Micro-motor-driven distributed turbulent flow pump-free liquid cooling device for space thermal control

Abstract

The invention discloses a micromotor-driven distributed turbulent flow pumpless liquid cooling device for space thermal control. The micromotor-driven distributed turbulent flow pumpless liquid cooling device comprises a pipeline body and an impeller pump, the impeller pump comprises an impeller with the outer diameter being D and capable of actively rotating. When the impeller pump is used for overall heat dissipation of a single small-size electronic element, one impeller pump is arranged in the cooling flow channel at the position 0.5 D-1. 5D away from the upstream of the small-size electronic element; when the impeller pump is used for eliminating the hot spots of the large-size electronic element, one impeller pump is arranged in the cooling flow channel at the position 0.5 D-1. 5D away from the upstream of each hot spot to be eliminated. An external pump is removed, and the impeller pump is arranged in the cooling flow channel, so that on one hand, a cooling working medium is pumped, on the other hand, a turbulent flow effect is achieved on the cooling working medium, a boundary layer is broken, and the heat dissipation effect is improved. In addition, for a large-scale heat dissipation scene, a plurality of impeller pumps can be arranged in the cooling flow channel in an array mode, the impeller pumps can be placed at local hot spots in a targeted mode, targeted heat dissipation is achieved, and the heat dissipation efficiency and uniformity are further improved.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology for electronic devices, especially aerospace electronic devices, and in particular to a micro-motor driven distributed turbulence pumpless liquid cooling device. Background Technology

[0002] Currently, AI technology is considered the core driving force leading the next stage of industrial revolution and a commanding height in the competition among major economies. Against the backdrop of explosive growth in demand for AI chips, high-performance computing equipment and data processing systems in the aerospace field are also constantly being upgraded. The performance of high-power devices such as GPU chips has improved significantly, but power consumption has also increased accordingly. Statistics show that approximately 45% of the energy consumed during chip operation is lost as heat, making high-power projects highly dependent on advanced packaging technologies and heat dissipation solutions. In the aerospace field, the application scenarios for high-power chips (such as GPUs and AI accelerators) are complex and demanding. Chip sizes are typically between 50mm×50mm and 100mm×100mm, with power reaching 100W to over 1kW, and heat flux densities typically around 50W / cm². 2 Up to 200W / cm 2 Even higher. These chips operate under high loads for extended periods, generating significant and unevenly distributed heat, with localized hotspots being particularly prominent. For example, an aerospace GPU chip measures approximately 50mm x 50mm, with a single chip powering 200W to 500W, resulting in a power density of approximately 80W / cm². 2 Up to 120W / cm 2 The heat from these types of chips is mainly concentrated in the core area, easily forming localized hotspots, which places extremely high demands on the heat dissipation system. In aerospace environments, the heat dissipation requirements for high-power chips are particularly stringent: the temperature of localized hotspots must be below 100°C to avoid thermal stress causing chip damage; the overall chip temperature must be maintained below 85°C to prevent performance degradation or damage. Furthermore, the unique characteristics of the aerospace environment (such as extreme temperatures, vacuum, and radiation) place even higher demands on the reliability and stability of the heat dissipation system.

[0003] Currently, GPU chip cooling technologies mainly include air cooling, liquid cooling, heat pipe cooling, phase change material cooling, and microchannel cooling. Among these, liquid cooling is a relatively efficient cooling technology that removes heat through liquid circulation. Liquid cooling systems outperform air cooling in overall heat dissipation, effectively reducing the overall temperature of the GPU chip. Liquid cooling systems typically have a cooling capacity between 200W and 500W, which is sufficient to meet the cooling requirements of most high-performance GPUs.

[0004] Single-phase liquid cooling is a traditional liquid cooling method that uses an external pump to drive coolant to circulate in pipes, absorbing heat from the GPU chip and then cooling it through a heatsink. However, while single-phase liquid cooling can provide high heat dissipation capacity (typically between 200W and 500W), it has the following shortcomings in practical applications and needs to be improved.

[0005] (1) Boundary layer thickening leads to low heat transfer efficiency: In traditional single-phase liquid cooling technology, the coolant flow mainly relies on an external pump, and there is a lack of effective flow turbulence mechanisms inside the pipe, making it impossible to effectively break the boundary layer. The flow state of the cooling medium in the pipe is a single laminar flow state. In the laminar flow state, according to the Couette flow law, the flow velocity of the cooling medium is lower near the wall and higher away from the wall. As the flow distance increases, the thickness of the boundary layer gradually increases, resulting in a decrease in the temperature gradient between the cooling medium and the pipe wall, thereby reducing the heat transfer efficiency.

[0006] (2) Boundary layer thickening leads to uneven temperature distribution: Boundary layer thickening can cause uneven flow distribution of the cooling medium within the pipe, especially in long-distance or complex pipe layouts, further exacerbating local hotspot problems, resulting in increased local temperature peaks and uneven temperature distribution, affecting chip stability and lifespan. For example, when using traditional single-phase liquid cooling technology to dissipate heat from a GPU chip, the average temperature of the GPU chip is 166.42℃, and the peak temperature is 173.94℃, far exceeding 100℃.

[0007] (3) Increased Boundary Layer Thickness Leads to Increased Pump Work: According to the Darcy-Weisbach equation, flow resistance is closely related to the thickness of the boundary layer and the flow state; increased boundary layer thickness leads to increased flow resistance. In laminar flow, flow resistance mainly originates from viscous shear force. As the boundary layer thickness increases, the viscous shear force increases, resulting in a significant increase in flow resistance. To maintain the flow rate of the cooling medium, greater pump work is required to overcome the resistance, which not only increases the system's energy consumption but may also lead to a further reduction in pumping efficiency.

[0008] (4) Increased pump power leads to complex heat dissipation device structure: Traditional devices typically use a single external pump to drive the circulation of the cooling medium. Since the external pump needs to meet the pumping requirements of the entire system, its power requirement is high, resulting in a larger pump size. Furthermore, the complex structure and large size of the external pump increase the overall size of the heat dissipation system, limiting its compactness and installation flexibility. This size issue is particularly pronounced in high power density heat dissipation scenarios, making it difficult to meet the requirements of miniaturization and high integration.

[0009] (5) In large-scale heat dissipation scenarios, the problems of insufficient heat dissipation uniformity and high pump power consumption are more pronounced. Large-scale heat dissipation scenarios refer to environments or systems that require handling large amounts of heat, where efficient heat dissipation technology is used to maintain the normal operation and performance of equipment. These scenarios typically involve high-density equipment, high-power equipment, or extreme environmental conditions, making heat dissipation a key factor in ensuring system stability and efficiency. In traditional single-phase liquid cooling systems, the external pump is the core power source for the cooling medium circulation. The external pump needs to overcome pipe resistance, radiator resistance, and the inertia of the cooling medium itself, resulting in a large amount of energy being lost as heat. Pump efficiency is typically below 70%. Especially in large-scale heat dissipation scenarios such as aerospace servers, the liquid cooling pipe length is longer, and the flow resistance increases further with the flow distance, leading to even greater pump power consumption. In large-scale heat dissipation scenarios, more local hot spots are generated, which traditional liquid cooling technology cannot effectively dissipate, and the thickening of the boundary layer exacerbates this problem. These are key factors in ensuring system stability and efficiency. Summary of the Invention

[0010] The technical problem this invention aims to solve is to address the shortcomings of the prior art by providing a micro-motor driven distributed turbulence pumpless liquid cooling device. This device removes the external pump and installs impeller pumps within the cooling channel. These impeller pumps deliver the cooling medium while simultaneously turbulently flowing through it, breaking down the boundary layer and improving heat dissipation. For large-scale heat dissipation scenarios, multiple impeller pumps can be arrayed within the cooling channel, and their positions can be strategically placed at localized hotspots for targeted heat dissipation, further enhancing heat dissipation efficiency and uniformity.

[0011] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows:

[0012] A micro-motor driven distributed turbulence pumpless liquid cooling device includes a pipe body and an impeller pump.

[0013] The pipe body has cooling channels and heat dissipation surfaces.

[0014] The heat dissipation surface is used to mount electronic components that need to be cooled; the electronic components include small-sized electronic components and large-sized electronic components; among them, the side length of the large-sized electronic components is longer than that of the small-sized electronic components, and they have multiple hot spots.

[0015] The cooling channels are filled with a flowing cooling medium.

[0016] Impeller pumps can be used for overall heat dissipation of small individual electronic components and hot spot elimination of large electronic components.

[0017] An impeller pump consists of an impeller with an outer diameter of D that can rotate actively.

[0018] When an impeller pump is used for overall heat dissipation of a single small electronic component, an impeller pump is built into the cooling channel at a distance of 0.5D to 1.5D upstream of the small electronic component.

[0019] When impeller pumps are used to eliminate hot spots in large electronic components, one impeller pump is installed in each cooling channel at a distance of 0.5D to 1.5D upstream of each hot spot to be eliminated.

[0020] If the longitudinal section of the cooling channel is square or near-square with a side length of w, then D = 0.6~0.8w, and the impeller inner diameter d = 0.2~0.3w.

[0021] The axial length of the impeller is l = 0.3 to 0.4D.

[0022] The cooling channel has a cooling medium inlet and a cooling medium outlet. When the impeller pump is used for the overall heat dissipation of a single small electronic component and the cooling channel is not less than 10D, the small electronic component is embedded on the top surface of the heat dissipation surface adjacent to the cooling medium outlet. Several impeller pumps are arranged in an array along the axis in the cooling channel upstream of the small electronic component. The impeller pump adjacent to the small electronic component is referred to as heat dissipation pump one. The distance between the downstream end face of the impeller of heat dissipation pump one and the downstream end face of the small electronic component is in the range of 0.5D to 1.5D. The interval between two adjacent impeller pumps is 3D to 4D.

[0023] When impeller pumps are used to eliminate hot spots in large electronic components, the first hot spot along the flow direction of the cooling medium is designated as Hot Spot 1. The cooling channel upstream of Hot Spot 1 and the cooling channel between two adjacent hot spots are both designated as single hot spot cooling channels. When the length of any single hot spot cooling channel A is not less than 10D, several impeller pumps are arranged in an array along the axis in the single hot spot cooling channel A. Let the hot spot at the end of the single hot spot cooling channel A be Hot Spot A. Let the impeller pump adjacent to Hot Spot A and located in the single hot spot cooling channel A be designated as Cooling Pump 2. Then the distance between the downstream end face of the impeller of Cooling Pump 2 and Hot Spot A is in the range of 0.5D to 1.5D. The interval between two adjacent impeller pumps in the single hot spot cooling channel A is 3D to 4D.

[0024] When impeller pumps are used to eliminate hot spots in large electronic components, the cooling flow channel is an S-shaped flow channel.

[0025] Let the wall thickness of the pipe body be a, and the thickness of the electronic component be b, then a / b = 2 to 2.5.

[0026] The impeller pump includes a motor that drives the impeller to rotate actively, and the motor is located upstream of the impeller; the motor speed is 2000rpm~9000rpm.

[0027] The motor is coaxially built into the motor bracket, and the bottom of the motor bracket is installed on the bottom surface of the cooling channel; the motor bracket is a cylindrical shape arranged along the axial direction, and the outer diameter ranges from 0.67w to 0.72w; where w is the side length of the longitudinal section of the cooling channel.

[0028] Small-sized electronic components are GPU chips with length dimensions between 50mm×50mm and 100mm×100mm; large-sized electronic components are servers containing multiple GPU chips, with each GPU chip forming a hotspot.

[0029] The present invention has the following beneficial effects:

[0030] 1. Formation of a strong turbulent region and disruption of the boundary layer: The rotation of the impeller introduces strong vortices and mixing into the cooling medium 0.5D to 1.5D downstream of the impeller, thus transforming the laminar flow state into a turbulent state. In the turbulent state, the flow characteristics of the cooling medium change significantly: the strong disturbance of turbulence breaks the original laminar boundary layer, reduces the thickness of the boundary layer, and thus improves the heat transfer efficiency between the cooling medium and the pipe wall.

[0031] 2. Reduced flow resistance and pump power consumption: The rotation of the impeller pump generates turbulence, which breaks down the boundary layer, reduces flow resistance, and decreases pump power consumption. Compared with traditional single-phase flow systems, this invention uses pump power simultaneously for pumping the cooling working fluid and turbulence, significantly improving pump efficiency. Furthermore, this arrangement is expected to disrupt the flow boundary layer within the pipe, reduce flow resistance, thereby lowering the inlet and outlet pressure difference and saving pump power consumption.

[0032] 3. Improved heat dissipation uniformity: In traditional single-phase flow systems, as the working fluid travels a greater distance, the boundary layer thickness increases, making it difficult to achieve uniform flow velocity and pressure distribution. This invention, through the turbulence effect of the impeller pump, can improve the flow distribution of the cooling working fluid and enhance heat dissipation uniformity.

[0033] 4. Improved System Compactness and Deployment Flexibility: By removing the external pump (i.e., pump-free design) and integrating multiple small impeller pumps (also known as mini-pumps) into the piping, the overall system's space requirements are reduced. Optimizing the layout and design of the built-in mini-pumps makes the cooling system more compact, facilitating integration into high-density equipment. Through modular design, the built-in mini-pumps can be flexibly arranged to adapt to the needs of different cooling scenarios.

[0034] 5. Hotspot and power consumption issues in large-scale heat dissipation scenarios: Addressing the issue of high power consumption from external pumps in traditional liquid cooling technologies, multiple built-in impeller pumps can be used to continuously break down the boundary layer, reducing overall flow resistance. Although the number of impeller pumps increases, the average power consumption per impeller pump decreases, resulting in a reduction in overall pump power. For localized hotspots in large-scale heat dissipation problems, the built-in impeller pumps can be flexibly positioned to target specific hotspots, improving the uniformity of overall heat dissipation. This invention is particularly suitable for aerospace, high-performance computing equipment, and other scenarios, meeting the stringent requirements of high-power chips for heat dissipation efficiency and temperature distribution uniformity. Attached Figure Description

[0035] Figure 1 The diagram shows the internal structure of a micro-motor driven distributed turbulence pumpless liquid cooling device according to Embodiment 1 of the present invention.

[0036] Figure 2 A schematic diagram of the overall structure of the pipe body in Embodiment 1 of the present invention is shown.

[0037] Figure 3 This diagram shows the overall structure of the pipe body after small-sized electronic components are embedded in it, according to Embodiment 1 of the present invention.

[0038] Figure 4 A schematic diagram of the overall structure of the impeller pump in this invention is shown.

[0039] Figure 5 An exploded view of the impeller pump of this invention is shown.

[0040] Figure 6 This diagram illustrates the flow state of the cooling medium within the cooling channel in Embodiment 1 of the present invention.

[0041] Figure 7 The diagram shows the location of the pump and the flow of the cooling medium in the pipes of a conventional liquid cooling device; Figure (a) shows the location of the external pump in the conventional liquid cooling device, and Figure (b) shows the flow state of the cooling medium inside the pipes of the conventional liquid cooling device.

[0042] Figure 8 The diagram shows the location of the pump and the flow of the cooling medium in the pipeline according to an embodiment of the present invention; wherein, Figure (a) shows the location of the built-in impeller pump in Embodiment 1 of the present invention, and Figure (b) shows the flow state of the cooling medium in the cooling channel in Embodiment 1 of the present invention.

[0043] Figure 9 This paper shows a three-dimensional simulation structure of a micro-motor driven distributed turbulence pumpless liquid cooling device according to Embodiment 2 of the present invention. Figure 1 .

[0044] Figure 10 This paper shows a three-dimensional simulation structure of a micro-motor driven distributed turbulence pumpless liquid cooling device according to Embodiment 2 of the present invention. Figure 2 .

[0045] Figure 11 The diagram shows the layout of the hotspot and impeller pump in Embodiment 2 of the present invention.

[0046] Figure 12 This diagram shows the locations of X=0 and Z=0 in Embodiment 1 of the present invention.

[0047] Figure 13 The figures show a comparison of the cooling effects of Embodiment 1 of the present invention and conventional single-phase flow liquid cooling; wherein, (a) is a turbulent temperature distribution diagram of the impeller pump of Embodiment 1 of the present invention; (b) is a non-turbulent temperature distribution diagram of conventional single-phase flow liquid cooling; and (c) is a comparison curve of the temperature distribution of Embodiment 1 of the present invention and conventional single-phase flow liquid cooling at Z=0.

[0048] Among them are:

[0049] 100. Pipe body;

[0050] 110. Cooling flow channel; 111. Cooling medium inlet; 112. Cooling medium outlet;

[0051] 120. Heat dissipation surface; 121. Embedded slot;

[0052] 200. Impeller pump;

[0053] 210. Impeller;

[0054] 220. Electric motor; 221. Electric motor shaft;

[0055] 230. Motor housing; 231. Housing mounting plate; 232. Cable outlet hole;

[0056] 310. Small-sized electronic components;

[0057] 320. Large-size electronic components; 321. Hotspots. Detailed Implementation

[0058] The present invention will now be described in further detail with reference to the accompanying drawings and specific preferred embodiments.

[0059] In the description of this invention, it should be understood that the terms "left side," "right side," "upper part," "lower part," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. "First," "second," etc., do not indicate the importance of the components, and therefore should not be construed as a limitation of this invention. The specific dimensions used in this embodiment are only for illustrating the technical solution and do not limit the scope of protection of this invention.

[0060] A micro-motor-driven distributed turbulence pumpless liquid cooling device is used for uniform liquid cooling of electronic components. The electronic components include, for example... Figure 1 and Figure 3 The small electronic component 310 shown and such Figure 7 and Figure 8 The large-size electronic component 320 shown; wherein the side length of the large-size electronic component is greater than the side length of the small-size electronic component, and has the following characteristics: Figure 9 The multiple hotspots shown are 321.

[0061] In this invention, small-sized electronic components preferably refer to GPU chips with a length dimension between 50mm×50mm and 100mm×100mm. Furthermore, the thickness of small-sized electronic components is typically between 1-2mm.

[0062] Servers containing large electronic components and multiple GPU chips each become a hotspot. Servers, with their multiple GPUs, high-performance computing nodes, interface devices, power supplies, etc., are larger and generate more heat. Furthermore, the heat distribution is uneven (more heat is generated near the GPUs and high-performance computing nodes). This invention, when cooling servers, requires the laying of pipes according to the actual conditions of the server, and the installation of impeller pumps at the hotspots for heat dissipation.

[0063] The following sections will introduce heat dissipation for small-sized and large-sized electronic components respectively.

[0064] Example 1: Heat dissipation of small-sized electronic components

[0065] like Figure 1 As shown, a micro-motor driven distributed turbulence pumpless liquid cooling device includes a pipe body 100 and an impeller pump 200.

[0066] like Figure 2 and Figure 3 As shown, the pipe body has a cooling channel 110 and a heat dissipation surface 120.

[0067] The cooling channel is filled with a flowable cooling medium. In this embodiment, the cooling channel is preferably a straight pipe, with the two ends of the straight pipe forming a cooling medium inlet 111 and a cooling medium outlet 112, respectively.

[0068] Furthermore, the longitudinal section of the cooling channel is square or near-square, with a side length of w and a length of L. When the longitudinal section of the cooling channel is near-square, a too small aspect ratio will weaken the pumping effect of the working fluid, while a too large aspect ratio will not only weaken the pumping effect of the working fluid but also reduce the heat dissipation effect. Therefore, the aspect ratio is in the range of 0.75 to 1.1, and should be as close to 1 as possible. In this case, the side length w of the longitudinal section of the cooling channel is the minimum value between the width and height of the near-square.

[0069] The aforementioned heat dissipation surface is located at the top of the cooling channel and between the cooling medium inlet and outlet. A non-through embedding groove 121 is provided on the heat dissipation surface adjacent to the cooling medium outlet for mounting small electronic components 310 to be cooled. In this embodiment, the small electronic components are completely embedded in the embedding groove, with their top surfaces flush with the heat dissipation surface.

[0070] Let the wall thickness of the pipe body be a, and the thickness of the electronic component be b. If the pipe body thickness a is too thick, the heat dissipation effect will be reduced, and if it is too thin, there is a risk of leakage of the cooling medium. Taking all factors into consideration, a / b = 2 to 2.5 is selected.

[0071] In this embodiment 1, the impeller pump is used for overall heat dissipation of a single small-sized electronic component.

[0072] like Figure 4 and Figure 5 As shown, the impeller pump includes an impeller 210, a motor 220, and a motor housing 230.

[0073] The bottom of the aforementioned motor bracket is preferably mounted on the bottom surface of the cooling channel via a housing mounting plate 231. Both the housing mounting plate and the bottom surface of the cooling channel are provided with cable outlet holes 232 for the motor wires to pass through.

[0074] The aforementioned motor bracket is preferably a cylindrical shape arranged along the axial direction, and the outer diameter ranges from 0.67w to 0.72w, which facilitates the passage of cooling medium from the top and sides of the motor bracket.

[0075] The aforementioned motor is a cylinder coaxially mounted in a motor bracket, and its diameter is preferably no more than 0.6W.

[0076] The aforementioned motor drives the impeller to rotate actively via a motor shaft, with a motor speed ranging from 2000 rpm to 9000 rpm. The motor power is selected based on the longitudinal cross-sectional side length w of the cooling channel. For example, if w = 10 mm, a motor power of 10W or less is sufficient to meet the requirements. However, if an external motor is used, not only will its size be larger, but its power will also reach over 50W.

[0077] The impeller is coaxially located not at the center of the pipe body, but downstream of the motor. The preferred impeller dimensions are: outer diameter D = 0.6~0.8w, inner diameter d = 0.2~0.3w, and axial length l = 0.3~0.4D.

[0078] When the pipe body is short, only one impeller pump needs to be built into the cooling channel at a distance of 0.5D to 1.5D upstream of the small electronic component. In this case, if... Figure 6 As shown, the strong turbulence region generated by the impeller rotation is located 0.5D to 1.5D downstream of the impeller. Small electronic components, such as GPU chips, should be placed in this strong turbulence region. Beyond a distance of 2D downstream of the impeller, the turbulence intensity begins to weaken, and the working fluid flow tends to return to laminar flow.

[0079] When the length of the pipe body is relatively long, such as not less than 10D, several impeller pumps are arranged in an array along the axis in the cooling channel upstream of the small electronic component. Among them, the impeller pump adjacent to the small electronic component is referred to as heat pump one. The distance between the downstream end face of the impeller of heat pump one and the downstream end face of the small electronic component is 0.5D to 1.5D; the interval between two adjacent impeller pumps is 3D to 4D.

[0080] The pumping distance of the impeller can reach 5D to 20D at different rotational speeds. However, beyond 2D downstream of the impeller, the turbulence intensity begins to weaken, and the flow resistance begins to increase again. Therefore, for long pipelines, impeller pumps need to be arranged in an array at intervals along the pipeline direction inside.

[0081] Figure 7 (a) shows the location of the pump in a conventional liquid cooling system. Figure 7 (b) shows that the flow state of the cooling medium inside the pipe of the conventional liquid cooling device is laminar flow, which satisfies the Coetzee flow law. The boundary layer thickness δ increases with the increase of the flow distance. τ is the shear stress between the two fluid layers. p1 and p2 are the upstream pressure and downstream pressure, respectively.

[0082] Figure 8 (a) shows the location of the pump in an embodiment of the present invention. Figure 8 (b) shows that the cooling medium inside the pipe in this embodiment of the invention is turbulent due to the disturbance of the pump, and the boundary layer is broken, with a significant reduction in thickness δ. P1′ and P2′ are the upstream and downstream pressures, respectively.

[0083] By comparison Figure 7 and Figure 8 The pump of the present invention is located inside and is smaller in size, while the pump of the conventional device is located outside and is larger in size; the pump power consumed by the present invention is used for both pumping and turbulence, while the pump power consumed by the conventional device can only be used for pumping; the thickness of the flow boundary layer inside the pipe of the present invention is significantly smaller than that of the conventional device.

[0084] To more intuitively demonstrate the beneficial effects of the device of this invention, the heat dissipation effect of the device was simulated and calculated based on the current requirements of GPU chips in the aerospace field, and compared with the heat dissipation effect of a traditional single-phase flow pipe liquid cooling device. The GPU chip size was set to 50mm × 50mm, and the heat flux density was 50W / cm³. 2 The cooling medium is deionized water at a temperature of 25℃. The impeller speed of the integrated pump-driven liquid cooling system is 6000 rpm. The traditional single-phase flow liquid cooling system has the same geometric dimensions as the integrated pump-driven liquid cooling system, except for the absence of a motor, motor support, and impeller. Its mass flow rate of the cooling medium is also the same. In the actual simulation calculation, a heat dissipation surface of 50 W / cm² was set. 2 The heat flux density can more intuitively compare the overall heat dissipation and local heat dissipation effects of the two heat dissipation devices.

[0085] To facilitate the demonstration of simulation effects, such as Figure 12 As shown, the length direction of the pipe body is denoted as the X direction, and the cross-section where the impeller center is located is denoted as X=0, with the direction towards the cooling medium outlet being the positive X direction; the width direction of the pipe body is denoted as the Z direction, and the vertical plane where the impeller central axis is located is denoted as Z=0.

[0086] Figure 13 The simulation results for this specific embodiment 1 are shown in Figure (a), which shows the temperature distribution on the heat dissipation surface of embodiment 1, with the dashed box area representing the temperature distribution of the GPU chip. Figure (b) shows the temperature distribution on the heat dissipation surface of a traditional single-phase flow pipe liquid cooling device, with the dashed box area representing the chip temperature distribution. A comparison of Figures (a) and (b) clearly shows that the overall heat dissipation effect of the device of the present invention is superior to that of the traditional device, both on the entire heat dissipation surface and at the GPU chip. Actual calculations show that the average temperature of the GPU chip in the traditional device is 166.42℃, and the peak temperature is 173.94℃; the average temperature of the GPU in embodiment 1 of the present invention is 78.19℃, and the peak temperature is 83.17℃, both meeting current requirements and representing a significant improvement over the traditional device. Figure (c) shows the temperature distribution on the heat dissipation surface of the two devices along the straight line Z=0, with the dashed line representing the traditional device and the solid line representing the device of embodiment 1 of the present invention. It can be intuitively seen that the traditional device forms a large temperature peak area in the embedded slot, while embodiment 1 of the present invention reduces the temperature in this area through impeller rotation and turbulence, resulting in a more even overall temperature distribution.

[0087] Example 2: Heat dissipation of large-size electronic components

[0088] In this embodiment, the large-size electronic component 320 is preferably an aerospace server. Standard rack servers typically have a width of 19 inches (approximately 48.26 cm) and a height measured in U units, where 1U = 1.75 inches (approximately 4.445 cm). Common configurations include 1U, 2U, and 4U. Aerospace servers are more compact than standard rack servers, with dimensions including 3U CompactPCI (100×160 mm), 6U CompactPCI (160×233 mm), and VPX standard (160×233 mm).

[0089] like Figures 9 to 11 As shown, the pipe body is serpentine or stacked S-shaped, the cooling channel is an S-shaped channel, and the top surface of the pipe body is formed as a heat dissipation surface for placing large electronic components 320.

[0090] This invention can solve scenarios where hot-button issues are prominent, such as... Figure 11 The diagram shows an array of impeller pumps arranged within a pipeline under large-scale heat dissipation conditions. The black squares represent localized hot spots, and the black rectangles represent the impeller pumps. For long pipelines, to ensure pumping efficiency, multiple impeller pumps need to be configured based on the side length w of the cooling channel cross-section and the outer diameter D of the impeller pump. For localized hot spot issues, impeller pumps are configured according to D for targeted heat dissipation.

[0091] The first hot spot along the direction of the cooling medium flow is designated as hot spot one. The cooling channel upstream of hot spot one and the cooling channel between two adjacent hot spots are both designated as single hot spot cooling channels.

[0092] At least one impeller pump is built into the single-hot-point cooling channel. The structure of the impeller pump is the same as in Embodiment 1, and will not be described again here. The number of impeller pumps is determined according to the length of the single-hot-point cooling channel.

[0093] When the length of the single hot spot cooling channel is short, such as not exceeding 10D, only one impeller pump needs to be installed at a distance of 0.5D to 1.5D upstream of the corresponding hot spot in the single hot spot cooling channel.

[0094] When the length of any single hot spot cooling channel A is not less than 10D, several impeller pumps are arranged in an array along the axis in the single hot spot cooling channel A; let the hot spot at the end of the single hot spot cooling channel A be hot spot A, and let the impeller pump adjacent to hot spot A and located in the single hot spot cooling channel A be denoted as heat pump two. Then the distance between the downstream end face of the impeller of heat pump two and hot spot A is 0.5D to 1.5D; the interval between two adjacent impeller pumps in the single hot spot cooling channel A is 3D to 4D.

[0095] The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the specific details in the above embodiments. Within the scope of the technical concept of the present invention, various equivalent transformations can be made to the technical solutions of the present invention, and these equivalent transformations all fall within the protection scope of the present invention.

Claims

1. A micro-motor driven distributed turbulence pumpless liquid cooling device, characterized in that: Includes the pipeline body and the impeller pump; The pipe body has cooling channels and heat dissipation surfaces; The heat dissipation surface is used to mount electronic components that need to be cooled; the electronic components include small-sized electronic components and large-sized electronic components; among them, the side length of the large-sized electronic components is longer than that of the small-sized electronic components, and they have multiple hot spots; The cooling channels are filled with a flowable cooling medium; Impeller pumps can be used for overall heat dissipation of small individual electronic components and hot spot elimination of large electronic components; An impeller pump includes an impeller with an outer diameter of D that can rotate actively; When an impeller pump is used for overall heat dissipation of a single small electronic component, an impeller pump is built into the cooling channel at a distance of 0.5D to 1.5D upstream of the small electronic component; When impeller pumps are used to eliminate hot spots in large electronic components, one impeller pump is installed in each cooling channel at a distance of 0.5D to 1.5D upstream of each hot spot to be eliminated.

2. The micro-motor driven distributed turbulence pumpless liquid cooling device according to claim 1, characterized in that: If the longitudinal section of the cooling channel is square or near-square and the side length is w, then D = 0.6~0.8w, and the impeller inner diameter d = 0.2~0.3w.

3. The micro-motor driven distributed turbulence pumpless liquid cooling device according to claim 1 or 2, characterized in that: The axial length of the impeller is l = 0.3 to 0.4D.

4. The micro-motor driven distributed turbulence pumpless liquid cooling device according to claim 1, characterized in that: The cooling channel has a cooling medium inlet and a cooling medium outlet. When the impeller pump is used for the overall heat dissipation of a single small electronic component and the cooling channel is not less than 10D, the small electronic component is embedded on the top surface of the heat dissipation surface adjacent to the cooling medium outlet. Several impeller pumps are arranged in an array along the axis in the cooling channel upstream of the small electronic component. The impeller pump adjacent to the small electronic component is referred to as heat dissipation pump one. The distance between the downstream end face of the impeller of heat dissipation pump one and the downstream end face of the small electronic component is in the range of 0.5D to 1.5D. The interval between two adjacent impeller pumps is 3D to 4D.

5. The micro-motor driven distributed turbulence pumpless liquid cooling device according to claim 1, characterized in that: When impeller pumps are used to eliminate hot spots in large electronic components, the first hot spot along the flow direction of the cooling medium is designated as Hot Spot 1. The cooling channel upstream of Hot Spot 1 and the cooling channel between two adjacent hot spots are both designated as single hot spot cooling channels. When the length of any single hot spot cooling channel A is not less than 10D, several impeller pumps are arranged in an array along the axis in the single hot spot cooling channel A. Let the hot spot at the end of the single hot spot cooling channel A be Hot Spot A. Let the impeller pump adjacent to Hot Spot A and located in the single hot spot cooling channel A be designated as Cooling Pump 2. Then the distance between the downstream end face of the impeller of Cooling Pump 2 and Hot Spot A is in the range of 0.5D to 1.5D. The interval between two adjacent impeller pumps in the single hot spot cooling channel A is 3D to 4D.

6. The micro-motor driven distributed turbulence pumpless liquid cooling device according to claim 5, characterized in that: When impeller pumps are used to eliminate hot spots in large electronic components, the cooling flow channel is an S-shaped flow channel.

7. The micro-motor driven distributed turbulence pumpless liquid cooling device according to claim 1, characterized in that: Let the wall thickness of the pipe body be a, and the thickness of the electronic component be b, then a / b = 2 to 2.

5.

8. The micro-motor driven distributed turbulence pumpless liquid cooling device according to claim 1, characterized in that: The impeller pump includes a motor that drives the impeller to rotate actively, and the motor is located upstream of the impeller; the motor speed is 2000rpm~9000rpm.

9. The micro-motor driven distributed turbulence pumpless liquid cooling device according to claim 8, characterized in that: The motor is coaxially built into the motor bracket, and the bottom of the motor bracket is installed on the bottom surface of the cooling channel; the motor bracket is a cylindrical shape arranged along the axial direction, and the outer diameter ranges from 0.67w to 0.72w; where w is the side length of the longitudinal section of the cooling channel.

10. The micro-motor driven distributed turbulence pumpless liquid cooling device according to claim 1, characterized in that: Small-sized electronic components are GPU chips with length dimensions between 50mm×50mm and 100mm×100mm; large-sized electronic components are servers containing multiple GPU chips, with each GPU chip forming a hotspot.

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