Single crystal silicon wafer chamfering device

Abstract

This utility model relates to the field of semiconductor manufacturing equipment, and more particularly to a chamfering processing device for single-crystal silicon wafers. It includes a support base and a drive assembly. A grinding disc is mounted on the support base. The drive assembly is connected to a robotic arm. A stable base for fixing the single-crystal silicon wafer is connected to the top of the drive assembly. The drive assembly drives the stable base to rotate. A fixing frame is connected to the side of the drive assembly. A slider is slidably connected to the fixing frame. A mounting bracket is connected to the end of the slider near the stable base. A motor is mounted on the top of the mounting bracket. A brush is rotatably connected to the middle of the mounting bracket. The top of the brush is connected to the output shaft of the motor. An adjustment assembly for fixing the slider is provided on the fixing frame. Through the coordinated action of the brush and the top spray system, coolant directly washes the grinding area at the edge of the silicon wafer and penetrates into the bottom gap where the brush contacts the silicon wafer, achieving simultaneous removal of debris from both the top and bottom sides, thereby improving the edge processing accuracy.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment, and in particular to a chamfering device for single-crystal silicon wafers. Background Technology

[0002] Monocrystalline silicon wafers are a core material for photovoltaic power generation and the semiconductor industry, and their manufacturing process involves multiple precision machining steps. Since monocrystalline silicon wafers are typically cut from silicon ingots using diamond wire cutting, the edges of the wafers after cutting will have sharp corners and micro-cracks. These defects not only cause the wafers to fragment due to stress concentration during subsequent processing and use, but also significantly reduce their mechanical strength and photoelectric conversion efficiency. Therefore, chamfering the edges of silicon wafers is an indispensable and critical process in silicon wafer manufacturing, and its processing precision directly affects the yield of silicon wafers and the performance of end devices.

[0003] Existing single-crystal silicon wafer chamfering equipment mainly employs the mechanical friction processing principle. The equipment typically consists of one or more pairs of rotating grinding rollers, with diamond abrasive grains or hard abrasives such as silicon carbide embedded in their surfaces. During processing, the silicon wafer is fixed by vacuum adsorption or mechanical clamping. The grinding rollers adhere to the edge of the silicon wafer with a certain pressure and rotate at high speed, removing material through the friction between the abrasive grains and the wafer edge. To control the processing temperature and remove grinding debris, the equipment continuously sprays coolant into the processing area, using the water flow to carry away heat and wash away silicon powder particles generated during grinding.

[0004] However, while continuous water flow can effectively reduce the temperature in the grinding zone, its debris removal effect is limited by the matching of the coolant spray direction with the debris distribution location. Coolant is typically sprayed from the top or upper side of the grinding roller, resulting in the water flow primarily covering the space above the contact area between the roller and the silicon wafer. For silicon chips deposited at the bottom edge of the wafer or below the grinding roller during grinding, the top water flow, due to gravity, cannot generate an effective flushing force, causing debris to accumulate in the processing area. This phenomenon not only causes quality defects such as scratches on the wafer edge surface and uneven grinding, but also accelerates abrasive passivation due to debris embedding in the grinding roller surface, shortening equipment maintenance cycles. Utility Model Content

[0005] To overcome the drawback of debris residue, this invention provides a single-crystal silicon wafer chamfering processing device, which aims to solve the above-mentioned shortcomings.

[0006] A single-crystal silicon wafer chamfering processing device includes a support base and a drive assembly. A grinding disc is mounted on the support base. The drive assembly is connected to a robotic arm. A stabilizing base for fixing the single-crystal silicon wafer is connected to the top of the drive assembly. The drive assembly drives the stabilizing base to rotate. A fixing frame is connected to the side of the drive assembly. A slider is slidably connected to the fixing frame. A mounting bracket is connected to the end of the slider near the stabilizing base. A motor is mounted on the top of the mounting bracket. A brush is rotatably connected to the middle of the mounting bracket. The top of the brush is connected to the output shaft of the motor. An adjustment assembly for fixing the slider is provided on the fixing frame.

[0007] In a preferred embodiment of this utility model, the adjusting component includes a locking pin, the slider has a plurality of limiting holes, the locking pin passes through the fixing frame and is slidably connected to the slider, the locking pin is interference-fitted with the limiting holes, and a return spring is sleeved on the locking pin, one end of the return spring is connected to the locking pin and the other end is connected to the fixing frame.

[0008] In a preferred embodiment of this utility model, a guide block is provided at the end of the limiting hole facing the locking pin.

[0009] In a preferred embodiment of this utility model, a handle is connected to the side of the mounting bracket away from the stable base.

[0010] In a preferred embodiment of this utility model, baffles are connected to both the front and rear sides of the mounting bracket.

[0011] In a preferred embodiment of this utility model, a rubber ring is connected to the end of the locking pin.

[0012] Compared with the prior art, the present invention has the following advantages: 1. Through the coordinated action of the brush and the top spray system, the coolant directly washes the grinding area of ​​the silicon wafer edge and penetrates into the bottom gap where the brush contacts the silicon wafer, so as to remove debris from both the top and bottom sides at the same time, thereby improving the edge processing accuracy. At the same time, the micro-turbulence between the bristles continuously peels off the attached debris when the brush rotates, preventing debris from accumulating on the processing surface and achieving the goal of long-term cleanliness of the equipment.

[0013] 2. By adjusting the cooperation of the locking pin, guide block and reset spring in the assembly, when the slider slides on the fixed frame, the end of the locking pin is accurately inserted into the limiting hole along the inclined surface of the guide block, and the reset spring provides a stable rebound force to ensure positioning reliability. This adapts to the rapid adjustment needs of various common silicon wafer diameters, thereby improving equipment adaptability and operating efficiency. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0015] Figure 2 This is a schematic diagram of the installation structure of the slider and mounting bracket of this utility model.

[0016] Figure 3 This is a cross-sectional view of the mounting structure of the locking pin and the return spring of this utility model.

[0017] The labels in the attached diagram are as follows: 1. Support base, 2. Grinding disc, 3. Drive assembly, 4. Stabilizing base, 5. Fixing frame, 6. Slider, 7. Mounting bracket, 8. Motor, 9. Brush, 10. Limiting hole, 11. Locking pin, 12. Return spring, 13. Guide block, 14. Handle, 15. Baffle, 16. Rubber ring. Detailed Implementation

[0018] Although this invention may be described with respect to a particular application or industry, those skilled in the art will recognize its broader applicability. Those skilled in the art will understand that terms such as "above," "below," "upward," "downward," etc., are used to describe the drawings and not to indicate a limitation on the scope of the invention as defined by the appended claims. Any numerical designations such as "first" or "second" are merely illustrative and not intended to limit the scope of the invention in any way.

[0019] Example: A chamfering device for monocrystalline silicon wafers, such as Figures 1-3 As shown, the assembly includes a support base 1, a grinding disc 2, a drive assembly 3, a stabilizing base 4, a fixing frame 5, a slider 6, a mounting bracket 7, a motor 8, a brush 9, and an adjustment assembly. The support base 1 has a shock-absorbing rubber pad at its bottom to absorb grinding vibrations. The grinding disc 2 is mounted on the support base 1. The drive assembly 3 is connected to the robotic arm. The top of the drive assembly 3 is connected to the stabilizing base 4 for fixing the single-crystal silicon wafer. The stabilizing base 4 uses a vacuum adsorption structure with adsorption holes arranged in a ring array to accommodate silicon wafers of different thicknesses. The drive assembly 3 drives the stabilizing base 4 to rotate. A fixing frame 5 is connected to the side of the drive assembly 3. The frame 5 is slidably connected to the slider 6. The slider 6 has a built-in ball retainer to achieve gapless sliding. The end of the slider 6 near the stable base 4 is connected to the mounting frame 7. The top of the mounting frame 7 is equipped with a motor 8. The middle of the mounting frame 7 is rotatably connected to a brush 9. The brush 9 is made of nylon bristles with a high bristle density. The top of the brush 9 is connected to the output shaft of the motor 8. The mounting frame 7 adopts a C-shaped structure design with reinforcing ribs on the side plates. The top is reserved with mounting holes for the motor 8. The middle is equipped with a bearing chamber to support the rotation of the brush 9. The fixed frame 5 is equipped with an adjustment component for fixing the slider 6.

[0020] like Figure 3As shown, the adjustment assembly includes a locking pin 11 and a return spring 12. The slider 6 has several limiting holes 10. The locking pin 11 passes through the fixing frame 5 and is slidably connected to the slider 6. The end of the locking pin 11 is chamfered to facilitate insertion into the limiting hole 10. The surface is chrome-plated to improve wear resistance. The locking pin 11 is interference-fitted with the limiting hole 10. The locking pin 11 is fitted with the return spring 12. One end of the return spring 12 is connected to the locking pin 11, and the other end is connected to the fixing frame 5.

[0021] like Figure 3 As shown, it also includes a guide block 13. The guide block 13 is provided at one end of the limiting hole 10 facing the locking pin 11, and the guide block 13 is provided with a 30° inclined surface.

[0022] like Figure 2 As shown, it also includes a handle 14. The mounting bracket 7 is connected to the side away from the stable base 4 with the handle 14. The surface of the handle 14 is provided with anti-slip texture.

[0023] like Figure 1 As shown, it also includes baffles 15. The mounting bracket 7 is connected to baffles 15 on both the front and rear sides. The baffles 15 are made of transparent PC board.

[0024] like Figure 3 As shown, it also includes a rubber ring 16, and the end of the locking pin 11 is connected to the rubber ring 16, which is made of silicone rubber.

[0025] The operator places the monocrystalline silicon wafer in the vacuum adsorption area of ​​the stable base 4 and starts the fixing program through the control panel. To adapt to the wafer size, the operator holds the rubber ring 16 with one hand and pulls it outward. The elastic deformation of the rubber ring 16 causes the locking pin 11 to disengage from the limiting hole 10 of the slider 6. At this time, the return spring 12 is stretched and stored. The operator holds the handle 14 on the side of the mounting bracket 7 with the other hand and pushes the slider 6 horizontally along the guide rail at the top of the fixing bracket 5. The slider 6 and the fixing bracket 5 slide smoothly through the cooperation of the concave and convex tracks. When the edge of the brush 9 approaches the edge of the silicon wafer, the rubber ring 16 is slowly released. The elastic force of the return spring 12 drives the locking pin 11 to rebound. The end of the locking pin 11 is accurately inserted into the corresponding limiting hole 10 under the guidance of the inclined surface of the guide block 13, forming a stable positioning effect through interference fit. After the position is locked, the robotic arm moving drive assembly 3 moves towards the support base 1, so that the grinding disc 2 makes slight contact with the edge of the silicon wafer. After the equipment is started, the support base 1 drives the grinding disc 2 to rotate at high speed, and the drive component 3 synchronously drives the stable base 4 to rotate at low speed. The motor 8 drives the brush 9 to rotate in the opposite direction at a specific speed, and the nylon bristles of the brush 9 form bidirectional friction with the edge of the silicon wafer. The top spray system sprays coolant synchronously, and the water flow is dispersed into multiple fine streams along the bristles of the brush 9. Part of the water directly washes the grinding area on the top edge of the silicon wafer, while the other part penetrates into the bottom gap where the brush 9 contacts the silicon wafer, carrying away the silicon chips generated during grinding from the processing surface. When the coolant flows through the brush 9, the liquid flow between the bristles forms micro-turbulence, further stripping away the chips attached to the surface of the bristles and preventing chip accumulation from affecting the processing accuracy.

[0026] After the chamfering and grinding are completed, the power to the support base 1 and motor 8 is turned off, and the robotic arm lifts the drive assembly 3 to detach the grinding disc 2 from the silicon wafer. At this time, the baffle 15 naturally droops as the brush 9 stops rotating, forming a semi-enclosed structure to prevent residual droplets from splashing. The operator releases the vacuum adsorption of the stabilizing base 4, vertically removes the silicon wafer, and the water flow in the processing area carries debris along the inclined surface of the support base 1 into the waste liquid collection tank, completing a single processing cycle.

[0027] The above embodiments are provided for those skilled in the art to implement or use the present invention. Those skilled in the art can make various modifications or changes to the above embodiments without departing from the inventive concept of the present invention. Therefore, the protection scope of the present invention is not limited to the above embodiments, but should be the maximum scope that conforms to the innovative features mentioned in the claims.

Claims

1. A chamfering processing device for single-crystal silicon wafers, characterized in that, The device includes a support base (1) and a drive assembly (3). A grinding disc (2) is mounted on the support base (1). The drive assembly (3) is connected to a robotic arm. A stable base (4) for fixing a single crystal silicon wafer is connected to the top of the drive assembly (3). The drive assembly (3) drives the stable base (4) to rotate. A fixing frame (5) is connected to the side of the drive assembly (3). A slider (6) is slidably connected to the fixing frame (5). A mounting frame (7) is connected to one end of the slider (6) near the stable base (4). A motor (8) is mounted on the top of the mounting frame (7). A brush (9) is rotatably connected to the middle of the mounting frame (7). The top of the brush (9) is connected to the output shaft of the motor (8). An adjustment assembly for fixing the slider (6) is provided on the fixing frame (5).

2. The single-crystal silicon wafer chamfering apparatus according to claim 1, characterized in that, The adjustment assembly includes a locking pin (11), the slider (6) has several limiting holes (10), the locking pin (11) passes through the fixing frame (5) and is slidably connected to the slider (6), the locking pin (11) is interference-fitted with the limiting holes (10), and a return spring (12) is sleeved on the locking pin (11). One end of the return spring (12) is connected to the locking pin (11), and the other end is connected to the fixing frame (5).

3. The single-crystal silicon wafer chamfering apparatus according to claim 2, characterized in that, A guide block (13) is provided at one end of the limiting hole (10) facing the locking pin (11).

4. The single-crystal silicon wafer chamfering apparatus according to claim 3, characterized in that, The mounting bracket (7) has a handle (14) attached to the side opposite to the stabilizing base (4).

5. The single-crystal silicon wafer chamfering apparatus according to claim 4, characterized in that, The mounting bracket (7) has baffles (15) connected to both the front and rear sides.

6. The single-crystal silicon wafer chamfering apparatus according to claim 5, characterized in that, The end of the locking pin (11) is connected to a rubber ring (16).

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