Anti-interference gpf differential pressure sensor

Abstract

The utility model relates to an anti -interference's GPF pressure difference sensor relates to sensor technical field, it includes the casing, sets up the ceramic plate and the base plate in the casing, the ceramic plate top encapsulation pressure chip, the base plate bottom sets up signal processing element, the base plate top sets up the cavity groove, the ceramic plate is inserted in the cavity groove, sets up several insertion slots in the cavity groove, the ceramic plate side wall sets up several clamping slots, the clamping slot and the insertion slot between opposite set up clamping assembly jointly, the clamping assembly is used for making the base plate and ceramic plate clamping, the ceramic plate bottom sets up and sets up accommodating groove, the accommodating groove is provided with upper pad, the upper pad and pressure chip between line connection, the upper pad is provided with the electrically conductive spring piece, the cavity groove is provided with lower pad, the lower pad and the electrically conductive spring piece abut. The application has the effect that the sensor is convenient for normal use.

Description

Technical Field

[0001] This utility model relates to the field of sensor technology, and in particular to an anti-interference GPF differential pressure sensor. Background Technology

[0002] The GPF differential pressure sensor is a core detection component of the particulate filter system, mainly used to monitor the pressure difference of the exhaust gas before and after the particulate filter.

[0003] A related technology, Chinese patent CN217111290U, discloses a GPF pressure sensor, which includes an FR-4 substrate and a pressure sensing module. The FR-4 substrate has four layers from top to bottom. The first layer has a cavity, the second layer has a second signal electrical connection pad, and the back of the fourth layer has a signal processing element. The pressure sensing module includes a double-sided ceramic plate. A pressure chip is encapsulated on the upper surface of the ceramic plate, and a first signal electrical connection pad is provided on the lower surface of the ceramic plate. The first signal electrical connection pad is connected to the pressure chip by a wire. The first signal electrical connection pad and the second signal electrical connection pad are connected by silver paste adhesive. The pressure sensing module and the substrate module are interconnected to form a PCBA module, which is encapsulated in a housing with an air nozzle. The dual-board embedded connection method makes the structure more compact and improves the accuracy of the sensor's data acquisition and processing.

[0004] In the process of developing this application, the inventors discovered that the technology has at least the following problems: the first signal electrical connection pad and the second signal electrical connection pad are only connected by silver paste adhesive. When exposed to the high temperature and vibration environment of automobile exhaust for a long time, the bonding is prone to aging and poor signal contact, which affects the normal use of the sensor. Utility Model Content

[0005] To facilitate normal use of the sensor and improve the stability of its normal operation, this application provides an anti-interference GPF differential pressure sensor.

[0006] The anti-interference GPF differential pressure sensor provided in this application adopts the following technical solution: An anti-interference GPF differential pressure sensor includes a housing, within which a ceramic plate and a substrate are disposed. A pressure chip is encapsulated on the top of the ceramic plate, and a signal processing element is disposed on the bottom of the substrate. A cavity is formed on the top of the substrate, and the ceramic plate is inserted into the cavity. Several insertion slots are formed in the cavity, and several snap-fit ​​slots are formed on the sidewall of the ceramic plate. A snap-fit ​​assembly is disposed between the snap-fit ​​slots and the insertion slots, and the snap-fit ​​assembly is used to snap the substrate and the ceramic plate together. A receiving groove is formed on the bottom of the ceramic plate, and an upper solder pad is disposed in the receiving groove. The upper solder pad is wire-connected to the pressure chip, and a conductive spring is disposed on the upper solder pad. A lower solder pad is disposed in the cavity, and the lower solder pad abuts against the conductive spring.

[0007] By adopting the above technical solution, when the ceramic plate is inserted into the cavity on the substrate, the substrate and the ceramic plate are snapped together by the snap-fit ​​assembly, which improves the connection strength between the substrate and the ceramic plate. When the substrate and the ceramic plate are snapped together, the conductive spring abuts against the lower pad to achieve conductive connection. At the same time, the conductive spring can undergo elastic deformation and always abut against the upper pad and the lower pad, reducing the situation of sensor abnormality caused by poor contact of pad signal.

[0008] Preferably, the inner wall of the cavity is fitted to the side wall of the ceramic plate.

[0009] By adopting the above technical solution, the stability of the connection between the substrate and the ceramic plate is improved.

[0010] Preferably, a first pad is provided at the bottom of the ceramic plate, the first pad is connected to the pressure chip by a wire, a second pad is provided in the cavity, and a silver paste adhesive layer is provided between the first pad and the second pad.

[0011] By adopting the above technical solution, silver paste adhesive is printed on the first pad, and then the ceramic plate is inserted into the cavity on the substrate to achieve a rapid connection between the first pad and the second pad.

[0012] Preferably, an intermediate pad is provided at the end of the conductive spring away from the upper pad, and the intermediate pad abuts between the bottom of the ceramic plate and the lower pad.

[0013] By adopting the above technical solution, the contact area between the conductive spring and the lower pad is increased by the middle pad.

[0014] Preferably, a plurality of insulating rods are provided through the intermediate pad, the insulating rods are fixedly connected to the ceramic plate, and a plurality of insulating holes are opened in the cavity for inserting the insulating rods.

[0015] By adopting the above technical solution, the insulating rod inserted into the insulating hole forms a limiting and guiding effect on the intermediate pad, which facilitates the alignment of the intermediate pad with the lower pad.

[0016] Preferably, the snap-fit ​​assembly includes a snap-fit ​​rod and a snap-fit ​​spring. One end of the snap-fit ​​rod is inserted into the insertion groove, and the end of the snap-fit ​​rod in the insertion groove abuts against the inner wall of the insertion groove. The other end of the snap-fit ​​rod is inserted into the snap-fit ​​groove, and the end of the snap-fit ​​rod in the snap-fit ​​groove is fixedly connected to one end of the snap-fit ​​spring. The other end of the snap-fit ​​spring is fixedly connected to the inner wall of the snap-fit ​​groove.

[0017] By adopting the above technical solution, during the process of inserting the ceramic plate into the cavity, the pressing snap rod retracts into the snap groove. After the ceramic plate is inserted into the cavity, the snap spring resets and pushes the snap rod into the insertion groove, thereby achieving the effect of inserting the ceramic plate into the substrate.

[0018] Preferably, the inner wall of the insertion slot is in contact with the outer wall of the snap-fit ​​rod.

[0019] By adopting the above technical solution, the wobbling of the locking rod in the insertion slot is reduced, thereby improving the stability of the connection between the substrate and the ceramic plate.

[0020] Preferably, the inner wall of the snap-fit ​​groove is fitted to the outer wall of the snap-fit ​​rod.

[0021] By adopting the above technical solution, the wobbling of the locking rod in the locking groove is reduced, thereby improving the stability of the connection between the substrate and the ceramic plate.

[0022] In summary, this application includes at least one of the following beneficial technical effects: 1. By setting up a housing, ceramic plate, substrate, pressure chip, signal processing element, cavity, insertion slot, snap-in slot, snap-in assembly, receiving slot, upper pad, conductive spring and lower pad, the connection strength between the substrate and the ceramic plate is improved. The conductive spring can undergo elastic deformation and always abut against the upper pad and the lower pad, reducing the situation of sensor abnormality caused by poor contact of pad signal. 2. By setting an intermediate pad, the contact area between the conductive spring and the lower pad is increased; 3. By setting insulating rods and insulating holes, it is easy to align the middle pad with the lower pad. Attached Figure Description

[0023] Figure 1 This is a schematic diagram illustrating the positional relationship between the pressure chip and the signal processing element in an embodiment of this application.

[0024] Figure 2 This is a schematic diagram of an anti-interference GPF differential pressure sensor structure in an embodiment of this application.

[0025] Figure 3 This is a schematic diagram illustrating the connection relationship between the ceramic plate and the substrate in the embodiments of this application.

[0026] Figure 4 yes Figure 3Enlarged view of part A in the middle.

[0027] Figure 5 yes Figure 3 Enlarged view of section B.

[0028] Explanation of reference numerals in the attached drawings: 1. Ceramic plate; 11. Pressure chip; 2. Substrate; 21. Signal processing element; 22. Cavity; 3. Silver paste adhesive layer; 31. First pad; 32. Second pad; 4. Snap-fit ​​assembly; 41. Snap-fit ​​rod; 42. Snap-fit ​​spring; 43. Snap-fit ​​groove; 44. Insertion groove; 5. Conductive spring; 51. Upper pad; 52. Middle pad; 53. Lower pad; 6. Insulating rod; 61. Insulating hole; 7. Receiving groove; 8. Housing. Detailed Implementation

[0029] The following is in conjunction with the appendix Figure 1-5 This application will be described in further detail.

[0030] This application discloses an anti-interference GPF differential pressure sensor. (Refer to...) Figures 1 to 5 The system includes a housing 8, within which a ceramic plate 1 and a substrate 2 are disposed. A pressure chip 11 is encapsulated on the top of the ceramic plate 1, and a signal processing element 21 is disposed on the bottom of the substrate 2. A cavity 22 is formed on the top of the substrate 2, and the ceramic plate 1 is inserted into the cavity 22. The inner wall of the cavity 22 is in contact with the side wall of the ceramic plate 1, improving the stability of the connection between the substrate 2 and the ceramic plate 1. A first pad 31 is provided on the bottom of the ceramic plate 1, and the first pad 31 is connected to the pressure chip 11 by a wire. A second pad 32 is provided in the cavity 22, and the first pad 31 and the second pad 32 are connected by silver paste adhesive, forming a silver paste adhesive layer 3 between the first pad 31 and the second pad 32.

[0031] Reference Figure 3A plurality of insertion slots 44 are formed within the cavity 22, and a plurality of snap-fit ​​slots 43 are formed on the side wall of the ceramic plate 1. A snap-fit ​​assembly 4 is provided between the snap-fit ​​slots 43 and the insertion slots 44, which are arranged opposite to each other. The snap-fit ​​assembly 4 is used to snap the substrate 2 and the ceramic plate 1 together. The snap-fit ​​assembly 4 includes a snap-fit ​​rod 41 and a snap-fit ​​spring 42. One end of the snap-fit ​​rod 41 is inserted into the insertion slot 44, and the other end of the snap-fit ​​rod 41 is inserted into the snap-fit ​​slot 43. The inner wall of the insertion slot 44 fits against the outer wall of the snap-fit ​​rod 41, reducing the wobbling of the snap-fit ​​rod 41 within the insertion slot 44. The inner wall of the snap-fit ​​slot 43 fits against the outer wall of the snap-fit ​​rod 41, reducing the wobbling of the snap-fit ​​rod 41 within the snap-fit ​​slot 43, thereby improving the stability of the connection between the substrate 2 and the ceramic plate 1. One end of the latching rod 41 is located inside the insertion slot 44 and abuts against the inner wall of the insertion slot 44. The other end of the latching rod 41 is located inside the insertion slot 43 and is fixedly connected to one end of the latching spring 42. The other end of the latching spring 42 is fixedly connected to the inner wall of the insertion slot 43. During the process of inserting the ceramic plate 1 into the cavity 22, the latching rod 41 is pressed and retracted into the insertion slot 43. After the ceramic plate 1 is inserted into the cavity 22, the latching spring 42 returns to its original position and pushes the latching rod 41 into the insertion slot 44, thereby achieving the effect of inserting the ceramic plate 1 and the substrate 2.

[0032] Reference Figure 3 and Figure 4 A receiving groove 7 is provided at the bottom of the ceramic plate 1, and an upper pad 51 is provided in the receiving groove 7. The upper pad 51 is wired to the pressure chip 11. A conductive spring 5 is provided on the upper pad 51, and an intermediate pad 52 is provided at the end of the conductive spring 5 away from the upper pad 51. A lower pad 53 is provided in the cavity 22, and the intermediate pad 52 abuts against the bottom of the ceramic plate 1 and the lower pad 53, thereby increasing the contact area between the conductive spring 5 and the lower pad 53.

[0033] Reference Figure 3 and Figure 4 A plurality of insulating rods 6 are integrally formed with the ceramic plate 1 through the intermediate pad 52. A plurality of insulating holes 61 are formed in the cavity 22 for inserting the insulating rods 6. The insulating rods 6 inserted in the insulating holes 61 provide a limiting and guiding function for the intermediate pad 52, so as to facilitate the alignment and contact between the intermediate pad 52 and the lower pad 53.

[0034] The implementation principle of the anti-interference GPF differential pressure sensor in this application embodiment is as follows: When the ceramic plate 1 is inserted into the cavity 22 on the substrate 2, the substrate 2 and the ceramic plate 1 are snapped together by the snap-fit ​​rod 41, thereby improving the connection strength between the substrate 2 and the ceramic plate 1. When the substrate 2 and the ceramic plate 1 are snapped together, the conductive spring 5 abuts the middle pad 52 against the lower pad 53 to achieve a conductive connection. At the same time, the conductive spring 5 can undergo elastic deformation and always abuts between the upper pad 51 and the lower pad 53, reducing the possibility of sensor malfunction due to poor contact of the pad signal.

[0035] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. An anti-interference GPF differential pressure sensor, comprising a housing, a ceramic plate and a substrate disposed within the housing, a pressure chip encapsulated on the top of the ceramic plate, a signal processing element disposed on the bottom of the substrate, and a cavity formed on the top of the substrate, the ceramic plate being inserted into the cavity, characterized in that: The cavity has several insertion slots, and the ceramic plate has several snap-fit ​​slots on its sidewall. A snap-fit ​​assembly is provided between the snap-fit ​​slots and the insertion slots. The snap-fit ​​assembly is used to snap the substrate and the ceramic plate together. A receiving groove is provided at the bottom of the ceramic plate. An upper solder pad is provided in the receiving groove. The upper solder pad is connected to the pressure chip by a wire. A conductive spring is provided on the upper solder pad. A lower solder pad is provided in the cavity, and the lower solder pad abuts against the conductive spring.

2. The anti-interference GPF differential pressure sensor according to claim 1, characterized in that: The inner wall of the cavity is attached to the side wall of the ceramic plate.

3. The anti-interference GPF differential pressure sensor according to claim 1, characterized in that: The ceramic plate has a first pad at the bottom, which is connected to the pressure chip by a wire. The cavity has a second pad, and a silver paste adhesive layer is disposed between the first pad and the second pad.

4. The anti-interference GPF differential pressure sensor according to claim 1, characterized in that: The conductive spring is provided with an intermediate pad at the end away from the upper pad, and the intermediate pad abuts between the bottom of the ceramic plate and the lower pad.

5. The anti-interference GPF differential pressure sensor according to claim 4, characterized in that: Several insulating rods are installed through the intermediate pad, and the insulating rods are fixedly connected to the ceramic plate. Several insulating holes are opened in the cavity for inserting the insulating rods.

6. The anti-interference GPF differential pressure sensor according to claim 1, characterized in that: The snap-fit ​​assembly includes a snap-fit ​​rod and a snap-fit ​​spring. One end of the snap-fit ​​rod is inserted into the insertion groove, and the end of the snap-fit ​​rod in the insertion groove abuts against the inner wall of the insertion groove. The other end of the snap-fit ​​rod is inserted into the snap-fit ​​groove, and the end of the snap-fit ​​rod in the snap-fit ​​groove is fixedly connected to one end of the snap-fit ​​spring. The other end of the snap-fit ​​spring is fixedly connected to the inner wall of the snap-fit ​​groove.

7. The anti-interference GPF differential pressure sensor according to claim 6, characterized in that: The inner wall of the insertion slot is in contact with the outer wall of the snap-fit ​​rod.

8. The anti-interference GPF differential pressure sensor according to claim 6, characterized in that: The inner wall of the snap-fit ​​groove is in contact with the outer wall of the snap-fit ​​rod.

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