure, wherein the two hot spots are close to the edge of the chip.

[0026] Figure 10 This is a schematic diagram of a heat sink structure provided in some embodiments of the present disclosure, in which the chip is indicated by dashed lines, and two hot spots are close to the edge of the chip.

[0027] Figure 11 This is a schematic diagram of hot spots, a first temperature zone, and a second temperature zone of a chip provided in some embodiments of this disclosure, wherein four hot spots are located near the center of the chip.

[0028] Figure 12 This is a schematic diagram of a heat sink structure provided in some embodiments of the present disclosure, in which the chip is indicated by dashed lines, and four hot spots are close to the center of the chip.

[0029] Figure 13 This is a schematic diagram of a hot spot, a first temperature zone, and a second temperature zone of a chip provided in some embodiments of this disclosure, wherein a second temperature zone is provided between the two first temperature zones.

[0030] Figure 14 This is a schematic diagram of a heat sink structure provided in some embodiments of the present disclosure, wherein the chip is indicated by dashed lines, and a second cooling zone is provided between the two second cooling zones.

[0031] Figure 15 This is a schematic diagram of the structure of a heat sink provided in some embodiments of this disclosure.

[0032] Figure 16 This is a side bottom view of a heat sink provided in some embodiments of this disclosure.

[0033] Figure 17 This is an exploded view of the heat dissipation module.

[0034] Figure 18 This is a side cross-sectional view of the heat dissipation module.

[0035] Explanation of reference numerals in the attached figures 10-Heat dissipation module; 100-Heat radiator; 101-Liquid inlet; 102-Cooling channel; 103-Liquid outlet; 104-Heat dissipation fins; 110-First cooling zone; 120-Second cooling zone; 200 - Chip; 210 - First temperature zone; 211 - Hot spot; 220 - Second temperature zone; 300 - Thermal conductive component; 400-Substrate. Detailed Implementation

[0036] The specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this disclosure.

[0037] In this disclosure, unless otherwise stated, directional terms such as "inner" and "outer" refer to the inner and outer contours of the corresponding components; "far" and "near" refer to the corresponding structure or component being away from or near another structure or component. Furthermore, the terms "first," "second," etc., used in this disclosure are for distinguishing one element from another and do not have sequential or importance implications. In addition, in the following description, when referring to the accompanying drawings, unless otherwise explained, the same reference numerals in different drawings denote the same or similar elements. The above definitions are for explanation and illustration only and should not be construed as limiting this disclosure.

[0038] To achieve the above objectives, such as Figures 1 to 18 As shown, according to the design method of the heat sink 100 provided in this disclosure, the method includes steps S100 to S300.

[0039] Step S100: Obtain the temperature distribution map of the chip 200 to be cooled.

[0040] Step S200: Obtain the first temperature zone 210 and the second temperature zone 220 of the chip to be cooled according to the temperature distribution map; wherein, the temperature of the first temperature zone 210 is greater than the temperature of the second temperature zone 220.

[0041] Step S300: Design a first cooling zone 110 and a second cooling zone 120 of the radiator 100 according to the first temperature zone 210 and the second temperature zone 220; wherein, the first cooling zone 110 is used for cooling the first temperature zone 210, the second cooling zone 120 is used for cooling the second temperature zone 220, and the cooling capacity of the first cooling zone 110 is greater than the cooling capacity of the second cooling zone 120.

[0042] Through the above-described technical solution, namely the design method of the heat sink 100 disclosed herein, a temperature distribution map of the chip 200 to be cooled is obtained. Then, based on this temperature distribution map, a first temperature zone 210 and a second temperature zone 220 of the chip 200 to be cooled are determined. Based on the distribution of the first temperature zone 210 and the second temperature zone 220, a first cooling zone 110 and a second cooling zone 120 of the heat sink 100 are designed. This ensures that the first cooling zone 110, with its greater cooling capacity, cools the higher-temperature first temperature zone 210 of the chip 200, while the second cooling zone 120, with its smaller cooling capacity, cools the lower-temperature second temperature zone 220 of the chip 200, thus guaranteeing the overall temperature uniformity of the chip 200. The design method of the heat sink 100 disclosed herein addresses the problem of uneven temperature distribution of the chip 200 by designing the heat sink 100 in zones according to different cooling capacities. Compared with related technologies, this reduces localized heat accumulation on the chip 200 and improves the performance and reliability of the chip 200.

[0043] It is understood that in this embodiment, the first temperature zone 210 refers to a region of the chip 200 with a relatively high temperature. It can be one or multiple, meaning the chip 200 has multiple high-temperature regions. The second temperature zone 220 can be a region with a relatively lower temperature compared to the high temperature of the first temperature zone 210. It should be noted that "relatively high temperature" in the first temperature zone 210 means that it includes multiple regions with temperatures higher than the second temperature zone 220, or that the entire first temperature zone 210 has a higher temperature than the second temperature zone 220. This can also be understood as the average temperature of the first temperature zone 210 being higher than the average temperature of the second temperature zone 220. Correspondingly, the first cooling zone 110 on the heat sink 100 corresponds to the first temperature zone 210. Therefore, the number of first temperature zones 210 corresponds to the number of first cooling zones 110 designed in the heat sink 100, and each first cooling zone 110 corresponds one-to-one with a first temperature zone 210.

[0044] One method to obtain the temperature distribution map of the chip 200 to be cooled is to obtain the temperature distribution on the chip 200 through thermal simulation under a pre-designed power consumption distribution, and then plot the temperature distribution map based on the simulation results. Alternatively, the temperature distribution map can be obtained by detecting the temperature at various locations of the chip 200 using various sensors when the chip 200 is actually working.

[0045] like Figure 2 As shown, the temperature distribution on chip 200 was obtained through thermal simulation. Three hot spots 211 arranged in a triangle are displayed. Therefore, based on the positions of the three hot spots 211, the following is defined: Figure 3The rectangular first temperature zone 210 shown is defined as the second temperature zone 220 on the chip 200, excluding the first temperature zone 210. For example... Figure 4 The method involves arranging a first cooling zone 110 corresponding to the first temperature zone 210 and a second cooling zone 120 corresponding to the second temperature zone 220 on the heat sink 100, and placing the liquid inlet 101 of the heat sink 100 in the middle of the first cooling zone 110. The first temperature zone 210 is cooled by two cooling channels 102 arranged between the hot spots 211 and through another hot spot 211. This method can better dissipate heat from the high-temperature first temperature zone 210 and ensure the temperature uniformity of the entire chip 200.

[0046] It should be noted that the chip 200 to be cooled can be a graphics processing chip 200 or a chip 200 with other functions. With the development of technology, there are more and more transistors and other capacitors, resistors or inductors on the chip 200, which increases the unevenness of its surface temperature.

[0047] Additionally, it should be noted that the radiator 100 can be any suitable type of radiator 100, including but not limited to liquid cooling radiators 100.

[0048] In some optional embodiments, obtaining the first temperature zone 210 and the second temperature zone 220 of the chip to be cooled based on the temperature distribution map includes the following steps.

[0049] The hotspot 211 and its parameters are obtained from the temperature distribution map. The hotspot 211 parameters include the location, number, and size of the hotspot 211.

[0050] The first temperature zone 210 and the second temperature zone 220 are determined based on hotspot 211 and hotspot 211 parameters.

[0051] Specifically, the temperature points with higher temperatures, i.e., hotspots 211, can be obtained from the temperature map, along with hotspot 211 parameters such as their location, number, and size. Based on the hotspots 211 and their parameters, a first temperature zone 210 is determined, including its size and location. Typically, hotspots 211 are located within the first temperature zone 210, and the area of ​​the first temperature zone 210 is equal to or greater than the area of ​​the hotspots 211.

[0052] Optionally, determining the first temperature zone 210 and the second temperature zone 220 based on hotspot 211 and hotspot 211 parameters includes the following steps.

[0053] When there is only one hot spot 211, the first temperature zone 210 corresponds to the hot spot 211.

[0054] When there are multiple hot spots 211, the first temperature zone 210 is determined based on the area enclosed by at least a portion of the multiple hot spots 211.

[0055] like Figure 5 and Figure 6 As shown, in some embodiments, when there is only one hot spot 211 on the temperature distribution map, the area of ​​the first temperature zone 210 corresponds to the hot spot 211. A range slightly larger than the hot spot 211 is determined based on its size, and a corresponding first cooling zone 110 is designed based on the first temperature zone 210. By arranging the first cooling zone 110 of the heat sink 100 in the first temperature zone 210, cooling is achieved at that temperature zone. Since the first cooling zone 110 has relatively strong cooling capacity and heat exchange capability, it can quickly cool the hot spot 211. Combined with the second cooling zone 120 corresponding to the second temperature zone 220, the relatively weaker cooling of the second temperature zone 220 is achieved, resulting in a more uniform overall temperature of the chip 200.

[0056] In other embodiments, when there are multiple hotspots 211, the first temperature zone 210 is determined based on the area enclosed by at least a portion of the multiple hotspots 211. The first temperature zone 210 can cover the area enclosed by multiple relatively close hotspots 211. For multiple hotspots 211, there can be one or multiple first temperature zones 210. Among the multiple first temperature zones 210, relatively close hotspots 211 can be grouped into one area to form multiple first temperature zones 210. Specifically, the center of the relatively close hotspots 211 can be used as the vertex, and they can be connected sequentially to form a polygon. Based on the position and size of each hotspot 211, the polygon can be optimized into a relatively regular shape (including triangles, rectangles, circles, or ellipses) to form the first temperature zone 210. The shape of the first cooling zone 110 can be designed with reference to the shape of the first temperature zone 210. Its area can be larger than the area of ​​the first temperature zone 210, and its shape can also be adaptively adjusted according to the shape of the first temperature zone 210.

[0057] When the radiator 100 is a liquid-cooled radiator 100, the radiator 100 includes a liquid inlet 101, a liquid outlet 103, and a cooling flow channel 102 connecting the liquid inlet 101 and the liquid outlet 103. Optionally, the step of designing the first cooling zone 110 and the second cooling zone 120 of the radiator 100 according to the first temperature zone 210 and the second temperature zone 220 includes the following steps.

[0058] The liquid inlet 101 of the radiator 100 is designed according to the first temperature zone 210 and the second temperature zone 220; wherein, the liquid inlet 101 is located in the first cooling zone 110 or to the side of the first cooling zone 110.

[0059] The cooling channel 102 of the radiator 100 is designed according to the first temperature zone 210 and the second temperature zone 220; wherein, the end of the cooling channel 102 near the liquid inlet 101 is located in the first cooling zone 110.

[0060] In some embodiments, when there is only one hot spot 211 and the hot spot 211 corresponds to the middle position of the chip 200, the first cooling zone 110 is designed to correspond to the hot spot 211. The liquid inlet 101 can be arranged in the first cooling zone 110 of the heat sink 100 and is arranged directly to the hot spot 211, so that the cooling medium entering through the liquid inlet 101 can first cool the hot spot 211. Since the cooling medium temperature at the liquid inlet 101 is the lowest, the fluid convection heat transfer capacity is stronger, which is beneficial to the cooling of the hot spot 211.

[0061] like Figure 7 and Figure 8 As shown, in some other embodiments, when there is only one hot spot 211 and the hot spot 211 corresponds to the edge position of the chip 200, the first cooling zone 110 is designed to correspond to the hot spot 211. The liquid inlet 101 can be arranged on the side of the first cooling zone 110 of the heat sink 100, and the cooling channel 102 connected to the liquid inlet 101 can be located at the hot spot 211 or arranged on the side of the hot spot 211, so that the cooling medium entering through the liquid inlet 101 can preferentially pass through the hot spot 211 for cooling. Similarly, since the cooling medium temperature of the liquid inlet 101 and the cooling channel 102 near the liquid inlet 101 is the lowest, the fluid convection heat transfer capacity is stronger, which is beneficial to the cooling of the hot spot 211.

[0062] like Figure 9 and Figure 10 As shown, when there are two hot spots 211, and both hot spots 211 correspond to the edge of the chip 200, the first cooling zone 110 is designed to correspond to the two hot spots 211. The liquid inlet 101 can be arranged on the side of the first cooling zone 110 of the heat sink 100, and the cooling channel 102 connected to the liquid inlet 101 can be located at the hot spot 211 or arranged on the side of the hot spot 211, so that the cooling medium entering through the liquid inlet 101 can preferentially pass through the hot spot 211 for cooling. Similarly, since the cooling medium temperature of the liquid inlet 101 and the cooling channel 102 near the liquid inlet 101 is the lowest, the fluid convection heat transfer capacity is stronger, which is beneficial to the cooling of the hot spot 211.

[0063] like Figures 11 to 14As shown, in some embodiments, the number of hot spots 211 is multiple, such as four. A first temperature zone 210 can be defined with reference to these four hot spots 211, and a corresponding first cooling zone 110 can be designed on the radiator 100. The liquid inlet 101 can be arranged in the middle of the first cooling zone 110, and the cooling channel 102 can be positioned between two adjacent hot spots 211. Through this design, the cooling medium entering the cooling channel 102 from the liquid inlet 101 can first cool the hot spot 211 at the position closest to it. It is understood that there can be two cooling channels 102, such as... Figure 14 As shown, one cooling channel 102 extends upward, passing between the two upper hot spots 211; the other cooling channel 102 extends downward, passing between the two lower hot spots 211, thereby achieving cooling of the four hot spots 211. It should be noted that the two cooling channels 102 mentioned above can also be configured to extend to the left and right respectively, which will not be elaborated here.

[0064] To further improve the heat dissipation capacity of the radiator 100, in some embodiments, the method further includes the following steps.

[0065] Heat dissipation fins 104 are designed in the first cooling zone 110 and the second cooling zone 120; wherein, the total heat dissipation area of ​​the heat dissipation fins 104 in the first cooling zone 110 is greater than the total heat dissipation area of ​​the heat dissipation fins 104 in the second cooling zone 120.

[0066] The heat dissipation fins 104 can be disposed inside the cooling channels 102 of the first cooling zone 110 and the second cooling zone 120 to increase the heat exchange area of ​​the cooling medium, thereby improving the overall heat dissipation efficiency of the heat sink 100. In order to ensure that the heat exchange capacity of the first cooling zone 110 is greater than that of the second cooling zone 120, the area of ​​the heat dissipation fins 104 in the first cooling zone 110 can be arranged to be larger than that in the second cooling zone 120, so that the heat sink 100 can remove more heat from the first temperature zone 210 and ensure the overall temperature uniformity of the chip 200.

[0067] Related studies have shown that the spacing of the heat dissipation fins 104 affects the heat transfer effect. Using high-density / high-height heat dissipation fins 104 in hot spots 211 / areas with higher temperatures, and using low-density / high-height heat dissipation fins 104 in areas with lower temperatures, is beneficial to enhance the heat dissipation capacity of the hot spot 211 area, while reducing the overall flow resistance.

[0068] Based on this, in some embodiments, the step of designing heat dissipation fins 104 in the first cooling zone 110 and the second cooling zone 120 includes: designing the spacing of the heat dissipation fins 104; wherein the density of the heat dissipation fins 104 in the first cooling zone 110 is greater than the density of the heat dissipation fins 104 in the second cooling zone 120; and / or, designing the height of the heat dissipation fins 104, wherein the height of the heat dissipation fins 104 in the first cooling zone 110 is greater than the height of the heat dissipation fins 104 in the second cooling zone 120.

[0069] By designing the spacing of the heat dissipation fins 104 in the first cooling zone 110 and the second cooling zone 120, the density of the heat dissipation fins 104 in the first cooling zone 110 and the second cooling zone 120 is changed. Since the heat exchange demand of the first cooling zone 110 is greater than that of the second cooling zone 120, the density of the heat dissipation fins 104 in the first cooling zone 110 is arranged to be greater than that in the second cooling zone 120 to ensure the cooling capacity of the first cooling zone 110. Similarly, the height of the heat dissipation fins 104 also affects the heat exchange efficiency. Designing the height of the heat dissipation fins 104 in the first cooling zone 110 to be greater than that in the second cooling zone 120 further improves the cooling capacity of the first cooling zone 110.

[0070] It should be noted that the heat exchange area of ​​the heat exchange fins 104 of the radiator 100 can be adjusted by the spacing and height of the heat exchange fins 104, so that the first cooling zone 110 corresponding to the higher temperature zone 210 has better heat exchange capacity than the second cooling zone 120 corresponding to the lower temperature zone 220, and the cooling medium can remove more heat to ensure cooling.

[0071] Optionally, the denser the heat dissipation fins 104, the larger the contact area, but the denser they are, the greater the flow resistance. Based on the manufacturing process and practical experience, the width and spacing of the heat dissipation fins 104 are preferably between 0.1mm and 0.15mm. Therefore, in the first cooling zone 110 near the hot spot 211, the spacing between two adjacent heat dissipation fins 104 is 0.1-0.15mm.

[0072] It should be noted that the method also includes: by further designing the arrangement direction of the heat dissipation fins 104 and combining it with the sparseness, spacing and height of the heat dissipation fins 104, a radiator 100 with a first cooling zone 110 and a second cooling zone 120 having different cooling capacities is obtained.

[0073] like Figures 15 to 18 As shown, the heat sink 100 provided in this disclosure is used for heat dissipation of the chip 200. The heat sink 100 includes a first cooling zone 110 and a second cooling zone 120, wherein the cooling capacity of the first cooling zone 110 is greater than the cooling capacity of the second cooling zone 120.

[0074] Chip 200 can be disposed on substrate 400 or circuit board. Heat sink 100 and chip 200 are connected by thermal conductive component 300 (e.g., thermal pad, thermal adhesive, or thermal paste). Chip 200 has a first temperature zone 210 and a second temperature zone 220, wherein the temperature of the first temperature zone 210 is higher than the temperature of the second temperature zone 220. A first cooling zone 110 corresponds to the first temperature zone 210, and a second cooling zone 120 corresponds to the second temperature zone 220. The first temperature zone 210 can directly correspond to the hot spot 211 on chip 200, or it can be an area surrounded by several hot spots 211. When heat sink 100 is used to cool chip 200, the first cooling zone 110 is arranged corresponding to the first temperature zone 210, and the second cooling zone 120 is arranged corresponding to the second temperature zone 220.

[0075] Through the above configuration, the first cooling zone 110 of the heat sink 100, with a larger cooling capacity, cools the first temperature zone 210 of the chip 200, which has a relatively high temperature. Conversely, the second cooling zone 120, with a relatively smaller cooling capacity, cools the second temperature zone 220 of the chip 200, which has a lower temperature, ensuring the overall temperature uniformity of the chip 200. This heat sink 100 addresses the problem of uneven temperature distribution on the chip 200 by partitioning the heat sink 100 according to different cooling capacities. Compared with related technologies, this reduces localized heat accumulation on the chip 200, improving its overall performance and reliability.

[0076] In some embodiments, the number of first cooling regions 110 and / or second cooling regions 120 is multiple. The number of first cooling regions 110 can be multiple, each corresponding to a hot spot location or hot spot region of the chip, i.e., a first temperature region 210, and multiple first cooling regions 110 can be used to cool multiple first temperature regions 210. The number of second cooling regions 120 can also be one or more, each corresponding to a hot spot location, hot spot region, and other regions of the chip, i.e., a second temperature region 220, and multiple second cooling regions 120 can be used to cool multiple second temperature regions 220. By providing multiple first cooling regions 110 and second cooling regions 120 that can respectively correspond to the first temperature regions 210 and second temperature regions 220 of the chip 200, the chip 200 can be better adapted to different temperature regions, thereby improving the overall temperature uniformity of the chip 200.

[0077] In some embodiments, the first cooling zone 110 and the second cooling zone 120 are connected in series or in parallel. Specifically, the first cooling zone 110 and the second cooling zone 120 can be connected in series or in parallel. When connected in series, the cooling medium flows sequentially through the first cooling zone 110 and the second cooling zone 120. The cooling medium first flows through the first cooling zone 110 to cool the first temperature zone 210, and then flows through the second cooling zone 120 to cool the second temperature zone 220. A greater degree of subcooling is used first to cool the higher temperature zone of the chip 200, and then a relatively smaller degree of subcooling is used to cool the lower temperature zone. This allows for sufficient heat absorption, achieving deep cooling, ensuring the overall system cooling effect reaches its optimal state, effectively maintaining the stable operating temperature of the equipment, and extending the equipment's service life. Parallel connection allows the cooling medium to enter both the first cooling zone 110 and the second cooling zone 120 simultaneously, thereby improving cooling efficiency and speed, and rapidly reducing equipment temperature. This is particularly suitable for high-load, temperature-sensitive equipment scenarios, helping to dissipate heat promptly, preventing overheating damage, ensuring the continuity and safety of the production process, providing strong support for efficient equipment operation, meeting cooling needs under different operating conditions, and enhancing the system's adaptability and flexibility. Furthermore, by designing the size of the cooling flow path and the flow rate of the cooling medium in the first cooling zone 110 and the second cooling zone 120, cooling can be targeted at non-temperature zones to improve the temperature uniformity of the entire chip 200.

[0078] It should be noted that the heat sink 100 can be a liquid-cooled heat sink 100, or it can be a metal heat sink, using air cooling and / or heat pipe cooling. The heat sink 100 may include a liquid inlet 101 and a cooling channel 102 communicating with the liquid inlet 101. The liquid inlet 101 is located in or to the side of the first cooling zone 110, wherein the end of the cooling channel 102 near the liquid inlet 101 is located in or near the first cooling zone 110. Since the temperature at the inlet of the cooling medium is low when it enters the heat sink 100, and the convective heat transfer capacity of the fluid is stronger, arranging the liquid inlet 101 and the end of the cooling channel 102 near the liquid inlet 101 in the first cooling zone 110 can improve the cooling capacity of the first cooling zone 110, which is beneficial to reducing the temperature of the first temperature zone 210 corresponding to the hot spot 211 on the chip 200.

[0079] The liquid inlet 101 can be positioned corresponding to the hot spot 211, or it can be positioned to the side of the hot spot 211 (close to the hot spot 211). The liquid inlet 101 can also be positioned in the second cooling zone 120, away from the first cooling zone 110, allowing the cooling medium to flow out of the heat sink 100 or to circulate. Furthermore, the end of the cooling channel 102 near the liquid inlet 101 can either pass directly through the hot spot 211 or be close to it. It should be noted that this refers to the liquid inlet 101 and the hot spot 211 passing through or being close to the hot spot 211 when projected onto the plane of the chip 200.

[0080] To further improve the cooling capacity of the heat sink 100, in some embodiments, the heat sink 100 further includes heat dissipation fins 104 disposed inside the heat sink 100, wherein the total heat dissipation area of ​​the heat dissipation fins 104 in the first cooling zone 110 is greater than the total heat dissipation area of ​​the heat dissipation fins 104 in the second cooling zone 120. By arranging the total heat dissipation area of ​​the heat dissipation fins 104 in the first cooling zone 110 to be slightly larger than that in the second cooling zone 120, the heat sink 100 can remove more heat from the first temperature zone 210, ensuring uniform overall temperature of the chip 200.

[0081] It is understandable that multiple heat dissipation fins 104 may be provided inside the cooling channels 102 of the first cooling zone 110 and the second cooling zone 120 of the radiator 100 to increase the heat dissipation area. Of course, the heat dissipation fins 104 may be used to form the aforementioned cooling channels 102, or at least partially to form the cooling channels 102, without specific limitations here.

[0082] Optionally, the density of the heat dissipation fins 104 in the first cooling zone 110 is greater than the density of the heat dissipation fins 104 in the second cooling zone 120; and / or, the height of the heat dissipation fins 104 in the first cooling zone 110 is greater than the height of the heat dissipation fins 104 in the second cooling zone 120. Since the heat exchange demand of the first cooling zone 110 is greater than that of the second cooling zone 120, the density of the heat dissipation fins 104 in the first cooling zone 110 is arranged to be greater than that in the second cooling zone 120 to ensure the cooling capacity of the first cooling zone 110. Similarly, the height of the heat dissipation fins 104 also affects the heat exchange efficiency; designing the height of the heat dissipation fins 104 in the first cooling zone 110 to be greater than that in the second cooling zone 120 further improves the cooling capacity of the first cooling zone 110.

[0083] It should be noted that the total heat exchange area of ​​the heat dissipation fins 104 of the radiator 100 can be adjusted by the spacing and height of the heat dissipation fins 104, so that the first cooling zone 110 corresponding to the higher temperature zone 210 has better heat exchange capacity than the second cooling zone 120 corresponding to the lower temperature zone 220, and the cooling medium can remove more heat to ensure cooling.

[0084] Considering that denser heat dissipation fins 104 result in a larger contact area, but also greater flow resistance, in some embodiments, based on processing technology and practical experience, it is determined that the width and spacing of heat dissipation fins 104 are preferably between 0.1mm and 0.15mm. Therefore, in the first cooling zone 110 near the hot spot 211, the spacing between two adjacent heat dissipation fins 104 is 0.1-0.15mm.

[0085] like Figure 17 and 18 As shown, this disclosure provides a heat dissipation module 10, which includes a chip 200 disposed on a substrate 400. The heat dissipation module 10 also includes a heat sink 100 provided in the above embodiments. The heat sink 100 is used for heat dissipation of the chip 200. Through the first cooling zone 110 and the second cooling zone 120 of the heat sink 100, the first temperature zone 210 and the second temperature zone 220 of the chip 200 are cooled (wherein the first cooling zone 110 corresponds to the first temperature zone 210, and the second cooling zone 120 corresponds to the second temperature zone 220). This enables cooling of different temperature regions of the chip 200, i.e., strong cooling of high-temperature regions and weak cooling of low-temperature regions, thereby improving the overall temperature uniformity of the chip 200.

[0086] The chip 200 includes, but is not limited to, a GPU chip, a CPU chip, or a SOC chip. The heat dissipation module 10 may include a substrate 400 and a GPU (Graphics Processing Unit) chip disposed on the substrate 400. The heat sink 100 can be connected to the side of the chip 200 away from the substrate 400 through a thermal pad, which can cool the chip 200.

[0087] It is understandable that chip 200 could also be a CPU (Central Processing Unit) chip, a SOC (System on Chip) chip, etc.

[0088] Embodiments of this disclosure also provide an electronic device that includes the heat sink 100 described above or the heat dissipation module 10 described above. Therefore, this electronic device also has all the advantages of the heat sink 100 or the heat dissipation module 10 described above, which will not be elaborated here.

[0089] It should be noted that electronic devices can include personal computers, servers, base station equipment, tablets, mobile phones, digital products, and wearable devices.

[0090] This disclosure discloses a heat sink 100 and its design method, a heat dissipation module 10, and electronic devices. The heat sink 100 is used for heat dissipation of a high-power chip 200. The design method obtains the temperature distribution on the chip 200 through thermal simulation under a pre-designed power consumption distribution. It optimizes the liquid inlet 101, cooling channel 102, and liquid outlet 103 of the heat sink 100 based on the location, number, and size of local hot spots 211 in the temperature distribution of the chip 200, while simultaneously optimizing the density, height, and orientation of the heat dissipation fins 104. This results in a heat sink 100 with a first cooling zone 110 and a second cooling zone 120, at least partially solving the current heat dissipation problem of hot spots 211 on the chip 200.

[0091] The preferred embodiments of this disclosure have been described in detail above with reference to the accompanying drawings. However, this disclosure is not limited to the specific details of the above embodiments. Within the scope of the technical concept of this disclosure, various simple modifications can be made to the technical solutions of this disclosure, and these simple modifications all fall within the protection scope of this disclosure.

[0092] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this disclosure will not describe the various possible combinations separately.

[0093] Furthermore, various different embodiments of this disclosure can be combined in any way, as long as they do not violate the spirit of this disclosure, they should also be regarded as the content disclosed in this disclosure.

Claims

1. A radiator, characterized in that, To reduce localized heat buildup on the chip, the heat sink includes a first cooling zone and a second cooling zone, wherein the cooling capacity of the first cooling zone is greater than that of the second cooling zone; The radiator includes a liquid inlet and a cooling channel communicating with the liquid inlet, wherein the liquid inlet is located in the first cooling zone or laterally to the first cooling zone. The radiator further includes heat dissipation fins disposed inside the radiator, wherein the total heat dissipation area of ​​the heat dissipation fins in the first cooling zone is greater than the total heat dissipation area of ​​the heat dissipation fins in the second cooling zone.

2. The radiator according to claim 1, characterized in that, The number of the first cooling zone and / or the second cooling zone is multiple.

3. The radiator according to claim 1, characterized in that, The first cooling zone and the second cooling zone are connected in series or in parallel.

4. The radiator according to claim 1, characterized in that, The arrangement density of the heat dissipation fins in the first cooling zone is greater than that in the second cooling zone.

5. The radiator according to claim 1, characterized in that, The height of the heat dissipation fins in the first cooling zone is greater than the height of the heat dissipation fins in the second cooling zone.

6. A heat dissipation module, characterized in that, Includes the chip and the heat sink as described in any one of claims 1-5.

7. The heat dissipation module according to claim 6, characterized in that, The chip is a GPU chip, a CPU chip, or a SOC chip.

8. An electronic device, characterized in that, The electronic device includes the heat sink as described in any one of claims 1-5 or the heat dissipation module as described in claim 6 or 7.

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