Heat exchange fin, heat exchanger and air conditioning cooling system

Abstract

The utility model relates to a kind of heat exchange fin, heat exchanger and air conditioning cooling system, medium flow channel is equipped in the heat exchange fin, the medium flow channel includes main flow channel and microchannel, the microchannel is located downstream of the main flow channel, the microchannel includes multiple microchannel units, multiple the microchannel unit is arranged side by side along the thickness direction of the heat exchange fin is orthogonal, and multiple the microchannel unit is all communicated with the main flow channel.The heat exchange fin of the utility model can improve heat exchange efficiency, and it is beneficial to reduce the energy consumption when heat exchanger exchanges heat.

Description

Technical Field

[0001] This utility model relates to the field of data center cooling technology, specifically to a heat exchange fin, a heat exchanger, and an air conditioning cooling system. Background Technology

[0002] As data centers continue to expand in scale and computing power increases, their heat load is also rising, making it difficult for traditional air conditioning systems to meet the demands for efficient and energy-saving cooling. In related technologies, data center air conditioning systems often employ air cooling or liquid cooling, but these methods suffer from low heat exchange efficiency and high energy consumption. Utility Model Content

[0003] This utility model aims to at least partially solve one of the technical problems in the related art.

[0004] Therefore, embodiments of this utility model propose a heat exchange plate that can improve heat exchange efficiency and help reduce energy consumption during heat exchange.

[0005] An embodiment of this utility model also proposes a heat exchanger.

[0006] An embodiment of this utility model also proposes an air conditioning cooling system.

[0007] The heat exchange plate of this utility model is provided with a medium flow channel, which includes a main channel and a micro channel. The micro channel is located downstream of the main channel and includes multiple micro channel units. The multiple micro channel units are arranged side by side along the thickness direction orthogonal to the heat exchange plate, and all of the multiple micro channel units are connected to the main channel.

[0008] According to the embodiment of the present invention, since the microchannel is located downstream of the main channel, when the heat exchange medium enters the heat exchange plate, the heat exchange medium can first flow through the main channel for heat exchange, and then flow through the microchannel for heat exchange. Since multiple microchannel units are arranged side by side along the thickness direction orthogonal to the heat exchange plate, and multiple microchannel units are all connected to the main channel, the heat exchange efficiency of the heat exchange medium flowing through the microchannel can be improved. This avoids the problem of inconsistent heat exchange temperature and pressure of the heat exchange medium upstream and downstream of the medium flow channel due to the liquefaction of the heat exchange medium downstream of the medium flow channel. This is beneficial to improving the overall heat exchange efficiency of the heat exchange plate and reducing the energy consumption of the heat exchanger during heat exchange.

[0009] In some embodiments, the heat exchange plate has a pillow-shaped region with wavy protrusions, and the main channel is located within the projected outline of the pillow-shaped region in a projection orthogonal to the thickness direction of the heat exchange plate.

[0010] In some embodiments, the height of the protrusion along the thickness direction of the heat exchange plate is H, wherein 2mm≤H≤5mm.

[0011] In some embodiments, the inner wall surface of the main channel is provided with a toothed structure.

[0012] In some embodiments, a plurality of the microchannel units are arranged side by side along a first direction, and the size of a single microchannel unit along the first direction is L1, wherein 50μm≤L1≤300μm.

[0013] In some embodiments, the dimension of the microchannel unit along the thickness direction of the heat exchange plate is L2, wherein 0.5mm≤L2≤2mm.

[0014] In some embodiments, the heat exchange plate includes two plates stacked along the thickness direction of the heat exchange plate, and the medium flow channel is disposed between the two plates.

[0015] In some embodiments, the sheet has a wavy structure, and the two sheets are arranged symmetrically.

[0016] In some embodiments, the heat exchange plate is provided with a plurality of spaced solder joints, which connect two of the plates together.

[0017] In some embodiments, the outer wall of the heat exchange plate is provided with heat dissipation fins.

[0018] Another embodiment of the heat exchanger of the present invention includes a plurality of heat exchange plates, wherein the heat exchange plates are the heat exchange plates described in any one of the embodiments of the present invention, and the plurality of heat exchange plates are stacked sequentially along the thickness direction of the heat exchange plates.

[0019] According to the embodiment of the present invention, since the microchannel is located downstream of the main channel, when the heat exchange medium enters the heat exchange plate, the heat exchange medium can first flow through the main channel for heat exchange, and then flow through the microchannel for heat exchange. Since multiple microchannel units are arranged side by side along the thickness direction orthogonal to the heat exchange plate, and multiple microchannel units are all connected to the main channel, the heat exchange efficiency of the heat exchange medium flowing through the microchannel can be improved. This avoids the problem of inconsistent heat exchange temperature and pressure of the heat exchange medium upstream and downstream of the medium flow channel due to the liquefaction of the heat exchange medium downstream of the medium flow channel. This is beneficial to improving the overall heat exchange efficiency of the heat exchange plate and reducing the energy consumption of the heat exchanger during heat exchange.

[0020] Another embodiment of the air conditioning cooling system of the present invention includes the heat exchanger described in the embodiment of the present invention.

[0021] According to the air conditioning cooling system of the present invention, since the microchannels of the heat exchange plate are located downstream of the main channel, when the heat exchange medium enters the heat exchange plate, the heat exchange medium can first flow through the main channel for heat exchange, and then flow through the microchannels for heat exchange. Since multiple microchannel units are arranged side by side along the thickness direction orthogonal to the heat exchange plate, and multiple microchannel units are all connected to the main channel, the heat exchange efficiency of the heat exchange medium flowing through the microchannel can be improved. This avoids the problem of inconsistent heat exchange temperature and pressure of the heat exchange medium upstream and downstream of the medium channel caused by the liquefaction of the heat exchange medium downstream of the medium channel. This is beneficial to improving the overall heat exchange efficiency of the heat exchange plate and reducing the energy consumption of the heat exchanger during heat exchange. Attached Figure Description

[0022] Figure 1 This is a flow path diagram of the heat exchange medium in the heat exchange plate of this utility model embodiment.

[0023] Figure 2 yes Figure 1 A magnified view of A in the middle.

[0024] Figure 3 This is a schematic diagram of the heat exchange plate according to an embodiment of the present invention.

[0025] Figure 4 This is a three-dimensional cross-sectional view of the heat exchange plate according to an embodiment of the present invention.

[0026] Figure label: 1. Heat exchange fin; 11. Medium flow channel; 111. Main flow channel; 112. Microchannel; 1121. Microchannel unit; 12. Pillow-shaped region; 121. Protrusion; 101. Fin body; 102. Solder joint. Detailed Implementation

[0027] The embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0028] The following is a reference appendix. Figures 1 to 4 This invention describes heat exchange plates, heat exchangers, and air conditioning cooling systems according to embodiments of the present invention.

[0029] like Figures 1 to 4 As shown, the heat exchange plate 1 of this utility model embodiment is provided with a medium flow channel 11. The medium flow channel 11 includes a main flow channel 111 and a micro channel 112. The micro channel 112 is located downstream of the main flow channel 111. The micro channel 112 includes a plurality of micro channel units 1121. The plurality of micro channel units 1121 are arranged side by side along the thickness direction orthogonal to the heat exchange plate 1, and the plurality of micro channel units 1121 are all connected to the main flow channel 111.

[0030] According to the embodiment of the present invention, the heat exchange plate 1 has a microchannel 112 located downstream of the main channel 111. When the heat exchange medium enters the heat exchange plate 1, it can first flow through the main channel 111 for heat exchange, and then flow through the microchannel 112 for heat exchange. Since the multiple microchannel units 1121 of the microchannel 112 are arranged side by side along the thickness direction orthogonal to the heat exchange plate 1, and the multiple microchannel units 1121 are all connected to the main channel 111, the heat exchange efficiency of the heat exchange medium flowing through the microchannel 112 can be improved. This avoids the problem of inconsistent heat exchange temperature and pressure of the heat exchange medium upstream and downstream of the medium channel 11 due to the liquefaction of the heat exchange medium downstream of the medium channel 11. This is beneficial to improving the overall heat exchange efficiency of the heat exchange plate 1 and reducing the energy consumption of the heat exchanger during heat exchange.

[0031] It is understandable that for the scheme where "microchannels 112 are not provided downstream of the medium flow channel 11 of heat exchange plate 1", when the heat exchange medium passes downstream of the medium flow channel 11, some of the heat exchange medium will liquefy due to heat exchange, which will cause a significant drop in pressure within the medium flow channel 11, resulting in uneven heat exchange temperature of the heat exchange medium upstream and downstream of the medium flow channel 11 and poor overall heat exchange effect.

[0032] In this embodiment of the invention, the heat exchange plate 1 has microchannels 112 downstream of the main flow channel 111. When the heat exchange medium enters the heat exchange plate 1, it can first flow through the main flow channel 111 for heat exchange, and then enter the multiple microchannel units 1121 side by side, thereby reducing the resistance during fluid flow. When the heat exchange medium flows in the microchannels 112, the pressure drop during the flow of the heat exchange medium is reduced through the heat exchange effect of the microchannels 112, which can transfer heat to the external environment more quickly, thus improving the overall heat exchange efficiency of the heat exchange plate 1.

[0033] Optionally, such as Figure 4 As shown, the heat exchanger 1 has a pillow-shaped region 12 with wavy protrusions 121. The main flow channel 111 is located within the projected outline of the pillow-shaped region 12, orthogonal to the thickness direction of the heat exchanger 1. Because the pillow-shaped region 12 has wavy protrusions 121 and the main flow channel 111 is located within its projected outline, when the heat exchange medium flows within the main flow channel 111, local turbulence is formed, enhancing the mixing of the heat exchange medium. In other words, when the heat exchange medium passes through the pillow-shaped region 12, more disturbances and turbulence are generated, increasing the contact area between the heat exchange medium and the inner wall of the main flow channel 111, thereby improving the heat exchange efficiency of the heat exchanger 1.

[0034] Optionally, the height of the protrusion 121 along the thickness direction of the heat exchange plate 1 is H, where 2mm ≤ H ≤ 5mm. For example, H can be 2mm, 3mm, 4mm, or 5mm. By designing the protrusion 121 with the above parameters, the heat exchange plate 1 of this embodiment can further enable local turbulence of the heat exchange medium within the main flow channel 111, enhance the mixing effect of the heat exchange medium, increase the contact area between the heat exchange medium and the inner wall of the main flow channel 111, and improve the heat exchange efficiency of the heat exchange plate 1.

[0035] In other examples, the inner wall of the main channel 111 is provided with a toothed structure, which can increase the contact area between the heat exchange medium and the inner wall of the main channel 111 and improve the heat exchange efficiency of the heat exchange plate 1.

[0036] For example, the roughness of the inner wall surface of the main channel 111 can be increased to form a toothed structure on the inner wall surface of the main channel 111.

[0037] Optionally, such as Figure 1 and Figure 2 As shown, multiple microchannel units 1121 are arranged along a first direction (e.g., Figure 1 The microchannel units 1121 are arranged side-by-side in the left and right directions, and the dimension of a single microchannel unit 1121 along the first direction is L1, where 50μm≤L1≤300μm. In the embodiment of this utility model, the heat exchange plate 1 uses the above parameters to design the left and right widths of the microchannel units 1121. This avoids the problem of blockage of the microchannel units 1121 due to L1 being too small, and also avoids the problem of insufficient heat exchange area due to L1 being too large. In other words, by using the above parameters to design L1, both the smooth flow of the heat exchange medium and the heat exchange efficiency of the heat exchange plate 1 can be guaranteed.

[0038] For example, L1 can be 50μm, 100μm, 150μm, 200μm, 250μm, or 300μm.

[0039] Optionally, the microchannel unit 1121 has a dimension L2 along the thickness direction of the heat exchange plate 1, where 0.5mm ≤ L2 ≤ 2mm. For example, L2 can be 0.5mm, 1mm, 1.5mm, or 2mm. This allows for faster heat transfer to the outside, improving the heat exchange efficiency of the heat exchange plate 1.

[0040] Optionally, such as Figure 4 As shown, the heat exchange plate 1 includes two plates 101, which are stacked along the thickness direction of the heat exchange plate 1, and the medium flow channel 11 is disposed between the two plates 101. This makes the processing and manufacturing of the medium flow channel 11 convenient.

[0041] For example, the plate 101 has a wavy structure, and the two plates 101 are arranged symmetrically. When the heat exchange medium flows in the main channel 111, local turbulence is formed in the main channel 111 to enhance the mixing of the heat exchange medium. In other words, when the heat exchange medium passes through the pillow region 12, more disturbances and turbulence are generated, increasing the contact area between the heat exchange medium and the inner wall of the main channel 111, thereby improving the heat exchange efficiency of the heat exchange plate 1.

[0042] For example, the heat exchange plate 1 is provided with a plurality of spaced solder joints 102, which connect two plates 101 together. This can improve the stability of the connection between the two plates 101 and facilitate assembly.

[0043] For example, the heat exchange plate 1 can be integrally formed using 3D printing technology. The microchannel 112 is made using an etching process, or the heat exchange plate 1 can also be formed into a non-etched microchannel 112 by a stamping process.

[0044] For example, heat exchange plate 1 uses metal powder sintered 3D printed plate, and directly forms microchannels 112 and protrusion structures.

[0045] Optionally, the outer wall of the heat exchange plate 1 is provided with heat dissipation fins (not shown), which can transfer heat to the outside more quickly and improve the heat exchange efficiency of the heat exchange plate 1.

[0046] The heat exchange plate 1 of the present invention has at least the following technical effects: 1. The composite design of the protrusion 121 of the pillow region 12 and the microchannel 112 array of the heat exchange plate 1 in the embodiment of the present invention can significantly improve the heat exchange efficiency of the heat exchange plate 1.

[0047] When the heat exchange medium passes through the main flow channel 111 inside the pillow region 12, it can generate more disturbances and turbulence, which increases the contact area between the heat exchange medium and the heat exchange surface, thereby improving the heat exchange efficiency of the heat exchange plate 1.

[0048] When the heat exchange medium flows in the microchannel 112, the heat can be transferred to the external environment more quickly through the heat exchange effect of the microchannel 112, further improving the heat exchange efficiency of the heat exchange plate 1.

[0049] 2. The raised structure of the pillow-shaped region 12 of the heat exchange plate 1 in the embodiment of this utility model can significantly enhance the fluid mixing effect and improve the heat exchange uniformity.

[0050] The protrusions 121 of the pillow-shaped region 12 of the heat exchanger fin 1 generate more turbulence in the heat exchange medium during flow, increasing the contact area between the heat exchange medium and the inner wall of the main flow channel 111, thereby improving the mixing effect of the heat exchange medium. When the heat exchange medium passes through the main flow channel 111 inside the pillow-shaped region 12, it generates more turbulence and makes the mixing of the heat exchange medium more uniform, improving the uniformity of heat exchange of the heat exchanger fin 1.

[0051] 3. The heat exchange plate 1 of the present invention effectively reduces the pressure drop during the flow of the heat exchange medium by means of the microchannel 112 array design.

[0052] The design of the microchannel 112 enables the heat exchange medium to transfer heat more quickly during flow, while reducing the resistance during the flow process. When the heat exchange medium flows in the microchannel 112, the heat can be transferred to the external environment more quickly through the heat exchange effect of the microchannel 112, thereby reducing the pressure drop during the flow process of the heat exchange medium.

[0053] 4. The composite design of the heat exchange plate 1 with the three-dimensional pillow-shaped protrusion structure and the microchannel 112 array in the embodiment of this utility model improves the structural strength of the heat exchanger.

[0054] The composite design of the three-dimensional pillow-shaped protrusion structure and the microchannel 112 array makes the heat exchanger structure more stable and improves the structural strength of the heat exchange plate 1. It enables the pressure generated by the heat exchange medium during the flow process to be evenly distributed, thereby improving the structural strength of the heat exchange plate 1.

[0055] 5. This application proposes a composite design of a three-dimensional pillow-shaped protrusion structure and a microchannel 112 array, which simplifies the manufacturing process of the heat exchange plate 1 and reduces the manufacturing cost.

[0056] In summary, the heat exchanger 1 of the present invention can significantly improve heat exchange efficiency, enhance the mixing effect of the heat exchange medium, reduce pressure drop, improve the structural strength of the heat exchanger 1, and simplify the manufacturing process of the heat exchanger 1.

[0057] Another embodiment of the heat exchanger of the present invention includes a plurality of heat exchange plates 1, wherein the heat exchange plates 1 are the heat exchange plates 1 of the present invention, and the plurality of heat exchange plates 1 are stacked sequentially along the thickness direction of the heat exchange plates 1.

[0058] According to the embodiment of the present invention, since the microchannel 112 is located downstream of the main channel 111, when the heat exchange medium enters the heat exchange plate 1, the heat exchange medium can first flow through the main channel 111 for heat exchange, and then flow through the microchannel 112 for heat exchange. Since the multiple microchannel units 1121 of the microchannel 112 are arranged side by side along the thickness direction orthogonal to the heat exchange plate 1, and the multiple microchannel units 1121 are all connected to the main channel 111, the heat exchange efficiency of the heat exchange medium flowing through the microchannel 112 can be improved, so as to avoid the problem of inconsistent heat exchange temperature and pressure of the heat exchange medium upstream and downstream of the medium channel 11 due to the liquefaction of the heat exchange medium downstream of the medium channel 11. This is beneficial to improving the overall heat exchange efficiency of the heat exchange plate 1 and reducing the energy consumption of the heat exchanger during heat exchange.

[0059] Another embodiment of the air conditioning cooling system of the present invention includes the heat exchanger of the present invention.

[0060] According to the air conditioning cooling system of the present invention, since the microchannel 112 of the heat exchange plate 1 is located downstream of the main channel 111, when the heat exchange medium enters the heat exchange plate 1, the heat exchange medium can first flow through the main channel 111 for heat exchange, and then flow through the microchannel 112 for heat exchange. Since the multiple microchannel units 1121 of the microchannel 112 are arranged side by side along the thickness direction orthogonal to the heat exchange plate 1, and the multiple microchannel units 1121 are all connected to the main channel 111, the heat exchange efficiency of the heat exchange medium flowing through the microchannel 112 can be improved, so as to avoid the problem of inconsistent heat exchange temperature and pressure of the heat exchange medium upstream and downstream of the medium channel 11 due to the liquefaction of the heat exchange medium downstream of the medium channel 11. This is beneficial to improving the overall heat exchange efficiency of the heat exchange plate 1 and reducing the energy consumption of the heat exchanger during heat exchange.

[0061] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0062] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0063] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0064] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0065] In this utility model, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Furthermore, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0066] Although the above embodiments have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Any changes, modifications, substitutions and variations made to the above embodiments by those skilled in the art are within the protection scope of the present invention.

Claims

1. A heat exchange plate (1), characterized in that, The heat exchange plate (1) is provided with a medium flow channel (11), which includes a main flow channel (111) and a micro channel (112). The micro channel (112) is located downstream of the main flow channel (111). The micro channel (112) includes a plurality of micro channel units (1121). The plurality of micro channel units (1121) are arranged side by side along the thickness direction orthogonal to the heat exchange plate (1), and the plurality of micro channel units (1121) are all connected to the main flow channel (111).

2. The heat exchange plate (1) according to claim 1, characterized in that, The heat exchange plate (1) has a pillow-shaped region (12) with wavy protrusions (121). In the projection orthogonal to the thickness direction of the heat exchange plate (1), the main channel (111) is located within the projection outline of the pillow-shaped region (12).

3. The heat exchange plate (1) according to claim 2, characterized in that, The height of the protrusion (121) along the thickness direction of the heat exchange plate (1) is H, where 2mm≤H≤5mm.

4. The heat exchange plate (1) according to claim 1, characterized in that, The inner wall of the main channel (111) is provided with a toothed structure.

5. The heat exchange plate (1) according to claim 1, characterized in that, Multiple microchannel units (1121) are arranged side by side along a first direction, and the size of a single microchannel unit (1121) along the first direction is L1, wherein 50μm≤L1≤300μm; And / or, the dimension of the microchannel unit (1121) along the thickness direction of the heat exchange plate (1) is L2, wherein 0.5mm≤L2≤2mm.

6. The heat exchange plate (1) according to claim 1, characterized in that, The heat exchange plate (1) includes two plates (101), which are stacked along the thickness direction of the heat exchange plate (1), and the medium flow channel (11) is disposed between the two plates (101).

7. The heat exchange plate (1) according to claim 6, characterized in that, The sheet (101) has a wavy structure, and the two sheets (101) are arranged symmetrically. And / or, the heat exchange plate (1) is provided with a plurality of spaced solder joints (102), the solder joints (102) connecting the two plates (101) together.

8. The heat exchanger (1) according to any one of claims 1-7, characterized in that, The outer wall of the heat exchange plate (1) is provided with heat dissipation fins.

9. A heat exchanger, characterized in that, It includes a plurality of heat exchange plates (1), wherein the heat exchange plate (1) is any one of claims 1-8, and the plurality of heat exchange plates (1) are stacked sequentially along the thickness direction of the heat exchange plate (1).

10. An air conditioning cooling system, characterized in that, Includes the heat exchanger as described in claim 9.

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