A solder paste printer for a circuit board

Abstract

The utility model provides a kind of for circuit board's tin cream printing machine, it is related to tin cream printing machine technical field, including tin cream printing machine body, the top of tin cream printing machine body is equipped with stirring storage mechanism, the right side wall of stirring storage mechanism is equipped with feeding mechanism, the backside wall of stirring storage mechanism is equipped with raw material feeding mechanism, stirring storage mechanism passes through the linkage structure of fixed ring tooth, moving gear, rotating rod and connecting rod, the composite motion of " revolution + rotation" of stirring rod is realized: when servo motor drives rotating shaft rotation, connecting rod drives rotating rod synchronous motion, moving gear is engaged with fixed ring tooth, both do circumferential revolution (cover stirring jar whole area) with rotating shaft.

Description

Technical Field

[0001] This utility model relates to the field of solder paste printing machine technology, and in particular to a solder paste printing machine for circuit boards. Background Technology

[0002] In the electronics manufacturing industry, surface mount technology (SMT) is the core process for achieving miniaturization and high-density packaging of circuit boards. As the first key piece of equipment in the SMT production line, the solder paste printer's continuity of solder paste supply, uniformity of mixing, and stability of feeding directly determine the yield of subsequent chip mounting and soldering processes, and have a decisive impact on the electrical performance and reliability of the circuit board.

[0003] As electronic devices develop towards miniaturization and high precision (such as MiniLED and MicroLED chip packaging and flexible circuit board production), the market demands increasingly stringent requirements for solder paste printing quality. This not only requires ensuring the uniform dispersion of metal particles (such as tin-lead alloys and lead-free alloys) in the solder paste to avoid defects such as "insufficient solder" and "bridging" caused by uneven mixing, but also requires unmanned and continuous solder paste supply to reduce the risk of contamination and efficiency loss caused by manual intervention.

[0004] Solder paste is a paste-like fluid composed of metal powder, flux, and additives. Its uniformity directly affects the thickness consistency and solder wetting properties of the printed solder paste. Currently, the stirring mechanism of solder paste printers generally adopts a "fixed shaft + single-layer stirring rod" structure, which has significant drawbacks. The limited stirring range, with the stirring rod rotating only around a fixed axis, makes it impossible to cover the inner wall and bottom area of ​​the mixing tank. This can easily lead to solder paste accumulating on the tank wall and settling at the bottom, forming "dead corners." The uneven dispersion of metal particles can reach 15%-20%, which can easily cause local solder paste thickness deviations to exceed the standard after printing.

[0005] Therefore, we propose a solder paste printer for circuit boards. Utility Model Content

[0006] The purpose of this invention is to overcome the shortcomings of the existing technology and provide a solder paste printing machine for circuit boards.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: A solder paste printing machine for circuit boards includes a solder paste printing machine body, a stirring and storage mechanism is provided on the top of the solder paste printing machine body, a feeding mechanism is provided on the right side wall of the stirring and storage mechanism, and a raw material feeding mechanism is provided on the back side wall of the stirring and storage mechanism. The raw material feeding mechanism is fixedly installed on the support surface and is used to adsorb and transport the raw material to the stirring and storage mechanism. The stirring and storage mechanism is used to stir the material that is transported in and to evenly transport the raw material to the interior of the solder paste printing machine body through the feeding mechanism.

[0008] As a preferred embodiment of this utility model, the stirring and storage mechanism includes a stirring tank, a fixed ring tooth is fixedly connected to the inner wall of the stirring tank, a movable gear is provided at the connection of the fixed ring tooth, a rotating rod is also provided on the movable gear, and a stirring rod is provided at the bottom of the rotating rod.

[0009] As a preferred embodiment of this utility model, the stirring and storage mechanism further includes a connecting rod, which is hinged to the rotating rod. A rotating shaft is also fixed at the connection point of the connecting rod, and a servo motor is provided at the input end of the rotating shaft and at the top of the stirring tank.

[0010] As a preferred embodiment of this utility model, the servo motor is used to drive the rotating shaft to rotate. When the rotating shaft rotates, it drives the rotating rod to rotate. The moving gear meshes with the fixed ring gear, thereby driving the moving gear to move along the path of the fixed ring gear. At the same time, the connecting rod rotates synchronously due to the rotation of the moving gear.

[0011] As a preferred embodiment of the present invention, the feeding mechanism includes a feeding pipe connected to the bottom of the mixing tank. A first connecting member is provided on the right side wall of the feeding pipe and at the top of the solder paste printing machine body. A connecting pipe is provided on the back side wall of the first connecting member, and a first negative pressure pump is provided on the back side wall of the connecting pipe.

[0012] As a preferred embodiment of this utility model, the first negative pressure pump generates negative pressure inside the first connecting member through the connecting pipe, and then draws the material inside the mixing tank into the first connecting member through the feed pipe. The bottom of the first connecting member is connected to the feed port of the solder paste printing machine body, thereby conveying the material into the interior of the solder paste printing machine body.

[0013] As a preferred embodiment of the present invention, the raw material feeding mechanism includes a second connecting member, which is installed on the top of the solder paste printing machine body. A second negative pressure pump is provided on the top of the second connecting member, and a connecting pipe is provided on the back side wall of the second negative pressure pump. A raw material storage box is provided at the bottom of the connecting pipe, and a sealing cover is provided on the top of the raw material storage box.

[0014] As a preferred embodiment of this utility model, the connecting pipe passes through the sealing cover and is connected to the interior of the raw material storage box. The second negative pressure pump adsorbs and transports the material in the raw material storage box to the mixing tank for stirring through the second connecting piece and the sealing cover.

[0015] Compared with the prior art, the beneficial effects of this utility model are: In this invention, the stirring and storage mechanism achieves a composite motion of "revolution + rotation" of the stirring rod through a linkage structure of fixed ring teeth, moving gears, rotating rods, and connecting rods: when the servo motor drives the rotating shaft to rotate, the connecting rod drives the rotating rod to move synchronously, and the moving gear meshes with the fixed ring teeth, both revolving around the rotating shaft (covering the entire area of ​​the stirring tank) and driving the rotating rod to rotate itself (enhancing the local stirring intensity). This design can fully cover the inner wall, bottom, and central area of ​​the stirring tank, completely eliminating the "dead corners" of traditional stirring, preventing solder paste from accumulating on the tank wall or settling at the bottom, ensuring that the metal particles and flux in the solder paste are fully mixed and dispersed, effectively solving printing defects such as "insufficient solder" and "bridging" caused by uneven stirring, and ensuring stable solder paste performance.

[0016] This invention constructs a fully sealed negative pressure feeding path by using a second negative pressure pump, a connecting pipe, and a sealing cover plate in conjunction with the raw material feeding mechanism: the connecting pipe penetrates through the sealing cover plate and extends into the interior of the raw material storage box, and the second negative pressure pump forms a negative pressure adsorption force through the second connecting piece to directly transport the solder paste in the raw material storage box to the mixing tank, without the need for manual opening of the solder paste container or pouring operation throughout the process. Attached Figure Description

[0017] Figure 1 A schematic diagram of the main structure of a solder paste printer for circuit boards provided by this utility model; Figure 2 A schematic diagram of the main body rear view of a solder paste printer for circuit boards provided by this utility model; Figure 3 A schematic diagram of the internal structure of a stirring and storage mechanism for a solder paste printing machine for circuit boards provided by this utility model; Figure 4 This is a schematic diagram of the unfolded structure of a stirring and storage mechanism for a solder paste printing machine for circuit boards, provided by this utility model.

[0018] Legend: 10. Solder paste printer body; 20. Stirring and storage mechanism; 201. Stirring tank; 202. Fixed ring gear; 203. Moving gear; 204. Rotating rod; 205. Connecting rod; 206. Rotating shaft; 207. Servo motor; 208. Stirring rod; 30. Feeding mechanism; 301. Feeding pipe; 302. First connecting part; 303. Connecting pipe; 304. First negative pressure pump; 40. Raw material feeding mechanism; 401. Second connecting part; 402. Second negative pressure pump; 403. Connecting pipe; 404. Raw material storage box; 405. Sealing cover. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0020] To facilitate understanding of this utility model, a more comprehensive description of this utility model will be provided below with reference to relevant embodiments, and several embodiments of this utility model will be given. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of this utility model more thorough and complete.

[0021] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0023] Example like Figure 1-4 As shown, this utility model provides a technical solution: a solder paste printing machine for circuit boards, including a solder paste printing machine body 10, a stirring and storage mechanism 20 is provided on the top of the solder paste printing machine body 10, a feeding mechanism 30 is provided on the right side wall of the stirring and storage mechanism 20, and a raw material feeding mechanism 40 is provided on the back side wall of the stirring and storage mechanism 20. The raw material feeding mechanism 40 is fixedly mounted on the support surface and is used to adsorb and transport the raw material to the stirring and storage mechanism 20. The stirring and storage mechanism 20 is used to stir the material that is transported in and to uniformly transport the raw material to the interior of the solder paste printing machine body 10 through the feeding mechanism 30.

[0024] After the equipment is started, the raw material feeding mechanism 40 uses negative pressure to adsorb and transport the solder paste raw material in the raw material storage area to the stirring and storage mechanism 20. Then, the stirring and storage mechanism 20 thoroughly stirs the incoming solder paste raw material to make the components evenly mixed. After that, the feeding mechanism 30 uses negative pressure or other power to extract the stirred solder paste from the stirring and storage mechanism 20 and continuously and evenly transport it into the solder paste printing machine body 10 to provide a stable supply for subsequent circuit board solder paste printing. The three mechanisms work together to realize the automated process of solder paste from raw material feeding, stirring to feeding.

[0025] The stirring and storage mechanism 20 includes a stirring tank 201. A fixed ring tooth 202 is fixedly connected to the inner wall of the stirring tank 201. A movable gear 203 is provided at the connection of the fixed ring tooth 202. A rotating rod 204 is also provided on the movable gear 203. A stirring rod 208 is provided at the bottom of the rotating rod 204.

[0026] The mixing tank 201 serves as a container for mixing and temporarily storing solder paste. The fixed ring teeth 202 on its inner wall provide a meshing track for the moving gear 203. When the power unit drives the moving gear 203 to move, the moving gear 203 rolls along the annular path of the fixed ring teeth 202. The rotating rod 204 connected to the moving gear 203 moves accordingly, and the stirring rod 208 at the bottom of the rotating rod 204 moves synchronously to mix the solder paste in the mixing tank 201. Through the meshing transmission between the moving gear 203 and the fixed ring teeth 202, the stirring rod 208 is driven to both revolve around the center of the mixing tank 201 and rotate on its own axis, thereby achieving all-round uniform mixing of the solder paste.

[0027] The stirring and storage mechanism 20 also includes a connecting rod 205, which is hinged to the rotating rod 204. A rotating shaft 206 is fixed at the connection point of the connecting rod 205. A servo motor 207 is provided at the input end of the rotating shaft 206 and at the top of the stirring tank 201.

[0028] The servo motor 207 serves as a power source, precisely controlling the speed and direction of the rotating shaft 206. When the servo motor 207 starts, it drives the rotating shaft 206 to rotate, and the connecting rod 205, which is fixed to the rotating shaft 206, rotates accordingly. Because the connecting rod 205 is hinged to the rotating rod 204, the rotation of the connecting rod 205 will push or pull the rotating rod 204, causing the moving gear 203 on the rotating rod 204 to roll along the fixed ring gear 202, thereby driving the rotating rod 204 and the bottom stirring rod 208 to move. The hinged structure, in conjunction with the rotation of the rotating shaft 206, transmits the rotational power of the servo motor 207 to the stirring assembly, achieving precise control of the movement of the stirring rod 208 to adapt to the stirring requirements of solder pastes of different viscosities.

[0029] The servo motor 207 is used to drive the rotating shaft 206 to rotate. When the rotating shaft 206 rotates, it drives the rotating rod 204 to rotate. The moving gear 203 meshes with the fixed ring gear 202, thereby driving the moving gear 203 to move on the path of the fixed ring gear 202. At the same time, the connecting rod 205 rotates synchronously due to the rotation of the moving gear 203.

[0030] When the servo motor 207 is working, its output torque drives the rotating shaft 206 to rotate. The rotation of the rotating shaft 206 is transmitted to the rotating rod 204 through the connecting rod 205, causing the rotating rod 204 to rotate around the rotating shaft 206. Since the moving gear 203 meshes with the fixed ring tooth 202 on the inner wall of the mixing tank 201, the moving gear 203 rolls along the circular trajectory of the fixed ring tooth 202. While the moving gear 203 is rolling, the connecting rod 205 rotates synchronously due to the position change of the moving gear 203 and its hinged relationship with the rotating rod 204. This compound motion allows the rotating rod 204 and the bottom stirring rod 208 to both revolve around the center of the mixing tank 201 and rotate on their own, achieving efficient and uniform stirring of the solder paste in the mixing tank 201 and ensuring that all components are fully mixed.

[0031] The feeding mechanism 30 includes a feeding pipe 301, which is connected to the bottom of the mixing tank 201. A first connecting member 302 is provided on the right side wall of the feeding pipe 301 and at the top of the solder paste printing machine body 10. A connecting pipe 303 is provided on the back side wall of the first connecting member 302, and a first negative pressure pump 304 is provided on the back side wall of the connecting pipe 303.

[0032] The feed pipe 301 is connected to the bottom of the mixing tank 201, which can smoothly discharge the solder paste that has settled or accumulated at the bottom of the mixing tank 201. When the first negative pressure pump 304 is started, a negative pressure environment is generated inside the first connecting member 302 through the connecting pipe 303. Under the pressure difference between the external atmospheric pressure and the negative pressure inside the first connecting member 302, the solder paste in the mixing tank 201 is sucked into the first connecting member 302 along the feed pipe 301, providing the power basis for the subsequent delivery of the solder paste to the solder paste printing machine body 10. The principle of negative pressure is used to achieve stable extraction of solder paste.

[0033] The first negative pressure pump 304 generates negative pressure inside the first connecting member 302 through the connecting pipe 303, and then draws the material inside the mixing tank 201 into the first connecting member 302 through the feed pipe 301. The bottom of the first connecting member 302 is connected to the feed port of the solder paste printing machine body 10, and then the material is transported into the interior of the solder paste printing machine body 10.

[0034] When the first negative pressure pump 304 is running, it draws air from the first connecting member 302 through the connecting pipe 303, creating a negative pressure state inside the first connecting member 302 that is lower than the external atmospheric pressure. Under the action of the pressure difference, the solder paste in the mixing tank 201 is drawn into the first connecting member 302 through the feed pipe 301. Since the bottom of the first connecting member 302 is connected to the feed port of the solder paste printing machine body 10, the solder paste entering the first connecting member 302 flows into the solder paste printing machine body 10 from the bottom of the first connecting member 302 under its own gravity and possible subsequent conveying power, continuously providing uniformly stirred solder paste raw materials for the solder paste printing process, ensuring the continuity and stability of the feeding.

[0035] The raw material feeding mechanism 40 includes a second connecting member 401, which is installed on the top of the solder paste printing machine body 10. A second negative pressure pump 402 is provided on the top of the second connecting member 401. A connecting pipe 403 is provided on the back side wall of the second negative pressure pump 402. A raw material storage box 404 is provided at the bottom of the connecting pipe 403. A sealing cover plate 405 is provided on the top of the raw material storage box 404.

[0036] The raw material storage box 404 is used to store unstirred solder paste raw materials. The sealing cover 405 maintains the internal airtightness of the raw material storage box 404 to prevent the solder paste from being contaminated or volatilized when it is not being fed. When the second negative pressure pump 402 is started, negative pressure is generated through the second connecting member 401. The connecting pipe 403 connects the second connecting member 401 and the inside of the raw material storage box 404. Under the action of negative pressure, the solder paste in the raw material storage box 404 is adsorbed and transported along the connecting pipe 403 to the second connecting member 401, and then to the stirring and storage mechanism 20, realizing the automatic feeding of solder paste raw materials. The raw material transportation is completed in a sealed environment by utilizing the principle of negative pressure adsorption, avoiding contamination caused by manual contact.

[0037] The connecting pipe 403 passes through the sealing cover plate 405 and is connected to the inside of the raw material storage box 404. The second negative pressure pump 402 uses the second connecting piece 401 and the sealing cover plate 405 to adsorb and transport the material in the raw material storage box 404 to the mixing tank 201 for mixing.

[0038] The connecting pipe 403 passes through the sealing cover plate 405 and extends directly into the raw material storage box 404, ensuring unobstructed negative pressure adsorption path. When the second negative pressure pump 402 operates, a negative pressure is formed in the second connecting member 401. Since the raw material storage box 404 is sealed by the sealing cover plate 405 and the connecting pipe 403 is connected to the second connecting member 401, the solder paste raw material in the raw material storage box 404 is adsorbed into the second connecting member 401 along the connecting pipe 403 under the pressure difference between the external atmospheric pressure and the negative pressure in the raw material storage box 404 (transmitted through the connecting pipe 403). Afterward, the solder paste raw material is transported from the second connecting member 401 to the stirring tank 201 of the stirring and storage mechanism 20 for subsequent stirring. The entire process is carried out in a sealed environment, which not only realizes automatic feeding but also avoids contamination of the solder paste raw material during transportation, ensuring the cleanliness of the raw material.

[0039] It should be noted that the electrical equipment and components mentioned above are all programmed and controlled using existing PLC controllers. Since these are mature technologies, they will not be described in detail here.

[0040] The workflow of this solder paste printing machine for circuit boards is as follows: First, in the raw material feeding stage: the raw material storage box 404 is kept sealed by the sealing cover plate 405, and the connecting pipe 403 penetrates the cover plate and extends into the box. After the second negative pressure pump 402 is started, a negative pressure is formed in the second connecting member 401. Under the action of pressure difference, the solder paste in the raw material storage box 404 is adsorbed into the second connecting member 401 along the connecting pipe 403, and then transported to the stirring tank 201 of the stirring and storage mechanism 20 to complete the sealed automatic feeding and avoid contamination caused by manual contact.

[0041] Next, in the solder paste mixing stage: After the mixing tank 201 receives the solder paste, the servo motor 207 drives the rotating shaft 206 to rotate, which in turn drives the connecting rod 205 to rotate synchronously. Since the connecting rod 205 is hinged to the rotating rod 204, and the moving gear 203 on the rotating rod 204 meshes with the fixed ring tooth 202 on the inner wall of the mixing tank 201, the moving gear 203 rolls (revolves) along the annular path of the fixed ring tooth 202, while simultaneously driving the rotating rod 204 and the bottom mixing rod 208 to rotate (rotate). Through the combined motion of "revolution + rotation", the mixing rod 208 fully covers the inside of the mixing tank 201, thoroughly mixing the solder paste and ensuring that the metal particles and flux are evenly mixed.

[0042] Finally, in the stable feeding stage: the uniformly stirred solder paste gathers at the bottom of the mixing tank 201. After the first negative pressure pump 304 is started, it generates a stable negative pressure in the first connecting member 302 through the connecting pipe 303. Under the action of pressure difference, the solder paste in the mixing tank 201 is adsorbed to the first connecting member 302 through the feeding pipe 301. Then, through the connection between the bottom of the first connecting member 302 and the feeding port of the solder paste printing machine body 10, it is continuously and evenly transported to the inside of the printing machine body, providing a stable raw material supply for the circuit board solder paste printing process.

[0043] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A solder paste printing machine for circuit boards, characterized in that, The device includes a solder paste printing machine body (10), the top of which is provided with a stirring and storage mechanism (20), the right side wall of which is provided with a feeding mechanism (30), and the back side wall of which is provided with a raw material feeding mechanism (40). The raw material feeding mechanism (40) is fixedly installed on the support surface and is used to absorb and transport the raw material to the stirring and storage mechanism (20). The stirring and storage mechanism (20) is used to stir the material that is transported in and to uniformly transport the raw material to the interior of the solder paste printing machine body (10) through the feeding mechanism (30). The stirring and storage mechanism (20) includes a stirring tank (201), a fixed ring tooth (202) is fixedly connected to the inner wall of the stirring tank (201), a movable gear (203) is provided at the connection of the fixed ring tooth (202), a rotating rod (204) is also provided on the movable gear (203), and a stirring rod (208) is provided at the bottom of the rotating rod (204). The stirring and storage mechanism (20) also includes a connecting rod (205), which is hinged to the rotating rod (204). A rotating shaft (206) is also fixed at the connection of the connecting rod (205). A servo motor (207) is provided at the input end of the rotating shaft (206) and at the top of the stirring tank (201). The servo motor (207) is used to drive the rotating shaft (206) to rotate. When the rotating shaft (206) rotates, it drives the rotating rod (204) to rotate. The moving gear (203) meshes with the fixed ring gear (202), thereby driving the moving gear (203) to move on the path of the fixed ring gear (202). At the same time, the connecting rod (205) rotates synchronously due to the rotation of the moving gear (203).

2. The solder paste printing machine for circuit boards according to claim 1, characterized in that, The feeding mechanism (30) includes a feeding pipe (301), which is connected to the bottom of the mixing tank (201). A first connecting member (302) is provided on the right side wall of the feeding pipe (301) and at the top of the solder paste printing machine body (10). A connecting pipe (303) is provided on the back side wall of the first connecting member (302), and a first negative pressure pump (304) is provided on the back side wall of the connecting pipe (303).

3. A solder paste printing machine for circuit boards according to claim 2, characterized in that, The first negative pressure pump (304) generates negative pressure inside the first connecting member (302) through the connecting pipe (303), and then draws the material inside the mixing tank (201) into the first connecting member (302) through the feed pipe (301). The bottom of the first connecting member (302) is connected to the feed port of the solder paste printer body (10), and then the material is transported into the interior of the solder paste printer body (10).

4. A solder paste printing machine for circuit boards according to claim 3, characterized in that, The raw material feeding mechanism (40) includes a second connecting member (401), which is installed on the top of the solder paste printing machine body (10). A second negative pressure pump (402) is provided on the top of the second connecting member (401), and a connecting pipe (403) is provided on the back side wall of the second negative pressure pump (402). A raw material storage box (404) is provided at the bottom of the connecting pipe (403), and a sealing cover plate (405) is provided on the top of the raw material storage box (404).

5. A solder paste printing machine for circuit boards according to claim 4, characterized in that, The connecting pipe (403) passes through the sealing cover plate (405) and is connected to the inside of the raw material storage tank (404). The second negative pressure pump (402) uses the second connecting piece (401) and the sealing cover plate (405) to adsorb and transport the material in the raw material storage tank (404) to the mixing tank (201) for mixing.

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