Laser processing apparatus
By arranging the unloading device, loading device, and laser emitting device along the second direction in the laser processing equipment, and by using the flipping device and the transfer device to realize the automated operation of the product, the problem of high cost of laser marking is solved, the conveying efficiency is improved, and the labor demand is reduced.
Patent Information
- Application Number
- CN202522589469.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-04
- Publication Date
- 2026-11-03
- Estimated Expiration
- 2035-12-04
AI Technical Summary
The loading and unloading stations of existing laser processing equipment are located at the beginning and end of the equipment, respectively, which means that loading and unloading need to be carried out in different places, increasing the number of workers and marking costs.
Design a laser processing equipment in which the processing areas of the unloading device, the loading device, and the laser emitting device are arranged sequentially along a second direction, the flipping device is adjacent to the laser emitting device, the product is transported by the transfer device, and the automated loading, unloading, and flipping operations of the product are realized by the gripping component and the flipping device.
It reduces the cost of laser marking on products, improves the conveying efficiency of transfer devices, reduces the number of workers or automatic loading and unloading devices, and simplifies the operation process.
Smart Images

Figure CN224927216U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor processing technology, and in particular to a laser processing device. Background Technology
[0002] In the semiconductor industry, markings are required on the surface of circuit boards for traceability. In some industries, markings are also needed on the reverse side of the circuit boards.
[0003] Laser processing equipment is typically used to mark circuit boards. This equipment generally includes a loading station, an unloading station, a laser marking station, and a flipping station. The loading station is used to load circuit boards, the unloading station is used to unload circuit boards, the laser marking station is used to laser-mark the circuit boards, and the flipping station is used to flip the circuit boards over.
[0004] Currently, the loading and unloading stations of laser processing equipment are located at opposite ends of the equipment, resulting in a significant distance between them. This necessitates manual operation at both stations, increasing the workforce and consequently raising the cost of marking circuit boards. Utility Model Content
[0005] This application provides a laser processing device that can reduce the marking cost of circuit boards.
[0006] This application provides a laser processing device, the laser processing device comprising:
[0007] frame;
[0008] A feeding device is disposed on the frame and is used to convey products along a first direction;
[0009] A feeding device is disposed on the frame and is used to convey the product along the first direction;
[0010] A laser emitting device is mounted on the frame and is used to emit a laser beam to mark the product;
[0011] A flipping device is disposed on the frame and is used to flip the product;
[0012] A transfer device is disposed on the frame and is used to transport the product along a second direction;
[0013] The processing areas of the unloading device, the loading device, and the laser emitting device are arranged sequentially along the second direction, or the processing areas of the loading device, the unloading device, and the laser emitting device are arranged sequentially along the second direction; the flipping device is adjacent to the processing area of the laser emitting device, the conveying direction of the loading device is opposite to the conveying direction of the unloading device, and the first direction, the second direction, and the vertical direction are perpendicular to each other.
[0014] In some possible implementations, the transfer device includes:
[0015] A slide rail is provided on the frame and is located directly above the processing areas of the loading device, the unloading device and the laser emitting device. The length direction of the slide rail is parallel to the second direction.
[0016] A first drive unit is disposed on the frame;
[0017] A gripping component is slidably mounted on the slide rail and connected to the output end of the first drive unit. The first drive unit is used to drive the gripping component to move along the second direction, and the gripping component is used to grip the product.
[0018] In some possible implementations, the grasping component includes:
[0019] A second drive unit is slidably mounted on the slide rail. The second drive unit is connected to the output end of the first drive unit. The first drive unit is used to drive the second drive unit to move along the second direction.
[0020] A first gripping unit is disposed at the output end of the second drive unit. The second drive unit is used to drive the first gripping unit to move up and down, and the first gripping unit is used to grip the product.
[0021] In some possible implementations, two grasping components are provided.
[0022] In some possible implementations, the spacing between the two gripping components is equal to the spacing between the feeding device and the unloading device.
[0023] In some possible implementations, the flipping device is located on the side of the processing area of the laser emitting device away from the feeding device, and the flipping device is located directly below the slide rail.
[0024] In some possible implementations, the flipping device includes:
[0025] A third drive unit is disposed on the frame;
[0026] The second gripping unit is located at the output end of the third driving unit. The third driving unit is used to drive the second gripping unit to rotate. The rotation center line of the second gripping unit is parallel to the first direction. The second gripping unit can rotate to the processing area of the laser emitting device.
[0027] In some possible implementations, the laser processing equipment further includes:
[0028] A fourth drive unit is disposed on the frame;
[0029] The fifth drive unit is disposed at the output end of the fourth drive unit, and the fourth drive unit is used to drive the fifth drive unit to move along the second direction;
[0030] A fixture is disposed at the output end of the fifth drive unit, which drives the fixture to move along the first direction. The fixture is located directly below the laser emitting device.
[0031] In some possible implementations, the laser emitting device includes:
[0032] The sixth drive unit is disposed on the frame;
[0033] A laser emitting unit is disposed at the output end of the sixth driving unit, and the sixth driving unit is used to drive the laser emitting unit to move in the vertical direction.
[0034] In some possible implementations, the laser processing equipment further includes:
[0035] A robotic arm, which is mounted on the frame;
[0036] The third gripping unit is located at the end of the robotic arm. The robotic arm is used to drive the third gripping unit to place the product outside the frame onto the loading device or to place the product on the unloading device outside the frame.
[0037] The laser processing equipment provided in this application embodiment has a processing area for a feeding device, a loading device, and a laser emitting device arranged along a second direction to facilitate product transport by a transfer device, thereby improving the transport efficiency of the transfer device. A flipping device is adjacent to the processing area of the laser emitting device, allowing the flipping device to flip the product in the processing area of the laser emitting device. The transfer device transports the product from the loading device to the processing area of the laser emitting device, whereby the laser emitting device emits a laser beam to laser-mark the product. Then, the flipping device flips the product in the processing area of the laser emitting device, and the laser emitting device emits a laser beam to laser-mark the back of the product. Finally, the transfer device transports the product from the processing area of the laser emitting device to the feeding device for unloading the marked product. Since the conveying direction of the loading device is opposite to that of the feeding device, and they are located adjacent to each other, products can be loaded and unloaded between the loading and unloading devices without needing to be loaded or unloaded separately at different locations. This reduces the number of workers or the number of automatic loading and unloading devices, thereby reducing the cost of laser marking products. Attached Figure Description
[0038] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0039] Figure 1 This is a schematic diagram of the structure of an embodiment of the laser processing equipment of this application;
[0040] Figure 2 This is a schematic diagram of the structure of an embodiment of the transfer device of this application;
[0041] Figure 3 This is a schematic diagram of the structure of an embodiment of the flipping device of this application;
[0042] Figure 4 This is a schematic diagram of the structure of an embodiment of the laser emitting device of this application;
[0043] Figure 5 This is a schematic diagram of the structure of one embodiment of the robotic arm and the third gripping unit assembled according to this application.
[0044] Explanation of icon numbers:
[0045] 1. Frame; 2. Loading device; 3. Unloading device; 4. Laser emitting device; 41. Sixth drive unit; 42. Laser emitting unit; 5. Tilting device; 51. Third drive unit; 52. Second gripping unit; 6. Transfer device; 61. Slide rail; 62. First drive unit; 63. Gripping assembly; 631. Second drive unit; 632. First gripping unit; 7. Fourth drive unit; 8. Fifth drive unit; 9. Fixture; 10. Robotic arm; 20. Third gripping unit.
[0046] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0047] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.
[0048] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.
[0049] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0050] It should be understood that the term "and / or" as used in this application specification and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.
[0051] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0052] This application provides a laser processing device to solve the technical problem of high cost of laser marking on circuit boards.
[0053] In the embodiments of this application, such as Figure 1 As shown, the laser processing equipment includes a frame 1, a loading device 2, a unloading device 3, a laser emitting device 4, a flipping device 5, and a transfer device 6. The loading device 2, unloading device 3, laser emitting device 4, flipping device 5, and transfer device 6 are all mounted on the frame 1. The loading device 2 and unloading device 3 are used to convey products along a first direction, and the laser emitting device 4 is used to emit a laser beam to mark the products. The flipping device 5 is used to flip the products, and the transfer device 6 is used to convey the products along a second direction.
[0054] The processing areas of the unloading device 3, the loading device 2, and the laser emitting device 4 are arranged sequentially along the second direction, and the flipping device 5 is adjacent to the processing area of the laser emitting device 4. The conveying direction of the loading device 2 is opposite to the conveying direction of the unloading device 3, and the first direction, the second direction, and the vertical direction are perpendicular to each other.
[0055] In another alternative embodiment, the processing areas of the feeding device 2, the unloading device 3, and the laser emitting device 4 are arranged sequentially along the second direction.
[0056] Laser processing equipment can mark products with lasers, such as circuit boards.
[0057] like Figure 1 As shown, the first direction is parallel to the Y direction, the second direction is parallel to the X direction, and the vertical direction is parallel to the Z direction.
[0058] The feeding device 2 and the unloading device 3 can have the same structure, both including multiple rollers. Adjacent rollers are arranged parallel and spaced apart, and the rollers are rotatably mounted on the frame 1. The conveying direction of the rollers to the products can be changed by controlling the rotation direction of the rollers.
[0059] In this embodiment, the processing areas of the unloading device 3, the loading device 2, and the laser emitting device 4 are arranged along a second direction to facilitate the transport device 6 in conveying products and improving the transport efficiency of the transport device 6. The flipping device 5 is adjacent to the processing area of the laser emitting device 4 so that the flipping device 5 can flip the products in the processing area of the laser emitting device 4. The transport device 6 is used to transport the products on the loading device 2 to the processing area of the laser emitting device 4 so that the laser emitting device 4 can emit a laser beam to laser mark the products. Then, the flipping device 5 flips the products in the processing area of the laser emitting device 4, and then the laser emitting device 4 emits a laser beam to laser mark the back of the products. Then, the transport device 6 transports the products in the processing area of the laser emitting device 4 to the unloading device 3 so that the marked products can be unloaded. Since the conveying direction of the loading device 2 is opposite to that of the unloading device 3 and they are located adjacent to each other, products can be loaded and unloaded between the loading device 2 and the unloading device 3 without having to load or unload separately at different locations. This reduces the number of workers or the number of automatic loading and unloading devices 3, thereby reducing the cost of laser marking products.
[0060] In one embodiment, such as Figure 1 and Figure 2 As shown, the transfer device 6 includes a slide rail 61, a first drive unit 62, and a gripping assembly 63. Both the slide rail 61 and the first drive unit 62 are mounted on the frame 1. The slide rail 61 is located directly above the processing areas of the loading device 2, the unloading device 3, and the laser emitting device 4, and its length direction is parallel to the second direction. The gripping assembly 63 is slidably mounted on the slide rail 61 and is connected to the output end of the first drive unit 62. The first drive unit 62 drives the gripping assembly 63 to move along the second direction. The gripping assembly 63 is used to grip products.
[0061] The gripping component 63 is slidably mounted on the slide rail 61, which improves the stability of the gripping component 63 sliding along the second direction driven by the first drive unit 62. The slide rail 61 is located directly above the processing areas of the loading device 2, unloading device 3, and laser emitting device 4, so that the gripping component 63 can transport products between the processing areas of the loading device 2, unloading device 3, and laser emitting device 4. Since the sliding direction of the gripping component 63 is linear, the efficiency of the gripping component 63 in transporting products can be improved.
[0062] In one embodiment, such as Figure 1 and Figure 2As shown, the gripping assembly 63 includes a second drive unit 631 and a first gripping unit 632. The second drive unit 631 is slidably mounted on the slide rail 61. The second drive unit 631 is connected to the output end of the first drive unit 62, and the first drive unit 62 is used to drive the second drive unit 631 to move along a second direction. The first gripping unit 632 is disposed at the output end of the second drive unit 631, and the second drive unit 631 is used to drive the first gripping unit 632 to rise and fall. The first gripping unit 632 is used to grip the product.
[0063] The first drive unit 62 drives the second drive unit 631 to move along the second direction, which can bring the first gripping unit 632 directly above the processing area of the loading device 2, unloading device 3, or laser emitting device 4. The second drive unit 631 drives the first gripping unit 632 to rise and fall, so that the gripping unit can grip or place products. By using the first drive unit 62 and the second drive unit 631 to drive the first gripping unit 632 to grip or place products, the efficiency of product conveying can be improved.
[0064] In one embodiment, such as Figure 1 and Figure 2 As shown, there are two gripping components 63. Since the operation times of the feeding device 2, unloading device 3, laser emitting device 4, and flipping device 5 are different, increasing the number of gripping components 63 can act as a buffer, taking into account the operation times of each device, thereby further improving the product conveying efficiency.
[0065] In one embodiment, such as Figure 1 and Figure 2 As shown, the distance between the two gripping components 63 is equal to the distance between the feeding device 2 and the unloading device 3. This allows the two gripping components 63 to be positioned directly above the feeding device 2 and the unloading device 3 at the same time, enabling them to grip or place products, thus improving the efficiency of product conveying. It also prevents the two gripping components 63 from interfering with each other.
[0066] In one embodiment, such as Figure 1 As shown, the flipping device 5 is located on the side of the processing area of the laser emitting device 4 away from the loading device 2, and the flipping device 5 is located directly below the slide rail 61. That is, the unloading device 3, the loading device 2, the processing area of the laser emitting device 4 and the flipping device 5 are arranged sequentially along the second direction, and the unloading device 3, the loading device 2, the processing area of the laser emitting device 4 and the flipping device 5 are all located directly below the slide rail 61.
[0067] The gripping component 63 can transport products from the processing area of the laser emitting device 4 to the flipping device 5, and the gripping component 63 can also transport products from the flipping device 5 to the processing area of the laser emitting device 4. Since the gripping component 63 can transport products between the unloading device 3, the loading device 2, the processing area of the laser emitting device 4, and the flipping device 5 by moving in a straight line, the downtime of the gripping component 63 can be reduced, thereby improving the efficiency of the gripping component 63 in transporting products.
[0068] In one embodiment, such as Figure 1 and Figure 3 As shown, the flipping device 5 includes a third drive unit 51 and a second gripping unit 52. The third drive unit 51 is mounted on the frame 1. The second gripping unit 52 is located at the output end of the third drive unit 51, and the third drive unit 51 drives the second gripping unit 52 to rotate. The rotation center line of the second gripping unit 52 is parallel to the first direction, and the second gripping unit 52 can rotate to the processing area of the laser emitting device 4.
[0069] After the laser emitting device 4 emits a laser beam to mark the front of the product, the third drive unit 51 can drive the second gripping unit 52 to rotate to the processing area of the laser emitting device 4, so that the second gripping unit 52 can grip the product. Then, the third drive unit 51 drives the second gripping unit 52 to rotate 180° away from the processing area of the laser emitting device 4, thereby flipping the product so that the back of the product is facing up. Then, the gripping assembly 63 transports the product on the second gripping unit 52 to the processing area of the laser emitting device 4 for laser marking on the back of the product.
[0070] The product is rotated and flipped by the second gripping unit 52 driven by the third drive unit 51. The structure is simple and the flipping efficiency is high.
[0071] In one embodiment, such as Figure 1 As shown, the laser processing equipment also includes a fourth drive unit 7, a fifth drive unit 8, and a fixture 9. The fourth drive unit 7 is mounted on the frame 1. The fifth drive unit 8 is located at the output end of the fourth drive unit 7, and the fourth drive unit 7 drives the fifth drive unit 8 to move along a first direction. The fixture 9 is located at the output end of the fifth drive unit 8, and the fifth drive unit 8 drives the fixture 9 to move along a second direction. The fixture 9 is located directly below the laser emitting device 4.
[0072] The fixture 9 is used to place the product. The fourth drive unit 7 and the fifth drive unit 8 drive the fixture 9 to move along the first direction and the second direction respectively, which can facilitate the laser emitting device 4 to emit a laser beam to laser mark the desired pattern on the product on the fixture 9.
[0073] In one embodiment, such as Figure 1 and Figure 4 As shown, the laser emitting device 4 includes a sixth driving unit 41 and a laser emitting unit 42. The sixth driving unit 41 is mounted on the frame 1. The laser emitting unit 42 is located at the output end of the sixth driving unit 41, and the sixth driving unit 41 is used to drive the laser emitting unit 42 to move vertically.
[0074] The laser emitting unit 42 is used to emit a laser beam. The sixth driving unit 41 drives the laser emitting unit 42 to move vertically, which can adjust the focus of the laser beam emitted by the laser emitting unit 42 on the product, thereby improving the quality of laser marking on the product.
[0075] In one embodiment, such as Figure 1 and Figure 5 As shown, the laser processing equipment also includes a robotic arm 10 and a third gripping unit 20. The robotic arm 10 is mounted on the frame 1. The third gripping unit 20 is located at the end of the robotic arm 10. The robotic arm 10 is used to drive the third gripping unit 20 to place products outside the frame 1 onto the loading device 2 or to place products on the unloading device 3 outside the frame 1. The robotic arm 10 has multiple degrees of freedom.
[0076] After the user uses the trolley to dock the product at the end of the loading device 2, the robotic arm 10 can drive the third gripping unit 20 to transport the product on the trolley to the loading device 2. The robotic arm 10 can also drive the third gripping unit 20 to transport the product on the unloading device 3 to the empty trolley docked with the unloading device 3. The robotic arm 10 can also drive the third gripping unit 20 to transport the partition paper on the trolley docked with the loading device 2 to the trolley docked with the unloading device 3. The partition paper is used to pad between two adjacent stacked products to prevent scratches caused by friction.
[0077] By using the robotic arm 10 to drive the third gripping unit 20 to feed products onto the feeding device 2 or to unload products from the unloading device 3, the efficiency of loading and unloading products can be improved.
[0078] After the robotic arm 10 drives the third gripping unit 20 to place the product on the loading device 2, the loading device 2 then conveys the product along the first direction to the gripping area of the transfer device 6 so that the transfer device 6 can grip the product. After the transfer device 6 places the product on the unloading device 3, the unloading device 3 then conveys the product along the first direction to the gripping area of the third gripping unit 20 so that the third gripping unit 20 can grip the product.
[0079] In one embodiment, the first gripping unit 632, the second gripping unit 52, and the third gripping unit 20 can all grip the product by adsorption.
[0080] In one embodiment, the laser processing equipment further includes a seventh drive unit, which is disposed on the frame 1. The robotic arm 10 is disposed at the output end of the seventh drive unit, and the seventh drive unit is used to drive the robotic arm 10 to move along the second direction. This allows the robotic arm 10 to easily move the third gripping unit 20 directly above the loading device 2 or the unloading device 3.
[0081] The above description is merely a preferred embodiment of this application and does not limit the patent scope of this application. Any equivalent structural transformations made based on the inventive concept of this application and the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this application.
Claims
1. A laser processing device, characterized in that, The laser processing equipment includes: frame; A feeding device is disposed on the frame and is used to convey products along a first direction; A feeding device is disposed on the frame and is used to convey the product along the first direction; A laser emitting device is mounted on the frame and is used to emit a laser beam to mark the product; A flipping device is disposed on the frame and is used to flip the product; A transfer device is disposed on the frame and is used to transport the product along a second direction; The processing areas of the unloading device, the loading device, and the laser emitting device are arranged sequentially along the second direction, or the processing areas of the loading device, the unloading device, and the laser emitting device are arranged sequentially along the second direction; the flipping device is adjacent to the processing area of the laser emitting device, the conveying direction of the loading device is opposite to the conveying direction of the unloading device, and the first direction, the second direction, and the vertical direction are perpendicular to each other.
2. The laser processing equipment as described in claim 1, characterized in that, The transfer device includes: A slide rail is provided on the frame and is located directly above the processing areas of the loading device, the unloading device and the laser emitting device. The length direction of the slide rail is parallel to the second direction. A first drive unit is disposed on the frame; A gripping component is slidably mounted on the slide rail and connected to the output end of the first drive unit. The first drive unit is used to drive the gripping component to move along the second direction, and the gripping component is used to grip the product.
3. The laser processing equipment as described in claim 2, characterized in that, The crawling component includes: A second drive unit is slidably mounted on the slide rail. The second drive unit is connected to the output end of the first drive unit. The first drive unit is used to drive the second drive unit to move along the second direction. A first gripping unit is disposed at the output end of the second drive unit. The second drive unit is used to drive the first gripping unit to move up and down, and the first gripping unit is used to grip the product.
4. The laser processing equipment as described in claim 2, characterized in that, There are two crawling components.
5. The laser processing equipment as described in claim 4, characterized in that, The spacing between the two gripping components is equal to the spacing between the feeding device and the unloading device.
6. The laser processing equipment as described in claim 2, characterized in that, The flipping device is located on the side of the processing area of the laser emitting device away from the feeding device, and the flipping device is located directly below the slide rail.
7. The laser processing equipment as described in claim 6, characterized in that, The flipping device includes: A third drive unit is disposed on the frame; The second gripping unit is located at the output end of the third driving unit. The third driving unit is used to drive the second gripping unit to rotate. The rotation center line of the second gripping unit is parallel to the first direction. The second gripping unit can rotate to the processing area of the laser emitting device.
8. The laser processing equipment as described in claim 1, characterized in that, The laser processing equipment also includes: A fourth drive unit is disposed on the frame; The fifth driving unit is disposed at the output end of the fourth driving unit, and the fourth driving unit is used to drive the fifth driving unit to move along the first direction; A fixture is disposed at the output end of the fifth drive unit, which drives the fixture to move along the second direction. The fixture is located directly below the laser emitting device.
9. The laser processing equipment as described in claim 8, characterized in that, The laser emitting device includes: The sixth drive unit is disposed on the frame; A laser emitting unit is disposed at the output end of the sixth driving unit, and the sixth driving unit is used to drive the laser emitting unit to move in the vertical direction.
10. The laser processing equipment as described in claim 1, characterized in that, The laser processing equipment also includes: A robotic arm, which is mounted on the frame; The third gripping unit is located at the end of the robotic arm. The robotic arm is used to drive the third gripping unit to place the product outside the frame onto the loading device or to place the product on the unloading device outside the frame.
