Flash upper chamber and vacuum flash apparatus

Abstract

The application relates to the technical field of solar cells, and provides a flash evaporation upper chamber and a vacuum flash evaporation device. The flash evaporation upper chamber is used in cooperation with a flash evaporation lower chamber in the vacuum flash evaporation device, and comprises a chamber main body with a flash evaporation upper chamber and an air exhaust port, and a flow guide cover arranged on the chamber main body and located in the flash evaporation upper chamber; the air exhaust port is located at the top of the chamber main body and is connected with the flash evaporation upper chamber and an external vacuum obtaining module; the inner wall of the flash evaporation upper chamber is gradually outwardly expanded from top to bottom at the air exhaust port; the flow guide cover is located below the air exhaust port and has a flow guide port corresponding to the air exhaust port; and the flow guide cover is arranged at a distance from the inner wall of the flash evaporation upper chamber. The flash evaporation upper chamber can optimize the flow of air during vacuumization, so that the laminar flow of the internal air flow has good uniformity, thereby helping to improve the crystallization quality of a perovskite thin film.

Description

Technical Field

[0001] This application relates to the field of solar cell technology, and in particular to a flash evaporation upper chamber and a vacuum flash evaporation device. Background Technology

[0002] Currently, vacuum crystallization equipment typically consists of a closed cavity structure with an extraction port at the top for vacuuming. However, for the fabrication of large-area perovskite solar cell modules, the large cavity area leads to uneven airflow throughout the cavity during vacuuming via a single extraction port. This results in uneven solvent escape from different areas of the perovskite film, ultimately causing significant differences in the size of the perovskite film crystals, particularly between the edge and center regions of the module, which is detrimental to improving the crystallization quality of the perovskite film. Utility Model Content

[0003] In view of this, this application aims to propose a flash evaporation upper chamber, which is beneficial to improving the crystallization quality of perovskite thin films.

[0004] To achieve the above objectives, the technical solution of this application is implemented as follows: A flash evaporation upper chamber for use in conjunction with a flash evaporation lower chamber in a vacuum flash evaporation device, comprising a chamber body having an exhaust port and a flash evaporation upper chamber, and a flow guide shroud disposed on the chamber body and located within the flash evaporation upper chamber; The exhaust port is located at the top of the main body of the chamber and connects the upper flash chamber to the external vacuum acquisition module. The inner wall of the upper flash chamber gradually expands outward from the exhaust port from top to bottom. The flow guide hood is located below the air extraction port and has a flow guide port corresponding to the air extraction port, and the flow guide hood is spaced apart from the inner wall of the flash evaporation upper chamber.

[0005] Furthermore, the bottom of the flow guide is positioned at a distance from the bottom of the flash evaporation upper chamber; an escape zone is formed between the flow guide, the inner wall of the flash evaporation upper chamber, and the film surface of the perovskite film to be flashed; an annular first air passage is formed between the flow guide and the inner wall of the flash evaporation upper chamber; a second air passage is formed inside the flow guide; and the second air passage can accelerate the airflow in the central region of the escape zone.

[0006] Furthermore, the airflow velocity at the outlet of the second airway is greater than the airflow velocity at the outlet of the first airway.

[0007] Furthermore, the width of the first airway is the same at all points along its longitudinal cross-section, and the second airway gradually expands outward from the guide port from top to bottom, with the outlet area of ​​the second airway being smaller than that of the first airway.

[0008] Furthermore, the guide shroud is spaced and conforms to the inner wall of the flash evaporation upper chamber, and the longitudinal cross-sectional profile of the inner wall of the flash evaporation upper chamber is streamlined from the air extraction port to the bottom.

[0009] Compared with related technologies, this application has the following advantages: (1) The flash evaporation upper chamber described in this application is configured such that the inner wall of the flash evaporation upper chamber gradually expands outward from the exhaust port from top to bottom, and a flow guide hood is provided in the flash evaporation upper chamber below the exhaust port. The flow guide hood is configured to correspond to the exhaust port, and the distance between the flow guide hood and the inner wall of the flash evaporation upper chamber is configured to optimize the airflow during vacuuming, so that the laminar flow of the internal airflow has better uniformity, thereby helping to improve the crystallization uniformity of the perovskite thin film layer, that is, to improve the crystallization quality of the perovskite thin film.

[0010] (2) The bottom of the flow guide is positioned at the bottom of the flash chamber, and an escape zone is formed between the flow guide, the inner wall of the flash chamber and the surface of the perovskite film to be flashed. An annular first air channel is formed between the flow guide and the inner wall of the flash chamber, and a second air channel is formed inside the flow guide. The second air channel accelerates the airflow in the middle region of the escape zone, which can reduce the risk of eddy currents during vacuuming, thereby making the solvent escape velocity at different parts of the film surface similar and reducing uniformity differences.

[0011] (3) The airflow velocity at the outlet of the second air channel is greater than that at the outlet of the first air channel, which can accelerate the solvent escape from the middle region of the film surface, thereby improving the crystallization efficiency.

[0012] (4) By ensuring that the width of the first air channel is the same at all points on the longitudinal section and by gradually expanding the second air channel from top to bottom from the guide port, the airflow can be optimized during vacuuming, resulting in better uniformity of the laminar flow of the internal airflow. At the same time, the diameter area of ​​the outlet end of the second air channel is smaller than that of the outlet end of the first air channel, which is conducive to achieving a greater airflow velocity at the outlet end of the second air channel than at the outlet end of the first air channel, thereby accelerating the solvent escape from the middle region of the membrane surface.

[0013] (5) The guide hood spacing is set in accordance with the inner wall of the flash evaporation upper chamber. At the same time, the longitudinal cross-sectional profile of the inner wall of the flash evaporation upper chamber is streamlined from the guide port to the bottom, which can help improve the optimization of airflow direction and improve laminar flow uniformity, thereby helping to improve the quality of film formation.

[0014] This application also proposes a vacuum flash evaporation device, including a lower flash evaporation chamber and an upper flash evaporation chamber as described above, which is sealed on the lower flash evaporation chamber.

[0015] Furthermore, the flash evaporation lower chamber includes a substrate placement stage; it also includes a drive mechanism connected to the substrate placement stage, the drive mechanism being used to drive the substrate placement stage closer to or further away from the flash evaporation upper chamber.

[0016] Furthermore, the driving mechanism includes a first driving unit, a base connected to the driving end of the first driving unit, and a second driving unit disposed on the base. The substrate placement stage is connected to the driving end of the second driving unit. The first driving unit is used to drive the base to move closer to or further away from the flash evaporation upper chamber in the horizontal direction, and the second driving unit is used to drive the substrate placement stage to move up and down in the vertical direction to dock with or detach from the flash evaporation upper chamber.

[0017] Furthermore, the base is provided with a guide sleeve, and the substrate placement platform is provided with a guide post, which is slidably disposed in the guide sleeve in the vertical direction.

[0018] Furthermore, the substrate placement stage is provided with a substrate placement position and a limiting component located around the substrate placement position, the limiting component being used to limit the substrate.

[0019] The vacuum flash evaporation device described in this application is equipped with the aforementioned flash evaporation upper chamber, which has the same beneficial effects as conventional technology, and will not be elaborated further here.

[0020] Furthermore, by setting up a drive mechanism, the overall automation level of the device can be improved. Through the coordinated arrangement of the first drive unit and the second drive unit, the substrate placement stage can be moved in both the horizontal and vertical directions, thereby facilitating the placement of the substrate stage to approach and close the upper flash chamber to form a sealed flash chamber, or to move away from the upper flash chamber to facilitate substrate placement.

[0021] In addition, the combined use of guide sleeves and guide posts can improve the stability of the substrate placement stage during lifting and lowering. By setting limiting components, the circumferential freedom of the substrate can be limited, ensuring the substrate placement position and preventing deviations in substrate placement that could affect the crystallization effect during flash evaporation. Attached Figure Description

[0022] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments and descriptions of this application are used to explain this application and do not constitute an undue limitation of this application. In the drawings: Figure 1 This is a schematic diagram of the overall structure of the vacuum flash evaporation device described in the embodiments of this application; Figure 2 for Figure 1 A schematic diagram of the structure shown in the image from another perspective; Figure 3This is an exploded view of the flash evaporation upper chamber as described in the embodiments of this application; Figure 4 for Figure 3 A schematic diagram of the structure shown in the image from another perspective; Figure 5 This is a longitudinal cross-sectional view of the flash evaporation upper chamber as described in the embodiments of this application; Figure 6 This is an exploded view of the flash evaporation lower chamber as described in the embodiments of this application; Explanation of reference numerals in the attached figures: 100. Flash vaporization lower chamber; 1000, Substrate; 101, Substrate placement stage; 1011, Guide post; 1012, Limiting block; 1013, Groove; 102, Cooling module; 200. Flash vaporization upper chamber; 2000, Flash evaporation upper chamber; 201, Upper chamber wall; 2011, Air extraction port; 202, Side chamber wall; 203, Draft hood; 2031, Draft port; 204, Connecting column; 205, First air passage; 206, Second air passage; 300. Drive mechanism; 301, guide rail; 302, sliding seat; 303, base; 3031, guide sleeve; 304, second drive unit; 400. Vacuum Acquisition Module. Detailed Implementation

[0023] To make the technical solution and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0024] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0025] Furthermore, it should be noted that in the description of this application, if terms such as "upper," "lower," "inner," or "outer" appear, indicating orientation or positional relationship, these are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, if terms such as "first" or "second" appear, they are also used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0026] Furthermore, in the description of this application, unless otherwise expressly defined, the terms "installation," "connection," "joining," and "connector" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application in light of the specific circumstances.

[0027] In this application, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0028] The present application will now be described in detail through exemplary embodiments. However, it should be understood that, without further description, elements, structures, and features in one embodiment may be advantageously incorporated into other embodiments.

[0029] An embodiment of the first aspect of this application provides a flash evaporation upper chamber 200, which is suitable for the flash evaporation of the perovskite layer and passivation layer in the fabrication of perovskite solar cells. By optimizing the laminar flow of the gas flow during rapid vacuuming, the crystallization uniformity of the perovskite film is optimized, thereby improving the conversion efficiency and stability of the perovskite solar cell.

[0030] In related technologies, vacuum crystallization equipment is usually a closed cavity structure with an air extraction port 2011 at the top of the cavity for vacuuming. For small-area battery modules, it has little impact on the uniformity of air extraction in various parts of the cavity.

[0031] However, for the fabrication of large-area perovskite solar cell modules, due to the large area inside the chamber, the airflow inside the chamber is uneven when vacuuming is performed through a single evacuation port 2011. This leads to uneven solvent escape from different areas of the perovskite film, resulting in significant differences in the size of the perovskite film crystals, especially between the edge and middle areas of the module, which is detrimental to improving the crystal quality of the perovskite film.

[0032] In view of this, in order to overcome the shortcomings of the related technology, in the flash evaporation upper chamber 200 of this embodiment, combined with Figures 1 to 6As shown, in terms of overall design, it is used in conjunction with the lower flash chamber 100 in a vacuum flash evaporation device, and includes a chamber body having an exhaust port 2011 and an upper flash chamber 2000, as well as a flow guide shroud 203 located in the upper flash chamber 2000 on the chamber body.

[0033] The extraction port 2011 is located at the top of the main chamber and connects the upper flash chamber 2000 and the external vacuum acquisition module 400. The inner wall of the upper flash chamber 200 gradually expands outward from the extraction port 2011. Furthermore, a flow guide 203 is located below the extraction port 2011 and has a corresponding flow guide 2031. The flow guide 203 is positioned at a distance from the inner wall of the upper flash chamber 200.

[0034] Therefore, by making the inner wall of the flash evaporation upper chamber 200 gradually expand outward from top to bottom from the exhaust port 2011, and by setting a flow guide hood 203 below the exhaust port 2011 in the flash evaporation upper chamber 2000, with the flow guide port 2031 of the flow guide hood 203 corresponding to the exhaust port 2011, and the flow guide hood 203 spaced apart from the inner wall of the flash evaporation upper chamber 200, the airflow can be optimized during vacuuming, resulting in better uniformity of the laminar flow inside the chamber. This helps to improve the crystallization uniformity of the perovskite thin film layer, which is beneficial to improving the crystallization quality of the perovskite thin film. This, in turn, helps to improve the conversion efficiency and stability of the perovskite solar cell.

[0035] Continue to combine Figures 1 to 5 As shown, in some exemplary embodiments, the bottom of the flow guide 203 is positioned at a distance from the bottom of the flash chamber 2000. Furthermore, an escape zone is formed between the flow guide 203, the inner wall of the flash chamber 200, and the surface of the perovskite film to be flashed. An annular first air passage 205 is formed between the flow guide 203 and the inner wall of the flash chamber 200. A second air passage 206 is formed within the flow guide 203, and the second air passage 206 can accelerate the airflow in the central region of the escape zone.

[0036] The main advantage of this setup is that it reduces the risk of eddy currents during vacuuming, which in turn helps to make the solvent escape rate similar across the perovskite film surface, thus reducing uniformity differences.

[0037] It should be noted that if the flow guide 203 is not set, the airflow velocity around the perovskite film may be high and the velocity in the middle area may be low. By adding a flow guide 203 with a certain distance between it and the middle area of ​​the perovskite film, the velocity in the middle area can be increased, the eddy current can be reduced, and the solvent escape velocity at different parts of the film surface can be made similar, which helps to reduce the uniformity difference.

[0038] However, it is necessary to avoid the distance between the flow guide 203 and the perovskite film being too small. For example, if the flow guide 203 is positioned close to the bottom of the flash evaporation chamber 2000 (i.e. close to the film surface), it may cause the formation of two relatively independent air channels on the film surface (the inner and outer air channels correspond to the middle area and the periphery of the perovskite film, respectively). This may result in a large difference in the inner and outer rates, which is not conducive to improving the crystallization efficiency and forming quality of the perovskite film.

[0039] Continue to combine Figures 1 to 5 As shown, in some exemplary embodiments, the airflow velocity at the outlet of the second air passage 206 is greater than the airflow velocity at the outlet of the first air passage 205. By making the airflow velocity at the outlet of the second air passage 206 greater than the airflow velocity at the outlet of the first air passage 205, solvent escape from the middle region of the film surface can be accelerated, thereby improving crystallization efficiency.

[0040] In specific implementation, based on the top of the guide shroud 203 having a corresponding air extraction port 2011, the air outlet of the second air passage 206 refers to the end of the second air passage 206 near the guide shroud 2031, and the air outlet of the first air passage 205 refers to the end near the air extraction port 2011.

[0041] Continue to combine Figures 1 to 5 As shown, in some exemplary embodiments, the width of the first air passage 205 is the same at all points in the longitudinal section, and the second air passage 206 is gradually extended outward from top to bottom from the guide port 2031, and the diameter area of ​​the outlet end of the second air passage 206 is smaller than the diameter area of ​​the outlet end of the first air passage 205.

[0042] Since the width of the first air passage 205 is the same at all points along its longitudinal cross-section, and the second air passage 206 is gradually expanded outward from top to bottom from the guide port 2031, it can optimize the airflow during vacuuming, resulting in better uniformity of the laminar flow inside the air passage. At the same time, the diameter area of ​​the outlet end of the second air passage 206 is smaller than that of the outlet end of the first air passage 205, which can help to make the airflow velocity at the outlet end of the second air passage 206 greater than that at the outlet end of the first air passage 205, thereby accelerating the solvent escape from the middle region of the membrane surface.

[0043] It should be mentioned that the width of the first air passage 205 is the same at all points in the longitudinal section, that is, the distance between different areas of the guide flow hood 203 and the inner wall of the flash upper chamber 200 is the same.

[0044] Continue to combine Figures 1 to 5 As shown, in some exemplary embodiments, the shroud 203 is spaced and conformally disposed to the inner wall of the flash upper chamber 200, and the longitudinal cross-sectional profile of the inner wall of the flash upper chamber 200 is streamlined from the exhaust port 2011 to the bottom.

[0045] It is understandable that the spacing of the flow guide 203 and its conformal shape to the inner wall of the flash evaporation upper chamber 200, along with the streamlined longitudinal cross-sectional profile of the inner wall of the flash evaporation upper chamber 200 from the exhaust port 2011 to the bottom, can help optimize the airflow direction, improve laminar flow uniformity, and thus improve the quality of membrane formation.

[0046] The term "streamlined" refers to the shape of an object where there is no obvious separation of airflow at the surface. Here, the inner wall (i.e., the inner surface) of the flash chamber 200 and the inner surface of the guide groove 203 are both set to be streamlined, which can reduce the vortex effect and avoid the formation of vortices, thereby helping to improve the uniformity of laminar flow.

[0047] Furthermore, continue to combine Figure 1 As shown, in some exemplary embodiments, the vacuum acquisition module 400 includes a vacuum pump, a vacuum line connecting the vacuum pump and the flash chamber, and a vacuum extraction valve and a vacuum breaking valve disposed on the vacuum line. The main advantage of this arrangement is that it allows for precise control of the vacuum level and ensures the stability of the vacuum extraction process and the overall safety of the device.

[0048] In specific implementations, in some exemplary embodiments, the main body of the flash evaporation upper chamber 200 includes an upper chamber wall 201 and a side chamber wall 202 disposed below the upper chamber wall 201. The side chamber wall 202 is a ring arranged circumferentially around the upper chamber wall 201, and the flash evaporation upper chamber 2000 is formed by the side chamber wall 202 and the upper chamber wall 201.

[0049] Meanwhile, in some exemplary embodiments, the flow deflector 203 can be connected to the upper cavity wall 201 via connecting posts 204. The number and arrangement of the connecting posts 204 can be set and adjusted according to the actual installation requirements of the flow deflector 203. For example, there are four connecting posts 204, and the lines connecting each connecting post 204 form a rectangle.

[0050] It is worth noting that, regarding the flash evaporation upper chamber 200 of this embodiment, based on the above exemplary embodiments, in specific implementation, as a preferred embodiment, it is still composed of... Figures 1 to 6 As shown, it is used, for example, in conjunction with the lower flash chamber 100 in a vacuum flash evaporation apparatus, and may include a chamber body having an exhaust port 2011 and an upper flash chamber 2000, and a flow guide shroud 203 disposed on the chamber body and located within the upper flash chamber 2000.

[0051] The exhaust port 2011 is located at the top of the main chamber and connects the flash evaporation upper chamber 2000 and the external vacuum acquisition module 400. The inner wall of the flash evaporation upper chamber 200 gradually expands outward from the exhaust port 2011. Furthermore, the flow guide 203 is located below the exhaust port 2011 and has a flow guide 2031 corresponding to the exhaust port 2011. The flow guide 203 is spaced from the inner wall of the flash evaporation upper chamber 200.

[0052] The bottom of the flow guide 203 is positioned at the bottom of the flash chamber 2000; and an escape zone is formed between the flow guide 203, the inner wall of the flash chamber 200, and the surface of the perovskite film to be flashed. An annular first air passage 205 is formed between the flow guide 203 and the inner wall of the flash chamber 200. A second air passage 206 is formed inside the flow guide 203. The second air passage 206 can accelerate the airflow in the central region of the escape zone.

[0053] The airflow velocity at the outlet of the second airway 206 is greater than the airflow velocity at the outlet of the first airway 205.

[0054] The first air passage 205 has the same width at all points in its longitudinal section. The second air passage 206 is gradually expanded outward from top to bottom from the guide port 2031. The diameter area of ​​the outlet end of the second air passage 206 is smaller than that of the outlet end of the first air passage 205.

[0055] The guide shroud 203 is spaced apart and conforms to the inner wall of the flash evaporation upper chamber 200. The longitudinal cross-sectional profile of the inner wall of the flash evaporation upper chamber 200 is streamlined from the exhaust port 2011 to the bottom.

[0056] In the preferred embodiment of the flash evaporation upper chamber 200 above, the specific settings and arrangements of the chamber body, the flow guide 203, the vacuum acquisition module 400, etc., can still be referred to the descriptions in the above exemplary embodiments. Furthermore, in this preferred embodiment, the beneficial effects brought about by the design of the chamber body, the flow guide 203, and the vacuum acquisition module 400, etc., can also be referred to the descriptions in the above exemplary embodiments.

[0057] The flash evaporation upper chamber 200 of this embodiment adopts the above design. By making the inner wall of the flash evaporation upper chamber 200 gradually expand outward from top to bottom from the air extraction port 2011, and the guide hood 203 is spaced at the inner wall of the flash evaporation upper chamber 200, the airflow can be optimized during vacuuming, so that the laminar flow of the internal airflow has better uniformity, which helps to improve the crystallization uniformity of the perovskite thin film layer, that is, it is beneficial to improve the crystallization quality of the perovskite thin film.

[0058] An embodiment of the second aspect of this application provides a vacuum flash evaporation apparatus, continuing in conjunction with... Figures 1 to 6As shown, in some exemplary embodiments, it includes a flash lower chamber 100 and a flash upper chamber 200, which is covered by the flash lower chamber 100, as in the embodiments of the first aspect of this application.

[0059] Among related technologies, flash evaporation is one of the important processes for manufacturing perovskite solar cells, mainly used for the preparation and film formation of perovskite thin films. This process typically involves coating a perovskite precursor solution onto a substrate material, followed by flash evaporation to remove the solvent, thereby forming a perovskite thin film.

[0060] Currently, vacuum crystallization equipment is either a cavity structure or contains a heating device within the cavity structure to facilitate solvent escape and thus rapid crystallization. However, this rapid crystallization method is detrimental to improving the crystallization quality of perovskite thin films.

[0061] In view of this, in order to overcome the shortcomings of the related technology, the vacuum flash evaporation apparatus of this embodiment continues to incorporate... Figures 1 to 6 As shown, the overall design includes a flash lower chamber 100 and a flash upper chamber 200 covered by the flash lower chamber 100.

[0062] The flash chamber is formed by the lower flash chamber 100 and the upper flash chamber 200. The upper flash chamber 200 is provided with a vacuum acquisition module 400 that communicates with the flash chamber. The lower flash chamber 100 includes a substrate placement stage 101 and a cooling module 102 located at the bottom of the substrate placement stage 101.

[0063] Therefore, by setting a cooling module 102 at the bottom of the substrate placement stage 101, the temperature conditions for flash evaporation at low temperature can be provided on the basis of the vacuum conditions provided by the vacuum acquisition module 400. Furthermore, since the nucleation site density increases significantly and the grains are smaller during low-temperature crystallization, grain boundary defects can be reduced, which can help improve the compactness, uniformity and stability of the perovskite film. This can improve the crystallization quality of the perovskite film and provide more possibilities for the flash evaporation process of perovskite films.

[0064] Based on the above general introduction, specifically, the vacuum flash evaporation device in this embodiment also includes a frame. The flash evaporation lower chamber 100, flash evaporation upper chamber 200 and vacuum acquisition module 400 are all mounted on the frame. The specific structure of the frame can be set and adjusted according to the actual load-bearing and installation requirements of each structure in the vacuum flash evaporation device, which will not be described in detail here.

[0065] It should be noted that the direction-related descriptions in this embodiment are merely illustrative examples. In actual implementation, the direction descriptions in this embodiment vary depending on the orientation of the substrate placement stage 101. That is, each direction in this embodiment refers to a relative coordinate system with the substrate placement stage 101 as the reference. For example, in this embodiment, the horizontal direction refers to the width direction of the substrate placement stage 101, and the vertical direction refers to the height direction of the substrate placement stage 101, etc.

[0066] Continue to combine Figure 1 and Figure 2 As shown, in some exemplary embodiments, the vacuum flash evaporation apparatus of this embodiment further includes a drive mechanism 300 drivenly connected to the substrate placement stage 101. The drive mechanism 300 is used to drive the substrate placement stage 101 to close the upper flash evaporation chamber 200 to form a sealed flash evaporation chamber or to move away from the upper flash evaporation chamber 200. By providing the drive mechanism 300, the overall automation level of the apparatus can be improved.

[0067] Furthermore, in some exemplary embodiments, the drive mechanism 300 includes a first drive unit, a base 303 connected to the drive end of the first drive unit, and a second drive unit 304 disposed on the base 303, with the substrate placement stage 101 connected to the drive end of the second drive unit 304.

[0068] The first driving unit is used to drive the base 303 to move closer to or further away from the flash evaporation upper chamber 200 in the horizontal direction, and the second driving unit 304 is used to drive the substrate placement stage 101 to move up and down in the vertical direction so as to seal and dock with or detach from the flash evaporation upper chamber 200.

[0069] It is understandable that, through the coordinated arrangement of the first driving unit and the second driving unit 304, the substrate placement stage 101 can move in the horizontal and vertical directions, thereby facilitating the substrate placement stage 101 to approach and close the flash evaporation upper chamber 200 to form a sealed flash evaporation chamber, or to move away from the flash evaporation upper chamber 200 to facilitate the placement of the substrate 1000.

[0070] In specific implementations, in some exemplary embodiments, the drive mechanism 300 of this embodiment further includes a guide rail 301 disposed on the frame. The guide rail 301 extends horizontally, and the base 303 is slidably disposed on the guide rail 301 via a sliding seat 302. In this way, the stability of the base 303 moving in the horizontal direction can be improved, that is, the stability of the flash lower chamber 100 moving in the horizontal direction can be improved.

[0071] Of course, the number and arrangement of the guide rails 301 in this embodiment can be set and adjusted according to the actual guiding and sliding requirements of the base 303. For example, they can be two or three arranged at intervals along the length of the substrate placement stage 101.

[0072] Meanwhile, the first drive unit in this embodiment can preferably be a servo motor or a cylinder, and if necessary, a linear module well known to those skilled in the art can be directly used. The second drive unit 304 in this embodiment can preferably be a cylinder, with the cylinder rod passing through the substrate and connected to the substrate placement stage 101 to drive the substrate placement stage 101 to move up and down in the vertical direction.

[0073] Continue to combine Figures 1 to 6 As shown, in some exemplary embodiments, the base 303 is provided with a guide sleeve 3031, and the substrate placement stage 101 is provided with a guide post 1011, which is slidably disposed in the guide sleeve 3031 in the vertical direction. The cooperation between the guide sleeve 3031 and the guide post 1011 can help improve the stability of the substrate placement stage 101 during lifting.

[0074] It should be mentioned that the number and arrangement of the guide sleeve 3031 and the guide post 1011 can be set and adjusted according to the actual guiding requirements of the substrate placement stage 101. For example, the guide post 1011 can slide vertically in the guide sleeve 3031 after passing through the base 303. Or, the guide sleeve 3031 and the guide post 1011 can be arranged in two or three sets at intervals.

[0075] In addition, continue to combine Figure 1 , Figure 2 and Figure 6 As shown, in some exemplary embodiments, the substrate placement stage 101 is provided with a substrate placement position and a limiting component located around the substrate placement position, the limiting component being used to limit the circumferential degree of freedom of the substrate 1000.

[0076] It can be understood that by setting a limiting component, the substrate's 1000 circumferential degrees of freedom can be limited, ensuring the substrate's placement position and preventing deviations in the substrate's placement position from affecting the crystallization effect during flash evaporation.

[0077] Furthermore, in some exemplary embodiments, the projection outline of the substrate placement position along the vertical direction is rectangular, and the limiting component includes limiting blocks 1012 located at two corners of any opposite corner of the substrate placement position.

[0078] Here, the projection outline of the substrate placement position along the vertical direction is rectangular, and the limiting component includes limiting blocks 1012 located at two corners of any opposite corner of the substrate placement position. This ensures that the substrate placement position is not deviated and also reduces the number of structural components used, which is beneficial for simplifying the structure and reducing costs.

[0079] Continue to combine Figures 1 to 3As shown in some exemplary embodiments, in this embodiment, in order to facilitate the placement and removal of the substrate 1000, grooves 1013 are also provided on the substrate placement stage 101, which are arranged opposite to each other along their own length direction. Each groove 1013 extends along the width direction of the substrate placement stage 101, so that it is convenient for the operator to manually place and remove the substrate 1000.

[0080] Continue to combine Figure 1 , Figure 2 and Figure 4 As shown, in some exemplary embodiments, the flash chamber includes a flash upper chamber 2000 formed on the flash upper chamber 200. The top of the flash upper chamber 200 is provided with an extraction port 2011 communicating with the vacuum acquisition module 400. The flash upper chamber 200 is provided with the aforementioned flow guide shroud 203 located within the flash upper chamber 2000. The flow guide shroud 203 is located below the extraction port 2011 and is used to guide the airflow flowing out of the flash chamber uniformly.

[0081] In addition, continue to combine Figure 1 , Figure 2 and Figure 6 As shown, in some exemplary embodiments, the cooling module 102 includes a semiconductor cooling module disposed at the bottom of the substrate placement stage 101, and a water cooling module disposed at the bottom of the semiconductor cooling module.

[0082] It can be understood that the cooling module 102 adopts a combination of semiconductor cooling module and water cooling module. It can make up for the shortcomings of water cooling, such as slow adjustment and lack of active cooling, by using the characteristics of fast response and high temperature control accuracy of semiconductor cooling. It can also solve the problems of heat accumulation and power limitation of semiconductor cooling by using the high power and high cooling stability of water cooling, which is conducive to improving temperature control accuracy and heat dissipation efficiency.

[0083] The cooling module 102 combines a semiconductor cooling module and a water cooling module, which can quickly reduce the temperature of the substrate 1000 to 10°C or even below 0°C, thus helping to improve the quality of perovskite thin film forming.

[0084] Furthermore, in some exemplary embodiments, the base 303 of this embodiment is provided with a clearance hole for avoiding the cooling module 102. The main advantage of this arrangement is that it can improve the overall vertical integration of the device, save space, and also achieve weight reduction, contributing to the overall lightweight design of the device. Moreover, the clearance hole also facilitates the arrangement and installation of the water inlet and outlet pipes of the water-cooling module.

[0085] In this embodiment, in some exemplary implementations, the cooling module 102 is attached to or placed on the bottom of the substrate placement stage 101, which can facilitate the reduction of heat transfer medium and achieve rapid and uniform cooling, thereby improving the perovskite thin film forming quality.

[0086] In some exemplary embodiments, the substrate 1000 is placed in close contact with the substrate placement stage 101, which makes the structure of the vacuum flash evaporation device of this embodiment more compact, significantly reducing the volume of the flash evaporation chamber and thus accelerating the vacuuming speed.

[0087] In this embodiment of the vacuum flash evaporation device, after the vacuum acquisition module 400 is started, the vacuum pump is first turned on, and the vacuum extraction valve and vacuum breaking valve are closed by default. Then, the semiconductor cooling module and the water cooling module are turned on together to achieve rapid cooling of the lower flash chamber 100. At this time, driven by the drive mechanism 300, the lower flash chamber 100 is moved horizontally away from the upper flash chamber 200 to the standby position. Then, the substrate 1000 can be manually placed and removed. After the substrate is placed, the lower flash chamber 100 is moved horizontally to below the upper flash chamber 200 by the drive mechanism 300, and then raised to close and seal with the upper flash chamber 200. Finally, the vacuum extraction valve is opened. Since the vacuum pump is turned on in advance and is in a high-speed state, the vacuum degree in the chamber can be pumped to less than 10 Pa within 30 seconds after the vacuum extraction valve is opened, thus achieving low-temperature flash evaporation.

[0088] It is worth noting that, regarding the vacuum flash evaporation device of this embodiment, based on the above exemplary embodiments, in specific implementation, as a preferred embodiment, it is still composed of... Figures 1 to 6 As shown, it may include, for example, a flash lower chamber 100 and a flash upper chamber 200 covered by the flash lower chamber 100.

[0089] The flash chamber is formed by the lower flash chamber 100 and the upper flash chamber 200; and the upper flash chamber 200 is provided with a vacuum acquisition module 400 that communicates with the flash chamber. The lower flash chamber 100 includes a substrate placement stage 101 and a cooling module 102 located at the bottom of the substrate placement stage 101.

[0090] It also includes a drive mechanism 300 that is connected to the substrate placement stage 101. The drive mechanism 300 is used to drive the substrate placement stage 101 to close the flash evaporation upper chamber 200 to form a sealed flash evaporation chamber or to move away from the flash evaporation upper chamber 200.

[0091] The drive mechanism 300 includes a first drive unit, a base 303 connected to the drive end of the first drive unit, and a second drive unit 304 disposed on the base 303. The substrate placement stage 101 is connected to the drive end of the second drive unit 304. The first drive unit is used to drive the base 303 to move closer to or further away from the flash evaporation upper chamber 200 in the horizontal direction, and the second drive unit 304 is used to drive the substrate placement stage 101 to rise and fall in the vertical direction, so as to seal and connect or disconnect from the flash evaporation upper chamber 200.

[0092] The base 303 is provided with a guide sleeve 3031, and the substrate placement platform 101 is provided with a guide post 1011. The guide post 1011 is slidably disposed in the guide sleeve 3031 in the vertical direction.

[0093] The substrate placement stage 101 is provided with a substrate placement position and a limiting component located around the substrate placement position. The limiting component is used to limit the circumferential degree of freedom of the substrate 1000.

[0094] The substrate placement position has a rectangular projection outline along the vertical direction, and the limiting component includes limiting blocks 1012 located at two corners of any opposite corner of the substrate placement position.

[0095] The flash chamber includes a flash upper chamber 2000 formed on the flash upper chamber 200; and the top of the flash upper chamber 200 is provided with an exhaust port 2011 that communicates with the vacuum acquisition module 400. The flash upper chamber 200 is provided with a flow guide hood 203 located inside the flash upper chamber 200. The flow guide hood 203 is located below the exhaust port 2011 and is used to guide the airflow flowing out of the flash chamber to be uniform.

[0096] The cooling module 102 includes a semiconductor cooling module disposed at the bottom of the substrate placement stage 101, and a water cooling module disposed at the bottom of the semiconductor cooling module.

[0097] The vacuum acquisition module 400 includes a vacuum pump, a vacuum pipeline connecting the vacuum pump and the flash chamber, and a vacuum extraction valve and a vacuum breaking valve located on the vacuum pipeline.

[0098] In the preferred embodiment of the above-described vacuum flash evaporation device, the specific configuration and arrangement of the lower flash chamber 100, upper flash chamber 200, drive mechanism 300, vacuum acquisition module 400, etc., can still be referred to the descriptions in the above-described exemplary embodiments. Furthermore, in this preferred embodiment, the beneficial effects brought about by the design of the lower flash chamber 100, upper flash chamber 200, drive mechanism 300, and vacuum acquisition module 400 can also be referred to the descriptions in the above-described exemplary embodiments.

[0099] The vacuum flash evaporation apparatus of this embodiment adopts the above design. By setting a cooling module 102 at the bottom of the substrate placement stage 101, it can provide the temperature conditions for low-temperature flash evaporation on the basis of the vacuum conditions provided by the vacuum acquisition module 400. Furthermore, since the nucleation site density increases significantly during low-temperature crystallization and the grains are smaller, grain boundary defects can be reduced, which can help improve the compactness, uniformity and stability of the perovskite film, thereby improving the crystallization quality of the perovskite film.

[0100] The above descriptions are merely some embodiments of this application and are not intended to limit this application. The technical features or structures in the foregoing different embodiments can be arbitrarily combined to form other specific technical solutions as needed. For those skilled in the art, this application can have various modifications and variations. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of the claims of this application.

Claims

1. A flash evaporation upper chamber (200) for use in conjunction with a flash evaporation lower chamber (100) in a vacuum flash evaporation apparatus, characterized in that: It includes a chamber body having an exhaust port (2011) and a flash evaporation upper chamber (2000), and a flow guide shroud (203) disposed on the chamber body and located in the flash evaporation upper chamber (2000). The exhaust port (2011) is located at the top of the main body of the chamber and connects the upper flash chamber (2000) and the external vacuum acquisition module (400). The inner wall of the upper flash chamber (200) gradually expands outward from the exhaust port (2011) from top to bottom. The flow guide hood (203) is located below the air extraction port (2011) and has a flow guide port (2031) corresponding to the air extraction port (2011), and the flow guide hood (203) is spaced apart from the inner wall of the flash evaporation upper chamber (200).

2. The flash evaporation upper chamber (200) according to claim 1, characterized in that: The bottom end of the flow guide shroud (203) is positioned at the bottom end of the flash evaporation upper chamber (2000); An escape zone is formed between the flow guide hood (203), the inner wall of the flash evaporation upper chamber (200), and the film surface of the perovskite film to be flashed. An annular first air passage (205) is formed between the flow guide hood (203) and the inner wall of the flash evaporation upper chamber (200). A second air passage (206) is formed inside the flow guide hood (203). The second air passage (206) can accelerate the airflow in the central region of the escape zone.

3. The flash evaporation upper chamber (200) according to claim 2, characterized in that: The airflow velocity at the outlet of the second airway (206) is greater than the airflow velocity at the outlet of the first airway (205).

4. The flash evaporation upper chamber (200) according to claim 2, characterized in that: The width of the first air passage (205) is the same at all points in the longitudinal section. The second air passage (206) is gradually expanded outward from the guide port (2031) from top to bottom. The diameter area of ​​the outlet end of the second air passage (206) is smaller than the diameter area of ​​the outlet end of the first air passage (205).

5. The flash evaporation upper chamber (200) according to any one of claims 1 to 4, characterized in that: The flow guide (203) is spaced apart and conforms to the inner wall of the flash evaporation upper chamber (200). The longitudinal cross-sectional profile of the inner wall of the flash evaporation upper chamber (200) is streamlined from the air extraction port (2011) to the bottom.

6. A vacuum flash evaporation apparatus, characterized in that: It includes a flash lower chamber (100) and a flash upper chamber (200) as described in any one of claims 1 to 5, which is covered by the flash lower chamber (100).

7. The vacuum flash evaporation apparatus according to claim 6, characterized in that: The flash evaporation lower chamber (100) includes a substrate placement stage (101); It also includes a drive mechanism (300) that is drivenly connected to the substrate placement stage (101), the drive mechanism (300) being used to drive the substrate placement stage (101) closer to or further away from the flash evaporation upper chamber (200).

8. The vacuum flash evaporation apparatus according to claim 7, characterized in that: The driving mechanism (300) includes a first driving unit, a base (303) connected to the driving end of the first driving unit, and a second driving unit (304) disposed on the base (303). The substrate placement stage (101) is connected to the driving end of the second driving unit (304). The first driving unit is used to drive the base (303) to move closer to or further away from the flash evaporation upper chamber (200) in the horizontal direction, and the second driving unit (304) is used to drive the substrate placement stage (101) to move up and down in the vertical direction to dock with or detach from the flash evaporation upper chamber (200).

9. The vacuum flash evaporation apparatus according to claim 8, characterized in that: The base (303) is provided with a guide sleeve (3031), and the substrate placement platform (101) is provided with a guide post (1011). The guide post (1011) is slidably disposed in the guide sleeve (3031) in the vertical direction.

10. The vacuum flash evaporation apparatus according to any one of claims 7 to 9, characterized in that: The substrate placement stage (101) is provided with a substrate (1000) placement position and a limiting component located around the substrate (1000) placement position. The limiting component is used to limit the substrate (1000).

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