Circuit board assembly and energy storage device

Abstract

The application provides a circuit board assembly and an energy storage device. The energy storage device has a ventilation opening. The circuit board assembly includes a circuit board, a heat conduction member, a ceramic passive element and a shielding member. The circuit board is provided with a heat generating device. The heat conduction member is arranged on the circuit board and connected to the heat generating device. The ceramic passive element is arranged on the circuit board and connected to the heat conduction member. The shielding member is arranged on the circuit board and located between the ceramic passive element and the ventilation opening and close to the ceramic passive element. The heat conduction member is configured to transfer heat of the heat generating device to the ceramic passive element. The shielding member is configured to shield impurities blown from the ventilation opening to the ceramic passive element. In use, the heat of the heat generating device is transferred to the ceramic passive element through the heat conduction member, thereby reducing the risk of condensation of the ceramic passive element. The impurities blown from the ventilation opening to the ceramic passive element are shielded by the shielding member, thereby reducing the risk of accumulation of wet dust on the ceramic passive element, and thereby improving the reliability of the circuit board and the energy storage device.

Description

Technical Field

[0001] This application relates to the field of circuit board design, specifically a circuit board assembly and an energy storage device. Background Technology

[0002] Currently, circuit boards in energy storage devices are typically cooled by fans. The fans blow outside air onto the circuit boards through the ventilation vents of the energy storage device. There are non-power components (such as ceramic capacitors) on the circuit boards located near the ventilation vents. Because ceramic capacitors have low temperatures, when the energy storage device is in a high-humidity environment, the airflow blowing from the ventilation vents onto the circuit boards carries water and impurities. This causes condensation to easily form on the ceramic capacitors and accumulate wet dust, leading to corrosion of the ceramic capacitors. This can easily cause short circuits on the circuit boards and reduce the reliability of the circuit boards and the energy storage device. Utility Model Content

[0003] In view of this, this application provides a circuit board assembly and energy storage device that can improve reliability.

[0004] One embodiment of this application provides a circuit board assembly for use in an energy storage device. The energy storage device has a vent for airflow. The circuit board assembly includes a circuit board, a heat-conducting component, a ceramic passive component, and a shielding component. The circuit board is provided with a heating device. The heat-conducting component is disposed on the circuit board and connected to the heating device. The ceramic passive component is disposed on the circuit board and connected to the heat-conducting component. The shielding component is disposed on the circuit board and located between the ceramic passive component and the vent, and is positioned close to the ceramic passive component. The heat-conducting component is configured to transfer heat from the heating device to the ceramic passive component. The shielding component is configured to block impurities blown from the vent toward the ceramic passive component.

[0005] The circuit board assembly provided in this application, when in use, transfers heat from the heat-generating device to the ceramic passive component through a heat-conducting component, thereby fully utilizing the heat from the heat-generating device to raise the temperature of the ceramic passive component and reducing the risk of condensation on the ceramic passive component. In addition, a shielding component is located between the ceramic passive component and the vent to block impurities blown towards the ceramic passive component from the vent, thereby reducing the risk of moisture accumulation on the ceramic passive component. At the same time, after the moisture is blocked by the shielding component, it will not come into contact with the ceramic passive component and affect the heat dissipation of the ceramic passive component. Therefore, the heat-conducting component can maximize the temperature of the ceramic passive component, further reducing condensation. In summary, even in scenarios with high air humidity, the circuit board assembly provided in this application can reduce the phenomenon of condensation and moisture accumulation on ceramic passive components, such as ceramic capacitors, reducing the risks of ceramic capacitor corrosion and short circuits on the circuit board, thereby improving the reliability of the circuit board and energy storage device.

[0006] In some embodiments, the thermal conductive element includes a first extension area, a second extension area, and a third extension area laid on a circuit board and connected in sequence. One end of the first extension area is connected to a heating device, and the other end extends toward a vent and is connected to one end of the second extension area. The other end of the second extension area extends in a direction perpendicular to the first extension area and is connected to one end of the third extension area. The other end of the third extension area extends in a direction away from the vent and is connected to a ceramic passive element.

[0007] In some embodiments, the heat-conducting component includes a linear extension area laid on a circuit board, the linear extension area extending linearly from the heating device to the ceramic passive element, the heating device being disposed at one end of the linear extension area, and the ceramic passive element being disposed at the other end of the linear extension area.

[0008] In some embodiments, the shielding member is disposed on the heat-conducting member, which can transfer heat from the heat-generating device to the shielding member.

[0009] In some embodiments, the shield is electrically connected to the circuit board and configured to generate heat when the circuit board is energized.

[0010] In some embodiments, the shielding member includes a connecting plate and a baffle connected together. The connecting plate is disposed on the heat-conducting member, and the baffle is bent relative to the connecting plate and has an angle relative to the circuit board. The baffle is located between the ceramic passive component and the vent to shield impurities blown from the vent to the ceramic passive component.

[0011] In some embodiments, the shielding member includes a base plate and a plurality of side plates. The base plate is disposed on the heat-conducting member, and the plurality of side plates are disposed around the base plate and together with the base plate form a receiving cavity. The base plate is provided with a clearance opening, through which the ceramic passive element is received in the receiving cavity. The plurality of side plates shield impurities blown toward the ceramic passive element from the vent.

[0012] In some embodiments, the shielding member has a groove on the side opposite to the ceramic passive element, the groove being configured to accommodate impurities blown from the vent toward the ceramic passive element.

[0013] In some embodiments, the circuit board assembly further includes a plurality of heating elements distributed around the ceramic passive element, the heating elements being electrically connected to the circuit board and configured to generate heat when the circuit board is energized.

[0014] This application also provides an energy storage device, which includes a housing, an inverter module and a battery pack. The inverter module and the battery pack are disposed inside the housing. The housing is provided with a ventilation opening. The inverter module includes a fan and a circuit board assembly as described in any of the above embodiments. The fan is located at the ventilation opening.

[0015] The energy storage device provided in this application, through the aforementioned circuit board assembly, also fully utilizes the heat from the heating element to raise the temperature of the ceramic passive component, thereby reducing the risk of condensation on the ceramic passive component. Furthermore, by using a shielding component to block impurities blown towards the ceramic passive component from the ventilation opening, the risk of moisture accumulation on the ceramic passive component is reduced. Simultaneously, since the moisture is blocked by the shielding component and does not contact the ceramic passive component for heat dissipation, the heat-conducting component can maximize the temperature increase of the ceramic passive component, further reducing condensation. Even in scenarios with high air humidity, the energy storage device can reduce condensation and moisture accumulation on the ceramic passive component, lowering the risks of ceramic capacitor corrosion and circuit board short circuits, thereby improving the reliability of the energy storage device. Attached Figure Description

[0016] Figure 1 This is a perspective view of an energy storage device according to one embodiment of this application.

[0017] Figure 2 for Figure 1 An exploded view of the energy storage device.

[0018] Figure 3 for Figure 1 A top view of the inverter module in the image.

[0019] Figure 4 This is a perspective view of a circuit board assembly and a fan in one embodiment of this application.

[0020] Figure 5 for Figure 4 A three-dimensional view of the circuit board assembly and fan from another perspective.

[0021] Figure 6 for Figure 4 Another top view of the circuit board assembly and fan.

[0022] Figure 7 This is a top view of a circuit board assembly and a fan in one embodiment of this application.

[0023] Figure 8 This is a perspective view of a circuit board assembly and a fan in one embodiment of this application.

[0024] Figure 9 This is a perspective view of a circuit board assembly and a fan in one embodiment of this application.

[0025] Figure 10 This is a perspective view of a circuit board assembly and a fan in one embodiment of this application.

[0026] Figure 11 This is a perspective view of a circuit board assembly and a fan in one embodiment of this application.

[0027] Explanation of key component symbols: 100. Circuit board assembly; 200. Energy storage device; 201. Housing; 202. Inverter module; 203. Ventilation port; 10. Circuit board; 11. Heating element; 20. Heat-conducting component; 21. First extension area; 22. Second extension area; 23. Third extension area; 24. Linear extension area; 30. Ceramic passive component; 40. Shielding component; 41. Connecting plate; 42. Baffle; 43. Base plate; 431. Clearance opening; 44. Side plate; 45. Receiving cavity; 46. Groove; 50. Heating element. Detailed Implementation

[0028] The technical solution of this application will now be described with reference to the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments.

[0029] It should be noted that when an element is considered to be "connected to" or "located on" another element, it can be directly connected to the other element or may have an element centrally located. In this application, unless otherwise explicitly specified and limited, the terms "installed," "connected," and "fixed," etc., should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two elements. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances. The terms "first," "second," etc., are only used to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly indicating the number, specific order, or primary / secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly specified. The shape descriptions in the embodiments of this application are merely illustrative and should not constitute any absolute limitation on this application. The terms "vertical" and "parallel" are used to describe the ideal state between two components; in actual production or use, a state approximately vertical or parallel may exist.

[0030] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. Where there is no conflict, the various embodiments in this application can be combined with each other.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The terms “comprising,” “having,” and “equipped with,” and any variations thereof, in the description, claims, and foregoing drawings of this application, are intended to cover non-exclusive inclusion.

[0032] Currently, circuit boards in energy storage devices are typically cooled by fans. The fans blow outside air onto the circuit boards through the ventilation vents of the energy storage device. There are non-power components (such as ceramic capacitors) on the circuit boards located near the ventilation vents. Because ceramic capacitors have low temperatures, when the energy storage device is in a high-humidity environment, the airflow blowing from the ventilation vents onto the circuit boards carries water and impurities. This causes condensation to easily form on the ceramic capacitors and accumulate wet dust, leading to corrosion of the ceramic capacitors. This can easily cause short circuits on the circuit boards and reduce the reliability of the circuit boards and the energy storage device.

[0033] In view of this, this application provides a circuit board assembly and an energy storage device that can improve reliability. The energy storage device has a vent for airflow. The circuit board assembly includes a circuit board, a heat-conducting component, a ceramic passive component, and a shielding component. The circuit board has a heating device. The heat-conducting component is disposed on the circuit board and connected to the heating device. The ceramic passive component is disposed on the circuit board and connected to the heat-conducting component. The shielding component is disposed on the circuit board and located between the ceramic passive component and the vent, and is positioned close to the ceramic passive component. The heat-conducting component is configured to transfer heat from the heating device to the ceramic passive component. The shielding component is configured to block impurities blown from the vent toward the ceramic passive component.

[0034] The circuit board assembly provided in this application, when in use, transfers heat from the heat-generating device to the ceramic passive component through a heat-conducting component, thereby fully utilizing the heat from the heat-generating device to raise the temperature of the ceramic passive component and reducing the risk of condensation on the ceramic passive component. In addition, a shielding component is located between the ceramic passive component and the vent to block impurities blown towards the ceramic passive component from the vent, thereby reducing the risk of moisture accumulation on the ceramic passive component. At the same time, after the moisture is blocked by the shielding component, it will not come into contact with the ceramic passive component and affect the heat dissipation of the ceramic passive component. Therefore, the heat-conducting component can maximize the temperature of the ceramic passive component, further reducing condensation. In summary, even in scenarios with high air humidity, the circuit board assembly provided in this application can reduce the phenomenon of condensation and moisture accumulation on ceramic passive components, such as ceramic capacitors, reducing the risks of ceramic capacitor corrosion and short circuits on the circuit board, thereby improving the reliability of the circuit board and energy storage device.

[0035] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0036] like Figure 1 , Figure 2 and Figure 3 As shown, this application embodiment provides a circuit board assembly 100 and an energy storage device 200. The energy storage device 200 includes a housing 201, an inverter module 202, and a battery pack (not shown). The inverter module 202 and the battery pack are disposed inside the housing 201. The housing 201 is provided with a vent 203 for airflow. The inverter module 202 includes a fan 204 and the circuit board assembly 100. The fan 204 is disposed at the vent 203 and is used to dissipate heat from the circuit board assembly 100. The energy storage device 200 can supply power to external devices, or external devices can charge the energy storage device 200. For example, the external devices can be various electrical appliances, solar panels, or mains power, etc. The energy storage device 200 can be a portable power source for outdoor scenarios, or a home energy storage system for home energy storage, etc.

[0037] like Figure 3 , Figure 4 and Figure 5 As shown, the circuit board assembly 100 includes a circuit board 10, a heat-conducting component 20, a ceramic passive component 30, and a shielding component 40. The circuit board 10 is provided with a heating device 11. The heat-conducting component 20 is disposed on the circuit board 10 and connected to the heating device 11. The ceramic passive component 30 is disposed on the circuit board 10 and connected to the heat-conducting component 20. The heat-conducting component 20 is configured to transfer heat from the heating device 11 to the ceramic passive component 30. The shielding component 40 is disposed on the circuit board 10. The shielding component 40 is located between the ceramic passive component 30 and the vent 203, and is disposed close to the ceramic passive component 30. The shielding component 40 is configured to shield impurities blown from the vent 203 towards the ceramic passive component 30.

[0038] Optionally, the heat-generating device 11 can be an electronic device that generates a large amount of heat when it is working, such as a transistor, chip, inductor or transformer; the ceramic passive component 30 can be a ceramic capacitor; and the heat-conducting component 20 can be a metal layer laid on the circuit board 10, such as copper foil.

[0039] In use, the circuit board assembly 100 transfers heat from the heating element 11 to the ceramic passive element 30 via the heat-conducting component 20. This fully utilizes the heat from the heating element 11 to raise the temperature of the ceramic passive element 30, thereby reducing the risk of condensation on the ceramic passive element 30. Furthermore, a shielding component 40 is located between the ceramic passive element 30 and the vent 203 to block impurities blown from the vent 203 onto the ceramic passive element 30, thus reducing the risk of moisture accumulation on the ceramic passive element 30. Simultaneously, the moisture is blocked by the shielding component 40. Since wet dust will not come into contact with the ceramic passive component 30 and affect the heat dissipation of the ceramic passive component 30, the heat-conducting component 20 can maximize the temperature of the ceramic passive component 30, which can further reduce the condensation of the ceramic passive component 30. In summary, the circuit board assembly 100 provided in this application can reduce the phenomenon of condensation and accumulation of wet dust on the ceramic passive component 30 even in the case of high air humidity, reduce the risk of corrosion of the ceramic passive component 30 and short circuit of the circuit board 10, and thus improve the reliability of the circuit board 10 and even the energy storage device 200.

[0040] In some embodiments, such as Figure 4 , Figure 5 and Figure 6 As shown, the heat-conducting component 20 includes a first extension area 21, a second extension area 22, and a third extension area 23 laid on the circuit board 10 and connected in sequence. One end of the first extension area 21 is connected to the heating device 11, and the other end extends toward the vent 203 and connects to one end of the second extension area 22. The other end of the second extension area 22 extends in a direction perpendicular to the first extension area 21 and connects to one end of the third extension area 23. The other end of the third extension area 23 extends in a direction away from the vent 203 and connects to the ceramic passive element 30. By laying the heat-conducting component 20 in this way, it can not only transfer the heat of the heating device 11 to the ceramic passive element 30, but also make the second extension area 22 closer to the vent 203, which can improve the heat dissipation efficiency of the second extension area 22. Thus, the heat-conducting component 20 can reduce the temperature of the heating device 11 and achieve the effect of heat dissipation for the heating device 11.

[0041] In some embodiments, such as Figure 7 As shown, the heat-conducting component 20 includes a straight extension area 24 laid on the circuit board 10. The straight extension area 24 extends in a straight line from the heating device 11 to the ceramic passive element 30. The heating device 11 is located at one end of the straight extension area, and the ceramic passive element 30 is located at the other end of the straight extension area. By laying the heat-conducting component 20 in this way, the shortest distance along the straight line can be achieved, thereby reducing the total length of the heat-conducting component 20 and reducing heat loss. This allows the heat-conducting component 20 to transfer more heat from the heating device 11 to the ceramic passive element 30, increasing the temperature of the ceramic passive element 30 and more effectively reducing the risk of condensation on the ceramic passive element 30.

[0042] In some embodiments, such as Figure 6 As shown, the shielding member 40 is disposed on the heat-conducting member 20. The heat-conducting member 20 can transfer the heat of the heating device 11 to the shielding member 40. That is, the shielding member 40 is located in the laying area of ​​the heat-conducting member 20, so that the shielding member 40 can absorb the heat of the heat-conducting member 20, thereby heating the air around the ceramic passive component 30, increasing the temperature around the ceramic passive component 30, and further reducing the risk of condensation on the ceramic passive component 30.

[0043] Alternatively, in some other embodiments, such as Figure 7 As shown, the shielding member 40 can also be located outside the laying area of ​​the heat-conducting member 20 to reduce the laying area of ​​the heat-conducting member 20, thereby reducing the heat dissipation efficiency of the heat-conducting member 20, so that the heat-conducting member 20 can transfer more heat from the heat-generating device 11 to the ceramic passive element 30.

[0044] In some embodiments, the shielding member 40 is electrically connected to the circuit board 10 and configured to heat up when energized by the circuit board 10. That is, without increasing the area of ​​the thermal conductive member 20, the heat generated by the shielding member 40 can heat the air around the ceramic passive component 30, thereby increasing the temperature around the ceramic passive component 30 and further reducing the risk of condensation on the ceramic passive component 30. Exemplarily, the shielding member 40 can be a device such as a resistor.

[0045] Alternatively, in some other embodiments, the shielding member 40 may also be a non-power device, such as a metal block or a plastic block, to reduce the power consumption of the circuit board 10.

[0046] In some embodiments, such as Figure 8 As shown, the shielding component 40 includes a connecting plate 41 and a baffle 42 connected together. The connecting plate 41 is disposed on the heat-conducting component 20. The baffle 42 is bent relative to the connecting plate 41 and has an angle relative to the circuit board 10. The baffle 42 is located between the ceramic passive component 30 and the vent 203 to shield impurities blown from the vent 203 towards the ceramic passive component 30. The shielding component 40 achieves a sheet-like structure through the connecting plate 41 and the baffle 42. Compared with a block structure, this reduces the volume, weight, and material cost of the shielding component 40.

[0047] Optionally, the baffle 42 is perpendicular to the connecting plate 41 to facilitate the processing and production of the shielding component 40. Alternatively, the baffle 42 is positioned at an acute angle relative to the circuit board 10 toward the vent 203, meaning the baffle 42 is tilted toward the vent 203. This allows impurities blown from the vent 203 toward the ceramic passive component 30 to be blocked by the baffle 42 and fall naturally onto the circuit board 10 under gravity, then be blown by the airflow into the angle between the baffle 42 and the circuit board 10. This prevents impurities from being carried away by the airflow onto the ceramic passive component 30, reducing the risk of moisture accumulation on the ceramic passive component 30.

[0048] In some embodiments, such as Figure 9 As shown, the shielding component 40 includes a base plate 43 and multiple side plates 44. The base plate 43 is disposed on the heat-conducting component 20, and the multiple side plates 44 are disposed around the base plate 43, forming a receiving cavity 45 with the base plate 43. The base plate 43 is provided with a clearance opening 431. The ceramic passive component 30 is connected to the heat-conducting component 20 through the clearance opening 431 and is housed in the receiving cavity 45. The multiple side plates 44 shield the impurities blown towards the ceramic passive component 30 from the vent 203, thereby shielding the ceramic passive component 30 from impurities blown towards it from all directions, rather than shielding impurities from a single direction, thus protecting the ceramic passive component 30 more efficiently and reducing the risk of moisture accumulation on the ceramic passive component 30.

[0049] Optionally, the side plate 44 has four rectangular base plates 43 and four side plates 44 forming a cubic box shape, or the side plate 44 can be cylindrical, with the circular base plate 43 and cylindrical side plates 44 forming a cylindrical box shape to accommodate the shape of the ceramic passive element 30.

[0050] Alternatively, the shielding member 40 may also include a cover plate (not shown) that covers the bottom plate 43 and the side plate 44 and covers the receiving cavity 45 so that the receiving cavity 45 is closed, thereby enclosing the ceramic passive element 30 in the receiving cavity 45, thereby maximizing the protection of the ceramic passive element 30 and reducing the risk of moisture and dust accumulation on the ceramic passive element 30.

[0051] In some embodiments, such as Figure 10 As shown, the shield 40 has a groove 46 on the side away from the ceramic passive element 30. The groove 46 is configured to accommodate impurities blown from the vent 203 to the ceramic passive element 30, so that the impurities are confined in the groove 46, thereby preventing the impurities from flying to the ceramic passive element 30 under the action of airflow, and reducing the risk of wet dust accumulating on the ceramic passive element 30.

[0052] Optionally, the groove 46 is angular, causing impurities to accumulate at the angular points under the influence of airflow, where they are held by the opposing sidewalls of the groove 46, thus confining the impurities within the groove 46 and further reducing the risk of impurities being dispersed by airflow. Alternatively, the groove 46 can be serrated, forming a greater number of angular points to confine impurities within each angular point, further reducing the risk of impurities being dispersed by airflow.

[0053] In some embodiments, such as Figure 11As shown, the circuit board assembly 100 also includes a plurality of heating elements 50 distributed around the ceramic passive element 30. The heating elements 50 are electrically connected to the circuit board 10 and configured to generate heat when energized by the circuit board 10. This further heats the air surrounding the ceramic passive element 30 by the multiple heating elements 50, in addition to the provision of the shielding element 40, thereby increasing the temperature around the ceramic passive element 30 and further reducing the risk of condensation on the ceramic passive element 30. For example, the heating elements 50 can be devices such as resistors.

[0054] Furthermore, those skilled in the art should recognize that the above embodiments are merely illustrative of this application and are not intended to limit this application. Any appropriate changes and variations made to the above embodiments within the essential spirit and scope of this application fall within the scope of this application's disclosure.

Claims

1. A circuit board assembly used in an energy storage device, the energy storage device having a vent for airflow, characterized in that, The circuit board assembly includes: A circuit board, wherein a heating element is provided; A heat-conducting component, wherein the heat-conducting component is disposed on the circuit board and connected to the heating device; A ceramic passive component, wherein the ceramic passive component is disposed on the circuit board and connected to the heat-conducting component; A shielding component is disposed on the circuit board and located between the ceramic passive component and the vent, and is positioned close to the ceramic passive component; The heat-conducting element is configured to transfer heat from the heating device to the ceramic passive element, and the shielding element is configured to shield impurities blown from the vent toward the ceramic passive element.

2. The circuit board assembly as described in claim 1, characterized in that: The heat-conducting component includes a first extension area, a second extension area, and a third extension area laid on the circuit board and connected in sequence. One end of the first extension area is connected to the heating device, and the other end extends toward the vent and is connected to one end of the second extension area. The other end of the second extension area extends in a direction perpendicular to the first extension area and is connected to one end of the third extension area. The other end of the third extension area extends in a direction away from the vent and is connected to the ceramic passive element.

3. The circuit board assembly as described in claim 1, characterized in that: The heat-conducting component includes a linear extension area laid on the circuit board. The linear extension area extends in a straight line from the heating device to the ceramic passive element. The heating device is located at one end of the linear extension area, and the ceramic passive element is located at the other end of the linear extension area.

4. The circuit board assembly as described in claim 1, characterized in that: The shielding member is disposed on the heat-conducting member, and the heat-conducting member can transfer the heat of the heating device to the shielding member.

5. The circuit board assembly as claimed in claim 1, characterized in that: The shielding element is electrically connected to the circuit board and is configured to generate heat when the circuit board is energized.

6. The circuit board assembly as claimed in claim 1, characterized in that: The shielding component includes a connecting plate and a baffle plate connected together. The connecting plate is disposed on the heat-conducting component. The baffle plate is bent relative to the connecting plate and has an angle relative to the circuit board. The baffle plate is located between the ceramic passive component and the vent to shield impurities blown from the vent plate to the ceramic passive component.

7. The circuit board assembly as claimed in claim 1, characterized in that: The shielding component includes a base plate and multiple side plates. The base plate is disposed on the heat-conducting component, and the multiple side plates are disposed around the base plate and together with the base plate form a receiving cavity. The base plate is provided with a clearance opening, through which the ceramic passive component is received in the receiving cavity. The multiple side plates shield impurities blown toward the ceramic passive component from the vent.

8. The circuit board assembly as claimed in claim 1, characterized in that: The shielding member has a groove on the side opposite to the ceramic passive element, the groove being configured to accommodate impurities blown from the vent toward the ceramic passive element.

9. The circuit board assembly as claimed in claim 1, characterized in that: The circuit board assembly also includes a plurality of heating elements distributed around the ceramic passive element. The heating elements are electrically connected to the circuit board and configured to generate heat when the circuit board is energized.

10. An energy storage device, characterized in that: The energy storage device includes a housing, an inverter module, and a battery pack. The inverter module and the battery pack are disposed inside the housing. The housing has a ventilation opening. The inverter module includes a fan and a circuit board assembly as described in any one of claims 1 to 9. The fan is located at the ventilation opening.

Images