A heat dissipation cabinet

Abstract

The heat dissipation cabinet provided by this utility model features a fan housing and multiple circuit board housings arranged sequentially from top to bottom inside the cabinet. A first air inlet is located at the bottom of the cabinet and the circuit board housings, and an air outlet is located at the top of the cabinet. A second air inlet is located on the side wall of each circuit board housing, and corresponding air guide components are installed on the inner side wall of the cabinet. During operation, external cold air enters the cabinet through the first air inlet and is drawn upwards by the fan in the fan housing, accelerating the airflow over the electronic components in the circuit board housings for rapid heat dissipation. Simultaneously, a portion of the high-velocity recirculated air, directed towards the top air outlet, is naturally cooled by the side wall of the cabinet and then introduced into the second air inlet for further cooling of the electronic components before being discharged towards the air outlet. Compared to existing technologies, the heat dissipation cabinet provided by this utility model utilizes a portion of the high-speed recirculated airflow to achieve secondary air cooling of the electronic components through the air guide components, effectively improving heat dissipation efficiency.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for electronic devices, and in particular to a heat dissipation cabinet. Background Technology

[0002] The traction drive system is the "heart" unit of rail transit vehicles, responsible for electromechanical energy conversion. Its performance, to a certain extent, determines the power quality, energy consumption, and control characteristics of rail transit vehicles, making it crucial for energy-saving upgrades in rail transit. The converter controller and network controller, as core components of the traction drive system, are integrated within the drive control cabinet. Existing drive control cabinets have modular installation areas. With improved product performance, the number of functional modules within the cabinet has gradually increased, occupying considerable internal space. The heat dissipation of the cabinet has also increased significantly, and natural cooling methods are insufficient. Air cooling is now the primary method used to accelerate internal heat dissipation. However, the internal space of the cabinet is limited. The heat dissipation structure, modules, and functional units all occupy a significant amount of space within the cabinet, making it difficult to meet the installation requirements of all functional modules and the overall heat dissipation needs of the cabinet.

[0003] Therefore, providing a heat dissipation cabinet that optimizes heat dissipation and improves heat dissipation efficiency is a problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0004] The purpose of this utility model is to provide a heat dissipation cabinet. The device has a simple structure, is safe, effective, reliable and easy to operate, and can effectively improve the heat dissipation efficiency of electronic components inside the cabinet.

[0005] Based on the above objectives, the technical solution provided by this utility model is as follows: A heat dissipation cabinet includes: a cabinet body, a fan socket, a first air inlet, an air outlet, an air guide component, a second air inlet, and multiple circuit board sockets; Inside the cabinet, the fan insertion box and multiple circuit board insertion boxes are arranged sequentially from top to bottom; The first air inlet is located on the cabinet and below the card slot box; The air outlet is located at the top of the cabinet and above the fan housing; The second air inlet is provided on the side wall of each of the aforementioned card slot boxes; The inner side wall of the cabinet is provided with a plurality of air guide components that cooperate with the second air inlet.

[0006] Preferably, the cabinet includes: a cabinet frame; The cabinet frame is provided with multiple slots at intervals for fixing the fan box and multiple board boxes.

[0007] Preferably, the cabinet further includes: a top panel, a bottom panel, a front panel, a rear panel, and side panels; The top plate, the bottom plate, the front plate, the rear plate, and the side plates are connected to the cabinet frame to form an accommodating space inside the cabinet.

[0008] Preferably, it further includes: The first air inlet is located on the front panel; The air outlet is located on the top panel.

[0009] Preferably, the cabinet further includes: an upper crossbeam; The upper crossbeam is connected to the cabinet frame and abuts against the side panel; The upper crossbeam is disposed between the top plate and the fan housing.

[0010] Preferably, the air guiding component includes: an air guiding box; The air guide box is disposed between the upper crossbeam and the side plate; The air guide box opening faces the board insertion box.

[0011] Preferably, the air guiding component further includes: an air guiding baffle; The air guide baffle is vertically installed on the inner wall of the side plate; The air guide baffle is located below the air guide box.

[0012] Preferably, the air guiding component further includes: a baffle plate for the insert layer; The insert layer guide plate is arranged laterally on the inner wall of the side plate and abuts against the air guide baffle. The opening of the insert layer guide plate faces the second air inlet.

[0013] Preferably, it also includes: a dustproof plate. The dustproof panel is installed inside the cabinet and is located behind the first air inlet.

[0014] Preferably, it further includes: The air outlet is designed with a louvered structure.

[0015] The heat dissipation cabinet provided by this utility model has a fan box and multiple circuit board boxes arranged sequentially from top to bottom inside the cabinet. A first air inlet is provided below the cabinet and the circuit board boxes, and an air outlet is provided at the top of the cabinet. A second air inlet is provided on the side wall of the circuit board boxes, and a corresponding air guide component is provided on the inner side wall of the cabinet.

[0016] During operation, external cold air enters the cabinet through the first air inlet. The fan in the fan box draws the air from bottom to top, accelerating the airflow speed on the surface of the electronic components in the board box to achieve rapid heat dissipation. At the same time, the high-velocity return air directed to the top air outlet is naturally cooled by the side wall of the cabinet and then introduced into the second air inlet to further cool the electronic components before being discharged to the air outlet.

[0017] Compared to existing technologies, the heat dissipation cabinet provided by this utility model utilizes a portion of high-speed recirculation to achieve secondary air cooling of electronic components by setting up air guiding components, effectively improving heat dissipation efficiency. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 A schematic diagram of a heat dissipation cabinet provided for an embodiment of this utility model; Figure 2 This is a structural schematic diagram of the upper crossbeam and air guide box provided in an embodiment of the present utility model; Figure 3 This is a schematic diagram of the structure of the air guide baffle and the insert layer air guide provided in the embodiment of this utility model; Figure 4 This is a schematic diagram of the structure of the second air inlet provided in an embodiment of the present utility model; Figure 5 A schematic diagram of the cabinet structure provided in this embodiment of the utility model; Figure 6 This is a schematic diagram of the structure of the dustproof plate provided in an embodiment of the present utility model; Reference numerals: 1. Cabinet; 2. Fan insertion box; 3. First air inlet; 4. Air outlet; 5. Air guide component (not shown in the figure); 6. Second air inlet; 7. Card insertion box; 11. Cabinet frame; 12. Top plate; 13. Front plate; 14. Rear plate; 15. Side plate; 16. Upper crossbeam; 51. Air guide box; 52. Air guide baffle; 53. Insertion box layer guide plate; 8. Dustproof plate. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] The embodiments of this utility model are written in a progressive manner.

[0022] This utility model provides a heat dissipation cabinet. It primarily addresses the technical problem in existing technologies where the internal space of the chassis is limited, and the heat dissipation structure, plug-ins, and functional modules occupy a significant amount of space inside the chassis, making it difficult to meet the installation requirements of all functional modules and the heat dissipation needs of the chassis.

[0023] like Figures 1 to 4 As shown, a heat dissipation cabinet includes: a cabinet body 1, a fan box 2, a first air inlet 3, an air outlet 4, an air guide component 5 (not shown in the figure), a second air inlet 6, and multiple board boxes 7; Inside the cabinet 1, from top to bottom, fan insertion box 2 and multiple circuit board insertion boxes 7 are arranged in sequence; The first air inlet 3 is located on the cabinet 1 and below the board insertion box 7; The air outlet 4 is located at the top of the cabinet 1 and above the fan insertion box 2; Multiple card slot boxes 7 are equipped with second air inlets 6 on their side walls; Multiple air guide components 5 are provided on the inner wall of the cabinet 1 to cooperate with the second air inlet 6.

[0024] In practical applications, the heat dissipation cabinet is equipped with a cabinet body, fan box, first air inlet, air outlet, air guide component, second air inlet, and multiple circuit board boxes. Inside the cabinet body, the fan box and multiple circuit board boxes are arranged from top to bottom, forming the main heat dissipation air duct with the first air inlet and the air outlet. The secondary heat dissipation air duct is formed by the second air inlet set on the side wall of the circuit board box, the air guide component that cooperates with the second air inlet on the inner side wall of the cabinet body, and the air outlet.

[0025] During operation, external cold air enters the cabinet through the first air inlet and is drawn upwards by the fan box, accelerating the airflow speed on the surface of electronic components in the board box to achieve rapid heat dissipation. At the same time, the high-velocity return air directed to the top air outlet is naturally cooled by the side wall of the cabinet and then introduced into the second air inlet to further cool the electronic components before being discharged to the air outlet.

[0026] By subjecting the electronic components in the circuit board enclosure to two air-cooling processes, heat dissipation efficiency is effectively improved.

[0027] like Figure 2 As shown, preferably, the cabinet 1 includes: a cabinet frame 11; The cabinet frame 11 has multiple slots spaced apart for fixing the fan box 2 and multiple board box 7.

[0028] In practical use, the cabinet is equipped with a cabinet frame; multiple slots are spaced apart on the cabinet frame. During operation, the fan box is fixed in the slot closest to the top of the cabinet, and multiple circuit board boxes are fixed in the remaining slots. When a circuit board malfunctions, the corresponding circuit board box in the slot is pulled out to replace the circuit board. Similarly, when dust needs to be cleaned, the fan in the fan box is pulled out for cleaning.

[0029] like Figure 5 As shown, preferably, the cabinet 1 further includes: a top plate 12, a bottom plate, a front plate 13, a rear plate 14, and a side plate 15; The top plate 12, bottom plate, front plate 13, rear plate 14 and side plate 15 are connected to the cabinet frame 11 to form an accommodating space inside the cabinet 1.

[0030] In actual use, the cabinet is also equipped with a top plate, a bottom plate (not shown), a front plate, and left and right side plates. The top plate, bottom plate, front plate, and left and right side plates are connected to the cabinet frame at corresponding positions, so that the inside of the cabinet forms a sealed storage space. This storage space has a large temperature difference with the outside of the cabinet, so that heat exchange can take place after the outside air enters the cabinet.

[0031] like Figure 5 As shown, preferably, it also includes: The first air inlet 3 is located on the front panel 13; Air outlet 4 is located on top panel 12.

[0032] In actual use, a first air inlet is set on the front panel and an air outlet is set on the top panel. During operation, cold air enters the cabinet from the first air inlet and is drawn upward by the fan in the fan box. The cold air exchanges heat with multiple circuit boards. After the exchange is completed, the hot air is discharged from the air outlet on the top panel.

[0033] like Figure 2 As shown, preferably, cabinet 1 further includes: an upper crossbeam 16; The upper crossbeam 16 is connected to the cabinet frame 11 and abuts against the side panel 15; The upper crossbeam 16 is located between the top plate 12 and the fan box 2.

[0034] In actual use, the cabinet is also equipped with an upper crossbeam, which is connected to the cabinet frame. At the same time, the left and right ends of the upper crossbeam abut against the inner walls of the left and right side panels respectively. The upper crossbeam is located between the fan box and the top plate, providing support for the air guiding components, thereby forming a secondary heat dissipation air duct.

[0035] like Figure 2 As shown, preferably, the air guide component 5 includes: an air guide box 51; The air guide box 51 is located between the upper crossbeam 16 and the side plate 15; The opening of the air guide box 51 faces the board insertion box 7.

[0036] In practical applications, the air guiding components are installed at the angles between the two ends of the upper crossbeam and the left and right side plates, with their openings facing the card slot box and their inner walls being smooth curved surfaces. The purpose is to ensure that the return airflow is reduced in attenuation when changing its flow direction, allowing more airflow to flow downwards at a higher speed.

[0037] like Figure 3 As shown, preferably, the air guide component 5 further includes: an air guide baffle 52; The air guide baffle 52 is vertically installed on the inner wall of the side plate 15; The air deflector 52 is located below the air guide box 51.

[0038] In practical applications, the air guide component is also equipped with an air guide baffle. The air guide baffle is vertically installed on the inner wall of the side plate and located below the air guide box. When the returning airflow flows downward at a high speed under the action of the air guide box, the airflow at the air guide box is gathered together by the air guide baffle, so that the gathered airflow contacts the inner wall of the side plate and uses the large surface area of ​​the side plate to dissipate heat from the gathered airflow.

[0039] like Figure 3 As shown, preferably, the air guide component 5 further includes: a box-type air guide plate 53; The insert layer guide plate 53 is horizontally arranged on the inner wall of the side plate 15 and abuts against the air guide baffle 52; The opening of the air intake 53 in the insert layer faces the second air inlet 6.

[0040] In practical applications, the air guide component is also equipped with a box layer guide plate. After the converged airflow dissipates heat, it flows back to the second air inlet on the side wall of the board box through the horizontally set box layer guide plate that abuts against the air guide baffle plate, and then cools the electronic components in the board box again through the air cooling, and is then dissipated from the air outlet.

[0041] like Figure 6 As shown, preferably, it also includes: a dustproof plate 8 The dustproof panel 8 is installed inside the cabinet 1 and is located behind the first air inlet 3.

[0042] In practical applications, a dustproof panel is installed inside the cabinet behind the first air inlet. This panel is protected with conductive cotton. The purpose of using conductive cotton is to prevent dust from entering the cabinet with the airflow and settling on the electronic components on the circuit boards, which could lead to heat dissipation difficulties or short circuits. Additionally, the conductive dustproof cotton provides electromagnetic shielding, allowing the cabinet to operate under complex electromagnetic conditions. The conductive cotton is secured to the air inlet panel with brackets to facilitate replacement and maintenance.

[0043] Preferably, it further includes: Air outlet 4 is designed with a louver structure.

[0044] In practical applications, the air outlet at the top of the cabinet is designed as an angled louver structure. The purpose of this design is to prevent foreign objects from falling vertically into the cabinet and causing short circuits to the operating electronic components.

[0045] It should be understood that the use of terms such as "system," "device," "unit," and / or "module" in this application is merely one method of distinguishing different components, elements, parts, sections, or assemblies at different levels. However, if other terms can achieve the same purpose, they may be replaced by other expressions.

[0046] As indicated in this application and claims, unless the context clearly indicates otherwise, the words "a," "an," "a," and / or "the" are not specifically singular and may include the plural. Generally, the terms "comprising" and "including" only indicate the inclusion of expressly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements. An element defined by the phrase "comprising an..." does not exclude the presence of other identical elements in the process, method, product, or apparatus that includes the element.

[0047] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

[0048] The present invention provides a detailed description of a heat dissipation cabinet. The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heat dissipation cabinet, characterized in that, include: Cabinet, fan box, first air inlet, air outlet, air guide components, second air inlet, and multiple circuit board boxes; Inside the cabinet, the fan insertion box and multiple circuit board insertion boxes are arranged sequentially from top to bottom; The first air inlet is located on the cabinet and below the card slot box; The air outlet is located at the top of the cabinet and above the fan housing; The second air inlet is provided on the side wall of each of the aforementioned card slot boxes; The inner side wall of the cabinet is provided with a plurality of air guide components that cooperate with the second air inlet.

2. The heat dissipation cabinet as described in claim 1, characterized in that, The cabinet includes: a cabinet frame; The cabinet frame is provided with multiple slots at intervals for fixing the fan box and multiple board boxes.

3. The heat dissipation cabinet as described in claim 2, characterized in that, The cabinet also includes: a top panel, a bottom panel, a front panel, a rear panel, and side panels; The top plate, the bottom plate, the front plate, the rear plate, and the side plates are connected to the cabinet frame to form an accommodating space inside the cabinet.

4. The heat dissipation cabinet as described in claim 3, characterized in that, Also includes: The first air inlet is located on the front panel; The air outlet is located on the top panel.

5. The heat dissipation cabinet as described in claim 4, characterized in that, The cabinet also includes: an upper crossbeam; The upper crossbeam is connected to the cabinet frame and abuts against the side panel; The upper crossbeam is disposed between the top plate and the fan housing.

6. The heat dissipation cabinet as described in claim 5, characterized in that, The air guiding component includes: an air guiding box; The air guide box is disposed between the upper crossbeam and the side plate; The air guide box opening faces the board insertion box.

7. The heat dissipation cabinet as described in claim 6, characterized in that, The air guiding component also includes: an air guiding baffle; The air guide baffle is vertically installed on the inner wall of the side plate; The air guide baffle is located below the air guide box.

8. The heat dissipation cabinet as described in claim 7, characterized in that, The air guiding component also includes: a baffle plate for the insert layer; The insert layer guide plate is arranged laterally on the inner wall of the side plate and abuts against the air guide baffle. The opening of the insert layer guide plate faces the second air inlet.

9. The heat dissipation cabinet as described in claim 1, characterized in that, Also includes: Dustproof board The dustproof panel is installed inside the cabinet and is located behind the first air inlet.

10. The heat dissipation cabinet as described in claim 1, characterized in that, Also includes: The air outlet is designed with a louvered structure.

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