A tablet press
By using dual encoders to control the relative movement of the material tray and the core tray, combined with the support base plate and the chip detection and rejection mechanism, the problem of chip positioning at the coating center position is solved, achieving high precision and consistency in chip coating.
Patent Information
- Application Number
- CN202522580034.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-04
- Publication Date
- 2026-11-03
- Estimated Expiration
- 2035-12-04
AI Technical Summary
Existing tablet presses have difficulty placing the chip accurately in the center of the coating, affecting the consistency of chip quality.
The relative movement of the material tray and the core tray is controlled by dual encoder linkage. Through the linkage of the first encoder and the second encoder, the mold cavity of the material tray and the chip receiving hole of the core tray are aligned with high precision at the set position. Combined with the support base plate, detection mechanism and chip rejection mechanism, the chip is accurately positioned.
This ensures that the chip falls stably and accurately into the center of the mold cavity, improving the quality consistency of the packaged chip and avoiding deviation problems caused by mechanical vibration or cumulative errors.
Smart Images
Figure CN224928605U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of tablet presses, and in particular to a tablet press. Background Technology
[0002] As a core dosage form in the pharmaceutical, food, and chemical industries, the consistency of tablet quality directly affects the safety and efficacy of products. In industrial production, tablet presses are the core equipment for high-speed compression molding of powder materials. Through a die system, high pressure is applied to the powder filling the die holes to form tablets with a predetermined shape and density.
[0003] Chip coating is a common type of pharmaceutical formulation, consisting of an outer coating and an inner chip. To improve efficacy, the chip needs to be centered within the coating. However, with existing tableting machines, it is often difficult to accurately center the chip within the coating during tableting. Utility Model Content
[0004] The purpose of this invention is to provide a tablet press that enables the chip to be accurately placed in the center of the coating.
[0005] To solve the above-mentioned technical problems, this utility model provides a tablet press.
[0006] The tablet press of this utility model includes: The turntable mechanism includes a first encoder, a material tray, and a first drive motor for driving the material tray to rotate circumferentially. The material tray has a plurality of mold cavities arranged at intervals along the circumference. The first encoder is used to measure and control the rotation of the material tray. The feeding mechanism is used to add the coating material into the mold cavity of the material tray; The chip feeding mechanism includes a chip conveying component, a chip disk, a second encoder, and a second drive motor for driving the chip disk to rotate circumferentially. The chip disk has a plurality of chip receiving holes arranged circumferentially at intervals. The chip conveying component is used to convey chips into the chip receiving holes. The second encoder is used to measure and control the rotation of the chip disk. The first encoder and the second encoder work together to align the mold cavity of the material tray and the chip receiving hole of the core tray at a set position, thereby causing the chip to fall into the center of the mold cavity; A pressing mechanism is used to compress materials to form packaged chips.
[0007] Furthermore, the core-feeding mechanism also includes a support base plate located below the core disk for supporting the chip in the chip receiving hole. The support base plate has a transfer through hole located at the set position for guiding the chip from the chip receiving hole into the center of the mold cavity.
[0008] Furthermore, it also includes a detection mechanism and a chip rejection mechanism. The detection mechanism detects whether the chip falls into the center of the mold cavity, and the chip rejection mechanism is used to reject tablets whose chips are not in the center of the mold cavity at the chip ejection position.
[0009] Furthermore, the detection mechanism includes a detection probe and a reflector, the reflector being used to reflect the internal information of the mold cavity into the detection probe.
[0010] Furthermore, the chip conveying component includes a vertical spiral conveyor belt and a horizontal conveyor belt connected to each other, and the end of the horizontal conveyor belt is adjacent to the circular boundary where the central axis of the chip receiving hole is located.
[0011] Furthermore, the chip conveying component also includes a conveying housing, the vertical spiral conveyor belt is located inside the conveying housing, the conveying housing has an outlet, and the vertical spiral conveyor belt and the horizontal conveyor belt are connected at the outlet.
[0012] Furthermore, the chip disk is also provided with a plurality of guide grooves that are connected to and correspond one-to-one with the chip receiving hole, and the guide grooves are used to guide the chip into the chip receiving hole.
[0013] Furthermore, the guide groove is a fan-shaped groove.
[0014] Furthermore, the pressing mechanism includes a pressing roller mechanism and a punch mechanism. The pressing roller mechanism includes a pre-pressing roller mechanism and a main pressing roller mechanism. The pre-pressing roller mechanism is used to press the punch mechanism to pre-press the material, and the main pressing roller mechanism is used to press the punch mechanism to squeeze the pre-pressed material to form tablets.
[0015] Compared with the prior art, the present invention has at least the following beneficial effects: This invention utilizes a first encoder and a second encoder working in tandem to synchronously adjust the relative movement of the material tray and the core tray based on their real-time position data. This ensures high-precision alignment of the mold cavity on the material tray and the chip receiving hole on the core tray at a set position. This dual-encoder collaborative mechanism effectively compensates for accumulated errors between different mechanisms, fundamentally solving the problem of chip misalignment. When the mold cavity and the chip receiving hole are aligned, the chip falls from the chip receiving hole into the center position of the mold cavity, thus achieving accurate chip positioning. Attached Figure Description
[0016] Figure 1 This is a schematic diagram illustrating the working principle of one embodiment of the tablet press of this utility model; Figure 2 for Figure 1 A schematic diagram of the material tray and the first encoder structure of the tablet press; Figure 3 forFigure 1 A schematic diagram of the core disk and second encoder structure of a tablet press; Figure 4 for Figure 1 A schematic diagram of the structure of a tablet press when the feed tray and core tray are used together; Figure 5 for Figure 1 A schematic diagram of the chip conveyor and chip disk structure of a tablet press; Figure 6 for Figure 5 A top view of the chip conveyor and chip disk of a tablet press; Figure 7 This is a schematic diagram showing the state of the material tray when material is first added to the mold cavity in an embodiment of the tablet press of this utility model; Figure 8 This is a schematic diagram showing the state of the lower punch after the material is initially added to the mold cavity of the material tray in an embodiment of the tablet press of this utility model. Figure 9 This is a schematic diagram showing the state of the chip in the mold cavity of the material tray in one embodiment of the tablet press of this utility model; Figure 10 This is a schematic diagram showing the state of the material tray after a second addition of material to the mold cavity in an embodiment of the tablet press of this utility model; Figure 11 This is a schematic diagram showing the state of a chip after it has been pressed into shape in the mold cavity of the material tray in one embodiment of the tablet press of this utility model.
[0017] Figure label: 10. First encoder; 11. Material tray; 12. Mold cavity; 20. Chip conveyor; 21. Vertical spiral conveyor belt; 22. Horizontal conveyor belt; 30. Chip disk; 31. Chip receiving hole; 32. Guide groove; 33. Second encoder; 34. Second drive motor; 35. Gear assembly; 40. Testing institution; 41. Testing probe; 42. Reflector; 51. Upper preload roller; 52. Lower preload roller; 53. Upper main pressure roller; 54. Lower main pressure roller; 55. Upper punch; 56. Lower punch; 61. Feeding shell; 62. Filling impeller; 63. Metering impeller; 64. Material cylinder; 65. Feed inlet; 71. Primary packing guide rail; 72. Primary metering guide rail; 73. Secondary packing guide rail; 74. Secondary metering guide rail. Detailed Implementation
[0018] The tablet press of this utility model will now be described with reference to the schematic diagrams, which illustrate preferred embodiments of the utility model. It should be understood that those skilled in the art can modify the utility model described herein while still achieving its advantageous effects. Therefore, the following description should be understood as being of general knowledge to those skilled in the art and not as a limitation thereof. Based on the teachings of this specification, those skilled in the art can form new technical solutions through cross-combinations of different implementation methods without creating technical contradictions; such modifications should all be considered to fall within the protection scope of this patent.
[0019] The serial numbers assigned to components in this document, such as "first," "second," etc., are merely for distinguishing the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this utility model, unless otherwise specified, include both direct and indirect connections (linkages). In the description of this utility model, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used solely for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0020] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0021] In this utility model, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium. Furthermore, the term "electrical connection" can be a direct electrical connection or an indirect electrical connection through an intermediate medium.
[0022] The present invention will be described more specifically by way of example in the following paragraphs with reference to the accompanying drawings. The advantages and features of the present invention will become clearer from the following description and claims. It should be noted that the drawings are in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of the present invention.
[0023] The following is in conjunction with the instruction manual appendix. Figure 1 To be continued Figure 11 This paper introduces the tablet press of this utility model.
[0024] like Figure 1 As shown, the tablet press of this utility model includes a turntable mechanism, a punch mechanism, a feeding mechanism, a core dropping mechanism, and a pressure roller mechanism.
[0025] like Figure 1 and Figure 2 As shown, the turntable mechanism includes a first encoder 10, a material tray 11, and a first drive motor for driving the material tray 11 to rotate circumferentially. The material tray 11 has a plurality of mold cavities 12 arranged circumferentially. The mold cavities 12 can be arranged at uniform intervals or at non-uniform intervals. The first encoder 10 is used to measure and control the rotation of the material tray 11, such as rotation position, speed, and direction.
[0026] The feeding mechanism is used to add the coating material into the mold cavity 12 of the material tray 11.
[0027] like Figure 3 , Figure 4 and Figure 5 As shown, the chip feeding mechanism includes a chip conveying component 20, a chip disk 30, a second encoder 33, and a second drive motor 34 for driving the chip disk 30 to rotate circumferentially. The chip disk 30 has a plurality of chip receiving holes 31 arranged circumferentially at intervals. The chip receiving holes 31 can be evenly spaced or unevenly spaced. The chip conveying component 20 is used to convey chips into the chip receiving holes 31. The second encoder 33 is used to measure and control the rotation of the chip disk 30, such as rotational position, speed, and direction.
[0028] The first encoder 10 and the second encoder 33 are linked together, such as... Figure 2 As shown, this is to align the mold cavity 12 of the material tray 11 and the chip receiving hole 31 of the core tray 30 at a set position, so that the chip falls into the center of the mold cavity 12.
[0029] The pressing mechanism is used to compress the material to form a packaged chip. Specifically, the pressing mechanism may include a pressure roller mechanism and a punch mechanism. The punch mechanism includes an upper punch assembly located above the material tray 11 and a lower punch assembly located below the material tray 11. The pressure roller mechanism is used to press against the punch mechanism to compress the material to form a packaged chip.
[0030] The first encoder 10 can be understood as a device for acquiring rotational motion parameters, which can detect rotational angle, speed, and direction through photoelectric, magnetoelectric, or mechanical contact methods. For example, an incremental encoder can be used to determine the rotational position by counting pulses, or an absolute encoder can be used to directly read the current position value. Furthermore, the first encoder 10 and the first drive motor can be connected through a signal feedback loop to achieve closed-loop control of the movement state of the material tray 11.
[0031] Specifically, the second encoder 33 is also a device for collecting rotational motion parameters. Its function and implementation are similar to those of the first encoder 10, but its main target is the core disk 30. The second drive motor 34 can drive the core disk 30 to rotate through the gear assembly 35.
[0032] Furthermore, the linkage between the first encoder 10 and the second encoder 33 can be achieved through a master-slave control mode, where one encoder acts as the master device, sending a synchronization signal, and the other encoder acts as the slave device, receiving and responding to the signal. For example, a PLC controller can be used as an intermediate processing unit to calculate the relative positional deviation between the material tray 11 and the core tray 30 based on the real-time data from the two encoders, and output corresponding adjustment commands.
[0033] This invention achieves high-precision synchronous control of the material tray 11 and the core tray 30 through the linkage of the first encoder 10 and the second encoder 33, fundamentally solving the problem of the chip being difficult to accurately place at the center of the coating. Compared with traditional tablet presses that rely on a single drive source or mechanical transmission, this embodiment uses dual encoders working together to effectively compensate for the cumulative errors between different mechanisms, enabling the chip to stably fall into the center of the mold cavity 12.
[0034] The working principle of this utility model embodiment is as follows: The first encoder 10 in the turntable mechanism measures and controls the rotational position, speed, and direction of the material tray 11 in real time, enabling the material tray 11 to accurately reach the set position. The material tray 11 has multiple cavities 12 arranged evenly around the circumference to accommodate the coating material. This closed-loop control mechanism based on encoder feedback effectively avoids positioning errors caused by inertia or wear in traditional mechanical transmissions, providing a fundamental guarantee for the precise positioning of the cavities 12. Furthermore, the second encoder 33 in the core-feeding mechanism precisely controls the rotational position, speed, and direction of the core tray 30. The core tray 30 has multiple chip-receiving holes 31 arranged evenly around the circumference to receive chips conveyed by the chip conveyor 20. Through dynamic adjustment of the movement of the core tray 30, the influence of the core tray 30's own rotational deviation on the chip landing point is eliminated.
[0035] The first encoder 10 and the second encoder 33 work in tandem, synchronously adjusting the relative movement of the material tray 11 and the core tray 30 based on their real-time position data. This ensures high-precision alignment of the mold cavity 12 of the material tray 11 and the chip receiving hole 31 of the core tray 30 at a set position. This dual-encoder collaborative mechanism effectively compensates for the cumulative errors between different mechanisms, fundamentally solving the problem of chip deviating from the center. Specifically, when the mold cavity 12 is aligned with the chip receiving hole 31, the chip falls from the chip receiving hole 31 into the center position of the mold cavity 12, thus achieving accurate chip positioning. Before the chip is positioned, the feeding mechanism adds coating material to the mold cavity 12, providing an initial positioning support surface for the chip and further improving chip stability. After the chip is positioned, the feeding mechanism adds coating material to the mold cavity 12 again, completely encapsulating the chip, thus forming a coated chip after extrusion. The pressure roller mechanism compresses the material through the top-pressing punch mechanism to complete the chip coating process. The punch mechanism includes an upper punch assembly above the material tray 11 and a lower punch assembly below the material tray 11. Its optimized pressure transmission path ensures that the coating material can evenly wrap the central chip, ultimately forming a structurally complete chip coating. Thus, the entire technical solution achieves high-precision synchronous control between the material tray 11 and the core tray 30 through encoder linkage. Combined with the orderly cooperation of various mechanisms, it completely avoids the randomness defects of manual or mechanical alignment, achieving the goal of the chip falling stably and accurately into the center of the mold cavity 12.
[0036] Furthermore, in some embodiments, the core-feeding mechanism further includes a support base plate located below the core disk 30 for supporting the chip in the chip receiving hole 31. The support base plate has a transfer through hole located at the set position for guiding the chip from the chip receiving hole 31 into the center of the mold cavity 12.
[0037] Specifically, the support base plate refers to a rigid structural component located below the chip disk 30. It can be made of materials such as metal sheet, high-strength composite material, or engineering plastic, and its purpose is to provide stable physical support for the chip. The transit via refers to a through hole formed on the support base plate. It can be designed as a circle, square, or other geometric structure adapted to the shape of the chip, and its purpose is to limit the chip's falling path and ensure alignment accuracy.
[0038] In detail, the design of the support base plate located below the core disk 30 effectively counteracts the centrifugal force and vibration generated during the rotation of the core disk 30 through physical support, thereby maintaining the initial positional stability of the chip in the chip receiving hole 31. The intermediate through hole positioned on the support base plate is strictly matched with the alignment point of the mold cavity 12 of the material tray 11 and the chip receiving hole 31 of the core disk 30. This positional relationship ensures that the chip can only be transferred through the through hole when the first encoder 10 and the second encoder 33 precisely control their alignment. In addition, the guiding function of the intermediate through hole limits the chip's falling path, avoiding deviation caused by uneven airflow or gravity during free fall, thereby achieving accurate positioning of the chip in the coating layer.
[0039] Through the above technical solution, the problem of chip position shift caused by mechanical vibration or rotational inertia is effectively solved during the process of transferring the chip from the core disk 30 to the material disk 11, so that the chip can accurately fall into the center of the mold cavity 12, thereby improving the overall quality of chip packaging.
[0040] Furthermore, in some embodiments, a detection mechanism and a rejection mechanism are also included. The detection mechanism detects whether the chip falls into the center of the mold cavity 12, and the rejection mechanism is used to reject tablets whose chips are not in the center of the mold cavity 12 at the exit position.
[0041] Specifically, the inspection mechanism refers to a device capable of monitoring the internal state of the mold cavity 12 in real time and determining whether the chip is centered. This can be achieved using optical sensors or image recognition equipment. The rejection mechanism refers to an execution device that can quickly reject defective tablets at the end of production based on the inspection results. This can be achieved through robotic arms, pneumatic push rods, or rotating rejection discs. The purpose of introducing the inspection mechanism is to solve the problem of chip misalignment caused by mechanical vibration or material flow, ensuring the chip is precisely centered in the coating. The rejection mechanism is designed to promptly reject defective products, preventing defective tablets from flowing into subsequent stages, thereby maintaining product quality consistency.
[0042] This solution establishes a closed-loop quality control system at the end of tablet production by integrating detection and rejection mechanisms. The detection mechanism monitors the center position of the mold cavity 12 in real time, directly acquiring the internal state of the cavity and accurately identifying whether the chips are centered, overcoming the limitations of relying solely on encoder alignment. The rejection mechanism performs rejection operations at the exit position based on the detection results. Since the exit position is the production endpoint, it facilitates the rapid removal of defective products, thus not interfering with the main tableting process and ensuring production continuity.
[0043] Furthermore, in some of these embodiments, such as Figure 4 As shown, the detection mechanism 40 includes a detection probe 41 and a reflector 42, wherein the reflector 42 is used to reflect the internal information of the mold cavity 12 into the detection probe 41.
[0044] Specifically, the detection probe 41 is a device capable of receiving optical signals and converting them into electrical signals for analysis. It can be implemented using a photodiode, a CCD (charge-coupled device) sensor, or a CMOS (complementary metal-oxide-semiconductor) sensor, with the aim of accurately acquiring the chip position information inside the mold cavity 12. The reflector 42 can be understood as an optical element with a highly reflective surface, which can be implemented in the form of a plane mirror, a concave mirror, or a prism. Its purpose is to reflect the optical information inside the mold cavity 12 to the detection probe 41 at a specific angle, thereby overcoming the problem of line-of-sight obstruction.
[0045] This solution effectively solves the problem of directly acquiring information inside the mold cavity 12 by using a combination of the detection probe 41 and the reflector 42. The detection probe 41, as the core information receiving component, requires stable optical input for accurate chip position determination. The introduction of the reflector 42, based on its optical reflection characteristics, reflects the optical information inside the mold cavity 12 to the detection probe 41 at a specific angle, avoiding visual obstruction caused by the compact structure of the tablet press. Thus, clear imaging of the inside of the mold cavity 12 can be achieved without adjusting the overall equipment layout, enabling the detection probe 41 to reliably capture chip position information.
[0046] Based on this, the design of the aforementioned detection mechanism is closely integrated with the overall structure of the tablet press. For example, the position and angle of the reflector 42 can be adjusted according to the specific layout of the mold cavity 12 to achieve optimal optical reflection. Simultaneously, the sensitivity and resolution of the detection probe 41 can be optimized according to actual needs to adapt to information acquisition within mold cavities 12 of different sizes and shapes. This design not only improves detection accuracy but also enhances the adaptability and stability of the equipment, thereby better meeting the stringent requirements for chip centering in chip packaging production.
[0047] Furthermore, in some of these embodiments, such asFigure 5 As shown, the chip conveying component 20 includes a vertical spiral conveyor belt 21 and a horizontal conveyor belt 22 connected to each other. The end of the horizontal conveyor belt 22 is adjacent to the circular boundary where the central axis of the chip receiving hole 31 is located.
[0048] In practical applications, the vertical spiral conveyor belt 21 refers to a device that uses spiral motion to lift and initially orient chips vertically. It can be implemented using a single spiral or multi-spiral structure, aiming to provide a continuous and orderly flow of chips for horizontal transport. The horizontal conveyor belt 22 refers to a device that precisely transports chips horizontally. It can be implemented using belt drive or chain drive, aiming to accurately transport chips to the target area. Furthermore, the design of the end of the horizontal conveyor belt 22 being adjacent to the circular boundary of the central axis of the chip receiving hole 31 is intended to allow the chip to naturally transition at the end of the transport and fall directly into the center of the receiving hole.
[0049] Specifically, this solution effectively solves the positioning accuracy problem during chip transport by optimizing the structural design of the chip transport component 20. The vertical spiral conveyor belt 21 uses spiral motion to stably lift the chip vertically and initially orient it, thus forming a continuous and orderly chip flow. Subsequently, the horizontal conveyor belt 22 accurately transports the chip to the target area horizontally according to the output state of the vertical spiral conveyor belt 21. Since the end of the horizontal conveyor belt 22 is adjacent to the circular boundary where the central axis of the chip receiving hole 31 is located, the chip can naturally transition at the end of the transport and fall directly into the center of the receiving hole, avoiding chip offset caused by abrupt changes in the transport path or positional deviation. This design not only ensures that the chip accurately enters the receiving hole, but also lays the foundation for the subsequent precise positioning of the chip in the center of the mold cavity 12. At the same time, the linkage between this solution and the chip receiving hole 31 on the chip disk 30 and the first encoder 10 and the second encoder 33 further improves the accuracy of the chip in the coating center during the pressing process, thereby significantly improving the quality consistency of the coated chips.
[0050] Furthermore, in some embodiments, the chip conveyor 20 further includes a conveyor housing, within which the vertical spiral conveyor belt is located, the conveyor housing having an outlet, and the vertical spiral conveyor belt 21 and the horizontal conveyor belt 22 are connected at the outlet.
[0051] In practical applications, the transport housing refers to a closed device used to enclose and protect the internal structure. It can be made of metal, plastic, or other materials with certain strength and protective properties, with the aim of isolating external environmental interference and improving the stability of the chip during transport. The outlet refers to a specific opening on the transport housing, which can be designed as circular, square, or other adaptable shapes. Its purpose is to precisely correspond to the conveyor belt connection point, allowing the chip to smoothly transition to the horizontal conveyor belt 22.
[0052] Specifically, this solution optimizes the chip delivery path through an integrated housing structure, effectively improving the stability and accuracy of the delivery process. The delivery housing, acting as a comprehensive protective device, completely encloses the conveyor belt, preventing chips from scattering, shifting, or jamming due to external vibrations, airflow, or operational interference during delivery. The vertical spiral conveyor belt 21 is placed inside the delivery housing; this design ensures the orderly arrangement of chips during the vertical lifting stage, maintaining controlled movement of the chips during ascent. The outlet on the delivery housing is precisely aligned with the connection point of the conveyor belt, allowing chips to smoothly transition from the vertical spiral conveyor belt 21 to the horizontal conveyor belt 22, preventing accumulation or shifting due to sudden turns at corners.
[0053] Furthermore, in some of these embodiments, such as Figure 6 As shown, the chip disk 30 is also provided with a plurality of guide grooves 32 that are connected to and correspond one-to-one with the chip receiving hole 31. The guide grooves 32 are used to guide the chip into the chip receiving hole 31.
[0054] Specifically, the guide groove 32 refers to a groove structure with a guiding function opened on the surface of the chip disk 30. By optimizing parameters such as its width, depth, and tilt angle, the guide groove 32 enables the chip to slide smoothly into the target receiving hole along a preset path. In addition, the one-to-one correspondence between the guide groove 32 and the chip receiving hole 31 can be ensured by precision machining technology, such as using CNC machine tools for high-precision positioning machining, thereby achieving the design purpose of equipping each receiving hole with a dedicated guide channel.
[0055] Preferably, the guide groove 32 is a fan-shaped groove. The design of the fan-shaped groove provides a continuous and smooth guiding effect through the arc edge, avoiding sudden turning or jamming caused by right angle or linear edges, so that the chip can accurately fall into the center position of the chip receiving hole 31.
[0056] In detail, the arc-shaped inner wall of the fan-shaped groove closely matches the natural movement trajectory of the chip. When the chip slides from the conveyor belt into the guide groove 32, the arc-shaped edge effectively reduces the risk of rotation or lateral displacement during the sliding process. This design not only improves the repeatability accuracy of chip positioning but also creates reliable conditions for the precise alignment of the mold cavity 12 of the material tray 11 with the chip receiving hole 31 of the core tray 30. Furthermore, the one-to-one correspondence between the fan-shaped groove and the chip receiving hole 31 ensures that each chip can enter the receiving hole through an independent guide path, thereby guaranteeing the precise placement of the chip at the coating center. Through the above technical solution, stable and precise placement of the chip at the coating center is achieved, significantly improving the quality consistency of the coated chips.
[0057] Furthermore, in some embodiments, the pressure roller mechanism includes a pre-pressure roller mechanism and a main pressure roller mechanism. The pre-pressure roller mechanism is used to press against the punch mechanism to pre-press the material, and the main pressure roller mechanism is used to press against the punch mechanism to squeeze the pre-pressed material to form tablets.
[0058] Specifically, the pre-compression roller mechanism refers to a device capable of applying initial pressure to the material. It can be implemented using a roller structure with a light compaction function, specifically including an upper pre-compression roller 51 and a lower pre-compression roller 52. Its purpose is to eliminate air gaps in the powder and promote initial bonding between particles, thereby reducing the lateral flow tendency of the material during subsequent main compression. The main compression roller mechanism can be understood as a device for final extrusion molding. It can be implemented through a high-strength pressure transmission structure, specifically including an upper main compression roller 53 and a lower main compression roller 54. Its purpose is to ensure that the pre-compressed material completes final molding in a stable state, while maintaining the concentric structure of the chip and coating.
[0059] In detail, this solution effectively mitigates the dynamic instability during material compression through a staged pressure application mechanism, thereby ensuring precise chip positioning in the coating center and the uniformity of the tablet structure. The pre-compression roller mechanism first performs preliminary compaction on the material filled in the mold cavity 12. This operation, based on the initial loose state of the material, provides a slight treatment, significantly reducing the air content inside the material and forming preliminary bonds between particles, providing a uniform base layer for the subsequent main compression stage. The main compression roller mechanism then applies the final high pressure based on the stable state of the material after pre-compression. Since pre-compression has made the material density distribution more uniform, the pressure transmission in the main compression stage is more balanced, preventing the chip from being pushed under high pressure or the coating layer from having local weak points. This step-by-step pressure strategy not only optimizes the gradual nature of material compression but also significantly reduces the risk of chip displacement through the buffering effect of the pre-compression stage, ultimately achieving reliable control of chip coating quality.
[0060] The punching mechanism includes an upper punch assembly and a lower punch assembly. The upper punch assembly is located above the material tray 11 and includes multiple upper punch rods 55 arranged evenly spaced circumferentially and corresponding one-to-one with the upper opening of the mold cavity 12. The lower punch assembly is located below the material tray 11 and includes multiple lower punch rods 56 arranged evenly spaced circumferentially and corresponding one-to-one with the lower opening of the mold cavity 12.
[0061] The tablet press also includes a filler guide rail and a metering guide rail.
[0062] The feeding mechanism includes a feeding housing 61 and a filling impeller 62 and a metering impeller 63 located in the feeding housing 61. The filling impeller 62 is used to cooperate with the lower punch 56 and the filler guide to fill the material into the mold cavity 12. The metering impeller 63 is used to cooperate with the lower punch 56 and the metering guide to remove excess material so as to maintain the material in the mold cavity 12 at a set filling amount.
[0063] The feeding mechanism also includes a material cylinder 64, which has an inlet 65 and an outlet. The outlet is connected to the inlet of the feeding housing 61, and materials can be added to the feeding housing 61 through the inlet 65.
[0064] In this embodiment, the packing guide rail includes a primary packing guide rail 71 and a secondary packing guide rail 73, and the metering guide rail includes a primary metering guide rail 72 and a secondary metering guide rail 74. Wherein, as... Figure 7 As shown, before the chip enters the mold cavity 12, the filling impeller 62 cooperates with the lower punch 56 and the primary filling guide 71 to fill the mold cavity 12 with material. The metering impeller 63 cooperates with the lower punch 56 and the primary metering guide 72 to remove excess material, thereby maintaining the material in the mold cavity 12 at a set filling amount. Then, as... Figure 8 As shown, the lower punch 56 moves downward to reserve space for inserting the chip and adding materials a second time. Figure 4 and Figure 9 As shown, the first encoder 10 and the second encoder 33 work in conjunction, synchronously adjusting the relative movement of the material tray 11 and the core tray 30 based on their real-time position data. This ensures high-precision alignment of the mold cavity 12 of the material tray 11 and the chip receiving hole 31 of the core tray 30 at a set position, allowing the chip to enter the center of the mold cavity 12. Figure 10 As shown, after the chip enters the mold cavity 12, the filling impeller 62 cooperates with the lower punch 56 and the secondary filling guide 73 to fill the mold cavity 12 with material. The metering impeller 63 cooperates with the lower punch 56 and the secondary metering guide 74 to remove excess material, thereby maintaining the material in the mold cavity 12 at a set filling amount. Finally, through two feeding processes, the material completely encapsulates the chip, thus forming a chip encapsulation after extrusion.
[0065] During operation, the upper pre-compression roller 51 applies downward pressure to the upper punch 55, and the lower pre-compression roller 52 applies upward pressure to the lower punch 56, so that the material is uniformly pre-compressed before entering the main pressure roller. After pre-compression, the upper main pressure roller 53 presses against the upper punch 55, and the lower main pressure roller 54 presses against the lower punch 56. Through the synchronous pressure applied by the symmetrically arranged upper and lower main pressure rollers 54, the material in the mold cavity 12 is subjected to a balanced axial extrusion force, thereby achieving the desired effect. Figure 11 As shown, the final product is a chip package.
[0066] Obviously, those skilled in the art can make various modifications and variations to this utility model without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this utility model and their equivalents, this utility model also intends to include these modifications and variations.
Claims
1. A tablet press, characterized in that, include: The turntable mechanism includes a first encoder (10), a material tray (11) and a first drive motor for driving the material tray (11) to rotate circumferentially. The material tray (11) has a plurality of mold cavities (12) arranged circumferentially. The first encoder (10) is used to measure and control the rotation of the material tray (11). A feeding mechanism is used to add the coating material into the mold cavity (12) of the material tray (11); The chip feeding mechanism includes a chip conveyor (20), a chip disk (30), a second encoder (33), and a second drive motor (34) for driving the chip disk (30) to rotate circumferentially. The chip disk (30) has a plurality of chip receiving holes (31) arranged circumferentially. The chip conveyor (20) is used to convey the chip into the chip receiving holes (31). The second encoder (33) is used to measure and control the rotation of the chip disk (30). The first encoder (10) and the second encoder (33) are linked to align the mold cavity (12) of the material tray (11) and the chip receiving hole (31) of the core tray (30) at a set position, thereby causing the chip to fall into the center of the mold cavity (12); A pressing mechanism is used to compress materials to form packaged chips.
2. The tablet press according to claim 1, characterized in that, The core dropping mechanism also includes a support base plate located below the core disk (30) for supporting the chip in the chip receiving hole (31). The support base plate has a transfer through hole located at the set position for guiding the chip from the chip receiving hole (31) into the center of the mold cavity (12).
3. The tablet press according to claim 1, characterized in that, It also includes a detection mechanism (40) and a chip rejection mechanism. The detection mechanism (40) detects whether the chip falls into the center of the mold cavity (12), and the chip rejection mechanism is used to reject the chip that is not in the center of the mold cavity (12) at the chip rejection position.
4. The tablet press according to claim 3, characterized in that, The detection mechanism (40) includes a detection probe (41) and a reflector (42), the reflector (42) being used to reflect the internal information of the mold cavity (12) into the detection probe (41).
5. The tablet press according to claim 1, characterized in that, The chip conveyor (20) includes a vertical spiral conveyor belt (21) and a horizontal conveyor belt (22) connected to each other. The end of the horizontal conveyor belt (22) is adjacent to the circular boundary where the central axis of the chip receiving hole (31) is located.
6. The tablet press according to claim 5, characterized in that, The chip conveyor (20) also includes a conveyor housing, the vertical spiral conveyor belt (21) is located inside the conveyor housing, the conveyor housing has an outlet, and the vertical spiral conveyor belt (21) and the horizontal conveyor belt (22) are connected at the outlet.
7. The tablet press according to claim 1, characterized in that, The chip disk (30) is also provided with a plurality of guide grooves (32) that are connected to and correspond one-to-one with the chip receiving hole (31). The guide grooves (32) are used to guide the chip into the chip receiving hole (31).
8. The tablet press according to claim 7, characterized in that, The guide groove (32) is a fan-shaped groove.
9. The tablet press according to claim 1, characterized in that, The pressing mechanism includes a pressing roller mechanism and a punch mechanism. The pressing roller mechanism includes a pre-pressing roller mechanism and a main pressing roller mechanism. The pre-pressing roller mechanism is used to press the punch mechanism to pre-press the material, and the main pressing roller mechanism is used to press the punch mechanism to squeeze the pre-pressed material to form tablets.