Heat dissipation structure and optical module heat dissipation system

Abstract

The utility model discloses an embodiment of a kind of heat dissipation structure and optical module heat dissipation system, wherein, heat dissipation structure includes first cover, second cover and heat conduction component, first cover and second cover are respectively provided with first connecting groove and second connecting groove, first connecting groove and second connecting groove respectively extend along the width direction of first cover and second cover, and heat conduction component connects first cover and second cover by first connecting groove and second connecting groove. Heat conduction component is used to connect first cover and second cover, and groove is opened on first cover and second cover, so that heat conduction component can directly contact optical module and heat dissipation plate to realize heat conduction, and the structure is simple and heat conduction is fast, and stable and efficient heat dissipation can be realized.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation structure technology, specifically to a heat dissipation structure and an optical module heat dissipation system. Background Technology

[0002] As the integration density and power consumption of optical modules continue to rise, heat dissipation has become a key factor restricting their stability and performance. The industry commonly uses heat sinks as the main heat dissipation structure for optical modules. However, since optical modules are inserted and removed individually, the pressure exerted on the heat sink during insertion and removal can affect the contact between the heat sink and other optical modules.

[0003] Existing technologies use a buffer component between the heat sink and the optical module to absorb insertion and extraction stress and maintain contact stability. However, most buffer components have complex heat conduction structures and low heat dissipation efficiency. Utility Model Content

[0004] In view of this, one embodiment of the present invention provides a heat dissipation structure and an optical module heat dissipation system, which has a simple structure and fast heat conduction speed, and achieves stable and efficient heat dissipation.

[0005] In a first aspect, embodiments of the present invention provide a heat dissipation structure, comprising: A first cover plate, a second cover plate, and a heat-conducting component are provided. The first cover plate has a first connecting groove, and the second cover plate has a second connecting groove. The first connecting groove extends along the width direction of the first cover plate, and the second connecting groove extends along the width direction of the second cover plate. The upper and lower ends of the heat-conducting component are connected to the first cover plate and the second cover plate through the first connecting groove and the second connecting groove, respectively.

[0006] Optionally, the heat dissipation structure further includes an even number of spring contacts, all of which are connected between the first cover plate and the second cover plate, and all of which are symmetrically arranged on both sides of the heat-conducting component.

[0007] Optionally, the spring sheet includes an integrally formed connecting portion and at least one V-shaped elastic portion. The connecting portion has at least one elastic groove, and the V-shaped elastic portion is correspondingly connected to the elastic groove.

[0008] Optionally, the second cover plate forms a positioning protrusion at a position corresponding to the connecting part, the connecting part forms a groove-shaped structure on the side facing the positioning protrusion, and the positioning protrusion is connected to the connecting part.

[0009] Optionally, the heat-conducting component includes multiple heat-conducting units arranged in an array, wherein the number of the first connecting slots and the number of the second connecting slots are the same as the number of heat-conducting units and their positions correspond.

[0010] Optionally, each of the heat-conducting units includes two extensions and a bend, with the two extensions disposed at both ends of the bend, and each heat-conducting unit is connected to the first cover plate and the second cover plate respectively through the two extensions.

[0011] Optionally, one end of each heat-conducting unit extends into the first connecting groove and its two sides contact the inner wall of the first connecting groove, and the other end of each heat-conducting unit extends into the second connecting groove and its two sides contact the inner wall of the second connecting groove.

[0012] Optionally, the first connecting groove passes through the first cover plate, and the second connecting groove passes through the second cover plate.

[0013] Optionally, the first cover plate includes a first connecting plate and a first plug-in plate, the first connecting plate being connected to the first plug-in plate, and the first connecting groove being formed on the first plug-in plate and extending to the edge of the first plug-in plate; The second cover plate includes a second connecting plate and a second plug-in plate. The second connecting plate is connected to the second plug-in plate, and the second connecting groove is formed on the second plug-in plate and extends to the edge of the second plug-in plate.

[0014] Optionally, each of the first connecting grooves extends to the edge on one side of the first cover plate along the width direction, and each of the second connecting grooves extends to the edge on one side of the second cover plate along the width direction, with the first connecting groove and the second connecting groove extending in the same direction.

[0015] Secondly, this utility model embodiment provides an optical module heat dissipation system, comprising: The cage frame includes multiple plug-in racks arranged in multiple rows; Multiple heat sinks are mounted on the cage frame, and each row of plug-in brackets is connected to at least one heat sink. The plurality of heat dissipation structures are provided, and one or two heat dissipation structures are movably disposed on each of the plug-in brackets. The first cover plate of each heat dissipation structure is connected to the heat dissipation plate.

[0016] One embodiment of this utility model provides a heat dissipation structure and an optical module heat dissipation system. The heat dissipation structure includes a first cover plate, a second cover plate, and a heat-conducting component. The first and second cover plates are respectively provided with a first connecting groove and a second connecting groove, extending along the width direction of the first and second cover plates, respectively. The heat-conducting component connects the first and second cover plates through the first and second connecting grooves. By using a heat-conducting component to connect the first and second cover plates, and by creating grooves on the first and second cover plates, the heat-conducting component can directly contact the optical module and the heat sink to achieve heat conduction. This results in a simple structure with rapid heat conduction, enabling stable and efficient heat dissipation. Attached Figure Description

[0017] The above and other objects, features, and advantages of the present invention will become clearer from the following description of embodiments of the present invention with reference to the accompanying drawings, in which: Figure 1 This is a three-dimensional structural diagram of an optical module heat dissipation system according to an embodiment of the present invention; Figure 2 This is a partially enlarged schematic diagram of the heat dissipation structure in an optical module heat dissipation system according to an embodiment of this utility model; Figure 3 This is an exploded view of the heat dissipation structure according to an embodiment of the present invention; Figure 4 This is a side view of a heat dissipation structure according to an embodiment of the present invention; Figure 5 This is a front view of a heat dissipation structure according to an embodiment of the present invention; Figure 6 This is a partially enlarged view of the connection between the extension and the first connecting groove in one embodiment of the present invention; Figure 7 This is a schematic diagram of a heat dissipation structure according to an embodiment of the present invention; Figure 8 This is a schematic diagram of a heat dissipation structure according to another embodiment of the present invention; Figure 9 This is a schematic diagram of a heat dissipation structure according to another embodiment of the present invention; Figure 10 This is a partially enlarged schematic diagram of the first cover plate according to an embodiment of the present invention; Figure 11 This is a partially enlarged schematic diagram of the first cover plate according to another embodiment of the present invention; Figure 12 This is a partially enlarged schematic diagram of the first cover plate according to another embodiment of the present invention; Figure 13 This is a schematic diagram of the internal structure of a heat sink according to an embodiment of the present invention.

[0018] Explanation of reference numerals in the attached figures: 1-Cage frame; 11-Floating hole; 21-First cover plate; 211-First connecting groove; 212-First connecting plate; 213-First plug-in plate; 22-Second cover plate; 221-Second connecting groove; 222-Second connecting plate; 223-Second plug-in plate; 224-Positioning protrusion; 23-Heat-conducting component; 231-Extension; 232-Bending part; 24-Contact part; 3-Spring; 31-Connecting part; 32-Elastic part; 33-Elastic groove; 4-Heat dissipation plate; 5-Circuit board. Detailed Implementation

[0019] The present application is described below based on embodiments, but it is not limited to these embodiments. In the detailed description of the present application below, certain specific details are described in detail. Those skilled in the art can fully understand the present application without these details. To avoid obscuring the substance of the present application, well-known methods, processes, flows, elements, and circuits are not described in detail.

[0020] Furthermore, those skilled in the art should understand that the accompanying drawings provided herein are for illustrative purposes only, and the scale shown in the drawings is only one embodiment; other embodiments are not necessarily implemented to scale.

[0021] Unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0022] For ease of explanation, spatially related terms such as “inside,” “outside,” “below,” “below,” “lower,” “above,” “upper,” etc., are used herein to describe the relationship between one element or feature illustrated in the figure and another. It will be understood that spatially related terms may be intended to encompass different orientations of the device in use or operation besides those depicted in the figure. For example, if the device in the figure is flipped, an element described as “below” or “below” another element or feature would then be positioned “above” that other element or feature. Thus, the exemplified term “below” can encompass both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially related descriptive terms used herein should be interpreted accordingly.

[0023] Unless the context explicitly requires it, words such as "including" or "contains" throughout the application should be interpreted as including rather than exclusive or exhaustive; that is, meaning "including but not limited to".

[0024] In the description of this application, it should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, in the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0025] Reference Figures 1-3 The heat dissipation structure of this embodiment includes a first cover plate 21, a second cover plate 22, and a heat-conducting component 23. The first cover plate 21 is in contact with the heat sink 4 to ensure that the heat conduction efficiency is not affected by the tilting or movement of the heat sink 4. The second cover plate 22 is in contact with the heat source to ensure that the heat generated by the heat source can be effectively conducted away. The heat-conducting component 23 conducts heat and is connected to the first cover plate 21 and the second cover plate 22 to achieve efficient heat conduction. Simultaneously, the first cover plate 21 and the second cover plate 22 also provide a fixed position for the heat-conducting component 23.

[0026] Depending on the actual situation, the heat source is a high-power electronic device, which may be a high-heat-generating component such as an optical module, CPU, or GPU. One embodiment of this utility model is illustrated using an optical module as an example.

[0027] Depending on the actual situation, the heat-conducting component 23 is usually made of a flexible material with high thermal conductivity, such as ultra-thin high thermal conductivity pure copper; the first cover plate 21 and the second cover plate 22 can also be made of materials with good thermal conductivity, such as high thermal conductivity pure copper. By using materials with stronger thermal conductivity, the heat dissipation efficiency can be further improved.

[0028] Specifically, refer to Figure 1 , 3 The first cover plate 21 has a first connecting groove 211, and the second cover plate 22 has a second connecting groove 221. The upper and lower ends of the heat-conducting component 23 are connected to the first cover plate 21 and the second cover plate 22 respectively through the first connecting groove 211 and the second connecting groove 221. That is, the heat-conducting component 23 is connected by extending into the first connecting groove 211 and the second connecting groove 221. Welding, such as ultrasonic welding, is usually used to connect the heat-conducting component 23 to the first cover plate 21 and the second cover plate 22. The heat-conducting component 23 can extend into the first cover plate 21 and the second cover plate 22, so that the heat generated by the optical module can be conducted more quickly from the side of the second cover plate 22 near the optical module to the side of the first cover plate 21 connected to the heat sink 4 through the heat-conducting component 23, avoiding the problem of the first cover plate 21 and the second cover plate 22 affecting the heat dissipation efficiency.

[0029] In some embodiments, such as Figure 3 As shown, the first connecting groove 211 extends along the width direction of the first cover plate 21, and the second connecting groove 221 extends along the width direction of the second cover plate 22. Correspondingly, the heat-conducting component 23 is also installed along the width direction of the second cover plate 22 to avoid increasing the installation difficulty due to excessive length.

[0030] Furthermore, referring to Figure 3 , Figure 4 , Figure 5 The second cover plate 22 has a protruding contact portion 24 on its outer side to reduce the impact on the heat dissipation structure when the optical module is inserted. Specifically, the contact portion 24 is formed as a boss structure, and its side is formed by four continuously connected inclined surfaces that taper inward. Depending on the actual situation, the contact portion 24 can also be formed with an inclined surface only on the side facing the optical module insertion direction; it can also extend to the edge of the second cover plate 22 on both sides in the width direction; it can also be formed by splicing multiple surfaces with different slopes for each inclined surface; it can also be formed as a smooth arc surface; or it can be connected by a smooth curved surface between the four continuously connected inclined surfaces, etc. It should be understood that the above structures are only examples and not limitations, and the above structures can also be combined and not exist in isolation, such as the contact portion 24 having an inclined surface only on the side facing the optical module insertion direction and extending to the edge of the second cover plate 22 on both sides in the width direction.

[0031] Due to the inclined surface, when the optical module is inserted, it first contacts the inclined surface on the front, and the heat dissipation structure is subjected to an inclined thrust. This prevents the optical module from directly impacting the heat dissipation structure, but rather pushes it through the guide of the inclined surface.

[0032] In some embodiments, refer to Figure 6 The heat-conducting component 23 includes multiple heat-conducting units arranged in an array. The number of first connecting grooves 211 and the number of second connecting grooves 221 are the same as the number of heat-conducting units and their positions correspond. For a heat-conducting unit, its two ends extend into a first connecting groove 211 and a second connecting groove 221, respectively. Changing the number and density of heat-conducting units can correspondingly change the speed of heat conduction. Typically, multiple heat-conducting units are arranged in an array. For example, the heat-conducting units are arranged linearly along the length of the first cover plate 21; or the first cover plate 21 is divided into two or more parts, each connected to a heat-conducting unit, forming a multi-row, multi-column array. Preferably, the heat-conducting units are arranged linearly to facilitate the installation of the heat dissipation structure.

[0033] like Figure 4As shown, the heat-conducting component 23 is formed into a curved structure. This curved structure effectively buffers the impact during the insertion of the optical module, preventing significant displacement of the heat sink 4. For example, when the second cover plate 22 moves upward due to the insertion of the optical module, the curved structure of the heat-conducting component 23 effectively absorbs energy and buffers the impact, preventing the first cover plate 21 from moving upward significantly. Specifically, refer to... Figure 6 Each heat-conducting unit includes two extensions 231 and a bend 232. The two extensions 231 are disposed at both ends of the bend 232, so that the heat-conducting unit is formed into an approximately S-shaped structure. Each heat-conducting unit is connected to the first cover plate 21 and the second cover plate 22 respectively through the two extensions 231, and the two extensions 231 extend into the first connecting groove 211 and the second connecting groove 221 respectively.

[0034] In some embodiments, refer to Figure 6 Each heat-conducting unit has one end extending into the first connecting groove 211, with both sides contacting the inner wall of the first connecting groove 211. The other end of each heat-conducting unit extends into the second connecting groove 221, with both sides contacting the inner wall of the second connecting groove 221. In other words, for the side near the first cover plate 21, the extension 231 extends into the first connecting groove 211, with both sides contacting the inner wall of the first connecting groove 211; in this case, both sides of the extension 231 participate in heat conduction. Similarly, for the side near the second cover plate 22, the extension 231 extends into the second connecting groove 221, with both sides contacting the inner wall of the second connecting groove 221; in this case, both sides of the extension 231 participate in heat conduction. This dual-sided heat conduction of the extension 231 effectively improves heat dissipation efficiency.

[0035] In some embodiments, the first connecting groove 211 and the second connecting groove 221 may also be formed as shallow grooves, such that one side of the extension 231 is horizontally attached to the shallow groove. By using the shallow groove attachment method, the density of the heat-conducting unit is lower, and only one side of the extension 231 can participate in heat conduction, but its structure is easier to install.

[0036] In some embodiments, refer to Figure 6 The first connecting groove 211 penetrates the first cover plate 21, and the second connecting groove 221 penetrates the second cover plate 22. At this time, the two extensions 231 of each heat-conducting unit can extend outward along the first connecting groove 211 and the second connecting groove 221, and are at the same height as the outer surfaces of the first cover plate 21 and the second cover plate 22. Since the first cover plate 21 is connected to the heat sink 4, the extensions 231 in the first connecting groove 211 can directly contact the heat sink 4. Similarly, since the second cover plate 22 is in contact with the optical module, the extensions 231 in the second connecting groove 221 can directly contact the optical module. The heat generated by the optical module can be conducted simultaneously through the second cover plate 22 and the heat-conducting units, further improving the heat conduction efficiency.

[0037] In some embodiments, refer to Figure 3 , Figures 7-9 The heat dissipation structure also includes an even number of spring contacts 3, all of which are connected between the first cover plate 21 and the second cover plate 22. The spring contacts 3 are typically made of C18400 R540 high thermal conductivity copper alloy to provide elasticity. For example, in a position where an optical module has already been inserted, the first cover plate 21 and the second cover plate 22 are compressed, and the spring contacts 3 are in a contracted state. When an optical module is inserted in an adjacent position, the heat sink 4 may slightly move upwards due to compression. The elasticity of the spring contacts 3 ensures that the first cover plate 21 remains tightly against the heat sink 4, minimizing gaps and effectively improving the stability of the heat dissipation state and guaranteeing heat dissipation efficiency. Simultaneously, the elasticity of the spring contacts 3 also enhances the structural strength.

[0038] Furthermore, referring to Figures 7-9 All springs 3 are symmetrically arranged on both sides of the heat-conducting component 23 to ensure that the heat dissipation structure does not tilt. Each spring 3 includes an integrally formed connecting portion 31 and at least one V-shaped elastic portion 32. The connecting portion 31 is used to connect with the second cover plate 22, and the V-shaped elastic portion 32 abuts against the first cover plate 21, generating elasticity through its V-shaped structure. Depending on the actual situation, the structure used to generate elasticity can also be formed into other elastic shapes such as U-shape or Z-shape. At least one elastic groove 33 is provided on the connecting portion 31, and the V-shaped elastic portion 32 is correspondingly connected to the elastic groove 33. Depending on the actual situation, the V-shaped elastic portion 32 is often integrally formed with the connecting portion 31. The protruding V-shaped structure of the V-shaped elastic portion 32 is achieved through folding, so its free end will form a gap with the connecting portion 31, i.e., the elastic groove 33. It should be understood that the above description is only an example and is not intended to limit the scope; the V-shaped elastic portion 32 can also be separately arranged and welded to the connecting portion 31.

[0039] In some embodiments, refer to Figure 5 , Figures 7-9 A positioning protrusion 224 is formed at a position corresponding to the connecting part 31 on the second cover plate 22. A groove-shaped structure is formed on the side of the connecting part 31 facing the positioning protrusion 224, and the positioning protrusion 224 connects to the connecting part 31. The positioning protrusion 224 creates a larger surface area, facilitating a more reliable connection with the connecting part 31. The width of the positioning protrusion 224 can be adjusted according to actual needs to achieve a better connection effect. The groove-shaped structure can match the shape of the positioning protrusion 224, improving connection stability. Depending on the actual needs, the connection between the positioning protrusion 224 and the connecting part 31 can be achieved through various connection methods such as snap-fit ​​connection or welding.

[0040] Reference Figures 7-11The structure of the first cover plate 21 and the second cover plate 22, as well as the position of the spring piece 3, can also be different.

[0041] Taking the second cover plate 22 as an example, such as Figure 7 As shown, the two spring tabs 3 are the same length as the second cover plate 22, and the length of the positioning protrusion 224 is also the same as the length of the second cover plate 22. Each second connecting groove 221 extends along both ends of the second cover plate 22 in the width direction and stops near the positioning protrusions 224 on both sides. When installing the heat-conducting assembly 23, it needs to be connected from above the second connecting groove 221, so that its extension 231 extends into the second connecting groove 221. The stability of the entire structure is ensured by the setting of the long spring tabs 3 and the integrated second cover plate 22. Accordingly, refer to Figure 10 The length of the first connecting groove 211 on the first cover plate 21 is the same as that of the second connecting groove 221.

[0042] like Figure 8 As shown, there are four spring pieces 3. Two spring pieces 3 located in the width direction of the second cover plate 22 form a group, and two groups of spring pieces 3 are respectively located at both ends in the length direction of the second cover plate 22. Positioning protrusions 224 are correspondingly provided only at positions corresponding to the spring pieces 3. Each second connecting groove 221 extends to the edge on one side of the second cover plate 22 along the width direction, thus forming a lateral opening. Since the connecting portion 31 of the spring piece 3 has a continuous structure, even if a lateral opening is formed on the positioning protrusion 224, a stable connection can be formed with the connecting portion 31.

[0043] Reference Figure 8 When installing the heat-conducting component 23, the extension 231 of the heat-conducting unit can slide into the second connecting groove 221 through the lateral opening formed by the second connecting groove 221 to achieve installation. The length of the heat-conducting component 23 is less than the length of the second connecting groove 221. Specifically, the length of the heat-conducting component 23 does not exceed the distance between the two positioning protrusions 224, to avoid the installation of the spring piece 3 affecting the setting of the heat-conducting component 23. The shorter and symmetrical spring piece 3, and the setting of the lateral opening of the second connecting groove 221, improve the installation efficiency of the heat dissipation structure.

[0044] Similarly, such as Figure 11 As shown, the configuration on the first cover plate 21 is the same as that on the second cover plate 22. Each first connecting groove 211 extends to the edge on one side of the first cover plate 21 along the width direction. The first connecting groove 211 and the second connecting groove 221 extend in the same direction to avoid stretching and twisting of the heat-conducting unit due to opposite opening directions, which would affect the heat dissipation efficiency.

[0045] like Figure 9As shown, there are four spring pieces 3. Two spring pieces 3 located in the width direction of the second cover plate 22 form a group, and the two groups of spring pieces 3 are respectively arranged symmetrically in the length direction of the second cover plate 22. The second cover plate 22 includes a second connecting plate 222 and a second insert plate 223. The second connecting plate 222 is connected to the second insert plate 223. At this time, a second connecting groove 221 is formed on the second insert plate 223 and extends to the edge of the second insert plate 223, thus forming a lateral opening. Positioning protrusions 224 are respectively arranged on the second connecting plate 222 and the second insert plate 223 at positions corresponding to the spring pieces 3. Since the connecting portion 31 of the spring piece 3 has a continuous structure, even if a lateral opening is formed on the positioning protrusion 224, a stable connection can be formed with the connecting portion 31.

[0046] Reference Figure 9 When installing the heat-conducting component 23, the extension 231 of the heat-conducting unit can slide into the second connecting groove 221 through the lateral opening formed by the second connecting groove 221 to achieve installation. After the heat-conducting component 23 is installed, the second connecting plate 222 and the second plug-in plate 223 are connected by welding. The length of the heat-conducting component 23 is less than the length of the second connecting groove 221. Specifically, the length of the heat-conducting component 23 does not exceed the distance between the two positioning protrusions 224, so as to avoid the welding of the second connecting plate 222 and the installation of the spring piece 3 affecting the setting of the heat-conducting component 23. The shorter and symmetrical spring piece 3 and the setting of the lateral opening of the second connecting groove 221 improve the installation efficiency of the heat dissipation structure.

[0047] Similarly, such as Figure 12 As shown, the configuration on the first cover plate 21 is the same as that on the second cover plate 22. The first cover plate 21 includes a first connecting plate 212 and a first plug-in plate 213. The first connecting plate 212 is connected to the first plug-in plate 213. The first connecting groove 211 is formed on the first plug-in plate 213 and extends to the edge of the first plug-in plate 213.

[0048] It should be understood that the above are merely examples and not intended as limitations. The structures of the first cover plate 21 and the second cover plate 22 can be combined with different arrangements of the spring pieces 3. For example, for an integrated first cover plate 21 and second cover plate 22, two sets of spring pieces 3 can be respectively arranged at symmetrical positions along the length of the second cover plate 22; for a first cover plate 21 and a second cover plate 22 formed by connecting a connecting plate and a plug-in plate, two spring pieces 3 of the same length as the second cover plate 22 can be connected to the second cover plate 22.

[0049] Based on this, refer to Figure 1 , Figure 2 , Figure 13The optical module heat dissipation system of this embodiment includes a cage 1, a heat sink 4, and the heat dissipation structure described above. The cage 1 supports and provides installation space for the optical module. The cage 1 includes multiple plug-in brackets arranged in multiple rows. Depending on the actual situation, it is usually set to 32, 64, or other numbers of plug-in brackets for use by the optical module. The heat sink 4 is used for heat dissipation and cooling to prevent the large amount of heat generated by the optical module during operation from affecting normal operation.

[0050] like Figure 1 As shown, specifically, the cage frame 1 is formed into a multi-row structure, with multiple heat dissipation plates 4 mounted on the cage frame 1. Each row of plug-in frames is connected to at least one heat dissipation plate 4, and each row of plug-in frames has multiple plug-in portions. Each plug-in portion corresponds to a heat dissipation structure. Furthermore, each plug-in portion has an elastic element located on the opposite side of the heat dissipation structure. This elastic element can apply a spring force to the inserted optical module in the direction of the heat dissipation structure. Depending on the actual situation, since the optical module needs to transmit information, a circuit board 5 is connected to the plug-in frame so that the optical module can be electrically connected to the circuit board 5 after insertion. Each plug-in frame has one or two heat dissipation structures movably mounted, and the first cover plate 21 of each heat dissipation structure is connected to the heat dissipation plate 4. Preferably, the heat dissipation structure is provided on the side of the plug-in frame closer to the heat dissipation plate 4.

[0051] by Figure 1 Taking the cage 1 of the four-row plug-in bracket as an example, the circuit board 5 is located between the second and third rows of plug-in brackets. The plug-in brackets, heat sinks 4, and heat dissipation structures are symmetrically arranged on the upper and lower sides of the circuit board 5. For example, for the first and second rows of plug-in brackets on the upper part of the circuit board 5, two heat sinks 4 are respectively located at the top of the first and second rows of plug-in brackets. At this time, heat sinks 4 are connected to both the upper and lower sides of the first row of plug-in brackets.

[0052] like Figure 2 As shown, each plug-in part of the first and second row plug-in frames has a floating hole 11 at its top. Heat dissipation structures are respectively located on the upper part of the first and second row plug-in frames, with their first cover plate 21 connected to the heat sink 4. The second cover plate 22, spring 3, and heat-conducting component 23 can move within the floating hole 11, which serves as a limiting mechanism. For the third and fourth row plug-in frames at the bottom of the circuit board 5, two heat sinks 4 are respectively located at the bottom of the third and fourth row plug-in frames. Heat sinks 4 are connected to both the upper and lower sides of the fourth row plug-in frame. Heat dissipation structures are respectively located at the lower part of the third and fourth row plug-in frames, with their first cover plate 21 connected to the heat sink 4.

[0053] The bottom of each plug-in part of the third and fourth rows of plug-in brackets is provided with a floating hole 11. The heat dissipation structure is respectively set at the bottom of the third and fourth rows of plug-in brackets. Its first cover plate 21 is connected to the heat dissipation plate 4, and the second cover plate 22, the spring 3 and the heat conduction component 23 can move in the floating hole 11. The floating hole 11 realizes the function of limiting.

[0054] Specifically, each heat sink 4 has an inlet pipe and an outlet pipe connected to both sides along its length, and its interior is equipped with a flow guiding channel, such as... Figure 13 As shown, fins are installed inside the flow channel to guide the direction of water flow. The water flows along... Figure 13 The heat flows through the heat sink 4 in the indicated direction, carrying away the heat generated by the optical module. When a new optical module is inserted, it first lifts the corresponding second cover plate 22, and the contact portion 24 of the second cover plate 22 guides the pushing force. The upward movement of the second cover plate 22 compresses the spring 3 and the heat-conducting component 23. Due to the elasticity of the spring 3, the heat dissipation structure can position the optical module together with the insertion slot. The elasticity of the spring 3 may also exert a pushing force on the heat sink 4, causing it to move slightly. For optical modules already inserted next to it, the first cover plate 21 is tightly connected to the heat sink 4 and remains effectively in contact due to the pushing of the spring 3, so the heat conduction efficiency is not affected.

[0055] This application provides a heat dissipation structure and an optical module heat dissipation system. The heat dissipation structure includes a first cover plate, a second cover plate, and a heat-conducting component. The first and second cover plates are respectively provided with a first connecting groove and a second connecting groove, extending along the width direction of the first and second cover plates, respectively. The heat-conducting component connects the first and second cover plates through the first and second connecting grooves. By using a heat-conducting component to connect the first and second cover plates, and by creating grooves on the first and second cover plates, the heat-conducting component can directly contact the optical module and the heat sink to achieve heat conduction. The structure is simple and provides rapid heat conduction, enabling stable and efficient heat dissipation.

[0056] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A heat dissipation structure, characterized in that, The heat dissipation structure includes: A first cover plate, a second cover plate, and a heat-conducting component are provided. The first cover plate has a first connecting groove, and the second cover plate has a second connecting groove. The first connecting groove extends along the width direction of the first cover plate, and the second connecting groove extends along the width direction of the second cover plate. The upper and lower ends of the heat-conducting component are connected to the first cover plate and the second cover plate through the first connecting groove and the second connecting groove, respectively.

2. The heat dissipation structure according to claim 1, characterized in that, The heat dissipation structure also includes an even number of spring contacts, all of which are connected between the first cover plate and the second cover plate, and all of which are symmetrically arranged on both sides of the heat-conducting component.

3. The heat dissipation structure according to claim 2, characterized in that, The spring sheet includes an integrally formed connecting part and at least one V-shaped elastic part. At least one elastic groove is provided on the connecting part, and the V-shaped elastic part is correspondingly connected to the elastic groove.

4. The heat dissipation structure according to claim 3, characterized in that, The second cover plate forms a positioning protrusion at the position corresponding to the connecting part, and the connecting part forms a groove-shaped structure on the side facing the positioning protrusion, and the positioning protrusion is connected to the connecting part.

5. The heat dissipation structure according to claim 1, characterized in that, The heat-conducting component includes multiple heat-conducting units arranged in an array. The number of the first connecting slots and the number of the second connecting slots are the same as the number of heat-conducting units and their positions correspond.

6. The heat dissipation structure according to claim 5, characterized in that, Each of the heat-conducting units includes two extensions and a bend, with the two extensions disposed at both ends of the bend, and each heat-conducting unit is connected to the first cover plate and the second cover plate respectively through the two extensions.

7. The heat dissipation structure according to claim 5, characterized in that, One end of each heat-conducting unit extends into the first connecting groove and its two sides contact the inner wall of the first connecting groove, and the other end of each heat-conducting unit extends into the second connecting groove and its two sides contact the inner wall of the second connecting groove.

8. The heat dissipation structure according to claim 1, characterized in that, The first connecting groove passes through the first cover plate, and the second connecting groove passes through the second cover plate.

9. The heat dissipation structure according to claim 1, characterized in that, The first cover plate includes a first connecting plate and a first plug-in plate. The first connecting plate is connected to the first plug-in plate, and the first connecting groove is formed on the first plug-in plate and extends to the edge of the first plug-in plate. The second cover plate includes a second connecting plate and a second plug-in plate. The second connecting plate is connected to the second plug-in plate, and the second connecting groove is formed on the second plug-in plate and extends to the edge of the second plug-in plate.

10. The heat dissipation structure according to claim 1, characterized in that, Each of the first connecting slots extends to the edge on one side of the first cover plate along the width direction, and each of the second connecting slots extends to the edge on one side of the second cover plate along the width direction, with the first connecting slots and the second connecting slots extending in the same direction.

11. A heat dissipation system for an optical module, characterized in that, include: The cage frame includes multiple plug-in racks arranged in multiple rows; Multiple heat sinks are mounted on the cage frame, and each row of the plug-in brackets is connected to at least two heat sinks; The heat dissipation structure as described in any one of claims 1-10, wherein one or two heat dissipation structures are movably disposed on each of the plug-in brackets, and the first cover plate of each heat dissipation structure is connected to the heat dissipation plate.

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