Electrodeposition apparatus for preparing α-planar sources

Abstract

This utility model relates to the field of electrodeposition equipment technology, specifically providing an electrodeposition apparatus for preparing α-planar sources, including a substrate; an electrodeposition tank base fixed to the substrate; an electrodeposition tank placed on the electrodeposition tank base; and at least one clamping assembly, each clamping assembly including a support column, a guide column, and a pressure plate; the support column is fixed to the substrate away from the electrodeposition tank; the guide column is fixed to the substrate closer to the electrodeposition tank than the support column; the tail end of the pressure plate is movably connected to the support column, the middle section of the pressure plate is provided with a first through hole for the guide column to pass through, and the head end of the pressure plate is connected to the electrodeposition tank; under the cooperative guidance of the guide column and the first through hole, the pressure plate swings around its connection point with the support column, so that the head end of the pressure plate presses down to clamp the electrodeposition tank. Through the above configuration, simple assembly and disassembly of the electrodeposition tank is achieved, while avoiding the risk of damage or even failure due to friction of threaded connections / seals, thus extending the effective service life of the seal.

Description

Technical Field

[0001] This utility model relates to the field of electrodeposition equipment technology, and in particular to an electrodeposition apparatus for preparing α-plane sources. Background Technology

[0002] Alpha planar sources are prepared using alpha radionuclides. To ensure that the energy of alpha particles does not decay significantly within the radioactive planar source and to reduce self-absorption, the active layer must be formed very thin. Most alpha radionuclides belong to the highly toxic group. Once inside the human body, human tissues are continuously irradiated by the alpha radionuclides. The radiation primarily affects DNA molecules, causing cell damage and leading to various health hazards. In the 1960s, a method was developed to prepare radioactive sources and targets for nuclear physics experiments in weakly polar organic solvents. Alpha radionuclides are deposited on the cathode in the form of hydroxides or other compounds. This method, known as molecular electroplating, is widely used in the preparation of alpha planar sources.

[0003] Chinese patent application No. 201710284564.6 discloses a deposition tank for preparing a high-resolution alpha radiation source by magnetohydrodynamic electrodeposition. The deposition tank has a structure in which a permanent magnet is set on the outside of the deposition tank body, an anode wire extends from the top of the deposition tank body into the deposition liquid, and the bottom of the deposition tank body is sealed by a threaded bottom cover with a central opening. A cathode guide gasket and a cathode deposition source plate are arranged sequentially from bottom to top inside the threaded bottom cover at the bottom of the deposition tank body. A cathode guide wire is connected to the bottom of the cathode guide gasket, and the cathode guide wire is led out from the opening of the threaded bottom cover and connected to the negative terminal of the power supply.

[0004] Chinese patent application No. 201610196264.8 discloses an electrodeposition tank for preparing a high-resolution alpha source. The electrodeposition tank includes a power supply, an electroplating tank, a bottom plate, a magnet, and a platinum electrode. The electroplating tank has an inner and outer layer structure, with openings at the upper and lower ends of the inner layer. The inner layer of the electroplating tank is used to hold the electrodeposition plating solution, and the outer layer has a cooling circulating water inlet and a cooling circulating water outlet at opposite corners. An upper sealing ring and an upper sealing cap are provided at the opening at the upper end of the inner layer, and a lower sealing ring and a lower sealing cap are provided at the opening at the bottom of the inner layer. The bottom plate serves as the cathode and is located directly below the hole in the middle of the lower sealing ring. The platinum electrode extends from the radial center of the upper end of the inner layer of the electroplating tank to a position 0.5 cm to 1 cm from the bottom of the electroplating tank.

[0005] In these existing technologies, electrodeposition tanks are all fixed to the corresponding bases using threaded connections. Considering that the electrodeposition process is usually carried out in a glove box, the space available for hand movement in the glove box is limited and the operability is low. Moreover, the threaded connection means that the relevant connecting parts are repeatedly rotated, making the operation cumbersome and time-consuming. The potential risk of operators being exposed to radiation sources increases over time. During repeated rotation, the threaded connection may wear down due to the sealing surface, and the thermal expansion caused by the high heat generated by molecular electroplating may also affect the fit of the sealing surface, thus creating gaps at that point, increasing the risk of radioactive material leakage or contamination inside the tank. Operators indirectly operate the threaded connection through the glove box. Due to the presence of gloves, the tactile feedback of the hand is weak, and the threaded connection is prone to problems such as incomplete rotation or over-tightening. Utility Model Content

[0006] This invention provides an electrodeposition apparatus for preparing α-plane sources, which solves the inconvenience caused by the threaded connection of the electrodeposition tank that is indirectly operated through a glove box in the prior art. It realizes a sealed electrodeposition apparatus that is suitable for the specific deposition process environment of the glove box and replaces the vulnerable threaded connection with a clamping component.

[0007] This invention provides an electrodeposition apparatus for preparing an α-planar source, comprising: substrate; Electrodeposition tank base, fixed to the substrate; An electrodeposition tank is placed on an electrodeposition tank base; At least one clamping assembly, each clamping assembly including a support column, a guide column, and a pressure plate; the support column is fixed to the substrate away from the electrodeposition tank; the guide column is fixed to the substrate closer to the electrodeposition tank than the support column; the tail end of the pressure plate is movably connected to the support column, the middle section of the pressure plate is provided with a first through hole for the guide column to pass through, and the head end of the pressure plate is connected to the electrodeposition tank. Guided by the guide post and the first through hole, the pressure plate swings around the connection point between itself and the support post, causing the head end of the pressure plate to press down on the electrodeposition tank.

[0008] According to the electrodeposition apparatus for preparing an α-plane source provided by this utility model, a pivot groove is provided at the tail end of the pressure plate, and the top end of the support extends into the pivot groove.

[0009] According to the electrodeposition apparatus for preparing an α-plane source provided by the present invention, each clamping assembly further includes a handle, which is sleeved on the guide post and located above the middle section of the pressure plate, with the bottom of the handle abutting against the top surface of the pressure plate.

[0010] According to the electrodeposition apparatus for preparing an α-plane source provided by this utility model, the handle is provided with a second through hole for fitting onto a guide post, and the second through hole is provided with an internal thread; at least the upper part of the guide post is provided with an external thread, and the cooperation between the internal thread and the external thread causes the handle to rotate helically around the guide post.

[0011] According to the electrodeposition apparatus for preparing an α-plane source provided by this utility model, the guide post is fitted with an elastic element, the first end of the elastic element is connected to the substrate, and the second end is connected to the middle section of the pressure plate.

[0012] According to the electrodeposition apparatus for preparing an α-plane source provided by this utility model, the electrodeposition tank base is formed into a cylinder or a disk shape, and the electrodeposition tank base has a through groove that penetrates itself radially, the depth of the through groove being less than the height of the electrodeposition tank base.

[0013] According to the electrodeposition apparatus for preparing an α-plane source provided by this utility model, on the top surface of the electrodeposition tank base, arc-shaped grooves are respectively provided on both sides of the through groove. The arc-shaped grooves cooperate with the through groove to form a circular recess to accommodate the bottom of the electrodeposition tank.

[0014] According to the electrodeposition apparatus for preparing α-plane sources provided by this utility model, the electrodeposition tank base also includes a sealing element, and the deposition source sheet to be processed, the sealing element and the electrodeposition tank are sequentially placed in the circular recess.

[0015] According to the electrodeposition apparatus for preparing an α-plane source provided by this utility model, the substrate is provided with a substrate groove, the electrodeposition tank base is provided with a guide rail corresponding to the substrate groove at its bottom, and a conductive post is provided through the guide rail, which is electrically connected to the deposition source sheet to be processed.

[0016] The electrodeposition apparatus for preparing an α-plane source provided by this utility model further includes an electrode component, which is formed in the shape of a disk and has an outer diameter not greater than the inner diameter of the electrodeposition tank. The electrode component is placed in the electrodeposition tank.

[0017] The electrodeposition apparatus for preparing α-plane sources provided by this invention uses at least one clamping component to press the electrodeposition tank onto the electrodeposition tank base. The operation of the clamping component is quite simple and quick; the operator only needs to press down the pressure plate in the clamping component to ensure that the electrodeposition tank is firmly pressed onto the base. Conversely, the operator only needs to return the pressure plate to its original position to release the fixation between the electrodeposition tank and the base, allowing for the removal of the electrodeposition tank. This achieves rapid assembly and disassembly of the electrodeposition tank, significantly reducing the time required for assembly and disassembly. Furthermore, the working principle of the clamping component largely utilizes the lever principle, where the pressure plate and the electrodeposition tank are subjected to uniform force, avoiding frictional wear in threaded connections and extending the effective service life of the seal between the electrodeposition tank base and the electrodeposition tank, thereby reducing the frequency of equipment maintenance and replacement. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0019] Figure 1 This is a perspective view of the electrodeposition apparatus for preparing an α-planar source provided by this utility model.

[0020] Figure 2 This is a perspective view of the substrate provided by this utility model.

[0021] Figure 3 This is a perspective view of the electrodeposition tank base provided by this utility model.

[0022] Figure 4 This is a perspective view of the electrodeposition tank provided by this utility model.

[0023] Figure label: 1. Substrate; 11. Substrate groove; 12. Support column; 13. Guide column; 14. Pressure plate; 15. Pivot groove; 16. Handle; 17. Elastic element; 2. Electrodeposition tank base; 21. Through slot; 22. Arc-shaped groove; 23. Guide rail; 24. Conductive post; 3. Electrodeposition tank; 31. Bottom of electrodeposition tank; 32. Annular protrusion; 33. Top of electrodeposition tank. Detailed Implementation

[0024] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of this utility model.

[0025] In the description of the embodiments of this utility model, it should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this utility model. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0026] In the description of the embodiments of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection or a detachable connection, wherein a fixed connection can include an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this utility model based on the specific circumstances.

[0027] In this embodiment of the utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0028] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0029] The following is combined with Figures 1 to 4 This invention describes an electrodeposition apparatus for preparing α-planar sources.

[0030] Figure 1 This is a perspective view of the electrodeposition apparatus for preparing an α-planar source provided by this utility model, as shown below. Figure 1 As shown, the electrodeposition apparatus for preparing an α-plane source includes a substrate 1, an electrodeposition tank base 2, and an electrodeposition tank 3.

[0031] Figure 2 This is a perspective view of the substrate provided by this utility model, such as... Figure 2 As shown, substrate 1 is placed on a general platform, for example, the bottom surface inside a glove box. (Combined) Figure 1 The electrodeposition tank base 2 is fixedly connected to the substrate 1. The electrodeposition tank 3 is placed on the electrodeposition tank base 2.

[0032] To hold the electrodeposition tank 3 on the electrodeposition tank base 2, the electrodeposition apparatus for preparing the α-planar source is further provided with at least one clamping assembly, each clamping assembly including a support post 12, a guide post 13, and a pressure plate 14. For example, the number of clamping assemblies can be configured to be two, four, or more. (Refer to...) Figure 1 In this embodiment, there are two clamping components, which are symmetrically arranged on the substrate 1 with respect to its length direction. In other embodiments, additional clamping components may be arranged symmetrically with respect to the width direction of the substrate 1, or each may be arranged on the substrate 1 aligned with its geometric center.

[0033] Reference Figure 1 and Figure 2 Here, we will only take the layout of the clamping components symmetrically arranged on the substrate 1 with respect to the length direction of the substrate 1 as an example to illustrate the spatial layout and connection relationship of the support column 12, guide column 13 and pressure plate 14. Other layouts of the clamping components with respect to the substrate 1 can be adapted based on the layout symmetrically arranged with respect to the length direction of the substrate 1, and will not be described in detail here.

[0034] Along the length of the substrate 1, the support post 12 of each clamping assembly is fixed to the substrate 1 away from the electrodeposition tank 3; in other words, the support post 12 is located near the edge of the substrate 1 along its length. The guide post 13 is fixed to the substrate 1 closer to the electrodeposition tank 3 than the support post 12; in other words, along the length of the substrate 1, the guide post 13 is closer to the inner side of the substrate 1 than the support post 12. The support post 12 and the guide post 13 are each fixedly connected to the substrate 1, for example, by means of threaded connection and welding. The tail end of the pressure plate 14 is movably connected to the support post 12; the middle section of the pressure plate 14 is provided with a first through hole for the guide post 13 to pass through, and in particular, the diameter of the first through hole is slightly larger than the diameter of the guide post 13, so that the pressure plate 14 moves in a non-orthogonal posture relative to the guide post 13; the head end of the pressure plate 14 is connected to the electrodeposition tank 3, and in particular, the head end of the pressure plate 14 is separable from the electrodeposition tank 3.

[0035] The guide post 13 engages with the first through hole, allowing the pressure plate 14 to move up and down approximately orthogonally to each other along the guide post 13. Simultaneously, the tail end of the pressure plate 14 and the support column 12 are movable relative to each other, yet remain connected. With the cooperation of these three elements, the pressure plate 14 moves as follows: using the connection point between its tail end and the support column 12 as a fulcrum, and guided by the guide post 13, the head end of the pressure plate 14 moves up and down in the vertical / height direction; that is, the pressure plate 14 swings in the vertical / height direction around the aforementioned fulcrum.

[0036] Therefore, by setting at least one clamping component, the electrodeposition tank 3 is clamped onto the electrodeposition tank base 2. The operation of the clamping component is quite simple and quick. The operator only needs to press down the pressure plate 14 in the clamping component to ensure that the clamping component presses down the electrodeposition tank 3 until the electrodeposition tank 3 is firmly clamped onto the electrodeposition tank base 2. Conversely, the operator only needs to return the pressure plate 14 to the original position so that it no longer presses down on the electrodeposition tank 3 to release the fixation between the electrodeposition tank 3 and the electrodeposition tank base 2, so as to remove the electrodeposition tank 3. This realizes the rapid assembly and disassembly of the electrodeposition tank 3, which greatly shortens the time required for assembly and disassembly.

[0037] Furthermore, a pivot groove 15 is provided at the tail end of the pressure plate 14, and the top end of the support column 12 extends into the pivot groove 15. The pivot groove 15 can be formed as a smooth arcuate groove; correspondingly, the top end of the support column 12 can be formed as a hemisphere to cooperate with the pivot groove 15. Thus, the pressure plate 14 can rotate omnidirectionally around the hemisphere at the top end of the support column 12 like a movable joint, and the rotation range of the pressure plate 14 is limited by the respective main body parts of the support column 12 and the pressure plate 14.

[0038] Figure 4 This is a perspective view of the electrodeposition tank provided by this utility model, as shown below. Figure 4As shown, an annular protrusion 32 is provided on the outer peripheral surface of the electrodeposition tank 3. The head end of the pressure plate 14 contacts and presses down on the annular protrusion 32 of the electrodeposition tank 3, further pressing it onto the electrodeposition tank base 2. Moreover, as described above, the head end of the pressure plate 14 and the annular protrusion 32 are separable from each other to facilitate the insertion or removal of the electrodeposition tank 3.

[0039] Furthermore, each clamping assembly also includes a handle 16. The handle 16 is sleeved on the guide post 13 and located above the middle section of the pressure plate 14. The bottom of the handle 16 abuts against the top surface of the pressure plate 14. The advantage of this configuration is that the operator does not need to directly operate the piezoelectric deposition tank 3 under the pressure plate 14. Instead, the operator can operate the handle 16 so that the bottom of the handle 16 presses down against the top surface of the pressure plate 14, thereby fixing the piezoelectric deposition tank 3 under the pressure plate 14.

[0040] Furthermore, the handle 16 is provided with a second through hole for fitting the handle 16 onto the guide post 13, and the second through hole is provided with an internal thread; correspondingly, at least the upper section of the guide post 13 is provided with an external thread. The handle 16 and the guide post 13 are connected to each other by a threaded engagement, and the engagement of the internal and external threads allows the handle 16 to rotate helically around the guide post 13. In particular, the threads of the handle 16 and the guide post 13 are clearance-fitted, allowing the handle 16 to easily move helically up and down along the guide post 13 under the guidance of the threads, rather than being fixed at any segment of the guide post 13 due to the threaded engagement between the two. The advantage of this configuration is that the operator can precisely adjust the downward stroke of the handle 16 and the pressure plate 14, thereby ensuring that the head end of the pressure plate 14 presses down on the electrodeposition tank 3.

[0041] Furthermore, the guide post 13 is fitted with an elastic element 17, the first end of which is connected to the base plate 1, and the second end is connected to the middle section of the pressure plate 14. The elastic element 17 can be a spring or other similar material. When the operator rotates the handle 16, thereby driving the pressure plate 14 to swing downward, the operator also needs to overcome the repulsive force of the elastic element 17; when the operator releases the handle 16, the elastic element 17 is in a compressed state, exerting a repulsive force on the base plate 1 and the pressure plate 14. Depending on whether the threaded engagement between the handle 16 and the guide post 13 adopts a self-locking thread design, the feedback of the pressure plate 14 and the handle 16 when the elastic element 17 exerts a repulsive force on the pressure plate 14 differs. In the case of a self-locking thread, the elastic element 17, in conjunction with the self-locking thread, locks the handle 16 and the pressure plate 14 in a specific position, that is, the position of both when the operator releases the handle 16; in the case of a non-self-locking thread, the elastic element 17 lifts the handle 16 and the pressure plate 14 until the elastic element 17 returns to its natural state.

[0042] Figure 3 This is a perspective view of the electrodeposition tank base provided by this utility model, as shown below. Figure 3As shown, the electrodeposition tank base 2 is formed in the shape of a cylinder or a disk. The electrodeposition tank base 2 has a through-slot 21 extending radially through it, and the depth of the through-slot 21 is less than the height of the electrodeposition tank base 2. This design results in the through-slot 21 penetrating the electrodeposition tank base 2 only radially, rather than vertically. The through-slot 21 provides a ventilation and heat dissipation path for the deposition source plate and facilitates its removal after the deposition process is completed; that is, the operator can use the space of the through-slot 21 to pry up the deposition source plate.

[0043] Furthermore, on the top surface of the electrodeposition tank base 2, arc-shaped grooves 22 are respectively provided on both sides of the through groove 21. The arc-shaped grooves 22 on both sides of the through groove 21, together with a portion of the originally provided through groove 21, form a circular recess, which, combined with... Figure 4 The circular recess is used to accommodate the bottom 31 of the electrodeposition tank. More precisely, the circular recess, which is formed by the arcuate groove 22 and a portion of the through groove 21, is used not only to accommodate the bottom 31 of the electrodeposition tank, but also to accommodate the deposit source sheet to be processed and any seals that may be present, as will be described below.

[0044] Furthermore, the electrodeposition tank base 2 also includes a seal (not shown in the figure), and the deposit source sheet to be treated, the seal, and the electrodeposition tank 3 are sequentially placed into the circular recess. The seal can be a rubber gasket or other type of seal. In other words, when the electrodeposition tank base 2 and the electrodeposition tank 3 are assembled in place, from bottom to top, they are the electrodeposition tank base 2, the deposit source sheet to be treated, the seal, and the electrodeposition tank 3.

[0045] The advantage of this configuration is that the electrodeposition tank 3 and the electrodeposition solution are arranged above the deposition source sheet to be treated, and a seal is provided between the electrodeposition tank 3 and the deposition source sheet. The electrodeposition solution can basically cover the entire upward-facing surface of the deposition source sheet so that when the anode and cathode of the electrodeposition device used to prepare the α-plane source are energized, the target metal ions in the electrodeposition solution are deposited onto the upward-facing surface of the deposition source sheet. At the same time, the junction between the electrodeposition tank 3 and the deposition source sheet is sealed by the seal to prevent the electrodeposition solution from leaking out from there.

[0046] Reference Figure 1 and Figure 2The substrate 1 has a substrate groove 11, and the electrodeposition tank base 2 has a guide rail 23 corresponding to the substrate groove 11 at its bottom. When the electrodeposition tank base 2 is fixedly connected to the substrate 1, the guide rail 23 is embedded in the substrate groove 11. The guide rail 23 is provided with a conductive post 24, which is electrically connected to the deposition source sheet to be processed. With the above configuration, the deposition source sheet to be processed is electrically connected to one of the electrodes of the power supply, and then forms an electric field with the other electrode component to deposit metal ions in the electrodeposition solution onto the deposition source sheet.

[0047] Furthermore, the electrodeposition apparatus for preparing the α-planar source also includes an electrode component (not shown in the figure). The electrode component is composed of wire wound into a disc shape, for example, similar to the shape of a mosquito coil. The disc-shaped electrode component has an outer diameter that is designed not to exceed the inner diameter of the electrodeposition tank 3. The electrode component is placed in the electrodeposition tank 3, specifically, through the top 33 of the electrodeposition tank. Preferably, the disc-shaped electrode component is positioned so as to be suspended in the electrodeposition solution in a substantially horizontal orientation. Thus, the electrode component and the deposition source sheet are substantially parallel to each other and face each other to form the desired electric field between them.

[0048] Typically, in a general radioactive source electrodeposition process, the deposition source sheet is electrically connected to the cathode of the power supply, and the electrode assembly is electrically connected to the anode of the power supply. However, in certain specific scenarios, the electrical connections can also be configured with opposite polarities, i.e., the deposition source sheet is electrically connected to the anode of the power supply, and the electrode assembly is electrically connected to the cathode of the power supply.

[0049] Furthermore, the electrodeposition tank 3 is made of transparent acrylic. Therefore, the electrodeposition tank 3 possesses good chemical stability and visibility, facilitating operators' observation of the entire deposition process.

[0050] Additionally, the quick-assembly electrodeposition apparatus can also be equipped with an electrodeposition solution supply device. After the electrodeposition tank 3 and the electrodeposition tank base 2 are assembled into place, the electrodeposition solution is supplied to the electrodeposition tank 3 by means of the electrodeposition solution supply device; when the deposition process of the deposition source sheet is completed, the electrodeposition solution can be recovered into an external storage tank by reversing the operation of the electrodeposition solution supply device.

[0051] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. An electrodeposition apparatus for preparing an α-planar source, characterized in that, include: substrate; An electrodeposition tank base is fixed to the substrate; An electrodeposition tank is placed on the base of the electrodeposition tank; At least one clamping assembly, each clamping assembly including a support post, a guide post, and a pressure plate; the support post is fixed to the substrate away from the electrodeposition tank; the guide post is fixed to the substrate closer to the electrodeposition tank than the support post; the tail end of the pressure plate is movably connected to the support post, the middle section of the pressure plate is provided with a first through hole for the guide post to pass through, and the head end of the pressure plate is connected to the electrodeposition tank; Guided by the guide post and the first through hole, the pressure plate swings around its connection point with the support post, causing the head end of the pressure plate to press down on the electrodeposition tank.

2. The electrodeposition apparatus for preparing an α-planar source according to claim 1, characterized in that, The tail end of the pressure plate is provided with a pivot groove, and the top end of the support extends into the pivot groove.

3. The electrodeposition apparatus for preparing an α-planar source according to claim 1, characterized in that, Each of the clamping assemblies also includes a handle sleeved on the guide post and located above the middle section of the pressure plate, the bottom of the handle abutting against the top surface of the pressure plate.

4. The electrodeposition apparatus for preparing an α-planar source according to claim 3, characterized in that, The handle is provided with a second through hole for fitting onto the guide post, and the second through hole is provided with an internal thread; at least the upper part of the guide post is provided with an external thread, and the engagement of the internal thread and the external thread causes the handle to rotate helically around the guide post.

5. The electrodeposition apparatus for preparing an α-planar source according to claim 4, characterized in that, The guide post is fitted with an elastic element, the first end of which is connected to the base plate and the second end of which is connected to the middle section of the pressure plate.

6. The electrodeposition apparatus for preparing an α-planar source according to claim 1, characterized in that, The electrodeposition tank base is formed in the shape of a cylinder or a disk, and the electrodeposition tank base has a through groove that runs through it radially, the depth of which is less than the height of the electrodeposition tank base.

7. The electrodeposition apparatus for preparing an α-planar source according to claim 6, characterized in that, On the top surface of the electrodeposition tank base, arc-shaped grooves are provided on both sides of the through groove. The arc-shaped grooves cooperate with the through groove to form a circular recess to accommodate the bottom of the electrodeposition tank.

8. The electrodeposition apparatus for preparing an α-planar source according to claim 7, characterized in that, The electrodeposition tank base also includes a sealing element, and the deposition source sheet to be processed, the sealing element, and the electrodeposition tank are sequentially placed into the circular recess.

9. The electrodeposition apparatus for preparing an α-planar source according to claim 8, characterized in that, The substrate is provided with a substrate groove, and the electrodeposition tank base is provided with a guide rail at its bottom corresponding to the substrate groove. The guide rail is provided with a conductive post, and the conductive post is electrically connected to the deposition source sheet to be processed.

10. The electrodeposition apparatus for preparing an α-planar source according to claim 9, characterized in that, It also includes an electrode component, which is formed in the shape of a disk and whose outer diameter is not greater than the inner diameter of the electrodeposition tank. The electrode component is placed in the electrodeposition tank.

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