PCBA board packaging equipment

Abstract

This application discloses a PCBA board packaging device, relating to the field of PCBA packaging technology, comprising: a glue spraying assembly having multiple independently controllable spray nozzles; the glue spraying assembly having an input interface and an output interface; a first movable assembly connected to the glue spraying assembly; a worktable located below the spray nozzles for placing the PCBA board; a glue supply assembly connected to the glue spraying assembly; the glue supply assembly having a first receiving cavity and a second receiving cavity; the output interface of the first receiving cavity being connected to the input interface of the glue spraying assembly, and the output interface of the glue spraying assembly being connected to the input interface of the second receiving cavity; the first receiving cavity being connected to a first negative pressure source, and the second receiving cavity being connected to a second negative pressure source; the negative pressure provided by the second negative pressure source is greater than the negative pressure provided by the first negative pressure source; an empty first gas cylinder is provided between the first receiving cavity and the first negative pressure source, and an empty second gas cylinder is provided between the second receiving cavity and the second negative pressure source. The PCBA board packaging device provided in this specification provides uniform glue dispensing during the packaging process.

Description

Technical Field

[0001] This specification relates to the field of PCBA packaging technology, and in particular to a PCBA board packaging device. Background Technology

[0002] There are many packaging methods for PCBA (Printed Circuit Board + Assembly) boards, such as applying conformal coating, potting, and low-pressure injection molding. Each of these methods has its own advantages and disadvantages: Directly spraying conformal coating, although simple, convenient, and easy to implement, cannot truly protect the circuit board, nor can it achieve waterproofing or shockproofing; over time, the packaging may fail. Potting is cumbersome, inefficient, costly, and unreliable. Low-pressure injection molding uses low-pressure injection equipment, special molds, and adjusts the injection pressure and time to complete the circuit board packaging; however, this method has high mold design and manufacturing costs, and the properties of the adhesive itself have a significant impact on the packaging.

[0003] To address the aforementioned issues, invention patent CN115646739A, entitled "PCBA Board Packaging Equipment," protects a PCBA board packaging device. Its control device can control a glue spraying assembly to linearly reciprocate in a first horizontal direction, spraying adhesive onto the PCBA board. This device is suitable for reliable packaging of low-profile PCBA boards. Furthermore, it includes a glue supply assembly with a first and a second receiving cavity. The output interface of the first receiving cavity is connected to the input interface of the glue spraying assembly, and the output interface of the glue spraying assembly is connected to the input interface of the second receiving cavity. A first negative pressure source connected to the first receiving cavity and a second negative pressure source connected to the second receiving cavity are also included. The negative pressure provided by the second negative pressure source is greater than that provided by the first negative pressure source, allowing the adhesive to smoothly enter the glue spraying assembly from the first receiving cavity, then enter the second receiving cavity, and finally be sprayed onto the PCBA board, achieving reliable packaging and high production efficiency.

[0004] However, in practical applications, it has been found that uneven glue dispensing still occurs during the PCBA board packaging process. Utility Model Content

[0005] The inventors discovered that uneven adhesive dispensing during the PCBA board packaging process is often caused by unstable pressure in the first and second receiving cavities, which can lead to sudden changes. To solve the problem of uneven adhesive dispensing, it is necessary to first address the issue of unstable pressure in the first and second receiving cavities.

[0006] In view of the shortcomings of the prior art, one object of this specification is to provide a PCBA board packaging device that dispenses adhesive evenly during the packaging process.

[0007] To achieve the above objectives, this specification provides a PCBA board packaging device, comprising: A glue spraying assembly with multiple independently controllable spray nozzles; the glue spraying assembly has an input interface and an output interface; A first movable component is connected to the glue spraying assembly; the first movable component is used to drive the glue spraying assembly to move linearly back and forth along a first horizontal direction. A workbench located below the nozzle for placing PCBA boards; A glue supply assembly is connected to the glue spraying assembly; the glue supply assembly has a first receiving cavity and a second receiving cavity; the output interface of the first receiving cavity is connected to the input interface of the glue spraying assembly, and the output interface of the glue spraying assembly is connected to the input interface of the second receiving cavity; the first receiving cavity is connected to a first negative pressure source, and the second receiving cavity is connected to a second negative pressure source; the negative pressure provided by the second negative pressure source is greater than the negative pressure provided by the first negative pressure source; an empty first gas cylinder is provided between the first receiving cavity and the first negative pressure source, and an empty second gas cylinder is provided between the second receiving cavity and the second negative pressure source.

[0008] In a preferred embodiment, the first gas cylinder and the second gas cylinder are each provided with two connection ports near the top. One end of each connection port is connected to the interior of the first gas cylinder or the second gas cylinder, and the other end is connected to the first negative pressure source or the second negative pressure source through a pipe.

[0009] In a preferred embodiment, the first gas cylinder and the second gas cylinder are arranged adjacent to each other; the four connection ports are located on the same straight line.

[0010] In a preferred embodiment, the tops of the first gas cylinder and the second gas cylinder are respectively fixedly connected to the first mounting plate via connecting plates.

[0011] In a preferred embodiment, the first negative pressure source and the second negative pressure source are installed vertically aligned, and the first negative pressure source and the second negative pressure source are fixedly connected to the second mounting plate; the second mounting plate is perpendicular to the first mounting plate.

[0012] In a preferred embodiment, the PCBA board packaging equipment further includes an installation platform, on which the first moving component, the worktable, the first mounting plate, and the second mounting plate are all mounted.

[0013] In a preferred embodiment, the first mounting plate is disposed on the side of the first movable component opposite to the adhesive spraying component, and the second mounting plate is disposed on the side of the first mounting plate opposite to the first movable component.

[0014] In a preferred embodiment, the first gas cylinder and the second gas cylinder are arranged adjacent to each other in the first horizontal direction.

[0015] In a preferred embodiment, the capacity of the first gas cylinder is 1L to 5L; the capacity of the second gas cylinder is 1L to 5L.

[0016] In a preferred embodiment, both the first gas cylinder and the second gas cylinder have a capacity of 2L. Beneficial effects

[0017] The PCBA board packaging equipment provided in this embodiment, by placing an empty first gas cylinder between the first receiving cavity and the first negative pressure source, and an empty second gas cylinder between the second receiving cavity and the second negative pressure source, allows for buffering when the first negative pressure source applies negative pressure to the first receiving cavity, thus ensuring a stable pressure change within the first receiving cavity. Similarly, when the second negative pressure source applies negative pressure to the second receiving cavity, the second gas cylinder provides buffering, ensuring a stable pressure change within the second receiving cavity. Therefore, this PCBA board packaging equipment can ensure stable pressure changes within the first and second receiving cavities, thereby guaranteeing uniform glue dispensing from the glue spraying assembly during the packaging process.

[0018] Specific embodiments of the present invention are disclosed in detail with reference to the following description and accompanying drawings, indicating how the principles of the present invention can be adopted. It should be understood that the scope of the embodiments of the present invention is not limited thereto.

[0019] Features described and / or illustrated for one embodiment may be used in the same or similar manner in one or more other embodiments, combined with features in other embodiments, or substituted for features in other embodiments.

[0020] It should be emphasized that the term "including / comprises" as used herein refers to the presence of a feature, whole, step, or component, but does not exclude the presence or addition of one or more other features, wholes, steps, or components. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of a PCBA board packaging device provided in one embodiment of this disclosure; Figure 2 yes Figure 1 A schematic diagram of the internal adhesive spraying assembly and workbench structure; Figure 3 yes Figure 2 Partial schematic diagram; Figure 4 yes Figure 3 The front view; Figure 5 yes Figure 2 Schematic diagram of the structure of the spray adhesive assembly; Figure 6 This is a schematic diagram of the nozzle arrangement of a piezoelectric array nozzle provided in one embodiment of this disclosure; Figure 7 This is a schematic diagram of the nozzle arrangement of a piezoelectric array nozzle provided in another embodiment of this disclosure; Figure 8 This is a schematic diagram showing the spacing between the curing light source and the array nozzles of a PCBA board packaging device provided in one embodiment of this disclosure; Figure 9 This is a connection diagram of an adhesive supply assembly provided in one embodiment of this disclosure; Figure 10 This is a schematic diagram of the structure of the first mounting plate and the second mounting plate provided in one embodiment of this disclosure; Figure 11 yes Figure 10 The main view.

[0023] Explanation of reference numerals in the attached figures: 1. Equipment housing; 2. Observation window; 3. Equipment door; 4. Equipment bracket; 5. Mounting platform; 6. Support frame; 7. Support plate; 10. Adhesive spraying assembly; 11. Nozzle; 12. Adhesive input connector; 13. Adhesive output connector; 15. First moving assembly; 16. Positioning part; 20. Curing light source; 21. Water-cooled input connector; 22. Water-cooled output connector; 23. Power connector; 25. Mounting plate; 30. Workbench; 35. Second moving assembly; 36. Rotating assembly; 113. Nozzle assembly; 114. Nozzle row; 115. Adhesive spray panel; 116. Nozzle; 117. Spacer; F1. First direction; F2. Second direction; 40. Adhesive supply assembly; 41. First receiving cavity; 42. Second receiving cavity; 43. First negative pressure source; 44. Second negative pressure source; 45. First drive pump; 46. Second drive pump; 47. Adhesive container; 48. Filter; 51. First gas cylinder; 52. Second gas cylinder; 53. Connection port; 54. Connection plate; 55. First mounting plate; 56. Second mounting plate; X, First horizontal direction. Detailed Implementation

[0024] To enable those skilled in the art to better understand the technical solutions of this utility model, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.

[0025] It should be noted that when an element is referred to as being "set on" another element, it can be directly on the other element or may be interposed with another element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or may be interposed with another element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementations.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0027] like Figures 1 to 5 As shown, one embodiment of this disclosure provides a PCBA board packaging apparatus. The PCBA board packaging apparatus is suitable for the protective packaging of electronic components on a PCBA board. The PCBA board includes a printed circuit board and electronic components disposed on the printed circuit board. In particular, this PCBA board packaging apparatus is suitable for electronic packaging of low-profile, thin, or surface-mount PCBA boards. Specifically, the maximum height of the electronic component relative to the surface of the printed circuit board (PCB) is less than 1 cm. Further, the maximum height of the electronic component relative to the surface of the printed circuit board is less than 0.5 mm.

[0028] In this embodiment, the PCBA board packaging equipment includes: a glue spraying assembly 10, a first moving assembly 15, and a worktable 30. The worktable 30 is mounted on an equipment bracket 4. The equipment bracket 4 has a mounting platform 5 for mounting the worktable 30. A support frame 6 is provided on the mounting platform 5 to support the first moving assembly 15. The support frame 6 spans across the mounting platform 5 to support the glue spraying assembly 10 and the first moving assembly 15, forming a gantry-like mechanism. A support plate 7 is supported on the support frame 6, and the first moving assembly 15 is fixedly mounted on the front surface of the support plate 7.

[0029] The packaging equipment has a housing 1, with a glue spraying assembly 10, a first moving assembly 15, and a worktable 30 located inside the housing 1 to prevent environmental impurities from entering the glue and affecting the packaging quality. An observation window 2 is located at the top of the housing 1 to observe the packaging status of the PCBA board. After the PCBA board is packaged, the equipment door 3, where the observation window 2 is located, can be opened by the handle to remove the PCBA board and insert a new one. A storage door is located at the bottom of the housing 1, and a storage space is formed inside the storage door.

[0030] The adhesive spraying assembly 10 has multiple independently controllable spray nozzles 116. A first moving assembly 15 is connected to the adhesive spraying assembly 10. The first moving assembly 15 drives the adhesive spraying assembly 10 to move back and forth in a straight line along a first horizontal direction X. A worktable 30 is located below the spray nozzles 116. The worktable 30 is lower in height than the spray nozzles 116. The worktable 30 has a placement surface for placing PCBA boards.

[0031] The adhesive spraying assembly 10 is fixedly equipped with at least one array nozzle 11. Each array nozzle 11 has an adhesive inlet connector 12 and an adhesive outlet connector 13 for connection to an adhesive storage box. Each array nozzle 11 is connected to an adhesive storage box via the adhesive inlet connector 12 and the adhesive outlet connector 13. Each array nozzle 11 is independently supplied with adhesive.

[0032] like Figure 3 , Figure 4 , Figure 5 As shown, the adhesive spraying assembly 10 includes two array nozzles 11a and 11b. The two array nozzles 11a and 11b are arranged along a first horizontal direction X. The height position of the adhesive spraying assembly 10 remains constant within the encapsulation device. The array nozzle 11 is a piezoelectric array nozzle 11. The array nozzle 11 has an adhesive spraying panel 115, on which a plurality of parallel rows of nozzles 114 are distributed; that is, the adhesive spraying panel 115 has a plurality of parallel rows of nozzles 116. Figure 7 As shown, each row of nozzles 114 has a plurality of independently controlled nozzles 116 arranged along a first direction F1. The plurality of nozzle rows 114 are arranged along a second direction F2 perpendicular to the first direction F1.

[0033] like Figure 6 , Figure 7As shown, in the row of nozzles 114, there is a gap 117 between two adjacent nozzles. At least one gap 117 is at least partially aligned with at least one nozzle in another row of nozzles 114 along the second direction F2. Further, the gap 117 is centered aligned with a nozzle along the second direction F2. The projections of the plurality of rows of nozzles 114 on the adhesive spraying panel 115 along the second direction F2 form a complete straight line, so that during adhesive spraying, the plurality of rows of nozzles 114 can complement each other to fill in unsprayed points, forming a line adhesive spraying.

[0034] Thus, in two adjacent rows of nozzles 114, the nozzles 116 of one nozzle row 114a are aligned with the gaps 117 of the nozzles in another nozzle row 114b along the second direction F2, with the nozzles staggered. In this way, the gaps 117 of the nozzle row 114a are compensated for by the nozzles 116 of the adjacent nozzle row 114b in the second direction F2 (the direction of travel of the nozzle 11, i.e., the first horizontal direction X described below). This not only reduces the nozzle size and increases the number of nozzles, improving the accuracy of the adhesive application position, but also avoids unapplied adhesive spots, resulting in more uniform adhesive application and improved encapsulation quality. The first direction F1 is perpendicular to the first horizontal direction X. The second direction F2 is parallel to the first horizontal direction X.

[0035] like Figure 5 , Figure 8 As shown, the adhesive spraying assembly 10 is also fixedly equipped with a curing light source 20. The curing light source 20 is an LED lamp with a wavelength of 365-395nm and a UV energy of 8000mW / cm². 3 The curing depth of the curing light source 20 is 100-3000 μm. The curing light source 20 is located on at least one side of the adhesive spraying assembly 10 in the first horizontal direction X. The emitting surface of the curing light source 20 is perpendicular to the worktable 30. The curing light source 20 is also provided with a water-cooling heat dissipation structure. The emitting surface of the curing light source 20 is vertically downward. The curing light source 20 is provided with a water-cooling input connector 21 and a water-cooling output connector 22. A power connector 23 (cable connector) is provided between the water-cooling input connector 21 and the water-cooling output connector 22 to input electrical energy.

[0036] like Figure 4 , Figure 5 As shown, curing light sources 20 are respectively provided on both sides of the first horizontal direction X of the adhesive spraying assembly 10. The lower end of the adhesive spraying assembly 10 has a horizontal mounting plate 25. Two curing light sources 20a and 20b (UV lamps) are respectively mounted on the mounting plate 25, at the same horizontal plane (at the same height) as the array nozzle 11. When moving along the first horizontal direction X, the curing light source 20 on the rear side of the adhesive spraying assembly 10 in the moving direction can be turned on to achieve follow-up curing after adhesive spraying, realizing simultaneous adhesive spraying and curing.

[0037] like Figure 8 As shown, to achieve better curing results and avoid the curing light source 20 affecting the spraying of the adhesive (mainly to prevent droplets from curing before contacting the PCBA), the horizontal distance L5 between the curing light source 20 and the array nozzle 11 is greater than 5 cm. The horizontal distance L5 between the curing light source 20 and the array nozzle 11 is within 15 cm.

[0038] The adhesive spraying assembly 10 also includes a positioning part 16 for positioning the PCBA board. For example... Figure 4 As shown, the positioning part 16 is fixed to one side of the adhesive spraying assembly 10 in the first horizontal direction X. Facing... Figure 4 At this time, the positioning part 16 is fixed on the right side of the adhesive spraying assembly 10, adjacent to the right-side curing light source 20. The curing light source 20 does not interfere with the positioning part 16. Specifically, the positioning part 16 includes a visual positioning component. For example, the positioning part 16 includes a CCD visual positioning system. The PCBA board has specific position points or predetermined electronic components that can be identified by the visual positioning component. By positioning the specific position points or predetermined electronic components with the positioning part 16, the worktable 30 is adjusted according to the positioning situation to precisely adjust the PCBA board to the specified adhesive spraying position. In other embodiments, the positioning part 16 can also be an ultrasonic positioning device.

[0039] In this embodiment, the first moving component 15 includes a lead screw module. The lead screw module has a servo motor and a lead screw driven to rotate by the servo motor. A slider that slides along the lead screw is provided on the lead screw module. The glue spraying component 10 includes a glue spraying bracket fixedly connected to the slider, and the glue spraying component 10 performs linear reciprocating motion together with the slider. The glue spraying component 10 forms the glue spraying bracket of the glue spraying shell, fixing multiple array nozzles 11 inside it, or fixing the array nozzles 11 as the bottom of the glue spraying bracket facing downwards. The glue spraying panel 115 of the array nozzle 11 is a horizontal panel, and the spray holes 116 face vertically downwards, perpendicular to the worktable 30.

[0040] In other embodiments, the first moving component 15 includes an electric cylinder and a linear guide rail. The glue spraying component 10 includes a glue spraying bracket slidably disposed on the linear guide rail and driven by the electric cylinder to reciprocate linearly along the linear guide rail; the array nozzle 11 is fixedly disposed on the glue spraying bracket.

[0041] If the nozzle 11 moves too fast, the error after curing will be greater. However, if the nozzle 11 moves too slow, the curing effect and encapsulation efficiency of the adhesive will not meet expectations. To avoid these problems, during the adhesive spraying process, the moving speed of the adhesive spraying assembly 10 is controlled to be less than 50 mm / s. Further, the moving speed of the adhesive spraying assembly 10 is controlled to be less than 30 mm / s. Even further, the moving speed of the adhesive spraying assembly 10 is controlled to be less than 20 mm / s.

[0042] In this embodiment, the packaging device further includes a rotating assembly 36 and a second moving assembly 35. The rotating assembly 36 drives the worktable 30 to rotate about a vertical axis. The second moving assembly 35 drives the worktable 30 to move along a second horizontal direction perpendicular to the first horizontal direction X. The worktable 30 is rotatably supported on the rotating assembly 36. The rotating assembly 36 can be a rotary servo motor, with the worktable 30 connected to the output of the rotary servo motor; alternatively, the worktable 30 can be connected to the output of the rotary servo motor via a reduction mechanism such as a speed reducer.

[0043] The second moving component 35 can refer to the first moving component 15, and the details will not be repeated. The rotating component 36 is disposed on the second moving component 35 and is driven to move along the second horizontal direction. The rotating component 36 and the worktable 30 are moved together by the second moving component 35 along the second horizontal direction and can be positioned at a predetermined position.

[0044] By rotating the worktable 30 within its plane and adjusting its height, the PCBA board placed on the worktable 30 is precisely positioned and adjusted to the designated glue spraying position, facilitating accurate glue spraying and encapsulation during subsequent glue spraying processes. The glue spraying assembly 10 is fixed in position in the second horizontal direction and can only move linearly in the first horizontal direction X. When the width of the PCBA board is too large and the nozzle 11 cannot complete the spraying in one go, the worktable 30 moves in the second horizontal direction, allowing the glue spraying assembly 10 to spray glue onto different areas of the PCBA board sequentially, thereby achieving glue spraying protection for large-area PCBA boards.

[0045] To automate the packaging process and improve production efficiency, in one embodiment, the packaging equipment further includes a control device connected to the adhesive spraying assembly 10 and the first moving assembly 15. The control device is capable of controlling the adhesive spraying assembly 10 to move back and forth along a first horizontal X-direction to spray UV adhesive onto the target adhesive spraying area of ​​the PCBA board.

[0046] In another embodiment, the encapsulation device further includes an acquisition module for acquiring information about the adhesive spraying area and a control device connected to the adhesive spraying assembly 10, the first moving assembly 15, and the acquisition module. The control device is capable of controlling the adhesive spraying assembly 10 to move linearly back and forth in a horizontal direction to spray UV adhesive onto the target adhesive spraying area of ​​the PCBA board.

[0047] The acquisition module includes a network transmission module, drawing software, mind mapping software, or data transmission interfaces such as USB or Type-C interfaces to input or import images of adhesive spraying information. The acquisition module may also include an input device such as a touchscreen or keyboard to input the target number of adhesive spraying layers. The controller runs host computer software.

[0048] One embodiment of this disclosure provides a piezoelectric array nozzle 11 for packaging PCBA boards, wherein the nozzle 11 has a spraying panel 115 on which parallel rows of nozzles 114 are distributed. Each row of nozzles 114 has a plurality of independently controlled nozzles 116 arranged along a first direction F1. The rows of nozzles 114 are arranged along a second direction F2 perpendicular to the first direction F1. In the rows of nozzles 114, there is a gap 117 between adjacent nozzles 116. At least one gap 117 is at least partially aligned with at least one nozzle in another row of nozzles 114 along the second direction F2.

[0049] The piezoelectric array nozzle 11 can be referenced and used interchangeably with the nozzles in the above embodiments, and the repeated parts will not be described again.

[0050] In a row of nozzles 114a, one nozzle 116 is at least partially offset from the nearest nozzle 116 in another row of nozzles 114b in the second direction F2. In adjacent rows of nozzles 114a and b, each nozzle is offset along the second direction F2. The nozzle rows 114 on both sides of a row of nozzles 114 are aligned one-to-one along the second direction F2. The adhesive spraying panel 115 has five or more rows of nozzles. Each row of nozzles 114 includes at least 50 or more nozzles 116. Further, each row of nozzles 114 includes at least 100 or more nozzles 116. The spacing between two nozzles 116 is less than the nozzle diameter. Of course, in some embodiments, the spacing between nozzles 116 is greater than the nozzle diameter.

[0051] For adhesive spraying encapsulation suitable for PCBA boards, the single drop volume of the nozzle 116 is between 50 and 100 picoliters. Alternatively, the single spray volume of the nozzle 116 is between 50 and 100 picoliters. The nozzle achieves continuous output of adhesive through high-frequency spraying. Each nozzle 116 of the nozzle 11 can spray up to 20,000 times per second.

[0052] like Figure 7 As shown, adjacent, staggered rows of nozzles 114 constitute a nozzle group 113. The adhesive spraying panel 115 has multiple parallel nozzle groups 113 arranged in the second direction F2. The multiple nozzle groups 113a and 113b are symmetrically arranged on the adhesive spraying panel 115. Alternatively, the multiple nozzle groups 113 have a translational structure. In the second direction F2, the distance L1 between two adjacent nozzle groups 113a and 113b is greater than the distance L2 between two rows of nozzles 114a and 114b within the nozzle group 113. The nozzle spacing portion 117 is centered and aligned with a nozzle along the second direction F2.

[0053] like Figure 9As shown, the PCBA board packaging equipment in this embodiment also includes an adhesive supply assembly 40. The adhesive spraying assembly 10 has an input interface and an output interface. The adhesive supply assembly 40 is connected to the adhesive spraying assembly 10. The adhesive supply assembly 40 has a first receiving cavity 41 and a second receiving cavity 42. The output interface of the first receiving cavity 41 is connected to the input interface of the adhesive spraying assembly 10, and the output interface of the adhesive spraying assembly 10 is connected to the input interface of the second receiving cavity 42. The first receiving cavity 41 is connected to a first negative pressure source 43, and the second receiving cavity 42 is connected to a second negative pressure source 44. The negative pressure provided by the second negative pressure source 44 is greater than the negative pressure provided by the first negative pressure source 43, so that the adhesive can smoothly enter the adhesive spraying assembly 10 from the first receiving cavity 41, and then enter the second receiving cavity 42, and be sprayed onto the PCBA board through the adhesive spraying assembly 10, achieving reliable packaging and high production efficiency.

[0054] In one embodiment, the adhesive spraying assembly 10 includes an array nozzle 11, which is connected to the first receiving cavity 41 and the second receiving cavity 42. The output interface of the first receiving cavity 41 is connected to the adhesive input connector 12 of the array nozzle 11, and the adhesive output connector 13 of the array nozzle 11 is connected to the input interface of the second receiving cavity 42.

[0055] like Figure 9 As shown, in this embodiment, the adhesive supply assembly 40 may further include an adhesive container 47. The adhesive container 47 is connected between the input interface of the first receiving cavity 41 and the output interface of the second receiving cavity 42. The output interface of the adhesive container 47 and the input interface of the first receiving cavity 41 are connected by a pipeline, and a first drive pump 45 is disposed between them. The input interface of the adhesive container 47 and the output interface of the second receiving cavity 42 are connected by a pipeline, and a second drive pump 46 is disposed between them. Figure 9 The arrows in the diagram indicate the direction of adhesive flow.

[0056] The first drive pump 45 and the second drive pump 46 are both started intermittently, rather than continuously. Specifically, the first receiving cavity 41 is equipped with a first liquid level sensor for detecting the liquid level in the first receiving cavity 41. When the first liquid level sensor detects that the liquid level is lower than a first predetermined liquid level, the first drive pump 45 starts; when the first liquid level sensor detects that the liquid level is equal to or higher than the first predetermined liquid level, the first drive pump 45 shuts down. The second receiving cavity 42 is equipped with a second liquid level sensor for detecting the liquid level in the second receiving cavity 42. When the second liquid level sensor detects that the liquid level is lower than a second predetermined liquid level, the second drive pump 46 shuts down; when the second liquid level sensor detects that the liquid level is equal to or higher than the second predetermined liquid level, the second drive pump 46 starts.

[0057] The adhesive flow rate from adhesive container 47 to the first receiving cavity 41 is greater than the adhesive flow rate from the first receiving cavity 41 to the second receiving cavity 42, and the adhesive flow rate from the second receiving cavity 42 to the adhesive container 47 is greater than the adhesive flow rate from the first receiving cavity 41 to the second receiving cavity 42. The adhesive flows slowly from the first receiving cavity 41 through the nozzle 11 and then into the second receiving cavity 42. The flow rate of the adhesive between the first receiving cavity 41 and the second receiving cavity 42 is slow, while the flow rates from adhesive container 47 to the first receiving cavity 41 and from the second receiving cavity 42 to the adhesive container 47 are very fast. Therefore, the first drive pump 45 and the second drive pump 46 are set to start intermittently to prevent the adhesive from overflowing from the first receiving cavity 41 and the second receiving cavity 42, thus ensuring the smooth progress of the encapsulation.

[0058] Specifically, the flow rate of the adhesive in the first receiving cavity 41 to the second receiving cavity 42 is 12 ml / min to 29 ml / min. Further, the flow rate of the adhesive in the first receiving cavity 41 to the second receiving cavity 42 is 17.5 ml / min to 24.3 ml / min. Even further, the flow rate of the adhesive in the first receiving cavity 41 to the second receiving cavity 42 is 19.5 ml / min to 21.5 ml / min.

[0059] like Figure 9 As shown, the adhesive supply assembly 40 may further include a filter 48 to filter impurities in the adhesive solution, preventing contaminated adhesive solution from entering the nozzle 11 during circulation. The filter 48 is disposed on the pipeline between the adhesive container 47 and the first receiving cavity 41 and / or on the pipeline between the adhesive container 47 and the second receiving cavity 42. The filter 48 cannot be disposed between the first receiving cavity 41 and the second receiving cavity 42, where the adhesive flow rate is slow; if a filter 48 is disposed there, it may cause uneven adhesive dispensing from the nozzle 11.

[0060] In this embodiment, the first negative pressure source 43 and the second negative pressure source 44 can be vacuum pumps. The negative pressure range provided by the first negative pressure source 43 and / or the negative pressure range provided by the second negative pressure source 44 is 0.01 kPa to 15 kPa. Further, the negative pressure range provided at both locations is 1 kPa to 20 kPa. Even further, the negative pressure range provided at both locations is 1 kPa to 10 kPa. Still even further, the negative pressure range provided at both locations is 2 kPa to 5 kPa. The negative pressure provided by the second negative pressure source 44 is greater than the negative pressure provided by the first negative pressure source 43, and the difference between the two is preferably 1 kPa. This not only allows the adhesive to smoothly enter the second receiving cavity 42 for circulation but also ensures that the nozzle 11 dispenses adhesive smoothly. Preferably, the negative pressure provided by the first negative pressure source 43 is 3.4 kPa, and the negative pressure provided by the second negative pressure source 44 is 4.4 kPa.

[0061] To ensure smoother adhesive dispensing from the nozzle 11, the adhesive supply assembly 40 further includes a heating element for maintaining a constant temperature of the adhesive solution within the first receiving cavity 41. The heating element maintains a constant temperature of 20°C to 200°C. Further, the heating element maintains a constant temperature of 30°C to 100°C. Even further, the heating element maintains a constant temperature of 40°C to 50°C; adhesive solutions within this temperature range are more suitable for PCBA board packaging.

[0062] In this embodiment, such as Figure 9 As shown, an empty first gas cylinder 51 is provided between the first receiving cavity 41 and the first negative pressure source 43, and an empty second gas cylinder 52 is provided between the second receiving cavity 42 and the second negative pressure source 44. Thus, when the first negative pressure source 43 applies negative pressure to the first receiving cavity 41, the first gas cylinder 51 can act as a buffer, allowing the pressure within the first receiving cavity 41 to change stably. Similarly, when the second negative pressure source 44 applies negative pressure to the second receiving cavity 42, the second gas cylinder 52 can act as a buffer, allowing the pressure within the second receiving cavity 42 to change stably. Therefore, this PCBA board packaging equipment can ensure stable pressure changes within the first receiving cavity 41 and the second receiving cavity 42, thereby guaranteeing uniform glue dispensing from the glue spraying assembly 10 during the packaging process.

[0063] like Figure 10 As shown, both the first gas cylinder 51 and the second gas cylinder 52 have two connection ports 53 near their tops. One end of each connection port 53 is connected to the interior of either the first gas cylinder 51 or the second gas cylinder 52, and the other end is connected to either the first negative pressure source 43 or the second negative pressure source 44 via a pipe. Positioning the connection ports 53 near the tops of the first and second gas cylinders facilitates connection and fully utilizes the buffering effect of the entire gas cylinder.

[0064] To facilitate wiring, the first gas cylinder 51 and the second gas cylinder 52 are arranged adjacent to each other. Furthermore, the four connection ports 53 are located on the same straight line, that is, one connection port 53 of the first gas cylinder 51 and one connection port 53 of the second gas cylinder 52 are arranged opposite each other to avoid interference between the wiring and the mounting plate during connection.

[0065] like Figure 10 and Figure 11As shown, the tops of the first gas cylinder 51 and the second gas cylinder 52 are respectively fixedly connected to the first mounting plate 55 via connecting plates 54. The first mounting plate 55 is vertically arranged, providing a reliable mounting position for the first gas cylinder 51 and the second gas cylinder 52. The connecting plate 54 may include a horizontal portion and a vertical portion. Its horizontal portion is fixedly connected to the top of the first gas cylinder 51 or the top of the second gas cylinder 52, and its vertical portion is fixedly connected to the first mounting plate 55, achieving a stable connection between the first gas cylinder 51 and the second gas cylinder 52 and the first mounting plate 55. The four connecting ports 53 are arranged in a straight line parallel to the first mounting plate 55.

[0066] Specifically, the first negative pressure source 43 and the second negative pressure source 44 are installed vertically aligned. The first negative pressure source 43 and the second negative pressure source 44 are fixedly connected to the second mounting plate 56. The second mounting plate 56 is perpendicular to the first mounting plate 55, and one side of the second mounting plate 56 is fixedly connected to one side of the first mounting plate 55, thereby providing a reliable installation position for the negative pressure source and the gas cylinder.

[0067] As described in the above embodiments, the PCBA board packaging equipment also includes a mounting platform 5. The first moving component 15, the worktable 30, the first mounting plate 55, and the second mounting plate 56 are all mounted on the mounting platform 5, thereby realizing the integrated installation of various components of the equipment.

[0068] Specifically, the first mounting plate 55 is disposed on the side of the first moving assembly 15 opposite to the glue spraying assembly 10 (or the worktable 30), and the second mounting plate 56 is disposed on the side of the first mounting plate 55 opposite to the first moving assembly 15. That is, the front side of the first moving assembly 15 can provide a mounting position for the glue spraying assembly 10 and the worktable 30, and the rear side of the first moving assembly 15 can provide a mounting position for the first negative pressure source 43, the second negative pressure source 44, the first gas cylinder 51, and the second gas cylinder 52, making full use of the space on the equipment and realizing multifunctionality within the same space.

[0069] like Figure 10 As shown, the first gas cylinder 51 and the second gas cylinder 52 are arranged adjacent to each other in the first horizontal direction X, the first mounting plate 55 is parallel to the first horizontal direction X, and the second mounting plate 56 is perpendicular to the first horizontal direction X.

[0070] In this embodiment, the capacity of the first gas cylinder 51 is 1L~5L, and the capacity of the second gas cylinder 52 is 1L~5L. This ensures good buffering without affecting the working efficiency of the negative pressure source (if the capacity of the first gas cylinder 51 or the second gas cylinder 52 is too large, it will cause the first negative pressure source 43 or the second negative pressure source 44 to take too long to draw negative pressure under initial conditions). The specific capacities of the first gas cylinder 51 and the second gas cylinder 52 can be selected differently or the same as needed. In a specific embodiment, the capacity of both the first gas cylinder 51 and the second gas cylinder 52 is 2L, which is sufficient to meet the buffering requirements of this application.

[0071] It should be noted that in the description of this specification, the terms "first," "second," etc., are used only for descriptive purposes and to distinguish similar objects; there is no order between them, nor should they be construed as indicating or implying relative importance. Furthermore, in the description of this specification, unless otherwise stated, "a plurality of" means two or more.

[0072] Any numerical values ​​cited herein include all values ​​ranging from a lower limit to an upper limit, increasing by one unit, with at least two units between any lower and any higher value. For example, if the quantity of a component or the value of a process variable (e.g., temperature, pressure, time, etc.) is described as being from 1 to 90, preferably from 20 to 80, more preferably from 30 to 70, the purpose is to illustrate that values ​​such as 15 to 85, 22 to 68, 43 to 51, 30 to 32 are also explicitly listed in this specification. For values ​​less than 1, a unit is appropriately considered to be 0.0001, 0.001, 0.01, 0.1, etc. These are merely examples intended for explicit expression, and it can be assumed that all possible combinations of values ​​listed between the minimum and maximum values ​​are explicitly described in this specification in a similar manner.

[0073] Unless otherwise stated, all ranges include the endpoints and all numbers between them. The terms "approximately" or "about" used with ranges apply to both endpoints of the range. Thus, "approximately 20 to 30" is intended to cover "approximately 20 to approximately 30," including at least the specified endpoints.

[0074] All articles and references disclosed herein, including patent applications and publications, are incorporated herein by reference for various purposes. The term “substantially constitutes…” used to describe a combination should include the identified elements, components, parts, or steps, as well as other elements, components, parts, or steps that do not substantially affect the essential novelty of the combination. The use of the terms “comprising” or “including” to describe combinations of elements, components, parts, or steps herein also contemplates embodiments substantially constituted by such elements, components, parts, or steps. The use of the term “may” herein is intended to indicate that any described attribute included by “may” is optional.

[0075] Multiple elements, components, parts, or steps can be provided by a single integrated element, component, part, or step. Alternatively, a single integrated element, component, part, or step can be divided into multiple separate elements, components, parts, or steps. The use of "a" or "an" to describe an element, component, part, or step does not imply the exclusion of other elements, components, parts, or steps.

[0076] It should be understood that the above description is for illustrative purposes and not for limitation. Many embodiments and applications beyond the provided examples will be apparent to those skilled in the art upon reading the above description. Therefore, the scope of this teaching should not be determined by reference to the above description, but rather by reference to the appended claims and the full scope of their equivalents. For purposes of completeness, all articles and references, including patent applications and publications, are incorporated herein by reference. The omission of any aspect of the subject matter disclosed herein in the preceding claims is not intended as a waiver of that subject matter, nor should it be construed as an indication that the inventors have not considered that subject matter as part of the disclosed utility model subject matter.

Claims

1. A PCBA board packaging apparatus, characterized by, include: A glue spraying assembly with multiple independently controllable spray nozzles; the glue spraying assembly has an input interface and an output interface; A first movable component is connected to the glue spraying assembly; the first movable component is used to drive the glue spraying assembly to move linearly back and forth along a first horizontal direction. A workbench located below the nozzle for placing PCBA boards; A glue supply assembly is connected to the glue spraying assembly; the glue supply assembly has a first receiving cavity and a second receiving cavity; the output interface of the first receiving cavity is connected to the input interface of the glue spraying assembly, and the output interface of the glue spraying assembly is connected to the input interface of the second receiving cavity; the first receiving cavity is connected to a first negative pressure source, and the second receiving cavity is connected to a second negative pressure source; the negative pressure provided by the second negative pressure source is greater than the negative pressure provided by the first negative pressure source; an empty first gas cylinder is provided between the first receiving cavity and the first negative pressure source, and an empty second gas cylinder is provided between the second receiving cavity and the second negative pressure source.

2. The PCBA board packaging apparatus of claim 1, wherein, The first gas cylinder and the second gas cylinder each have two connection ports near their tops. One end of each connection port is connected to the interior of the first gas cylinder or the second gas cylinder, and the other end is connected to the first negative pressure source or the second negative pressure source through a pipe.

3. The PCBA board packaging apparatus of claim 2, wherein, The first gas cylinder and the second gas cylinder are arranged adjacent to each other; the four connection ports are located on the same straight line.

4. The PCBA board packaging apparatus of claim 3, wherein, The tops of the first gas cylinder and the second gas cylinder are respectively fixedly connected to the first mounting plate via connecting plates.

5. The PCBA board packaging equipment according to claim 4, characterized in that, The first negative pressure source and the second negative pressure source are installed vertically aligned, and the first negative pressure source and the second negative pressure source are fixedly connected to the second mounting plate; the second mounting plate is perpendicular to the first mounting plate.

6. The PCBA board packaging equipment according to claim 5, characterized in that, The PCBA board packaging equipment also includes an installation platform, on which the first moving component, the workbench, the first mounting plate, and the second mounting plate are all mounted.

7. The PCBA board packaging equipment according to claim 6, characterized in that, The first mounting plate is disposed on the side of the first movable component opposite to the adhesive spraying component, and the second mounting plate is disposed on the side of the first mounting plate opposite to the first movable component.

8. The PCBA board packaging equipment according to claim 7, characterized in that, The first gas cylinder and the second gas cylinder are arranged adjacent to each other in the first horizontal direction.

9. The PCBA board packaging equipment according to claim 1, characterized in that, The capacity of the first gas cylinder is 1L to 5L; the capacity of the second gas cylinder is 1L to 5L.

10. The PCBA board packaging equipment according to claim 9, characterized in that, The capacity of both the first and second gas cylinders is 2L.

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