A power box and a range hood

Abstract

The utility model provides a kind of power box and extractor hood, belong to kitchen appliance equipment technical field.The power box includes: box body, PCB board, IPM module and radiator;Box body top end opening, PCB board is installed in box body and covers top end opening, IPM module is welded on the bottom surface of PCB board and is electrically connected with PCB board;Wherein, PCB board is at least integrated motor drive module and switch control module;Box body bottom is provided with radiator mounting port, radiator is installed in radiator mounting port, and is close to or adheres with IPM module;The outer surface of the bottom of radiator protrudes from the outer surface of the bottom of box body and is in heat-conducting contact with external heat transfer member.Radiator is adhered with IPM module, and form efficient heat conduction path.Radiator is convex, can be in close contact with shell, and utilize conduction heat dissipation to effectively export heat.This mode is superior to traditional air cooling in closed windless environment, can significantly reduce IPM module temperature, improve system stability and life.

Description

Technical Field

[0001] This utility model relates to the field of kitchen electrical equipment technology, and in particular to a power supply box and a range hood. Background Technology

[0002] In modern integrated kitchen appliances, especially high-end range hoods, higher demands are placed on the performance and miniaturization of the electronic control system. Due to the extremely limited installation space on top of the range hood, traditional power boxes are often too large or poorly designed for heat dissipation, hindering functional upgrades and structural optimization. Meanwhile, the intelligent power module (IPM module), as the core component of the drive motor, generates significant heat and requires stringent thermal management. In the enclosed environment of the appliance box, air convection is poor, and traditional air-cooling structures relying on heat sinks and natural convection are inefficient, easily leading to IPM module overheating and affecting system stability and lifespan.

[0003] Furthermore, IPM modules are typically soldered to the PCB board via pins. The soldered areas have relatively weak mechanical strength, making them highly susceptible to pin breakage or PCB board deformation during assembly or transportation, especially from pressure applied by the heatsink, leading to electrical connection failure. Current technologies lack effective protection mechanisms to prevent such problems. Therefore, there is an urgent need for a compact, efficiently heat-dissipating, mechanically protected, and well-sealed integrated power supply box to meet the demands of space-constrained, high-reliability applications. Utility Model Content

[0004] To address the aforementioned problems, the purpose of this invention is to provide a power supply box that effectively dissipates heat in a confined installation space and prevents damage to the soldered pins of the IPM module from compression.

[0005] In a first aspect, the present invention provides a power supply box, comprising: a box body, a PCB board, an IPM module, a support pad, and a heat sink; The box body has an opening at the top, the PCB board is installed inside the box body and covers the top opening, the IPM module is soldered to the bottom surface of the PCB board and electrically connected to the PCB board; wherein, the PCB board integrates at least a motor drive module and a switch control module; The bottom of the box has a heat sink mounting port, and the heat sink is installed in the heat sink mounting port and is close to or in contact with the IPM module; The outer surface of the bottom of the radiator protrudes from the outer surface of the bottom of the housing and makes thermal contact with the external heat transfer components.

[0006] Furthermore, it also includes a support pad, which is disposed between the bottom surface of the IPM module and the PCB board. The support pad includes a support plate and support protrusions respectively disposed at both ends of the support plate and extending downward. The free end of the support protrusion is higher than or flush with the bottom surface of the IPM module. The free end of the support protrusion is in close contact with the heat sink. The support pad partially surrounds the IPM module from top to bottom to form a buffer zone.

[0007] Furthermore, the radiator mounting opening is stepped, including at least one stepped surface; The shape of the heat sink is adapted to the heat sink mounting port, and it is located at the heat sink mounting port and close to the IPM module.

[0008] Furthermore, it also includes sealing gaskets; The sealing gasket is disposed on the stepped surface for sealing the radiator with the radiator mounting port.

[0009] Furthermore, the inner sidewall of the box is provided with reinforcing ribs for supporting the PCB board; The opening edge of the box body extends inward to form a snap-fit ​​protrusion; One edge of the PCB board overlaps the reinforcing rib, and the other edge is limited or fixed by the snap-fit ​​protrusion to fix the PCB board in the box.

[0010] Furthermore, a fixing post is also provided inside the box; The free end of the fixed column is provided with a first threaded hole; The PCB board is provided with fixing holes corresponding to the positions of the fixing posts; The PCB board is fixed to the housing by passing through the fixing hole with the first fastener and connecting to the first threaded hole.

[0011] Furthermore, the box body is also equipped with multiple support columns; The free end of the support column abuts against the PCB board; Multiple support columns are distributed around the radiator.

[0012] Furthermore, the support pad is provided with mounting holes; The radiator is provided with connection holes; The PCB board is provided with a second threaded hole corresponding to the mounting hole; The second fastener passes sequentially through the second threaded hole, the connecting hole, and the mounting hole to fix the support pad and the heat sink to the PCB board; The free end of the second fastener is higher than or flush with the top surface of the IPM module.

[0013] Furthermore, the outer edge of the box is also provided with a wire harness claw.

[0014] The wire harness claw includes a flexible slot structure for clamping and securing cables leading to external devices.

[0015] In a second aspect, a range hood is provided, comprising a housing and a power supply box as described above, mounted on the housing; The housing is an external heat transfer component, and the bottom of the radiator is in thermal contact with the housing.

[0016] This utility model has the following advantages or beneficial effects: By creating a heat sink mounting port at the bottom of the housing and directly installing the heat sink within this port, bringing it close to or flush with the IPM module, an efficient and direct heat conduction path is achieved from the heat source (IPM module) to the heat sink. The outer surface of the heat sink's bottom protrudes from the housing, allowing for large-area, close thermal contact with external heat transfer components, rapidly transferring heat to the larger heat sink. This conductive heat dissipation method is significantly superior to traditional air-cooling in the harsh environment of a range hood's enclosed space with poor air convection. It effectively reduces the operating temperature of the IPM module, preventing damage from overheating, thereby significantly improving the operational stability and lifespan of the entire power supply box and even the range hood system. Attached Figure Description

[0017] The above and other features and advantages of this invention will become more apparent from a detailed description of exemplary embodiments with reference to the accompanying drawings.

[0018] Figure 1 This is a first-view structural schematic diagram of a power supply box according to an exemplary embodiment; Figure 2 This is a second-view structural schematic diagram of a power supply box according to an exemplary embodiment; Figure 3 This is a schematic diagram of a power supply box with the PCB board removed, according to an exemplary embodiment. Figure 4 yes Figure 3 Enlarged view of part A in the image; Figure 5 yes Figure 3 Enlarged view of part B in the image; Figure 6 This is a schematic diagram of a power supply box without a heat sink, according to an exemplary embodiment.

[0019] The reference numerals in the attached figures are explained as follows: 1. Box body, 2. PCB board, 3. IPM module, 4. Support pad, 5. Heat sink, 6. Stepped surface, 7. Reinforcing rib, 8. Snap-fit ​​protrusion, 9. Fixing post, 10. First fastener, 11. Support post, 12. Second fastener, 13. Wire harness clip. 41. Support plate; 42. Support protrusion. Detailed Implementation

[0020] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the present invention will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore their detailed description will be omitted.

[0021] The terms “a,” “one,” “the,” and “the” are used to indicate the existence of one or more elements / components / etc.; the terms “including” and “having” are used to indicate an open-ended meaning of inclusion and that other elements / components / etc. may exist in addition to the listed elements / components / etc.

[0022] Figure 1 This is a first-view structural schematic diagram of a power supply box according to an exemplary embodiment; Figure 2 This is a second-view structural schematic diagram of a power supply box according to an exemplary embodiment; Figure 3 This is a schematic diagram of a power supply box with the PCB board removed, according to an exemplary embodiment. Figure 4 yes Figure 3 Enlarged view of part A in the image; Figure 5 yes Figure 3 Enlarged view of part B in the image; Figure 6 This is a schematic diagram illustrating a power supply box without a heat sink according to an exemplary embodiment. The above schematic diagram is only for illustrating the structural relationships related to the inventive point and is not intended as an actual scale of a product.

[0023] Example 1 like Figures 1 to 6As shown in the figure, a power supply box according to an embodiment of this utility model has a compact overall structure design, suitable for integrated kitchen appliances with limited space, especially small installation areas such as the top of the range hood, and can meet the reliable operation requirements of high-performance electronic control systems in limited spaces. The power supply box includes a box body 1, a printed circuit board (PCB board 2), an intelligent power module (IPM module 3), a support pad 4, and a heat sink 5. The box body 1, as the main structural body of the entire power supply box, is used to house and protect the internal electronic components. It is injection molded from high-temperature resistant and flame-retardant engineering plastics, and has good mechanical strength and electrical insulation properties.

[0024] The top of the housing 1 is open, and the PCB board 2 is installed inside the housing 1, covering the top opening. The IPM module 3 is soldered to the bottom surface of the PCB board 2 and electrically connected to the PCB board 2. The PCB board 2 integrates at least a motor drive module and a switch control module. The PCB board 2 is stably installed through multiple fixing structures. Specifically, reinforcing ribs 7 are provided on the inner sidewall of the housing 1 to support the PCB board 2. These reinforcing ribs 7 not only enhance the structural strength of the housing 1 but also serve as one side support point for the PCB board 2. At the same time, the opening edge of the housing 1 extends inward to form snap-fit ​​protrusions 8. There are three sets of snap-fit ​​protrusions 8, each set including two snap-fit ​​protrusions 8 symmetrically arranged on both sides of the housing 1, used to limit and snap-fit ​​the other edge of the PCB board 2. During assembly, one edge of the PCB board 2 overlaps the reinforcing ribs 7, and the other edge is embedded between the snap-fit ​​protrusions 8 to achieve positioning and prevent detachment. In addition, a fixing post 9 is provided inside the box 1, and the free end of the fixing post 9 is provided with a first threaded hole; a fixing hole is provided at the corresponding position on the PCB board 2; the first fastener 10 passes through the fixing hole in sequence and is screwed into the first threaded hole to connect, thereby firmly fixing the PCB board 2 inside the box 1 to ensure that it does not loosen under vibration or impact.

[0025] To further enhance the structural stability of the PCB board 2, support columns 11 are also provided inside the housing 1. Four support columns 11 are provided, positioned near the four corners of the IPM module 3. The free ends of the support columns 11 abut against the bottom surface of the PCB board 2, providing auxiliary support and preventing the PCB board 2 from bending downwards under stress. Especially when the IPM module 3 is heavy or subjected to external pressure, it effectively distributes the load and protects the reliability of the soldered connections of the IPM module 3.

[0026] A support pad 4, made of insulating material, is also installed on the PCB board 2 to support and protect the IPM module 3. The support pad 4 is positioned between the IPM module 3 and the bottom surface of the PCB board 2. The support pad 4 includes a support plate 41 and support protrusions 42 extending downward from both ends of the support plate 41. The free ends of the support protrusions 42 are higher than or flush with the bottom surface of the IPM module 3, and are in close contact with the heat sink 5. The support pad 4 partially surrounds the IPM module 3 from top to bottom, forming a buffer zone. The support pad 4 is fixed to the PCB board 2 by a second fastener 12: specifically, the support pad 4 has mounting holes, the heat sink 5 has connection holes, and the PCB board 2 has corresponding second threaded holes; the second fastener 12 passes through the gasket, the second threaded hole, the connection hole, and the mounting hole in sequence and is tightened to securely fix the support pad 4 and the heat sink 5 to the PCB board 2.

[0027] The IPM module 3 is mounted in the buffer zone between the support protrusions 42. Its pins extend backward from both sides of the support plate 41 and are electrically connected to the pads on the PCB board 2 by soldering. To prevent the pins of the IPM module 3 from breaking or the PCB board 2 from damage due to external pressure during assembly or use, this design incorporates a four-layer protection mechanism. The first layer of protection is the support pad 4 structure itself: the free end of the support protrusion 42 is higher than or flush with the top surface of the IPM module 3, so that when external pressure is applied to the top of the IPM module 3, the support protrusion 42 bears the load first, preventing the force from being directly transmitted to the soldered pins. The second layer of protection is the heat sink 5 mounting structure: the housing 1 has a stepped heat sink mounting opening with a bottom shaped section and at least one stepped surface 6. The shape of the heat sink 5 is adapted to the heat sink mounting opening and it is fixed in the mounting opening by a second fastener 12, thereby limiting the displacement of the heat sink 5 and preventing it from squeezing the IPM module 3. The third layer of protection is the support column 11: its free end abuts against the PCB board 2 to prevent the PCB board 2 from bending downwards under pressure. The fourth layer of protection is the height design of the second fastener 12: the free end of the second fastener 12 is higher than or flush with the top surface of the IPM module 3, that is, its axial length is slightly greater than or equal to the total thickness H2 of the PCB board 2 and the IPM module 3 after welding plus the spacer. Thus, when the heat sink 5 is press-fitted, the second fastener 12 can contact the heat sink 5 or the support structure in advance to share the pressure and avoid the IPM module 3 being directly stressed.

[0028] The heat sink 5 is installed inside the heat sink mounting port of the housing 1 and is close to or in contact with the IPM module 3 to achieve efficient heat conduction. The outer surface of the heat sink 5 protrudes from the outer surface of the housing 1, which helps to increase the heat dissipation area and improve heat dissipation efficiency. Thermal grease is applied between the heat sink 5 and the IPM module 3, and this thermal grease is applied to the inner surface of the heat sink 5. The outer surface of the bottom protrudes from the outer surface of the bottom of the housing 1 and makes thermal contact with the external heat transfer components. The outer surface of the heat sink 5 is slightly higher than the outer surface of the housing 1 by 0.3mm to 0.5mm. After the heat sink 5 is pressed together, a uniform thermally conductive layer is formed to ensure that heat is quickly transferred from the IPM module 3 to the heat sink 5. Since this power supply box is usually used in a closed electrical box environment with no internal air convection, the traditional air cooling structure of the heat sink tower is not effective. However, this design achieves good heat dissipation performance even without air cooling by using the heat sink 5 in close contact with the housing 1. This is superior to the traditional air cooling structure.

[0029] To ensure the airtightness of the radiator mounting opening and prevent external oil, moisture, or dust from entering the housing 1 and affecting electrical performance, a sealing gasket is provided on the stepped surface 6 of the radiator mounting opening. This sealing gasket has a U-shaped structure, can be made of silicone material, has a thickness of 1mm, and a deformation of 0.2mm under compression. It can effectively fill the gap between the radiator 5 and the housing 1, achieving a sealing effect with an IP65 or higher protection level.

[0030] A wire harness clip 13 is also provided on the outer edge of the housing 1. The wire harness clip 13 includes a flexible slot structure for clamping and securing cables leading to external devices. External devices include at least one of switches, LED lights, and push rod motors. The wire harness clips 13 are distributed along the outer wall of the housing 1 to rationally plan the cable routing, prevent cables from becoming loose, worn, or affected by tension, thus improving the assembly efficiency and safety of the entire machine.

[0031] In summary, this utility model solves the installation problem of high-performance power board components in confined spaces such as the top of a range hood through an integrated, miniaturized design. The synergistic action of the support pad 4, the stepped heat sink mounting port, the support column 11, and the second fastener 12 constructs a quadruple mechanical protection system, effectively preventing damage to the solder pins between the IPM module 3 and the PCB board 2 due to pressure during installation or use, significantly improving product reliability and lifespan. Simultaneously, the optimized heat dissipation structure and sealing design make it suitable for high-temperature, high-humidity, and oily kitchen environments, demonstrating excellent engineering application potential.

[0032] Example 2 An embodiment of the present invention provides a range hood, comprising a housing and a power supply box as described in Embodiment 1 above, mounted on the housing; the housing is an external heat transfer component, and the bottom of the radiator 5 is in thermal contact with the housing to conduct heat generated by the IPM module 3 outward through the housing.

[0033] In this embodiment of the invention, the term "multiple" refers to two or more, unless otherwise explicitly defined. The terms "install," "connect," and "fix" should be interpreted broadly. For example, "connect" can mean a fixed connection, a detachable connection, or an integral connection. Those skilled in the art can understand the specific meaning of the above terms in this embodiment of the invention based on the specific circumstances.

[0034] In the description of the embodiments of this utility model, it should be understood that the terms "upper" and "lower" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this utility model and simplifying the description, and do not indicate or imply that the device or unit referred to must have a specific direction or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this utility model.

[0035] In this specification, the terms "an embodiment," "a preferred embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0036] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. For those skilled in the art, the present utility model can have various modifications and variations. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A power supply box, characterized in that, include: Box (1), PCB board (2), IPM module (3) and heat sink (5); The box (1) has an opening at the top, the PCB board (2) is installed inside the box (1) and covers the opening at the top, and the IPM module (3) is soldered to the bottom surface of the PCB board (2) and electrically connected to the PCB board (2); wherein the PCB board (2) integrates at least a motor drive module and a switch control module; The bottom of the box (1) is provided with a heat sink mounting port, and the heat sink (5) is installed in the heat sink mounting port and is close to or attached to the IPM module (3); The outer surface of the bottom of the radiator (5) protrudes from the outer surface of the bottom of the box (1) and makes thermal contact with the external heat transfer element.

2. A power supply box according to claim 1, characterized in that, It also includes a support pad (4), which is disposed between the bottom surface of the IPM module (3) and the PCB board (2). The support pad (4) includes a support plate (41) and support protrusions (42) respectively disposed at both ends of the support plate (41) and extending downward. The free end of the support protrusion (42) is higher than or flush with the bottom surface of the IPM module (3). The free end of the support protrusion (42) is close to the heat sink (5). The support pad (4) partially surrounds the IPM module (3) from top to bottom to form a buffer zone.

3. A power supply box according to claim 1, characterized in that, The bottom of the radiator mounting port is stepped, including at least one stepped surface (6); The shape of the heat sink (5) is adapted to the heat sink mounting port, and it is located at the heat sink mounting port and close to or attached to the IPM module (3).

4. A power supply box according to claim 3, characterized in that, It also includes sealing gaskets; The sealing gasket is disposed on the stepped surface (6) for sealing the radiator (5) with the radiator mounting port.

5. A power supply box according to claim 1, characterized in that, The inner wall of the box (1) is provided with reinforcing ribs (7) for supporting the PCB board (2); The opening edge of the box (1) extends inward to form a snap-fit ​​protrusion (8); One edge of the PCB board (2) overlaps with the reinforcing rib (7), and the other edge is limited or fixed by the snap-fit ​​protrusion (8) to fix the PCB board (2) inside the box (1).

6. A power supply box according to claim 1, characterized in that, The box body (1) is also provided with a fixing column (9); The free end of the fixed column (9) is provided with a first threaded hole; The PCB board (2) is provided with fixing holes corresponding to the positions of the fixing posts (9); The first fastener (10) passes through the fixing hole and is connected to the first threaded hole.

7. A power supply box according to claim 1, characterized in that, The box body (1) is also provided with multiple support columns (11); The free end of the support column (11) abuts against the PCB board (2); Multiple support columns (11) are distributed around the radiator (5).

8. A power supply box according to claim 2, characterized in that, The support pad (4) is provided with mounting holes; The radiator (5) is provided with connection holes; The PCB board (2) is provided with a second threaded hole corresponding to the mounting hole; The second fastener (12) passes through the second threaded hole, the mounting hole and the connecting hole in sequence to fix the support pad (4) and the heat sink (5) onto the PCB board (2).

9. A power supply box according to claim 1, characterized in that, The outer edge of the box (1) is also provided with a wire harness claw (13); The wire harness claw (13) includes a resilient slot structure for clamping and securing cables leading to external devices.

10. A range hood, characterized in that, Includes a housing and a power supply box as described in any one of claims 1 to 9 mounted on the housing; the housing is an external heat transfer element, and the bottom of the heat sink (5) is in thermal contact with the housing.

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