Step curve water channel water cooling plate

Abstract

The utility model relates to light source water cooling heat abstractor technical field discloses a step curve water channel water cooling plate, including the substrate and the cover plate, is provided with the recessed cavity on the substrate, is equipped with the wavy water tank on the recessed cavity bottom surface, the recessed cavity bottom surface upper portion one side of substrate is equipped with the lower water inlet variable diameter buffer cavity, and the other side is equipped with the lower water outlet variable diameter buffer cavity, and one side of lower water inlet variable diameter buffer cavity communicates with the wavy water tank one end, and the other side communicates with the water inlet, one side of lower water outlet variable diameter buffer cavity communicates with the wavy water tank the other end, and the other side communicates with the water outlet, the inner wall of cover plate is equipped with the convex part of recessed cavity adaptation of substrate, and the inner wall upper portion both sides of cover plate are equipped with the upper water inlet variable diameter buffer cavity corresponding with lower water inlet variable diameter buffer cavity and the upper water outlet variable diameter buffer cavity corresponding with lower water outlet variable diameter buffer cavity respectively, the utility model prolongs the fluid path of whole course through the curved water channel, the water channel side wall is set to wavy, promotes the contact area of fluid and water channel, and jointly forms the step type near field thermal coupling structure.

Description

Technical Field

[0001] This utility model relates to the technical field of water-cooled heat dissipation devices for light sources, specifically a stepped curved water channel water-cooled plate. Background Technology

[0002] Currently, the main heat dissipation systems on the market are air cooling and water cooling. Water cooling devices are equipped with inlets and outlets, and the internal water flow channels form a loop to fully utilize the advantages of water cooling and remove more heat. In existing technologies, the water channel structure of water-cooled plates often uses straight water channels with equal cross-sections, U-shaped water channels, or microchannel arrays. The heat dissipation effect is improved by increasing the heat exchange area.

[0003] This waterway structure has the following problems and drawbacks: 1. Difficulty in balancing heat dissipation efficiency and flow resistance: When designing water channels, in order to pursue high heat dissipation efficiency, it is often necessary to reduce the cross-sectional area of ​​the water channel to increase the flow velocity and turbulence, thereby enhancing convective heat transfer. However, this will lead to a significant increase in flow resistance, increasing pump power consumption and system noise. Conversely, if the cross-sectional area of ​​the water channel is increased to reduce flow resistance, the flow velocity will decrease, the convective heat transfer coefficient will decrease, and the heat dissipation efficiency will decrease.

[0004] 2. Monotonous waterway layout: Using simple serpentine or U-shaped waterways results in short fluid paths and low turbulence intensity, leading to insufficient solid-liquid contact area and limited heat exchange efficiency. Straight waterways easily generate fluid temperature layers, causing heat accumulation; altering the fluid flow path can easily create vortices and dead zones at bends, resulting in uneven flow field distribution.

[0005] 3. Insufficient overall heat exchange efficiency of miniaturized cold plates: In small water-cooled plates, due to manufacturing difficulties and space limitations, the processing cost increases significantly. Meanwhile, the microchannel array has poor heat dissipation, high flow resistance, and low flow rate, resulting in a mismatch between the flow rate and velocity of the coolant and the heat load requirements. As a result, the overall heat exchange efficiency fails to reach the ideal state. Utility Model Content

[0006] In view of the shortcomings of the prior art, the purpose of this utility model is to provide a stepped curved water channel water-cooled plate to solve the technical problems of the existing small water-cooled plate equal cross-section water channel structure, which is difficult to balance heat dissipation efficiency and flow resistance, uneven flow field distribution leading to low local heat exchange efficiency and insufficient overall heat exchange efficiency.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a stepped curved water channel water-cooled plate, comprising a base plate and a cover plate, wherein a cavity is provided on the base plate, and a wavy water groove is formed on the bottom surface of the cavity; a lower water inlet variable diameter buffer cavity is formed on one side of the upper part of the bottom surface of the cavity of the base plate, and a lower water outlet variable diameter buffer cavity is formed on the other side; the lower water inlet variable diameter buffer cavity is connected to one end of the wavy water groove, and the lower water outlet variable diameter buffer cavity is connected to the other end of the wavy water groove; an inlet connected to the lower water inlet variable diameter buffer cavity is formed on one side of the base plate, and an outlet connected to the lower water outlet variable diameter buffer cavity is formed on the other side; The inner wall of the cover plate is provided with a protrusion that matches the concave cavity of the substrate. The upper two sides of the inner wall of the cover plate are respectively provided with an upper water inlet variable diameter buffer cavity corresponding to the lower water inlet variable diameter buffer cavity and an upper water outlet variable diameter buffer cavity corresponding to the lower water outlet variable diameter buffer cavity. That is, when the protrusion of the cover plate is adapted to be located in the concave cavity of the substrate, the lower water inlet variable diameter buffer cavity, the upper water inlet variable diameter buffer cavity and the inner side wall of one side of the concave cavity of the substrate form a complete water inlet variable diameter buffer cavity. Similarly, the lower water outlet variable diameter buffer cavity, the upper water outlet variable diameter buffer cavity and the inner side wall of the other side of the concave cavity of the substrate form a complete water outlet variable diameter buffer cavity. The wavy water groove on the bottom surface of the concave cavity of the substrate forms a closed water channel.

[0008] Furthermore, the wavy water trough forms a multi-bend shape.

[0009] Furthermore, the area on the back of the substrate corresponding to the wavy water tank is a cooling contact surface, and a heating chip is welded to the cooling contact surface.

[0010] Furthermore, a thermally conductive medium is provided between the cooling contact surface and the heat-generating chip, and an annular isolation groove is provided on the substrate around the cooling contact surface to prevent the thermally conductive medium from overflowing.

[0011] Furthermore, the cross-sectional area of ​​the wavy water tank is always equal to the cross-sectional area of ​​the inlet. This makes the flow rate more stable and improves the uniformity of heat dissipation.

[0012] Furthermore, the substrate and cover plate are made of aluminum alloy, which offers high thermal conductivity, low expansion, reasonable cost, and good durability.

[0013] Furthermore, the cover plate is assembled onto the base plate through a stop structure and fixed by friction welding, effectively avoiding adverse factors such as slag inclusion, incomplete fusion, and incomplete penetration during welding.

[0014] This invention is used for heat dissipation of a heat-generating chip. The inlet and outlet of the water-cooling plate are connected to coolant to form a circulating water channel. The heat generated by the heat-generating chip is transferred to the cooling contact surface through a heat-conducting medium. The coolant continuously carries away heat from the wavy water channel of the water-cooling plate, maintaining the heat-generating chip at a certain temperature. During this process, a water chiller is connected to maintain the circulating heat dissipation.

[0015] Compared with the prior art, the beneficial effects of this utility model are: This invention features a three-dimensional curved water channel and a stepped near-heat source. The multiple bends lengthen the fluid's path, while the wave-like sidewalls increase the contact area between the fluid and the channel, forming a stepped near-field thermal coupling structure. This further enhances the heat dissipation efficiency and temperature uniformity of the water-cooled plate.

[0016] This invention can be applied to various forms of continuous waterways without the need for complex diversion or confluence structures. It can be combined with existing water-cooled plate designs and manufacturing processes, making it simple to process and possessing strong practicality and promotional value. Attached Figure Description

[0017] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments.

[0018] Figure 1 This is a schematic diagram of the structure of the substrate of this utility model.

[0019] Figure 2 This is a schematic diagram of the structure of the cover plate of this utility model.

[0020] Figure 3 This is a front structural cross-sectional view of the present invention.

[0021] Figure 4 This is a side cross-sectional view of the present invention.

[0022] Figure 5 This is a schematic diagram of the back of this utility model.

[0023] Figure 6 This is a front view of the present invention.

[0024] In the figure, 1-substrate, 11-cavity, 12-wave-shaped water tank, 13-cooling contact surface, 14-annular isolation groove, 2-cover plate, 21-protrusion, 3-water inlet, 31-water inlet variable diameter buffer cavity, 311-upper water inlet variable diameter buffer cavity, 312-lower water inlet variable diameter buffer cavity, 4-water outlet, 41-water outlet variable diameter buffer cavity, 411-upper water outlet variable diameter buffer cavity, 412-lower water outlet variable diameter buffer cavity. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] Example: Reference Figure 1-6 The stepped curved water channel water-cooled plate shown includes a base plate 1 and a cover plate 2. A cavity 11 is provided on the base plate 1. A wavy water channel 12 is formed on the bottom surface of the cavity 11. A lower water inlet variable diameter buffer cavity 312 is formed on one side of the upper part of the bottom surface of the cavity of the base plate 1, and a lower water outlet variable diameter buffer cavity 412 is formed on the other side. The lower water inlet variable diameter buffer cavity 312 is connected to one end of the wavy water channel 12, and the lower water outlet variable diameter buffer cavity 412 is connected to the other end of the wavy water channel 12. A water inlet 3 connected to the lower water inlet variable diameter buffer cavity 312 is formed on one side of the base plate 1, and a water outlet 4 connected to the lower water outlet variable diameter buffer cavity 412 is formed on the other side. The inner wall of the cover plate 2 is provided with a protrusion 21 that matches the cavity 11 of the substrate 1, and the upper sides of the inner wall of the cover plate 2 are respectively provided with an upper water inlet variable diameter buffer cavity 311 corresponding to the lower water inlet variable diameter buffer cavity 312 and an upper water outlet variable diameter buffer cavity 411 corresponding to the lower water outlet variable diameter buffer cavity 412.

[0027] During installation, the cover plate 2 is assembled onto the base plate 1 via a stop structure and fixed by friction welding, which effectively avoids defects such as slag inclusions, incomplete fusion, and incomplete penetration during welding. At this time, the protrusion 21 of the cover plate 2 is located in the cavity 11 of the base plate 1, and the lower water inlet variable diameter buffer cavity 312, the upper water inlet variable diameter buffer cavity 311, and a portion of the inner wall of one side of the cavity 11 of the base plate 1 form a complete water inlet variable diameter buffer cavity 31. Similarly, the lower water outlet variable diameter buffer cavity 412, the upper water outlet variable diameter buffer cavity 411, and a portion of the inner wall of the other side of the cavity 11 of the base plate 1 form a complete water outlet variable diameter buffer cavity 41, and the wavy water channel 12 on the bottom surface of the cavity 11 of the base plate 1 forms a closed waterway. A stepped platform is formed between the inlet variable diameter buffer chamber 31 and the corrugated water tank 12. Similarly, the same stepped platform is formed between the outlet variable diameter buffer chamber 41 and the corrugated water tank 12. The stepped platform can lift the water flow into the corrugated water channel to ensure the rapid flow of the coolant.

[0028] Preferably, the substrate 1 and the cover plate 2 are made of aluminum alloy, which has the characteristics of high thermal conductivity and low expansion.

[0029] Preferred, such as Figure 3 As shown, the wavy water tank 12 has a shape that is bent twice.

[0030] Preferably, the area on the back of the substrate 1 corresponding to the wavy water tank 12 is the cooling contact surface 13. A heat-conducting medium is welded to the cooling contact surface 13, and then the heat-conducting medium is welded to the heat-generating chip. An annular isolation groove 14 is provided on the substrate 1 around the cooling contact surface 13 to prevent the heat-conducting medium from overflowing. Specifically, when welding the water-cooled plate and the heat-generating chip, the heat-conducting medium often melts due to heat. The melted heat-conducting medium easily flows out of the cooling contact surface 13, which is detrimental to the welding of the heat-generating chip. The annular isolation groove 14 can effectively isolate the heat-conducting medium and limit the flow of the melted heat-conducting medium out of the cooling contact area.

[0031] Preferred, such as Figure 4 As shown, the cross-sectional area of ​​the wavy water tank 12 is always equal to the cross-sectional area of ​​the water inlet 3, which makes the flow rate more stable and improves the uniformity of heat dissipation.

[0032] This invention is used to dissipate heat from a heat-generating chip. The inlet 3 and outlet 4 of the water-cooling plate are connected to coolant to form a circulating water channel. The heat generated by the heat-generating chip is transferred to the cooling contact surface 13 through a heat-conducting medium. The coolant continuously carries away heat from the wavy water channel of the water-cooling plate, maintaining the heat-generating chip at a certain temperature. During use, the coolant is connected to a water chiller to maintain circulating water cooling.

[0033] The water channel of this invention is wavy, significantly increasing the contact area compared to a smooth water channel. The multiple bends lengthen the fluid's path, effectively improving the heat dissipation efficiency and temperature uniformity of the water-cooled plate. The variable-diameter buffer section is connected to the water channel via a stepped platform; as the coolant extends from the inlet towards the heat source area, it is continuously lifted by the stepped platform, bringing it closer to the heat-generating chip.

[0034] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A stepped curved water-cooled plate, characterized in that: The system includes a base plate (1) and a cover plate (2). A cavity (11) is provided on the base plate (1). A wavy water channel (12) is provided on the bottom surface of the cavity (11). A lower water inlet variable diameter buffer cavity (312) is provided on one side of the upper part of the bottom surface of the cavity of the base plate (1), and a lower water outlet variable diameter buffer cavity (412) is provided on the other side. The lower water inlet variable diameter buffer cavity (312) is connected to one end of the wavy water channel (12), and the lower water outlet variable diameter buffer cavity (412) is connected to the other end of the wavy water channel (12). A water inlet (3) is provided on one side of the base plate (1) and connected to the lower water inlet variable diameter buffer cavity (312), and a water outlet (4) is provided on the other side and connected to the lower water outlet variable diameter buffer cavity (412). The inner wall of the cover plate (2) is provided with a protrusion (21) that matches the cavity (11) of the substrate (1), and the upper sides of the inner wall of the cover plate (2) are respectively provided with an upper water inlet variable diameter buffer cavity (311) corresponding to the lower water inlet variable diameter buffer cavity (312) and an upper water outlet variable diameter buffer cavity (411) corresponding to the lower water outlet variable diameter buffer cavity (412); that is, when the protrusion (21) of the cover plate (2) is adapted to be located in the cavity (11) of the substrate (1), the lower water inlet variable diameter buffer cavity (312) The inner wall of one side of the upper water inlet variable diameter buffer cavity (311) and the concave cavity (11) of the substrate (1) forms a complete water inlet variable diameter buffer cavity (31). Similarly, the inner wall of the other side of the lower water outlet variable diameter buffer cavity (412), the upper water outlet variable diameter buffer cavity (411) and the concave cavity (11) of the substrate (1) forms a complete water outlet variable diameter buffer cavity (41). The wave-shaped water tank (12) on the bottom surface of the concave cavity (11) of the substrate (1) forms a closed water channel.

2. The stepped curved water-cooled plate according to claim 1, characterized in that: The wavy water tank (12) forms a multiple-bend shape.

3. The stepped curved water-cooled plate according to claim 2, characterized in that: The area on the back of the substrate (1) corresponding to the wavy water tank (12) is the cooling contact surface (13), and a heating chip is welded to the cooling contact surface (13).

4. The stepped curved water-cooled plate according to claim 3, characterized in that: A thermally conductive medium is provided between the cooling contact surface (13) and the heat-generating chip, and an annular isolation groove (14) is provided on the substrate (1) on the outer periphery of the cooling contact surface (13) to prevent the thermally conductive medium from overflowing.

5. The stepped curved water-cooled plate according to claim 4, characterized in that: The cross-sectional area of ​​the wave-shaped water tank (12) is always equal to the cross-sectional area of ​​the inlet (3).

6. The stepped curved water-cooled plate according to claim 1, characterized in that: The substrate (1) and cover plate (2) are made of aluminum alloy.

7. The stepped curved water-cooled plate according to claim 6, characterized in that: The cover plate (2) is assembled onto the base plate (1) by a stop structure and is fixed by friction welding.

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