Plastic-wrapped aluminum integrally formed lamp cup

Abstract

The application belongs to the technical field of lamp cups, and particularly relates to a plastic-aluminum integrally formed lamp cup. The plastic-aluminum integrally formed lamp cup comprises a lamp cup, a lamp bead, a circuit board, a fastener, and a heat sink embedded in the bottom of the lamp cup and integrally formed with the lamp cup. The fastener passes through the heat sink to connect the circuit board and the lamp bead to the two sides of the heat sink respectively. The lamp bead is located in the inner side of the lamp cup and connected with the circuit board through the heat sink. The heat sink and the lamp cup are designed in an integrated manner, so that the lamp bead generating main heat and the circuit board also generating heat are directly contacted with the heat sink. The inherent defect that the traditional pure plastic lamp cup cannot effectively dissipate heat due to poor material thermal conductivity is changed. The heat generated during work can be quickly conducted out, the overall heat dissipation performance of the lamp is improved, so that the LED lamp bead can stably work under a larger current and higher power, and finally the technical effects of brighter light output and longer irradiation distance are realized, and the service life of the product is effectively prolonged.

Description

[Technical Field] This application belongs to the field of lamp cup technology, specifically relating to a lamp cup integrally molded with plastic-coated aluminum. [Background Technology] The primary function of a lamp reflector is to focus the light emitted by LED chips to form a beam with a specific angle and spot shape, thereby achieving the desired lighting effect. In existing technologies, many lamp reflectors are made of pure plastic and molded as a single piece using injection molding. However, as an electro-optical conversion device, LEDs inevitably generate a significant amount of heat during operation. If this heat cannot be dissipated effectively and promptly, it will accumulate around the LED chip and its substrate. Excessive operating temperature will affect luminous efficiency, leading to accelerated light decay, i.e., a continuous decrease in brightness; secondly, it will significantly shorten the lifespan of the LED chip and related packaging materials; in extreme cases, excessive heat may even cause the LED chips and driver circuit board to burn out, resulting in product failure. [Utility Model Content] To address the issues of poor heat dissipation, limited power handling capacity, and limited light output brightness in existing plastic lamp cups, this application provides a lamp cup integrally molded with plastic-coated aluminum.

[0001] This application is achieved through the following technical solution: A plastic-coated aluminum integrally molded lamp cup includes a lamp cup, an LED, a circuit board, a fastener, and a heat sink embedded in the bottom of the lamp cup and integrally molded with the lamp cup. The fastener passes through the heat sink to connect the circuit board and the LED to both sides of the heat sink, respectively. The LED is located inside the lamp cup and passes through the heat sink to connect with the circuit board.

[0002] As described above, in a plastic-coated aluminum integrally molded lamp cup, a connecting block is provided on the outer periphery of the heat sink, and an opening corresponding to the heat sink is provided at the bottom of the lamp cup. The inner sidewall of the opening is provided with a connecting groove for the connecting block to connect and cooperate to prevent the heat sink from disengaging downward from the lamp cup.

[0003] As described above, in a plastic-coated aluminum integrally molded lamp cup, the connecting block and the connecting groove are in the shape of an inverted trapezoid.

[0004] The lamp cup with one-piece plastic-coated aluminum as described above further includes a heat sink located between the heat sink and the circuit board, the heat sink being disposed along the outer side of the lamp cup.

[0005] As described above, in a plastic-coated aluminum integrally molded lamp cup, the heat sink extends outward in a direction gradually away from the lamp cup to form a gap area for air circulation between the heat sink and the lamp cup.

[0006] As described above, in a plastic-coated aluminum integrally molded lamp cup, the fastener is provided with a buckle, and the heat sink, the heat sink component, and the circuit board are respectively provided with a first buckle, a second buckle, and a third buckle. The buckle passes through the first buckle and the second buckle in sequence and then engages with the third buckle to connect the circuit board, the heat sink component, and the lamp bead.

[0007] As described above, in a plastic-coated aluminum integrally molded lamp cup, the height of the lamp cup is H, and the height of the heat sink is h, wherein 2h≤H.

[0008] As described above, in a plastic-coated aluminum integrally molded lamp cup, both the heat sink and the heat dissipation component are made of aluminum.

[0009] Compared with the prior art, this application has the following advantages: This application discloses a plastic-coated aluminum integrated lamp cup. By integrating the heat sink with the lamp cup, the LED chips that generate the main heat and the circuit board that also generates heat are in direct contact with the heat sink. This overcomes the inherent defect of traditional pure plastic lamp cups, which cannot effectively dissipate heat due to the poor thermal conductivity of the material. This allows the heat generated during operation to be quickly conducted away, improving the overall heat dissipation performance of the lamp. As a result, the LED chips can work stably under higher current and higher power, ultimately achieving the technical effects of brighter light output and longer illumination distance, and effectively extending the product's service life. [Attached Image Description] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0010] Figure 1 This is a three-dimensional perspective view of Embodiment 1 of this application; Figure 2 yes Figure 1 Exploded view; Figure 3 yes Figure 1 Top view; Figure 4 yes Figure 3 Cross-sectional view at point AA; Figure 5 This is a three-dimensional perspective view of Embodiment 2 of this application; Figure 6 yes Figure 5 Exploded view; Figure 7 yes Figure 5 Top view; Figure 8yes Figure 7 Cross-sectional view at point BB; Figure 9 This is a cross-sectional schematic diagram of Embodiment 3 of this application.

Detailed Implementation Methods

[0011] Please see Figures 1 to 9 A plastic-coated aluminum integrated lamp cup includes a lamp cup 1, an LED 2, a circuit board 3, a fastener 4, and a heat sink 5 embedded in the bottom of the lamp cup 1 and integrally formed with the lamp cup. The fastener 4 passes through the heat sink 5 to connect the circuit board 3 and the LED 2 to the two sides of the heat sink 5 respectively. The LED 2 is located inside the lamp cup 1 and passes through the heat sink 5 to connect with the circuit board 3.

[0012] This application discloses a plastic-coated aluminum integrated lamp cup. By integrating the heat sink with the lamp cup, the LED chips that generate the main heat and the circuit board that also generates heat are in direct contact with the heat sink. This overcomes the inherent defect of traditional pure plastic lamp cups, which cannot effectively dissipate heat due to the poor thermal conductivity of the material. This allows the heat generated during operation to be quickly conducted away, improving the overall heat dissipation performance of the lamp. This allows the LED chips to work stably under higher current and higher power, ultimately achieving the technical effects of brighter light output and longer illumination distance, effectively extending the product's service life, and increasing the current carrying capacity by 1-2A.

[0013] Furthermore, as a preferred embodiment of this solution and not a limitation, the heat sink 5 is provided with a connecting block 51 on its outer periphery, and the bottom of the lamp cup 1 is provided with an opening 11 corresponding to the heat sink 5. The inner sidewall of the opening 11 is provided with a connecting groove 111 for the connecting block 51 to connect and cooperate to restrict the heat sink 5 from disengaging downward from the lamp cup 1.

[0014] In this first embodiment, as Figure 4 As shown, by setting a connecting block on the outer periphery of the heat sink and a corresponding connecting groove on the inner wall of the opening at the bottom of the lamp cup, the spatial limiting and physical interlocking effect between the two structures is used to achieve a firm and reliable axial fixation between the heat sink and the lamp cup. This ensures the bonding strength and long-term stability of the metal heat sink and the plastic lamp cup in integral molding or subsequent press-fit assembly, and solves the technical problem of reliability in the bonding of heterogeneous materials.

[0015] In this third embodiment, as Figure 9As shown, the heat sink located at the bottom of the lamp cup is attached to the lamp cup and extends upwards at a certain height along the outline of the lamp cup.

[0016] Furthermore, as a preferred embodiment of this solution and not a limitation thereof, the connecting block 51 and the connecting groove 111 are in the shape of an inverted trapezoid.

[0017] In this embodiment, the wider bottom of the connecting block is restricted behind the narrower neck of the connecting groove. At this time, any force that attempts to detach the heat sink along the axial direction will cause the inclined surfaces of the inverted trapezoid to wedge together, generating a huge reverse locking force, thereby forming an extremely stable one-way mechanical lock, including but not limited to the inverted trapezoid, as well as the L-shaped connecting block and the L-shaped connecting groove.

[0018] Furthermore, as a preferred embodiment of this solution and not a limitation thereof, it also includes a heat sink 6 located between the heat sink 5 and the circuit board 3, the heat sink 6 being disposed along the outer side of the lamp cup 1.

[0019] In this second embodiment, as Figure 8 As shown, the heat sink 6 physically connects to the internal core heat source (circuit board 3 and heat sink 5) and extends spatially along the outer side of the lamp cup 1, thus constructing a three-dimensional heat dissipation path from the inside out. Heat can be conducted not only through the existing heat sink 5 but also simultaneously guided to the outside of the lamp through this heat sink 6. Its structure on the outside of the lamp cup increases the effective heat dissipation area in contact with the outside air, allowing the heat to be quickly dissipated through air convection and thermal radiation. The beneficial effect is that, through the dual heat dissipation path and the expanded external heat dissipation area, synergistic and efficient cooling of the two key heat-generating components—the circuit board and the LED—is achieved. This solves the technical problem of insufficient heat dissipation capacity of a single built-in heat sink at high power, allowing the lamp to operate safely and stably at higher power, increasing the current by 2A-3A, and further improving brightness and reliability. The heat sink 6 and the heat sink 5 can be designed as an integrated structure, that is, made from the same piece of metal. One part is inside the lamp cup to fix the lamp beads and circuit board, and the other part extends directly to the outside of the lamp cup to form heat dissipation fins. This eliminates the contact thermal resistance between the two independent components, maximizes the heat conduction efficiency, and solves the technical problem that the imperfect contact surface of the split structure affects the heat conduction performance.

[0020] Furthermore, as a preferred embodiment of this solution and not a limitation thereof, the heat sink 6 extends outward in a direction gradually away from the lamp cup 1 to form an air-permeable gap region 61 between the heat sink 6 and the lamp cup 1.

[0021] In this embodiment, the heat exchange efficiency is greatly accelerated, and the technical problem of a static hot air layer easily forming on the surface of the heat sink and hindering heat dissipation is solved, so that the ultimate heat dissipation capacity of the entire lamp is better improved.

[0022] Furthermore, as a preferred embodiment of this solution and not a limitation, the fastener 4 is provided with a buckle 41, and the heat sink 5, the heat sink 6 and the circuit board 3 are respectively provided with a first latch 52, a second latch 62 and a third latch 31. The buckle 41 passes through the first latch 52 and the second latch 62 in sequence and then engages with the third latch 31 to connect the circuit board 3, the heat sink 6 and the LED 2.

[0023] In this embodiment, an integrated fastener utilizes the elastic deformation and recovery characteristics of its end latch to achieve a one-time, quick-locking of multiple separate components. During assembly, the latch portion of the fastener sequentially passes through the heat sink, heat sink component, and pre-set alignment slots on the circuit board. Once it passes through the last layer of the circuit board, the latch automatically springs back to its original shape as it is no longer compressed, and its locking surface forms a reverse engagement with the edge of the circuit board's slot. Thus, using a simple "push-lock" action, the circuit board, heat sink component, heat sink, and the LEDs attached to the circuit board are firmly pressed, connected, and fixed together. The advantages are that it greatly simplifies the assembly process, improves production efficiency, and reduces manufacturing costs. Furthermore, the through-type design ensures precise alignment of all critical heat dissipation components, solving the problems of accumulated assembly errors and poor contact that may result from traditional distributed fixing methods.

[0024] Furthermore, as a preferred embodiment of this solution and not a limitation, the height of the lamp cup 1 is H, and the height of the heat sink 6 is h, wherein 2h≤H.

[0025] In this embodiment, by limiting the height h of the heat sink to no more than half the total height H of the lamp cup (2h≤H), the heat dissipation material is strategically concentrated in the critical area closest to the heat source and with the highest heat flux density, achieving the most efficient conduction and diffusion of heat. The upper section, farther from the bottom, has a significantly reduced temperature gradient, and its contribution to overall heat dissipation is correspondingly reduced. This design, while fully ensuring the heat dissipation efficiency of the core area, precisely reduces the amount of heat dissipation material configured in the upper section of the lamp cup, where the heat dissipation contribution rate is low. Therefore, without sacrificing key performance, it significantly saves on the amount of metal material used, directly reducing production costs and the overall weight of the product, and solving the technical problem of achieving the optimal balance between ensuring heat dissipation reliability and pursuing economic benefits.

[0026] Furthermore, as a preferred embodiment of this solution and not a limitation, both the heat sink 5 and the heat sink 6 are made of aluminum.

[0027] In this embodiment, the inherent high thermal conductivity, low density, and excellent processability of aluminum are utilized to construct a highly efficient and lightweight heat dissipation system. When the LED chips and circuit board operate, the heat generated is conducted to the heat sink and heat dissipation components. Aluminum's excellent thermal conductivity ensures that the heat is rapidly and evenly conducted to the entire heat dissipation structure and quickly dissipated through its large surface area in contact with the air. The beneficial effects are that while ensuring excellent heat dissipation performance and supporting high-power operation of the lamp, the overall weight of the product is significantly reduced, facilitating installation and transportation. Furthermore, aluminum, as a relatively inexpensive metal, effectively controls manufacturing costs, resolving the contradiction between high-performance heat dissipation and cost / weight control.

[0028] The working principle of this embodiment is as follows: This application discloses a plastic-coated aluminum integrated lamp cup. By integrating the heat sink with the lamp cup, the LED chips that generate the main heat and the circuit board that also generates heat are in direct contact with the heat sink. This overcomes the inherent defect of traditional pure plastic lamp cups, which cannot effectively dissipate heat due to the poor thermal conductivity of the material. This allows the heat generated during operation to be quickly conducted away, improving the overall heat dissipation performance of the lamp. This allows the LED chips to work stably under higher current and higher power, ultimately achieving the technical effects of brighter light output and longer illumination distance, effectively extending the product's service life, and increasing the current carrying capacity by 1-2A.

[0029] The above are implementation methods provided in conjunction with specific content, and it is not intended that the specific implementation of this application is limited to these descriptions. Any methods or structures that are similar to those of this application, or any technical deductions or substitutions made based on the concept of this application, should be considered within the scope of protection of this application.

Claims

1. A lamp cup integrally molded with plastic-coated aluminum, characterized in that, It includes a lamp cup (1), a lamp bead (2), a circuit board (3), a fastener (4), and a heat sink (5) embedded in the bottom of the lamp cup (1) and integrally formed with the lamp cup. The fastener (4) passes through the heat sink (5) to connect the circuit board (3) and the lamp bead (2) to the two sides of the heat sink (5) respectively. The lamp bead (2) is located inside the lamp cup (1) and passes through the heat sink (5) to connect with the circuit board (3).

2. The integrated plastic-coated aluminum lamp cup according to claim 1, characterized in that, The heat sink (5) has a connecting block (51) on its outer periphery. The bottom of the lamp cup (1) has an opening (11) corresponding to the heat sink (5). The inner sidewall of the opening (11) has a connecting groove (111) for the connecting block (51) to connect and cooperate to restrict the heat sink (5) from disengaging downward from the lamp cup (1).

3. The integrated plastic-coated aluminum lamp cup according to claim 2, characterized in that, The connecting block (51) and the connecting groove (111) are in the shape of an inverted trapezoid.

4. The integrated plastic-coated aluminum lamp cup according to claim 1, characterized in that, It also includes a heat sink (6) located between the heat sink (5) and the circuit board (3), the heat sink (6) being disposed along the outer side of the lamp cup (1).

5. A plastic-coated aluminum integrally molded lamp cup according to claim 4, characterized in that, The heat sink (6) extends outward in a direction gradually away from the lamp cup (1) to form an air-permeable gap (61) between the heat sink (6) and the lamp cup (1).

6. A plastic-coated aluminum integrally molded lamp cup according to claim 4, characterized in that, The fastener (4) is provided with a buckle (41), and the heat sink (5), the heat sink (6) and the circuit board (3) are respectively provided with a first buckle (52), a second buckle (62) and a third buckle (31). The buckle (41) passes through the first buckle (52) and the second buckle (62) in sequence and then engages with the third buckle (31) to connect the circuit board (3), the heat sink (6) and the lamp bead (2).

7. A plastic-coated aluminum integrally molded lamp cup according to claim 4, characterized in that, The height of the lamp cup (1) is H, and the height of the heat sink (6) is h, wherein 2h≤H.

8. A plastic-coated aluminum integrally molded lamp cup according to claim 4, characterized in that, Both the heat sink (5) and the heat sink component (6) are made of aluminum.

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