A polishing head and a polishing machine

Abstract

The utility model provides a kind of polishing head and polishing machine, the polishing head includes upper polishing head seat, lower polishing head seat, first recess and elastic sealing element are provided on upper polishing head seat, and elastic sealing element covers first recess and forms first pressurizing cavity;Lower polishing head seat is set on the lower surface of elastic sealing element, second pressurizing cavity and second air inlet that are connected are provided on lower polishing head seat, pressure regulating sliding member that can slide up and down is provided in second pressurizing cavity, and pressure regulating sliding member is located in the middle of lower polishing head seat.The polishing head of the utility model uses first pressurizing cavity and lower polishing head seat to pressurize the edge of wafer, and simultaneously uses second pressurizing cavity and pressure regulating sliding member to pressurize the middle of wafer.By this two-stage pressurizing mode, in combination with the synergistic effect of elastic sealing element, the pressure of polishing head on each position of wafer can be more uniform and close to consistent.This not only effectively improves the flatness of wafer, but also avoids the problem of over-polishing of wafer edge.

Description

Technical Field

[0001] This utility model relates to the field of polishing equipment technology, and in particular to a polishing head and a polishing machine. Background Technology

[0002] In recent years, China's semiconductor industry has flourished, and the research and development and manufacturing of equipment required for each stage of semiconductor processing have been continuously advancing. Among the many key processes, polishing is particularly crucial, as it grinds wafers to an extremely high surface finish and smoothness. During polishing, the wafer is typically held in place on the bottom surface of the polishing head, with the deposited layer side of the wafer in contact with the upper surface of the polishing pad. Driven by the drive assembly, the polishing head and polishing pad rotate in the same direction, while the polishing head applies a certain downward pressure to the wafer. In addition, a polishing slurry system supplies a certain amount of polishing slurry between the wafer and the polishing pad. Through the combined action of chemical and mechanical processes, the wafer can achieve efficient and reliable polishing.

[0003] However, in the existing technology, the non-parallelism between the polishing head and the polishing pad results in an unsatisfactory flatness of the wafer and an easy occurrence of over-polishing at the edges. Utility Model Content

[0004] The purpose of this invention is to provide a polishing head and a polishing machine, which aims to solve the problem that the polishing head of the existing polishing machine easily causes over-polishing of the wafer edges.

[0005] To solve the above-mentioned technical problems, the present invention provides a polishing head, comprising:

[0006] The upper throwing head base has a first groove and an elastic sealing element on its lower surface. The elastic sealing element seals the opening of the first groove to form a first pressurized cavity. The upper throwing head base has a first air inlet, which is connected to the first pressurized cavity.

[0007] The lower polishing head seat is disposed on the lower surface of the elastic seal. The lower polishing head seat is provided with a second pressurizing chamber and a second air inlet that are connected to each other. The second pressurizing chamber is provided with a pressure adjusting slider that can slide up and down. The pressure adjusting slider is located in the middle of the lower polishing head seat so that when air is injected into the first pressurizing chamber and the second pressurizing chamber, the polishing head applies downward pressure through the lower polishing head seat and the pressure adjusting slider simultaneously.

[0008] Preferably, a limiting structure is provided between the upper throwing head seat and the lower throwing head seat, the limiting structure being used to limit the lower throwing head seat in the vertical and / or horizontal directions.

[0009] Preferably, the upper surface of the upper throwing head seat is provided with a through hole extending in the vertical direction, and the lower end of the through hole communicates with the first groove; the limiting structure includes a support shaft extending in the vertical direction, the support shaft being slidably inserted into the through hole, the upper end of the support shaft being located on the upper side of the upper throwing head seat and provided with a support base, and when the support shaft is in the lower limit position, the support base abuts against the upper side of the upper throwing head seat; the lower end of the support shaft is located in the first groove, and a baffle is provided between the lower end of the support shaft and the upper surface of the elastic seal.

[0010] Preferably, an annular side plate is provided on the lower surface of the upper throwing head seat, the first groove is formed on the inner side of the side plate, an annular side pressure block is provided on the side plate, the side pressure block includes a clamping part, the clamping part is located on the lower side of the side plate, and the edge of the elastic seal is clamped between the clamping part and the side plate.

[0011] Preferably, the side pressure block further includes a sleeve portion, which is sleeved on the lower end of the side pressure block.

[0012] Preferably, the upper end of the lower throwing head seat extends into the inner side of the clamping part, and an upward-facing annular limiting surface is provided on the peripheral side of the lower throwing head seat, the annular limiting surface being located below the side pressure block.

[0013] Preferably, a second groove is provided on the lower surface of the lower throwing head seat, and a pressure plate is provided on the lower surface of the pressure adjusting slider, the pressure plate being located within the second groove.

[0014] Preferably, the lower throwing head seat is provided with a pressure regulating cylinder, the pressure regulating cylinder is provided with a second pressurizing chamber, and the lower end of the pressure regulating cylinder is located in the second groove.

[0015] Preferably, the upper surface of the lower throwing head seat is provided with an insertion hole, the lower end of the insertion hole is connected to the second groove, and the upper end of the pressure regulating cylinder is inserted into the insertion hole.

[0016] Preferably, a protective plate is provided on the peripheral side of the lower throwing head base, and the lower end of the protective plate protrudes downward from the lower throwing head base.

[0017] To achieve the above objectives, this utility model also provides a polishing machine, including the aforementioned polishing head.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] This invention's polishing head, through a unique design, applies pressure to the wafer's edges using a first pressure chamber and a lower polishing head seat, while simultaneously applying pressure to the wafer's center using a second pressure chamber and a pressure-adjusting slider. This two-stage pressure application, combined with the synergistic effect of the elastic seal, ensures more uniform and consistent pressure across the wafer. This not only effectively improves wafer flatness but also prevents over-polishing of the wafer edges. Attached Figure Description

[0020] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0021] Figure 1 This is a schematic diagram of the structure of the polishing head provided in an embodiment of the present utility model.

[0022] Explanation of reference numerals in the accompanying drawings of this utility model:

[0023] Polishing head 100, upper polishing head seat 1, first groove 11, first pressurizing chamber 11a, elastic seal 12, first air inlet 13, through hole 14, lower polishing head seat 2, second pressurizing chamber 21, second air inlet 22, pressure adjusting sliding component 23, annular limiting surface 24, second groove 25, pressure adjusting cylinder 26, insertion hole 27, support shaft 3, support base 31, baffle 32, side plate 4, side pressure block 5, clamping part 51, sleeve part 52, pressure plate 6, guard plate 7, rotating shaft 8, rotating flange 81.

[0024] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0027] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0028] This invention provides a polishing head that can be used in polishing equipment such as polishing machines. The following description will focus on its application in a single-sided wafer polishing machine. Figure 1 A preferred embodiment of the polishing head provided by this utility model is shown.

[0029] Please see Figure 1 In this embodiment, the polishing head 100 includes an upper polishing head seat 1 and a lower polishing head seat 2. The lower surface of the upper polishing head seat 1 is provided with a first groove 11 and an elastic seal 12. The elastic seal 12 covers the opening of the first groove 11 to form a first pressurized cavity 11a. The upper polishing head seat 1 is provided with a first air inlet 13, which communicates with the first pressurized cavity 11a. The lower polishing head seat 2 is disposed on the lower surface of the elastic seal 12. The lower polishing head seat 2 is provided with a second pressurized cavity 21 and a second air inlet 22 that are connected. The second pressurized cavity 21 is provided with a pressure-adjusting slider 23 that can slide up and down. The pressure-adjusting slider 23 is located in the middle of the lower polishing head seat 2 so that when air is injected into the first pressurized cavity 11a and the second pressurized cavity 21, the polishing head 100 applies downward pressure through the lower polishing head seat 2 and the pressure-adjusting slider 23 at the same time.

[0030] Specifically, a rotating flange 81 is typically provided at the middle of the upper end of the upper polishing head base 1. The polishing head 100 can be connected to the lower end of the rotating shaft 8 of the drive assembly via the rotating flange 81. Thus, through a series of transmissions such as a geared motor, the drive assembly can drive the polishing head 100 to rotate along the vertical axis. The rotating shaft 8 and the rotating flange 81 can be fixedly connected by screws or other means, thus serving both a connection function and transmitting rotational torque to the polishing head 100. The rotating shaft 8 can be a splined shaft or similar, and the polishing head 100 can be equipped with an angular contact bearing, which can increase the upper limit of the axial load that the polishing head 100 can withstand.

[0031] The lower surface of the upper throwing head base 1 is provided with a first groove 11 facing downwards. An elastic seal 12 is disposed on the lower surface of the upper throwing head base 1, and the elastic seal 12 seals and covers the groove opening of the first groove 11, thereby forming a sealed first pressurized cavity 11a within the upper throwing head base 1. The specific arrangement of the elastic seal 12 can be set according to actual conditions; for example, the elastic seal 12 can be a sealing membrane, etc. Optionally, please refer to... Figure 1 In this embodiment, the elastic seal 12 includes a spring plate and a sealing membrane. The sealing membrane is disposed on the upper or lower surface of the spring plate. The spring plate can play a supporting role. The spring plate can be a circular sheet-like part. The following will describe the elastic seal 12 including the spring plate and the sealing membrane as an example.

[0032] The upper polishing head 1 is provided with a first air inlet 13 communicating with the first pressurized chamber 11a. This allows air to be injected into the first pressurized chamber 11a through the first air inlet 13, thereby controlling the air pressure inside the first pressurized chamber 11a and causing the elastic seal 12 to expand and deform downwards. The lower polishing head 2 is disposed on the lower surface of the elastic seal 12. Thus, when the elastic seal 12 expands and deforms downwards, the elastic seal 12 can drive the lower polishing head 2 downwards, thereby applying downward pressure to the edge of the wafer through the lower polishing head 2.

[0033] The lower impeller 2 is provided with a second pressurizing chamber 21 extending vertically. A pressure-adjusting slider 23, capable of sliding vertically, is located at the lower end of the second pressurizing chamber 21. The lower impeller 2 is provided with a second air inlet 22 communicating with the second pressurizing chamber 21, allowing air to be supplied into the second pressurizing chamber 21 through the second air inlet 22 to control the air pressure within the second pressurizing chamber 21. This causes the pressure-adjusting slider 23 within the second pressurizing chamber 21 to slide downwards, thus applying downward pressure to the center of the wafer as the pressure-adjusting slider 23 slides downwards.

[0034] The polishing head 100 of this invention employs a unique design, using a first pressure chamber 11a and a lower polishing head seat 2 to apply pressure to the edge of the wafer, while simultaneously using a second pressure chamber 21 and a pressure adjusting slider 23 to apply pressure to the center of the wafer. This two-stage pressure application, combined with the synergistic effect of the elastic seal 12, ensures that the pressure applied by the polishing head 100 to various locations on the wafer is more uniform and nearly consistent. This not only effectively improves the flatness of the wafer but also avoids the problem of over-polishing the wafer edges.

[0035] A rotating flange 81 is provided at the upper end of the upper throwing head seat 1. The upper throwing head seat 1 and the rotating flange 81 can be fixedly connected by screws or other means. The rotating flange 81 can be a hollow rotating body that is smaller at both ends and larger in the middle. O-ring grooves can be provided on the inner side of the upper end and the outer side of the lower end of the rotating flange 81 for installing sealing rings. The sealing ring between the upper throwing head seat 1 and the rotating flange 81 can also be placed on the end face of the rotating flange 81.

[0036] A first groove 11 is provided on the lower surface of the upper throwing head base 1. The specific arrangement of the first groove 11 can be set according to the actual situation. Optionally, please refer to Figure 1 In this embodiment, an annular side plate 4 is provided on the lower surface of the upper throwing head seat 1, a first groove 11 is formed on the inner side of the side plate 4, and an annular side pressing block 5 is provided on the side plate 4. The side pressing block 5 includes a clamping part 51, which is located on the lower side of the side plate 4, and the edge of the elastic sealing member 12 is clamped between the clamping part 51 and the side plate 4.

[0037] Specifically, the side plate 4 can be sealed to the upper throwing head seat 1 by screws and sealing rings, so that the upper throwing head seat 1 and the annular side plate 4 enclose each other to form a first groove 11. The side pressure block 5 is disposed at the lower end of the side plate 4. The side pressure block 5 has an L-shaped cross-section. The side pressure block 5 can be sealed to the side plate 4 by screws and sealing rings, so as to clamp the elastic sealing element 12 between the lower end face of the side plate 4 and the clamping part 51 of the side pressure block 5, thereby forming a sealed first pressurized cavity 11a. The following description will take the upper throwing head seat 1 with side plate 4 and side pressure block 5 as an example. Among them, the upper throwing head seat 1, side plate 4 and side pressure block 5 can all be disc-shaped parts.

[0038] Further, please refer to Figure 1 In this embodiment, the side pressure block 5 further includes a sleeve portion 52, which is sleeved on the lower end of the side pressure block 5. The sleeve portion 52 is arranged in a cylindrical shape extending in the vertical direction, and the lower end of the sleeve portion 52 is folded inward to form a clamping portion 51, so that the cross-section of the side pressure block 5 is arranged in an L shape.

[0039] Optionally, please refer to Figure 1 In this embodiment, a limiting structure is provided between the upper throwing head seat 1 and the lower throwing head seat 2. The limiting structure is used to limit the lower throwing head seat 2 in the vertical and / or horizontal directions.

[0040] Specifically, a limiting structure is provided between the upper polishing head 1 and the lower polishing head 2, which can limit the movement of the lower polishing head 2 relative to the upper polishing head 1. By adding the limiting structure, excessive tilting of the polishing head 100 can be prevented.

[0041] Optionally, please refer to Figure 1In this embodiment, a through hole 14 extending vertically is provided on the upper surface of the upper throwing head seat 1, and the lower end of the through hole 14 is connected to the first groove 11; the limiting structure includes a support shaft 3 extending vertically, the support shaft 3 being slidably inserted into the through hole 14, the upper end of the support shaft 3 being located on the upper side of the upper throwing head seat 1 and provided with a support base 31, and when the support shaft 3 is in the lower limit position, the support base 31 abuts against the upper side of the upper throwing head seat 1; the lower end of the support shaft 3 is located in the first groove 11, and a baffle 32 is provided between the lower end of the support shaft 3 and the upper surface of the elastic seal 12.

[0042] Specifically, a through hole 14 is provided through the upper polishing head 1. The upper end of the through hole 14 extends upward through the upper surface of the upper polishing head 1, and the lower end extends downward through the bottom wall of the first groove 11. The support shaft 3 is slidably inserted into the through hole 14. The upper and lower ends of the support shaft 3 are respectively provided with a support base 31 and a baffle 32. The support shaft 3 and the support base 31 form a hanging device, which can adjust the position of the lower polishing head 2 relative to the upper polishing head 1, so that the wafer is as parallel as possible to the polishing disk, which is beneficial to improving polishing efficiency and polishing quality. The support base 31 can be sealed to the upper polishing head 1 by screws and a sealing ring, and the support shaft 3 can also be sealed to the support base 31 by a threaded structure and a sealing ring. Multiple support bases 31 and support shafts 3 are usually arranged at intervals along the circumference of the upper polishing head 1.

[0043] The baffle 32 can be fixedly connected to the lower throwing head seat 2 by means of screws or other means, so as to clamp the elastic seal 12 between the baffle 32 and the lower throwing head seat 2.

[0044] Further, please refer to Figure 1 In this embodiment, the upper end of the lower throwing head seat 2 extends into the inner side of the clamping part 51, and an upward-facing annular limiting surface 24 is provided on the peripheral side of the lower throwing head seat 2. The annular limiting surface 24 is located below the side pressure block 5.

[0045] Specifically, the clamping part 51 of the side pressure block 5 is embedded between the side plate 4 and the annular limiting surface 24. Through the limiting cooperation between the clamping part 51 and the side plate 4 and the annular limiting surface 24, the polishing head 100 can be prevented from tilting excessively.

[0046] Optionally, please refer to Figure 1 In this embodiment, a second groove 25 is provided on the lower surface of the lower throwing head seat 2, and a pressure plate 6 is provided on the lower surface of the pressure adjusting slider 23. The pressure plate 6 is located in the second groove 25.

[0047] Specifically, a second groove 25 with its opening facing downwards is provided in the middle of the lower surface of the lower throwing head base 2. The pressure plate 6 is located in the second groove 25, and the shape of the pressure plate 6 is usually adapted to the shape of the second groove 25. The pressure plate 6 can be fixed to the lower surface of the pressure adjusting slider 23 by means of screws or other methods. The ceramic disk and other fixed disks are usually fixed to the lower surface of the pressure plate 6, while the wafer can be fixed to the lower surface of the ceramic disk by means of bonding or other methods. For example, the wafer can be bonded to the ceramic disk with wax, which helps to ensure the stability of the equipment.

[0048] The lower throwing head seat 2 is provided with a second pressurizing chamber 21. Optionally, please refer to Figure 1 In this embodiment, a pressure regulating cylinder 26 is provided on the lower throwing head seat 2, and a second pressurizing chamber 21 is provided inside the pressure regulating cylinder 26. The lower end of the pressure regulating cylinder 26 is located in the second groove 25.

[0049] Specifically, a second air inlet 22 is formed by an air pipe connector at the top center of the pressure regulating cylinder 26. The pressure regulating cylinder 26 is sealed to the lower throwing head seat 2 by screws and a sealing ring. The pressure regulating sliding member 23 is sealed to the inner wall of the pressure regulating cylinder 26 by a piston-specific sealing ring and can slide up and down, thereby forming a second pressurizing chamber 21 inside the pressure regulating cylinder 26 and on the upper side of the pressure regulating sliding member 23. The pressure regulating cylinder 26 is suspended on the support shaft 3 by a baffle 32, and the entire pressure regulating cylinder 26 is connected to the elastic sealing member 12. The sealing ring between the pressure regulating cylinder 26 and the lower throwing head seat 2 can be placed on the side or the end face.

[0050] Optionally, please refer to Figure 1 In this embodiment, an insertion hole 27 is provided on the upper surface of the lower throwing head seat 2. The lower end of the insertion hole 27 is connected to the second groove 25, and the upper end of the pressure regulating cylinder 26 is inserted into the insertion hole 27.

[0051] Specifically, the lower throwing head base 2 is provided with a through insertion hole 27 extending vertically. The upper end of the insertion hole 27 extends upward through the upper surface of the lower throwing head base 2, and the lower end of the insertion hole 27 extends downward through the bottom wall of the second groove 25. The upper end of the pressure regulating cylinder 26 is inserted into the insertion hole 27, thus enabling the installation and positioning of the pressure regulating cylinder 26 and the lower throwing head base 2.

[0052] Optionally, please refer to Figure 1 In this embodiment, a protective plate 7 is provided on the peripheral side of the lower throwing head seat 2, and the lower end of the protective plate 7 protrudes downward from the lower throwing head seat 2.

[0053] Specifically, the guard plate 7 is usually an arc-shaped plate. The guard plate 7 is installed on the outer peripheral side of the lower throwing head seat 2. The guard plate 7 can limit the ceramic disc set on the pressure plate 6 in the radial direction.

[0054] The polishing head 100 mainly consists of discs and shafts, which facilitates machining and reduces manufacturing costs. The polishing head 100 can be connected to the lower end of the drive assembly's rotating shaft 8. Through a series of transmissions, including a geared motor, the polishing head 100 is rotated. By controlling the air pressure in the first pressurizing chamber 11a and the second pressurizing chamber 21, downward pressure is applied to the ceramic disc and wafer at the bottom of the polishing head 100, ensuring that the pressure at each position on the ceramic disc is as close as possible. Simultaneously, the polishing slurry system provides a uniform amount of polishing slurry composed of abrasives, pH adjusters, oxidants, dispersants, and surfactants to the polishing surface to improve polishing efficiency and quality.

[0055] This utility model also provides a polishing machine, which includes a polishing head. Since the polishing head adopts the technical solution of the above embodiments, it has the beneficial effects brought about by the technical solution of the above embodiments.

[0056] The above are merely preferred embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural transformations made based on the inventive concept of this utility model and the contents of this utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this utility model.

Claims

1. A polishing head, characterized by, include: The upper throwing head base has a first groove and an elastic sealing element on its lower surface. The elastic sealing element seals the opening of the first groove to form a first pressurized cavity. The upper throwing head base has a first air inlet, which is connected to the first pressurized cavity. The lower polishing head seat is disposed on the lower surface of the elastic seal. The lower polishing head seat is provided with a second pressurizing chamber and a second air inlet that are connected to each other. The second pressurizing chamber is provided with a pressure adjusting slider that can slide up and down. The pressure adjusting slider is located in the middle of the lower polishing head seat so that when air is injected into the first pressurizing chamber and the second pressurizing chamber, the polishing head applies downward pressure through the lower polishing head seat and the pressure adjusting slider simultaneously.

2. The polishing head of claim 1, wherein A limiting structure is provided between the upper throwing head seat and the lower throwing head seat, the limiting structure being used to limit the lower throwing head seat in the vertical and / or horizontal directions.

3. The polishing head as described in claim 2, characterized in that, The upper surface of the upper throwing head seat is provided with a through hole extending in the vertical direction, and the lower end of the through hole communicates with the first groove; the limiting structure includes a support shaft extending in the vertical direction, the support shaft being slidably inserted into the through hole, the upper end of the support shaft being located on the upper side of the upper throwing head seat and provided with a support base, and when the support shaft is in the lower limit position, the support base abuts against the upper side of the upper throwing head seat; the lower end of the support shaft is located in the first groove, and a baffle is provided between the lower end of the support shaft and the upper surface of the elastic seal.

4. The polishing head as described in claim 1, characterized in that, An annular side plate is provided on the lower surface of the upper throwing head seat. The first groove is formed on the inner side of the side plate. An annular side pressure block is provided on the side plate. The side pressure block includes a clamping part. The clamping part is located on the lower side of the side plate. The edge of the elastic seal is clamped between the clamping part and the side plate.

5. The polishing head as described in claim 4, characterized in that, The side pressure block further includes a sleeve portion, which is sleeved on the lower end of the side pressure block; and / or, The upper end of the lower throwing head seat extends into the inner side of the clamping part, and an upward-facing annular limiting surface is provided on the peripheral side of the lower throwing head seat. The annular limiting surface is located below the side pressure block.

6. The polishing head of claim 1, wherein, A second groove is provided on the lower surface of the lower throwing head seat, and a pressure plate is provided on the lower surface of the pressure adjusting slider, the pressure plate being located within the second groove.

7. The polishing head of claim 6, wherein The lower throwing head seat is provided with a pressure regulating cylinder, and the pressure regulating cylinder is provided with a second pressurizing chamber. The lower end of the pressure regulating cylinder is located in the second groove.

8. The polishing head as described in claim 7, characterized in that, The upper surface of the lower throwing head seat is provided with an insertion hole, the lower end of the insertion hole is connected to the second groove, and the upper end of the pressure regulating cylinder is inserted into the insertion hole.

9. The polishing head as described in claim 1, characterized in that, A protective plate is provided on the peripheral side of the lower throwing head base, and the lower end of the protective plate protrudes downward from the lower throwing head base.

10. A polishing machine, characterized in that, Includes the polishing head as described in any one of claims 1-9.

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