Circuit board testing tooling and test line

Abstract

The application relates to the technical field of circuit board detection, and discloses a circuit board test tool and a test line body, which are suitable for testing a soft and hard combined circuit board, the soft and hard combined circuit board has a hard part and a flexible part, at least one first plug-in part is arranged on the hard part, and at least one to-be-tested part is arranged on the flexible part, the test tool comprises a lower die and an upper die, the lower die is used for bearing at least one soft and hard combined circuit board; at least one test part is arranged on the surface of the upper die facing the lower die, at least one second plug-in part and at least one test probe are arranged on the test part; wherein the upper die can be close to or away from the lower die, the second plug-in part is used for plugging in or disconnecting with the first plug-in part, and the test probe is in contact with or disconnected from the to-be-tested part, so that the problem of low test efficiency of the soft and hard combined circuit board is solved or improved.

Description

Technical Field

[0001] This application relates to the field of circuit board testing technology, specifically to circuit board testing fixtures and testing lines. Background Technology

[0002] In related technologies, during the development of passenger vehicle systems in the new energy industry, rigid circuit boards and flexible circuit boards need to be integrated to form a rigid-flex circuit board, such as a combination of PCB (Printed Circuit Board) + FPC (Flexible Printed Circuit). After the circuit board is manufactured, it needs to undergo ICT (Information and Communications Technology) electrical performance testing and FCT (Functional Circuit Test) functional testing to ensure the performance of the product during the manufacturing process.

[0003] During the testing process of circuit boards, because rigid circuit boards and flexible circuit boards have different testing functions, multiple testing steps are required for both rigid and flexible circuit boards to test their respective functions, resulting in low testing efficiency for circuit boards. Utility Model Content

[0004] This application provides a circuit board testing fixture and testing line to solve or improve the problem of low testing efficiency of rigid-flex circuit boards.

[0005] On one hand, this application provides a circuit board testing fixture suitable for testing rigid-flex circuit boards. The rigid-flex circuit board has a rigid part and a flexible part. The rigid part is provided with at least one first insertion part, and the flexible part is provided with at least one part to be tested. The fixture includes a lower mold and an upper mold. The lower mold is used to support at least one rigid-flex circuit board. The upper mold has at least one test part on its surface facing the lower mold. The test part is provided with at least one second insertion part and at least one test probe. The upper mold can move closer to or further away from the lower mold, so that the second insertion part can be used to insert or disconnect with the first insertion part, and the test probe can contact or disconnect with the part to be tested.

[0006] Beneficial effects: By setting at least one test section on the upper mold, with at least one second insertion part and at least one test probe on the test section, the hard part is tested by interlocking the second insertion part with the first insertion part on the hard part of the rigid-flex circuit board, and the flexible part is tested by contacting the test probe with the part to be tested on the flexible part of the rigid-flex circuit board. Thus, a single test fixture can simultaneously test both the hard and flexible parts of the rigid-flex circuit board, thereby improving testing efficiency.

[0007] In one optional embodiment, a test motherboard is also included. The upper mold is provided with at least one upper communication probe module, which is connected to the test probe and the second connector. The lower mold is provided with at least one lower communication probe module, which is connected to the test motherboard. The upper mold can be moved closer to or further away from the lower mold, so that the upper communication probe module can be plugged into or disconnected from the lower communication probe module.

[0008] In one optional embodiment, the lower mold includes a support box and a download board. The download board is disposed on the side of the support box near the upper mold. The auxiliary test motherboard is disposed in the support box. An adapter pin module is embedded in the support box. The adapter pin module is connected to the auxiliary test motherboard and the lower communication probe module.

[0009] In one optional embodiment, there are multiple test sections, which are arranged side by side at intervals along a first direction. Each test section extends along a second direction and has a first end and a second end that are arranged opposite to each other. The first direction is perpendicular to the second direction. In any two adjacent test sections, the first end and the second end of one test section are close to the second end and the first end of the other test section, respectively.

[0010] In one alternative embodiment, the upper mold is further provided with a plurality of elastic telescopic rods, which are used to pre-position and abut against the rigid part.

[0011] In one optional embodiment, the upper mold includes a pressure plate and a middle partition plate. The pressure plate is used to connect to the lifting end of the lifting device. The pressure plate is connected to the middle partition plate through a plurality of connectors. The second insertion part and the test probe are both disposed on the surface of the middle partition plate away from the pressure plate.

[0012] In one optional embodiment, the connector is a spring plunger, the pressure plate is provided with a plurality of support columns, the edge of the lower mold is provided with a reinforcing strip, and the support column abuts against the reinforcing strip.

[0013] In one alternative embodiment, a positioning module is further included, the positioning module being located on the lower mold, the positioning module having at least one positioning area for supporting a rigid-flex circuit board.

[0014] In one optional embodiment, the upper mold is provided with a plurality of positioning pins, and the lower mold is provided with a plurality of positioning seats, wherein the plurality of positioning pins and the plurality of positioning seats are inserted into each other in a one-to-one correspondence.

[0015] On the other hand, this application also provides a test line, including: any of the circuit board test fixtures described above.

[0016] Beneficial effects: Since the test line includes circuit board test fixtures, it has the same technical effects as circuit board test fixtures, which will not be elaborated here. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the specific embodiments or related technologies of this application, the drawings used in the description of the specific embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0018] Figure 1 This is an isometric view of a circuit board testing fixture according to an embodiment of this application;

[0019] Figure 2 This is an isometric view of the lower mold in a circuit board testing fixture according to an embodiment of this application;

[0020] Figure 3 This is an isometric view of the upper mold in a circuit board testing fixture according to an embodiment of this application;

[0021] Figure 4 This is an exploded view of a circuit board testing fixture according to an embodiment of this application;

[0022] Figure 5 This is an axial view of a rigid-flex circuit board according to an embodiment of this application.

[0023] Explanation of reference numerals in the attached figures:

[0024] 1. Lower mold; 2. Upper mold; 3. Test motherboard; 4. Probe pads; 5. Rigid-flex circuit board;

[0025] 11. Lower communication probe module; 12. Support housing; 13. Download board; 14. Positioning seat; 15. Adapter pin module;

[0026] 21. Test section; 211. Second connector; 212. Test probe; 213. First end; 214. Second end; 22. Upper communication probe module; 23. Pressure plate; 24. Middle partition plate; 25. Connector; 26. Elastic telescopic rod; 27. Positioning pin; 28. Support column; 29. ​​Reinforcing strip;

[0027] 51. Rigid part; 511. First insertion part; 52. Flexible part; 521. Part to be tested. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0029] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0030] In related technologies, during the development of passenger vehicle systems in the new energy industry, rigid circuit boards and flexible circuit boards need to be integrated to form a rigid-flex circuit board. Specifically, this can be a combination of PCB (Printed Circuit Board) and FPC (Flexible Printed Circuit). After the circuit board is manufactured, it needs to undergo ICT (Information and Communications Technology) electrical performance testing and FCT (Functional Circuit Test) functional testing to ensure the product performance during the manufacturing process.

[0031] During the testing process of circuit boards, because rigid circuit boards and flexible circuit boards have different testing functions, multiple testing steps are required for both rigid and flexible circuit boards to test their respective functions, resulting in low testing efficiency for circuit boards.

[0032] Therefore, this application provides a circuit board testing fixture and testing line to solve or improve the problem of low testing efficiency of rigid-flex circuit boards.

[0033] The following is combined with Figures 1 to 5 This describes an embodiment of the present application.

[0034] According to embodiments of this application, in one aspect, a circuit board testing fixture is provided, suitable for testing a rigid-flex circuit board 5, such as... Figure 5 As shown, the rigid-flex circuit board 5 has a rigid portion 51 and a flexible portion 52. At least one first insertion portion 511 is provided on the rigid portion 51, and at least one test portion 521 is provided on the flexible portion 52. Figures 1 to 3 As shown, it includes a lower mold 1 and an upper mold 2, and the specific scheme is as follows.

[0035] like Figure 2 As shown, the lower mold 1 is used to support at least one rigid-flex circuit board 5. Specifically, the lower mold 1 is a base assembled from metal plates. In order to improve testing efficiency, the lower mold 1 can support 2 to 8 rigid-flex circuit boards 5 at the same time. More specifically, the number of rigid-flex circuit boards 5 that the lower mold 1 can support at the same time can be any one of 2, 3, 4, 5, 6, 7 and 8 or any two of these values.

[0036] like Figure 3As shown, the upper mold 2 is a base assembled from metal plates. At least one test part 21 is provided on the surface of the upper mold 2 facing the lower mold 1. The number of test parts 21 is the same as the number of flexible and rigid bonding circuit boards 5 carried on the lower mold 1, and they correspond one-to-one. Each test part 21 is provided with at least one second plug-in part 211 and at least one test probe 212. Specifically, the number of second plug-in parts 211 and the number of test probes 212 can be set according to actual needs.

[0037] Specifically, the test probe 212 is fixed to the upper mold 2 by the probe pad 4. The upper mold 2 and the test probe 212 are provided with a clearance hole. The test probe 212 has a tendency to extend out of the clearance hole by the spring. After the test probe 212 makes spring contact with the part to be tested 521, it can retract into the clearance hole.

[0038] The upper mold 2 can move closer to or further away from the lower mold 1, so that the second insertion part 211 can be inserted into or disconnected from the first insertion part 511, and the test probe 212 can contact or disconnect from the part under test 521.

[0039] It should be noted that the above-mentioned "upper mold 2 can approach or move away from lower mold 1" means that the upper mold 2 and lower mold 1 can move relative to each other. This can be that the lower mold 1 is stationary and the upper mold 2 moves to approach or move away from the lower mold 1; or the upper mold 2 is stationary and the lower mold 1 moves to approach or move away from the upper mold 2; or both the upper mold 2 and the lower mold 1 move to achieve the approach or move away of the upper mold 2 and the lower mold 1. Preferably, the lower mold 1 is stationary and the upper mold 2 moves to approach or move away from the lower mold 1.

[0040] In specific usage, such as Figures 1 to 5 As shown, taking the integrated busbar (Cell Contact System) of the battery module as an example, the rigid-flex circuit board 5 referred to in the embodiments of this application is part of the integrated busbar, such as... Figure 5 As shown, the rigid-flex circuit board 5 is elongated and includes an integrated PCB board and an FPC board. The FPC board is used to connect to the terminals of multiple battery cells and has 16 nickel strips (test section 521). Among them, 8 nickel strips are used to connect to the positive terminals of 8 battery cells, and the remaining 8 nickel strips are used to connect to the negative terminals of 8 battery cells. A second plug-in section 211 is provided on the PCB board to connect to the BMS (Battery Management System) module.

[0041] Specifically, such as Figure 4 As shown, the lower mold 1 carries four rigid-flex circuit boards 5 and four test sections 21. Each test section 21 is provided with one second plug-in section 211 and 16 test probes 212.

[0042] The lower mold 1 is fixed on the test platform, and the second plug-in part 211 and the test probe 212 are both connected to the test equipment. The upper mold 2 is connected to the lifting end of the lifting device. Then, the four rigid-flex circuit boards 5 are placed on the lower mold 1. The upper mold 2 is lowered by controlling the lifting device to realize the docking of the four test parts 21 with the four rigid-flex circuit boards 5. That is, in each test part 21, the first plug-in part 511 docks with the second plug-in part 211, and the 16 test probes 212 contact the 16 nickel sheets, so as to perform a comprehensive test on the rigid-flex circuit board 5 to measure information such as voltage and temperature. After the test is completed, the lifting device controls the upper mold 2 to rise, the first plug-in part 511 and the second plug-in part 211 separate, and the test probes 212 separate from the nickel sheets.

[0043] In this embodiment, such as Figures 1 to 5 As shown, at least one test section 21 is provided on the upper mold 2. The test section 21 is provided with at least one second insertion part 211 and at least one test probe 212. The second insertion part 211 is inserted into the first insertion part 511 on the rigid part 51 of the rigid-flex circuit board 5 to detect the rigid part 51. The test probe 212 is contacted with the part to be tested 521 on the flexible part 52 of the rigid-flex circuit board 5 to detect the flexible part 52. Thus, a single test fixture can simultaneously detect the rigid part 51 and the flexible part 52 of the rigid-flex circuit board 5, thereby improving the detection efficiency.

[0044] In one embodiment, such as Figure 4 As shown, the circuit board testing fixture also includes a test motherboard 3, which is used to connect the testing end to the testing equipment, for signal conversion and interaction with the testing equipment. Figure 3 As shown, at least one upper communication probe module 22 is fixedly mounted on the upper mold 2 by bolts. Specifically, the number of upper communication probe modules 22 is 1 to 3. Preferably, one upper communication probe module 22 is connected to two test sections 21, and the upper communication probe module 22 is connected to the test probe 212 and the second connector 211 via a wire harness. Figure 2 As shown, at least one lower communication probe module 11 is provided on the lower mold 1. Specifically, the number of upper communication probe modules 22 is the same as the number of lower communication probe modules 11. The number of upper communication probe modules 22 is 1 to 3. The lower communication probe module 11 is connected to the test motherboard 3 through a wire harness.

[0045] Specifically, either the upper communication probe module 22 or the lower communication probe module 11 has multiple signal transmission probes, and the other has a structure that can be plugged into multiple signal transmission probes to realize the transmission of multiple detection signals.

[0046] The upper communication probe module 22 and the lower communication probe module 11 can both be 96-pin adapter modules 15, or they can be other multi-signal transmission modules.

[0047] The upper mold 2 can move closer to or further away from the lower mold 1, so that the upper communication probe module 22 can be plugged into or disconnected from the lower communication probe module 11.

[0048] In this embodiment, such as Figures 2 to 4 As shown, by setting an upper communication probe module 22 on the upper mold 2 and a lower probe module on the lower mold 1, during the testing of the hard-soft integrated circuit board 5, the upper communication probe module 22 and the lower communication probe module 11 are connected and cooperated to realize the information exchange between the test motherboard 3 and the external test equipment. The solution is simple and the connection is highly stable.

[0049] In one embodiment, such as Figure 2 As shown, the lower mold 1 includes a support box 12 and a download board 13. The download board 13 is fixed to the side of the support box 12 near the upper mold 2 by bolts. The auxiliary test motherboard 3 is fixed inside the support box 12 by bolts. The support box 12 is embedded with an adapter pin module 15. Specifically, the adapter pin module 15 is a 96-pin adapter pin. The adapter pin module 15 is connected to the auxiliary test motherboard 3 and the lower communication probe module 11. The adapter pin module 15 is used to exchange information with external devices.

[0050] Specifically, the support box 12 is a box made of metal plates connected by welding or bolts, or it can be other high-strength boxes; the download plate 13 is a plate made of metal or other materials.

[0051] The test motherboard 3 and the adapter module 15 are connected according to the wiring harness definitions such as BMS-POWER, VEHICLE-CAN, and INT-CAN. The side resource cabinet is connected to the adapter module 15 to supply 12V voltage to the test motherboard 3 and to feed back messages to monitor the voltage and temperature information on the PCB+FPC rigid-flex circuit board 5.

[0052] The side resource cabinet also supplies power to the adapter pin module 15 through the resource cabinet (cell simulator), and then sequentially transmits it to the lower communication probe module 11, the upper communication probe module 22 and the test probe 212 to supply power to the hardware-software integrated circuit board 5.

[0053] In this embodiment, the test motherboard 3 can be protected by placing it inside the support housing 12.

[0054] In one embodiment, such as Figure 3As shown, there are multiple test sections 21, which are arranged side by side at intervals along a first direction. Each test section 21 extends along a second direction and has a first end 213 and a second end 214 arranged opposite to each other. The first direction is perpendicular to the second direction. Specifically, the second direction is the same as the length direction of the rigid-flex circuit board 5, and the first direction coincides with the width direction of the rigid-flex circuit board 5.

[0055] In any two adjacent test sections 21, the first end 213 and the second end 214 of one test section 21 are close to the second end 214 and the first end 213 of the other test section 21, respectively. That is, in two adjacent test sections 21, the first end 213 of one test section 21 and the second end 214 of the other test section 21 are located on the same side, and the second end 214 of one test section 21 and the first end 213 of the other test section 21 are located on the same side.

[0056] In this embodiment, such as Figure 3 As shown, multiple test sections 21 are arranged side by side at intervals along a first direction. In any two adjacent test sections 21, the first end 213 and the second end 214 of one test section 21 are respectively close to the second end 214 and the first end 213 of the other test section 21. This arrangement can reduce the layout area of ​​the multiple test sections 21, improve compactness, and reduce costs.

[0057] In one embodiment, such as Figure 3 As shown, the upper mold 2 is also provided with a plurality of elastic telescopic rods 26. Specifically, the elastic telescopic rods 26 are elastic pressure rods, and the plurality of elastic telescopic rods 26 are used to pre-position and abut against the rigid part 51.

[0058] Specifically, the distance between the elastic telescopic rod 26 and the rigid-flex circuit board 5 is less than the distance between the test probe 212 and the rigid-flex circuit board 5.

[0059] In actual use, during the descent of the upper mold 2, the elastic telescopic rod 26 first contacts the part of the rigid part 51 on the flexible-rigid circuit board 5 where no electronic components are installed. Then, as the lower mold 1 descends, the test probe 212 contacts the part to be tested 521.

[0060] In this embodiment, by setting the elastic telescopic rod 26, the rigid-flex circuit board 5 can be pre-fixed first, and then the test probe 212 can be made to abut against the part under test 521 on the rigid-flex circuit board 5. This can improve the contact stability and accuracy between the test probe 212 and the part under test 521, and avoid positional deviation.

[0061] In one embodiment, such as Figure 1As shown, the upper mold 2 includes a pressure plate 23 and a middle partition plate 24. The pressure plate 23 is used to connect with the lifting end of the lifting equipment through a snap-fit ​​structure or bolts. Specifically, the lifting equipment is a small hydraulic lifting system or a lifting system driven by a motor. The pressure plate 23 is connected to the middle partition plate 24 through multiple connectors 25. The second insertion part 211 and the test probe 212 are both set on the surface of the middle partition plate 24 away from the pressure plate 23.

[0062] In this embodiment, the upper mold 2 includes a pressure plate 23 and a middle partition plate 24. The pressure plate 23 is connected to the middle partition plate 24 through multiple connectors 25, so that the pressure plate 23 and the middle partition plate 24 are spaced apart, which can provide clearance space for the retraction of the test probe 212.

[0063] In one specific embodiment, the connector 25 is a spring plunger, and multiple support columns 28 are provided on the pressure plate 23 by welding. The edge of the lower mold 1 is provided with a reinforcing strip 29, and the support columns 28 abut against the reinforcing strip 29.

[0064] Specifically, the spring plunger can be adjusted in length, making it easy to pull and change the shape with the production line mechanism.

[0065] In one embodiment, such as Figures 1 to 4 As shown, the circuit board testing fixture also includes a positioning module (not shown in the figure). The positioning module is located on the lower mold 1 and has at least one positioning area. The positioning area is used to support the rigid-flex circuit board 5. Specifically, the positioning area is at least partially attached to the non-test surface of the rigid-flex circuit board 5 to position the rigid-flex circuit board 5.

[0066] Specifically, in one specific structure, the positioning module is fixed to the lower mold 1 by bolts; in another specific structure, there are multiple positioning modules, which are spaced apart on the transmission line, which is located between the upper mold 2 and the lower mold 1. When the positioning module moves to the test position, the lower mold 1 can support the positioning module (in one specific structure, the lower mold 1 is provided with a lifting platform to support the positioning module, and a positioning structure is provided between the lifting platform and the positioning module).

[0067] In one embodiment, such as Figure 3 As shown, the upper mold 2 is provided with multiple positioning pins 27, such as... Figure 2 As shown, the lower mold 1 is provided with multiple positioning seats 14, and multiple positioning pins 27 are inserted into the multiple positioning seats 14 in a one-to-one correspondence. Specifically, there are 3 to 6 positioning pins 27, preferably 4, which are installed at the four corners of the upper mold 2 respectively.

[0068] In actual use, before the elastic telescopic rod 26 contacts the rigid-flex circuit board 5, the positioning pin 27 and the positioning seat 14 are first inserted to achieve the pre-positioning of the upper mold 2 and the lower mold 1, so as to improve the accuracy of the relative position between the test probe 212 and the rigid-flex circuit board 5.

[0069] According to an embodiment of this application, in another aspect, a test line is provided, including the circuit board test fixture in any of the above embodiments.

[0070] Specifically, the test leads are the test leads of the rigid-flex circuit board 5.

[0071] In this embodiment, since the test line includes a circuit board test fixture and has the same technical effect as the circuit board test fixture, it will not be described in detail here.

[0072] Although embodiments of this application have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of this application, and all such modifications and variations fall within the scope defined by the appended claims.

Claims

1. A circuit board testing fixture suitable for testing a rigid-flex circuit board (5), the rigid-flex circuit board (5) having a rigid portion (51) and a flexible portion (52), the rigid portion (51) having at least one first insertion portion (511), and the flexible portion (52) having at least one test portion (521), characterized in that, include: The lower mold (1) is used to support at least one rigid-flex circuit board (5); The upper mold (2) has at least one test part (21) on its surface facing the lower mold (1), and the test part (21) has at least one second insertion part (211) and at least one test probe (212). The upper mold (2) can move closer to or further away from the lower mold (1), so that the second plug-in part (211) can be plugged into or disconnected from the first plug-in part (511), and the test probe (212) can contact or disconnect from the part to be tested (521).

2. The circuit board testing fixture according to claim 1, characterized in that, It also includes a test motherboard (3), the upper mold (2) is provided with at least one upper communication probe module (22), the upper communication probe module (22) is connected to the test probe (212) and the second plug-in part (211), the lower mold (1) is provided with at least one lower communication probe module (11), the lower communication probe module (11) is connected to the test motherboard (3); The upper mold (2) can be close to or far away from the lower mold (1), so that the upper communication probe module (22) can be plugged into or disconnected from the lower communication probe module (11).

3. The circuit board testing fixture according to claim 2, characterized in that, The lower mold (1) includes a support box (12) and a download board (13). The download board (13) is located on the side of the support box (12) near the upper mold (2). The test motherboard (3) is located inside the support box (12). The support box (12) is embedded with an adapter pin module (15). The adapter pin module (15) is connected to the test motherboard (3) and the lower communication probe module (11).

4. The circuit board testing fixture according to any one of claims 1 to 3, characterized in that, The test section (21) is multiple, and the multiple test sections (21) are arranged side by side at intervals along a first direction. The test section (21) extends along a second direction and has a first end (213) and a second end (214) arranged opposite to each other. The first direction is perpendicular to the second direction. In any two adjacent test sections (21), the first end (213) and the second end (214) of one test section (21) are respectively close to the second end (214) and the first end (213) of the other test section (21).

5. The circuit board testing fixture according to any one of claims 1 to 3, characterized in that, The upper mold (2) is also provided with a plurality of elastic telescopic rods (26), which are used to pre-position and abut against the rigid part (51).

6. The circuit board testing fixture according to any one of claims 1 to 3, characterized in that, The upper mold (2) includes a pressure plate (23) and a middle partition plate (24). The pressure plate (23) is used to connect with the lifting end of the lifting device. The pressure plate (23) is connected to the middle partition plate (24) through multiple connectors (25). The second insertion part (211) and the test probe (212) are both disposed on the surface of the middle partition plate (24) away from the pressure plate (23).

7. The circuit board testing fixture according to claim 6, characterized in that, The connector (25) is a spring plunger, and multiple support columns (28) are provided on the pressure plate (23). The edge of the lower mold (1) is provided with a reinforcing strip (29), and the support column (28) abuts against the reinforcing strip (29).

8. The circuit board testing fixture according to any one of claims 1 to 3, characterized in that, It also includes a positioning module located on the lower mold (1), the positioning module having at least one positioning area for supporting a rigid-flex circuit board (5).

9. The circuit board testing fixture according to any one of claims 1 to 3, characterized in that, The upper mold (2) is provided with a plurality of positioning pins (27), and the lower mold (1) is provided with a plurality of positioning seats (14). The plurality of positioning pins (27) and the plurality of positioning seats (14) are inserted into each other in a one-to-one correspondence.

10. A test line, characterized in that, include: The circuit board testing fixture as described in any one of claims 1 to 9.

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