Ceramic substrate laser drilling positioning device
Patent Information
- Application Number
- CN202522561657.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-02
- Publication Date
- 2026-11-03
- Estimated Expiration
- 2035-12-02
AI Technical Summary
Existing ceramic substrate positioning devices lack compatibility with substrates of different specifications, leading to substrate deformation or damage. Laser drilling accuracy is low, and residue accumulation and heat during drilling affect the positioning reference.
The system employs symmetrically distributed connecting plates and flip-plate fixing base plates, combined with motor-driven trigger components and 45° tilted cooling nozzles to achieve precise positioning and rapid cooling. It also utilizes a negative pressure cleaning ring to remove residue, ensuring positioning stability and drilling accuracy.
It achieves stable fixation and precise positioning of substrates of different specifications, reduces the impact of thermal deformation and residue, and improves the accuracy of laser drilling and product quality.
Smart Images
Figure CN224927191U_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of ceramic processing technology, and in particular to a laser drilling and positioning device for ceramic substrates. Background Technology
[0002] Ceramic substrates are widely used in high-end electronic devices due to their excellent electrical insulation, thermal conductivity, and current carrying capacity. Laser drilling is a critical process in the processing of ceramic substrates, and its positioning accuracy directly affects product quality.
[0003] Most existing ceramic substrate positioning devices are clamping structures, which have poor adaptability to substrates and insufficient compatibility with substrates of different specifications. This can easily lead to substrate deformation or breakage, which in turn affects the accuracy of laser drilling on the substrate. The accumulation of residue and micro-deformation of the substrate caused by heat during laser drilling will affect the overall positioning reference of the substrate, thereby reducing the product quality of the ceramic substrate. Utility Model Content
[0004] To overcome the shortcomings of insufficient compatibility with substrates of different specifications, residue accumulation during drilling, and micro-deformation of the substrate caused by heat, the technical problem to be solved is to provide a laser drilling positioning device for ceramic substrates.
[0005] The technical solution of this utility model is: a ceramic substrate laser drilling and positioning device, including a machine base, a controller on the machine base, a first base slidably connected to the machine base, a transverse electric belt on the machine base, the belt of the transverse electric belt being connected to the first base, a longitudinal electric belt on the first base, a second base slidably connected to the first base, the second base being connected to the belt of the longitudinal electric belt, a laser bracket fixedly connected inside the machine base, a laser on the laser bracket, an axisymmetrically distributed positioning mechanism for positioning the ceramic substrate on the second base, a triggering component for providing power inside the second base, and a cooling mechanism for reducing temperature on the laser bracket; The positioning mechanism includes: a connecting plate, which is slidably connected to the second base, a flap plate is rotatably connected to the connecting plate, a connecting rod is rotatably connected to the flap plate, and symmetrically distributed parallel rods are rotatably connected to the connecting plate.
[0006] Furthermore, the second base is provided with uniformly distributed cooling grooves, and a silicone cooling layer is provided on the cooling grooves of the second base.
[0007] Furthermore, the connecting plate is parallel to the adjacent connecting rod, the flap is L-shaped, the vertical side of the flap is parallel to the adjacent parallel rod, the horizontal side of the flap is perpendicular to the adjacent connecting rod, a composite buffer pad is provided on the side of the connecting plate near the central axis of the second base, and a foam buffer pad is provided on the side of the flap near the central axis of the second base.
[0008] Furthermore, the triggering component includes: a motor, the motor being fixedly connected to the second base, a trigger gear being fixedly connected to the output end of the motor, the trigger gear being rotatably connected to the second base, and trigger frames slidably connected within the second base, each of the symmetrically distributed trigger frames being provided with a rack, the trigger gear meshing with the racks of the symmetrically distributed trigger frames, a limiting plate being slidably connected to the trigger frame, an elastic element being provided between the limiting plate and the trigger frame, the limiting plate being slidably connected to an adjacent connecting plate, an elastic element being provided between the limiting plate and the adjacent connecting plate, the limiting plate being slidably connected to an adjacent connecting rod, and a force sensor being provided at the elastic element of the trigger frame and the adjacent limiting plate.
[0009] Furthermore, the elastic coefficient of the elastic element between the limiting plate and the adjacent trigger frame is greater than the elastic coefficient of the elastic element between the limiting plate and the adjacent connecting plate.
[0010] Furthermore, the cooling mechanism includes: a support frame fixed to the laser bracket; a cooling nozzle symmetrically distributed on the side of the support frame near the first base; an air compressor fixed to one side of the support frame, the air compressor being connected to all the symmetrically distributed cooling nozzles; a cleaning ring fixed to the side of the support frame near the first base, the cleaning ring having a negative pressure chamber; uniformly distributed slag suction ports on the side of the cleaning ring near the first base, the negative pressure chamber of the cleaning ring being connected to the outside through the uniformly distributed slag suction ports; and a negative pressure pump fixed to the side of the support frame away from the air compressor, the negative pressure chamber of the cleaning ring being connected to the negative pressure pump.
[0011] Furthermore, the axisymmetrically distributed cooling nozzles are all tilted at 45° towards the side of the cleaning ring located on the central axis.
[0012] The beneficial effects are: This utility model fixes the ceramic substrate by axially symmetrically distributing connecting plates and flip plates, and pushes the ceramic substrate to the center of the second base without changing the clamps. The L-shaped flip plate, together with the foam buffer pad, prevents the ceramic substrate from deforming due to heating, ensuring stable positioning and fitting, and providing a precise positioning reference for laser drilling. The motor drives the trigger frame to move, realizing the synchronous action of the positioning mechanism. The force sensor monitors the clamping force of the L-shaped flip plate, accurately controls the force, ensures firm positioning, and prevents damage to the base plate, further improving the stability and consistency of positioning. The 45° angled cooling nozzles provide directional heat dissipation, preventing the substrate from deforming due to the large amount of heat generated during laser drilling. The nozzles also blow away the drilling residue, which is then sucked up by a cleaning ring under negative pressure to prevent residue from affecting the positioning reference during laser drilling and to reduce processing errors. Attached Figure Description
[0013] Figure 1 This is a three-dimensional structural diagram of the present invention.
[0014] Figure 2 This is a partial three-dimensional structural diagram of the present invention.
[0015] Figure 3 This is a three-dimensional cross-sectional view of the second base of this utility model.
[0016] Figure 4 This is a three-dimensional cross-sectional view of the second base and positioning mechanism of this utility model.
[0017] Figure 5 This is a three-dimensional structural cross-sectional view of the positioning mechanism of this utility model.
[0018] Figure 6 This is a three-dimensional structural diagram of the trigger component of this utility model.
[0019] Figure 7 This is a three-dimensional cross-sectional view of the support frame and cleaning ring of this utility model.
[0020] In the attached diagram: 1-Machine base, 2-Controller, 3-First base, 301-Transverse electric belt, 302-Vertical electric belt, 4-Second base, 401-Silicone cooling layer, 5-Laser bracket, 6-Laser, 7-Positioning mechanism, 701-Connecting plate, 702-Flip plate, 703-Connecting rod, 704-Parallel rod, 8-Trigger assembly, 801-Motor, 802-Trigger gear, 803-Trigger frame, 804-Limit plate, 805-Force sensor, 9-Cooling mechanism, 901-Support frame, 902-Cooling nozzle, 903-Air compressor, 904-Cleaning ring, 905-Negative pressure pump. Detailed Implementation
[0021] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings. Example
[0022] This embodiment discloses a laser drilling positioning device for ceramic substrates, which is used for auxiliary positioning during drilling of the substrate and for cooling and cleaning the heat and residue generated during the drilling process.
[0023] A laser drilling and positioning device for ceramic substrates, such as Figures 1-3 As shown, the system includes a machine base 1, a controller 2 mounted on the machine base 1, a first base 3 slidably connected to the machine base 1, a transverse electric belt 301 mounted on the machine base 1, the belt of the transverse electric belt 301 connected to the first base 3, a longitudinal electric belt 302 mounted on the first base 3, a second base 4 slidably connected to the first base 3, the second base 4 connected to the belt of the longitudinal electric belt 302, a uniformly distributed cooling tank inside the second base 4, a silicone cooling layer 401 mounted on the cooling tank of the second base 4, by injecting coolant into the uniformly distributed cooling tank, the silicone cooling layer 401 contacts and cools the underside of the ceramic substrate, preventing the substrate from deforming due to the large amount of heat generated by laser drilling, a laser bracket 5 fixedly connected inside the machine base 1, a laser 6 mounted on the laser bracket 5, an axisymmetrically distributed positioning mechanism 7 for positioning the ceramic substrate mounted on the second base 4, a triggering component 8 for providing power inside the second base 4, and a cooling mechanism 9 for reducing temperature mounted on the laser bracket 5. like Figures 3-5 As shown, the positioning mechanism 7 includes: a connecting plate 701 slidably connected to the second base 4; a flap 702 rotatably connected to the connecting plate 701; a connecting rod 703 rotatably connected to the flap 702; and symmetrically distributed parallel rods 704 rotatably connected to the connecting rod 703. The symmetrically distributed parallel rods 704 are all rotatably connected to the connecting plate 701. The connecting plate 701 is parallel to the adjacent connecting rod 703. The flap 702 is L-shaped, with its vertical side parallel to the adjacent parallel rod 704 and its horizontal side perpendicular to the adjacent connecting rod 703. A composite buffer pad is provided on the side of the connecting plate 701 near the central axis of the second base 4 to avoid hard contact with the substrate. A foamed buffer pad is provided on the side of the flap 702 near the central axis of the second base 4. To avoid excessive clamping force that could cause substrate deformation or damage and to ensure substrate positioning stability, the substrate is circumferentially clamped by four axisymmetrically distributed connecting plates 701 and flip plates 702, providing a precise positioning reference for laser drilling.
[0024] like Figures 3-5As shown, the trigger assembly 8 includes: a motor 801 fixedly connected to the second base 4; a trigger gear 802 fixedly connected to the output end of the motor 801; the trigger gear 802 rotatably connected to the second base 4; trigger frames 803 slidably connected within the second base 4; each of the slidably connected trigger frames 803 is provided with a rack; the trigger gear 802 meshes with the racks of the slidably connected trigger frames 803; a limit plate 804 slidably connected to the trigger frames 803; an elastic element, which is a spring, is provided between the limit plate 804 and the trigger frames 803; the limit plate 804 is slidably connected to an adjacent connecting plate 701; and an elastic element, which is a spring, is provided between the limit plate 804 and the adjacent connecting plate 701. The elastic element is a spring. The elastic coefficient of the elastic element between the limiting plate 804 and the adjacent trigger frame 803 is greater than that between the limiting plate 804 and the adjacent connecting plate 701. This allows the limiting plate 804 to move relative to the trigger frame 803 after the connecting plate 701. This allows the connecting plate 701 to fix the substrate first, and then the limiting plate 804 to clamp the substrate. The limiting plate 804 is slidably connected to the adjacent connecting rod 703. A force sensor 805 is installed at the elastic element of the trigger frame 803 and the adjacent limiting plate 804 to monitor the real-time clamping force, thereby accurately controlling the clamping force. This ensures the positioning is firm, prevents overpressure damage to the substrate, and further improves the positioning consistency.
[0025] like Figure 6 and Figure 7 As shown, the cooling mechanism 9 includes: a support frame 901 fixed to the laser bracket 5; axially symmetrically distributed cooling nozzles 902 are arranged on the lower side of the support frame 901; the axially symmetrically distributed cooling nozzles 902 are all inclined downward at 45° towards the central axis, facing the laser drilling position to quickly cool the heat generated by laser drilling and disperse the drilling residue; an air compressor 903 is fixed to the right side of the support frame 901; the air compressor 903 is connected to the axially symmetrically distributed cooling nozzles 902; the support frame 901... A cleaning ring 904 is fixedly connected to the lower side of the support frame 901. A negative pressure chamber is provided inside the cleaning ring 904. The lower side of the cleaning ring 904 is provided with evenly distributed slag suction ports. The negative pressure chamber of the cleaning ring 904 is connected to the outside through the evenly distributed slag suction ports. A negative pressure pump 905 is fixedly connected to the left side of the support frame 901. The negative pressure chamber of the cleaning ring 904 is connected to the negative pressure pump 905. The substrate drilling position is rapidly cooled by the cooling nozzle 902. The generated residue is sucked up by the cleaning ring 904 to avoid the residue accumulation affecting the positioning reference and drilling accuracy.
[0026] When using this device for laser drilling of ceramic substrates, the operator places the ceramic substrate to be processed on the silicone cooling layer 401 on the second base 4. Then, the operator controls the motor 801 to start via the controller 2. The output of the motor 801 drives the trigger gear 802 to rotate clockwise (e.g., ...). Figure 4(As shown in the direction), the trigger gear 802 drives the four axisymmetrically distributed trigger holders 803 to move towards the central axis position closer to the second base 4 through meshing, so as to... Figure 4 Taking the positioning mechanism 7 shown as an example, the trigger frame 803 moves to the left, and the trigger frame 803 drives the limiting plate 804 to move to the left through the spring. The limiting plate 804 drives the connecting plate 701 to move to the left through the spring. Under the action of the spring, the limiting plate 804 remains relatively stationary with the trigger frame 803. The composite buffer pad on the left side of the connecting plate 701 moves to the left and contacts the substrate side and pushes it to the left. The four axially symmetrically distributed connecting plates 701 simultaneously push the substrate towards the central axis position, so that the substrate moves to the central axis position.
[0027] After the substrate moves to the central axis position of the second base 4, Figure 4 Taking the positioning mechanism 7 shown as an example, when the trigger frame 803 continues to move to the left, the connecting plate 701 stops moving. The elastic coefficient of the spring between the trigger frame 803 and the limiting plate 804 is greater than that between the limiting plate 804 and the connecting plate 701, so that the limiting plate 804 remains stationary relative to the trigger plate. The limiting plate 804 moves to the left, causing the spring between the limiting plate 804 and the connecting plate 701 to be compressed and stored, so that the four axisily symmetrically distributed connecting plates 701 simultaneously fix the base plate. The limiting plate 804 drives the connecting rod 703 to move to the left. Under the action of the parallel rod 704 and the flip plate 702, the connecting rod 703 moves downward. The connecting rod 703 drives the flip plate 702 to swing to the left. The swing of the flip plate 702 causes it to swing to the left. The foamed buffer pad on the side swings downward until the foamed buffer pad of the flip plate 702 contacts the substrate. At this time, the trigger frame 803 continues to move to the left, so that the spring between the trigger frame 803 and the limiting plate 804 is compressed and stored. The elastic force of the spring between the trigger frame 803 and the limiting plate 804 is monitored by the force sensor 805, which in turn monitors the clamping force of the foamed buffer pad on the substrate. When the clamping force increases to the size required for the substrate of the corresponding thickness, the control motor 801 stops, so that the trigger frame 803 stops moving. The four axisymmetrically distributed connecting plates 701 simultaneously limit the four sides of the substrate, and the four axisymmetrically distributed flip plates 702 simultaneously clamp the upper side of the substrate, which ensures that the positioning is firm and prevents the substrate from being damaged by overpressure.
[0028] After the substrate moves to the central axis position of the second base 4, the operator controls the transverse electric belt 301 and the longitudinal electric belt 302 to start simultaneously through the controller 2. The transverse electric belt 301 drives the first base 3 to move to the left, and the longitudinal electric belt 302 drives the second base 4 to move backward until the central axis position of the second base 4 is aligned with the laser 6 and then stops. This aligns the central axis position of the substrate with the laser 6 without the need for additional reference adjustments, reduces the laser 6 positioning and calibration steps, and quickly establishes a stable initial positioning reference.
[0029] After aligning the central axis of the substrate with the laser 6, the operator injects coolant into the cooling tank of the second base 4. The coolant cools the substrate through the silicone cooling layer 401, preventing deformation caused by the large amount of heat generated during laser drilling. Then, the operator uses the controller 2 to control the laser support 5 to move the laser 6 downwards until it is above the substrate. At this point, the air compressor 903 and the negative pressure pump 905 are started. The air compressor 903 sprays compressed and cooled air through evenly distributed cooling nozzles 902, directly targeting the area to be drilled on the substrate. The negative pressure pump 905 creates a negative pressure chamber within the cleaning ring 904, which then draws out slag through evenly distributed suction ports. Afterwards, the operator controls the laser 6 to start drilling via the controller 2. The heat generated by the laser 6 during drilling is cooled by the cooling gas ejected from the cooling nozzle 902. At the same time, the heat generated on the underside of the substrate is cooled by the silicone cooling layer 401, so that the heat on both the top and bottom sides of the substrate can be cooled quickly, avoiding warping or deformation of the substrate due to uneven heat dissipation, ensuring the substrate positioning reference is fixed, and reducing the impact of thermal deformation on the laser drilling accuracy. Meanwhile, the cooling gas ejected from the cooling nozzle 902 blows away the residue generated by laser drilling, and the slag suction port of the cleaning ring 904 sucks up the residue generated by laser drilling, preventing it from accumulating on the substrate surface or drilling area, preventing residue from interfering with the laser path, and ensuring the accuracy of laser drilling position.
[0030] After single-hole laser drilling is completed, the second base 4 continues to move according to the preset filter under the drive of the transverse electric belt 301 and the longitudinal electric belt 302, repeating the displacement, drilling, cooling and slag removal process until all points on the substrate are completed. After all drilling is completed, the second base 4 and the first base 3 are reset, the positioning mechanism 7 is reset and the substrate is released, and the operator takes out the substrate after drilling, thus completing the overall drilling process.
[0031] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.
Claims
1. A laser drilling and positioning device for ceramic substrates, characterized in that: The system includes a machine base (1), a controller (2) on the machine base (1), a first base (3) slidably connected to the machine base (1), a transverse electric belt (301) on the machine base (1), the belt of the transverse electric belt (301) being connected to the first base (3), a longitudinal electric belt (302) on the first base (3), a second base (4) slidably connected to the first base (3), the second base (4) being connected to the belt of the longitudinal electric belt (302), a laser bracket (5) fixedly connected inside the machine base (1), a laser (6) on the laser bracket (5), a positioning mechanism (7) for positioning ceramic substrates with axially symmetrical distribution on the second base (4), a trigger component (8) for providing power inside the second base (4), and a cooling mechanism (9) for reducing temperature on the laser bracket (5). The positioning mechanism (7) includes: a connecting plate (701), which is slidably connected to the second base (4), a flap (702) is rotatably connected to the connecting plate (701), a connecting rod (703) is rotatably connected to the flap (702), and a symmetrically distributed parallel rod (704) is rotatably connected to the connecting rod (703). The symmetrically distributed parallel rod (704) is rotatably connected to the connecting plate (701).
2. The laser drilling and positioning device for ceramic substrates as described in claim 1, characterized in that: The second base (4) is provided with uniformly distributed cooling grooves, and a silicone cooling layer (401) is provided on the cooling grooves of the second base (4).
3. The laser drilling and positioning device for ceramic substrates as described in claim 1, characterized in that: The connecting plate (701) is parallel to the adjacent connecting rod (703), the flap (702) is L-shaped, the vertical side of the flap (702) is parallel to the adjacent parallel rod (704), the horizontal side of the flap (702) is perpendicular to the adjacent connecting rod (703), a composite buffer pad is provided on the side of the connecting plate (701) near the central axis of the second base (4), and a foam buffer pad is provided on the side of the flap (702) near the central axis of the second base (4).
4. The ceramic substrate laser drilling and positioning device as described in claim 1, characterized in that: The triggering assembly (8) includes: a motor (801), which is fixedly connected to the second base (4). A trigger gear (802) is fixedly connected to the output end of the motor (801). The trigger gear (802) is rotatably connected to the second base (4). A trigger frame (803) symmetrically distributed is slidably connected in the second base (4). Each of the symmetrically distributed trigger frames (803) is provided with a rack. The trigger gear (802) meshes with the racks of the symmetrically distributed trigger frames (803). The trigger frame (803) is slidably connected to the limiting plate (804). An elastic element is provided between the limiting plate (804) and the trigger frame (803). The limiting plate (804) is slidably connected to the adjacent connecting plate (701). An elastic element is provided between the limiting plate (804) and the adjacent connecting plate (701). The limiting plate (804) is slidably connected to the adjacent connecting rod (703). A force sensor (805) is provided at the elastic element of the trigger frame (803) and the adjacent limiting plate (804).
5. The laser drilling and positioning device for ceramic substrates as described in claim 4, characterized in that: The elastic coefficient of the elastic element between the limiting plate (804) and the adjacent trigger frame (803) is greater than the elastic coefficient of the elastic element between the limiting plate (804) and the adjacent connecting plate (701).
6. The ceramic substrate laser drilling positioning device as described in claim 5, characterized in that: The cooling mechanism (9) includes: a support frame (901), which is fixedly connected to the laser bracket (5). A cooling nozzle (902) is symmetrically distributed on one side of the support frame (901) near the first base (3). An air compressor (903) is fixedly connected to one side of the support frame (901). The air compressor (903) is connected to both the symmetrically distributed cooling nozzle (902). The support frame (901) is located near the first base (3). A cleaning ring (904) is fixedly connected to one side of the support frame (901). A negative pressure chamber is provided inside the cleaning ring (904). A uniformly distributed slag suction port is provided on the side of the cleaning ring (904) near the first base (3). The negative pressure chamber of the cleaning ring (904) is connected to the outside through the uniformly distributed slag suction port. A negative pressure pump (905) is fixedly connected to the side of the support frame (901) away from the air compressor (903). The negative pressure chamber of the cleaning ring (904) is connected to the negative pressure pump (905).
7. The laser drilling and positioning device for ceramic substrates as described in claim 6, characterized in that: The cooling nozzles (902) are symmetrically distributed and all tilted at 45° toward the cleaning ring (904) on the side with the central axis.