Linear co-evaporation type electron beam evaporation coating equipment
Patent Information
- Application Number
- CN202522106296.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-30
- Publication Date
- 2026-11-03
- Estimated Expiration
- 2035-09-30
AI Technical Summary
In existing electron beam evaporation coating equipment, when using one or two annular rotating electron guns for multi-component evaporation, the equipment chamber needs to be enlarged, resulting in high manufacturing costs and wasted space, and making it difficult to achieve high-precision control of the co-evaporation alloy ratio.
A linear electron gun mechanism and a linear crucible device are adopted, with two sets of crucibles and electron guns configured to achieve linear forward and backward movement. Combined with a crystal oscillator detector and an automatic control system, the alloy ratio and film uniformity are precisely controlled, reducing the chamber design volume.
It reduces equipment manufacturing and maintenance costs, improves alloy ratio accuracy and film uniformity, is suitable for small-scale production scenarios, and reduces vacuum system energy consumption and equipment load.
Smart Images

Figure CN224930625U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electron beam evaporation coating equipment technology, and in particular to a linear co-evaporation type electron beam evaporation coating equipment. Background Technology
[0002] Electron beam evaporation (EPE) is a type of physical vapor deposition that can be used to prepare various materials such as metals, semiconductors, and insulators. It boasts advantages such as simple equipment structure, easy process control, large coating area, and strong film adhesion. With technological advancements, metallization co-evaporation has gradually become a major application area. EBE metallization co-evaporation is a precision physical vapor deposition (PVD) technology that uses electron beam evaporation as the heating method to simultaneously evaporate two or more metals (or metal compounds) to form a uniform alloy thin film or composite metal thin film on the substrate surface. Its advantages lie in its ability to precisely control the proportions of multi-component metals, film purity, and microstructure. It is suitable for preparing high-melting-point metals, special alloys, and high-performance metallization coatings, especially in semiconductor or microelectronics manufacturing, where it is used to form good ohmic contacts or solder layers, and in microelectronic packaging.
[0003] Currently, the traditional electron guns used in electron beam evaporation coating equipment are ring-shaped and rotating. If a single electron gun and multiple crucibles are used, simultaneous co-evaporation cannot be achieved. If two electron guns and ring-shaped and rotating crucibles are used, the design of the equipment chamber needs to be enlarged, resulting in a significant waste of process chamber space and a relatively higher manufacturing cost. Utility Model Content
[0004] To address the shortcomings of existing technologies, this invention provides a linear co-evaporation electron beam evaporation coating equipment. By changing the installation area of the electron gun, the process chamber maintains a reasonable size design, thereby reducing manufacturing and maintenance costs.
[0005] The complete technical solution of this utility model includes:
[0006] A linear co-evaporation electron beam evaporation coating apparatus includes a metallization co-evaporation process chamber, with an electron gun and crucible located at the bottom of the chamber. The metallization co-evaporation process chamber is also equipped with a dome-shaped rotating workpiece disk.
[0007] The crucibles are in two sets, each used to hold one of the two evaporation materials required for the metallization co-evaporation process. The two sets of crucibles are placed on a linear crucible device, which is connected to a linear crucible movement device and can move linearly back and forth under the drive of the linear crucible movement device.
[0008] Two sets of linear electron gun mechanisms are arranged on both sides of the linear crucible device. The electron beam nozzles of the electron guns are directed towards the two sets of crucibles, and a metallization co-evaporation process is performed.
[0009] A crystal oscillator detector probe is installed on each side of the two sets of crucibles to monitor the evaporation rate of the two evaporation materials in the metallization co-evaporation process, so as to control the proportion of co-evaporated alloy. A crystal oscillator detector probe is installed on one side of the top rotating workpiece disk to detect the total film thickness.
[0010] Furthermore, the two linear electron gun mechanisms are integrated into a single design, comprising two electron guns.
[0011] Furthermore, the number of crucibles in each group is 2≤N≤5, and the capacity of each crucible ranges from 10 to 60 mL.
[0012] Furthermore, the crucible running device is driven by an electric motor.
[0013] Furthermore, the crucibles are positioned and locked using photoelectric switches, with the number of photoelectric switches configured according to the number of crucibles in each group.
[0014] Furthermore, the bottom and rear of the chamber are provided with interfaces for installing the electron gun and crucible running device, and the interfaces are sealed by high-sealing rings.
[0015] Furthermore, the metallization co-evaporation process chamber is also equipped with a vacuum system, a vacuum degree measurement system, a process chamber gas filling and venting system, a heating system, and an automatic control system.
[0016] Furthermore, a dome-shaped rotating workpiece disk is installed at the top of the process chamber and rotates at 0 to 20 revolutions per minute under motor control, capable of loading round or square samples.
[0017] Furthermore, the automatic control system controls the start and stop of the operating components of the entire equipment, and includes modules for editing the automatic metallization co-evaporation process, data setting and monitoring, and equipment interlock protection alarms.
[0018] The advantages of this utility model over the prior art are as follows:
[0019] 1. The design volume of the process chamber has been reduced, saving equipment manufacturing costs. The manufacturing cost of the chamber has been reduced by 30%, and the energy consumption of the vacuum system has been reduced by 25%, which meets the industry's demand for low-carbon development. It can be adapted to small and medium-sized production workshops or laboratory scenarios, while reducing the load on the vacuum system and improving equipment operating efficiency.
[0020] 2. The linear electron gun mechanism is adopted. Compared with the ring-shaped rotary electron gun, the electron beam focusing is highly controllable, which is suitable for local heating in small chambers, reduces the impact of heat radiation on the chamber, and improves the accuracy of co-evaporation alloy ratio from ±3% to ±1%, improves film uniformity by 20%, and shortens equipment maintenance time by 50%. Attached Figure Description
[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly introduced below. The features and advantages of this utility model will be more clearly understood by referring to the drawings. The drawings are schematic and should not be construed as limiting this utility model in any way. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0022] in:
[0023] Figure 1 This is a schematic diagram of the electron beam evaporation device of this utility model.
[0024] Figure 2 This is a schematic diagram of a linear electron gun mechanism.
[0025] In the figure, 1-linear electron gun evaporation system, 2-electron gun baffle, 3-crystal oscillator detector, 4-linear crucible device, 5-crucible linear running device, 6-crucible, 7-electron beam nozzle. Detailed Implementation
[0026] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments of this utility model and the features thereof can be combined with each other.
[0027] like Figure 1 As shown, an electron beam evaporation apparatus for a metallization co-evaporation process with a linear electron gun mechanism is suitable for the coating and production of small-batch metallization co-evaporation samples. It includes a metallization co-evaporation process chamber, a linear electron gun evaporation system 1 at the bottom of the chamber, an electron gun baffle 2 above the system, and three sets of crystal oscillator detectors 3 located near the top of the two linear electron gun crucibles and at the top of the process chamber.
[0028] In the process chamber of the electron beam evaporation equipment disclosed in this utility model, the linear electron gun evaporation system 1 includes two sets of linear electron gun mechanisms, such as... Figure 2 As shown, the electron gun and crucible are arranged side by side at the bottom of the process chamber, and the operation mode is a linear back-and-forth automatic movement.
[0029] Multiple crucibles 6 are placed on a linear crucible device 4, divided into two groups, to hold the two evaporation materials required for the metallization co-evaporation process. The linear crucible device 4 is connected to a crucible linear running device 5 and can move back and forth linearly under the drive of the crucible linear running device. The linear crucible device is equipped with an electric adjustment module for crucible spacing and a tilt angle fine-tuning mechanism. The spacing adjustment module uses a servo motor to drive a ball screw, enabling precise adjustment of the spacing between the two groups of crucibles within the range of 50-200mm (accuracy ±0.1mm), adapting to the vapor diffusion characteristics of different evaporation materials. The tilt angle fine-tuning mechanism uses a piezoelectric ceramic actuator to control the tilt angle of the crucible bottom (0-5°), which can adjust the liquid level according to the molten state of the material and avoid electron beam bombardment of the crucible edge to prevent impurities.
[0030] The linear crucible device is equipped with two sets of linear electron gun mechanisms on both sides, which can enable the electron beam nozzle 7 of the electron gun to perform metallization co-evaporation process on the crucible.
[0031] Specifically, the two linear electron gun mechanisms are designed as a single unit, including two electron guns and two sets of crucibles. The number of crucibles in each set is configured to be 2≤N≤5, and the capacity of each crucible is selectable from 10 to 60 mL. It includes a crucible running device, which is responsible for the linear movement of the electron gun crucibles. The linear movement of the electron gun crucibles is driven by a motor, and the crucibles are positioned and locked by photoelectric switches. The number of photoelectric switches depends on the number of crucibles configured in each set.
[0032] The bottom and rear of the chamber are respectively provided with interfaces for installing the electron gun, crucible, and electron gun and crucible operating device, which are installed and sealed by a high sealing ring.
[0033] Each electron gun group is equipped with 2 to 5 crucibles, each with a capacity ranging from 10 to 60 mL. The materials selected are based on the specific metallization co-evaporation process. The overall volume of the electron gun and the number of samples loaded are designed according to the crucible capacity and quantity. Compared with the traditional two-rotating electron gun co-evaporation chamber, this design reduces the chamber length by nearly half while maintaining the same chamber width, resulting in relatively lower manufacturing costs and greater economic applicability.
[0034] The metallization co-evaporation process chamber is also equipped with a dome-shaped rotating workpiece disk, a vacuum system, a vacuum degree measurement system, a coating monitoring system, a process chamber gas filling and venting system, a heating system, and an automatic control system.
[0035] The dome-shaped rotating workpiece tray is installed at the top of the process chamber. It is controlled by a motor and its rotation speed is adjustable from 0 to 20 revolutions per minute. It can load round or square samples.
[0036] The vacuum system is responsible for evacuating the process chamber to the process vacuum required for electron beam evaporation and maintaining the process vacuum level continuously.
[0037] The vacuum measurement system is responsible for the real-time measurement of the vacuum level in the process chamber and the feedback of the measurement data.
[0038] The coating monitoring system has a crystal oscillator probe near each of the two electron gun crucibles to monitor the evaporation rate of the two evaporation materials in the metallization co-evaporation process, which can precisely control the alloy ratio. A crystal oscillator probe is installed near the workpiece tray to precisely control the total coating thickness.
[0039] The process chamber venting system is responsible for venting the process chamber from a high vacuum state to normal atmospheric pressure, so that the chamber can be opened to load or unload samples.
[0040] The heating system is responsible for heating and baking the process chamber, removing moisture, and enabling the process chamber to be better evacuated to process vacuum, or for baking the sample to remove moisture.
[0041] The automatic control system controls the start and stop of the operating components of the entire equipment, and includes modules for editing the automatic metallization co-evaporation process, data setting, and data monitoring. The automatic control system also includes a dynamic electron beam energy distribution module. Based on the real-time feedback of evaporation rate data from the crystal oscillator detector, this module automatically adjusts the accelerating voltage (0-10kV) and beam current intensity (0-1000mA) of the two sets of electron guns. When the evaporation rate of a certain material fluctuates by more than ±5%, the corresponding electron gun energy output is instantly adjusted to ensure that the co-evaporation alloy ratio deviation is controlled within ±1%, far exceeding the industry standard of ±3%.
[0042] The electron beam evaporation equipment for the metallization co-evaporation process configured with the linear electron gun mechanism of this utility model performs the metallization co-evaporation process as follows:
[0043] (1) Load the workpiece tray carrying the sample onto the workpiece stage of the process chamber, load the materials of the co-evaporation process into the crucibles of the electron guns, and close the process chamber door.
[0044] (2) Initiate the pre-programmed automated electron beam evaporation process to begin the metallization co-evaporation process. The automated process is as follows:
[0045] 2.1) Use a vacuum system to evacuate the process chamber to the required process vacuum level.
[0046] 2.2) Use the vacuum gauge feedback of the vacuum degree measurement system to monitor the vacuum status of the process chamber and feed back the vacuum degree data.
[0047] 2.3) Start the rotation of the workpiece disk.
[0048] 2.4) Pre-melt the evaporation material according to the pre-edited electron beam process, then open the electron gun baffle and perform metallization co-evaporation process according to the coating rate and coating thickness set by the edited electron gun process and coating monitoring system (set according to the ratio of the two material film layers). The coating process is controlled simultaneously by the electron gun process and coating monitoring system.
[0049] 2.5) After the automated process stops, the workpiece tray stops rotating, the electron gun automatically shuts off, and the process chamber is vented to normal atmospheric pressure using the venting system. The workpiece tray can be removed by opening the process chamber door, and the sample that has completed the co-evaporation process can be taken out.
[0050] The above description is merely a preferred embodiment of this utility model and is not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. A linear co-evaporation type electron beam evaporation coating equipment, characterized in that, It includes a metallization co-evaporation process chamber, with an electron gun and crucible at the bottom of the process chamber, and a dome-shaped rotating workpiece disk is also installed inside the metallization co-evaporation process chamber; The crucibles are in two sets, each used to hold one of the two evaporation materials required for the metallization co-evaporation process. The two sets of crucibles are placed on a linear crucible device, which is connected to a linear crucible movement device and can move linearly back and forth under the drive of the linear crucible movement device. Two sets of linear electron gun mechanisms are arranged on both sides of the linear crucible device. The electron beam nozzles of the electron guns are directed towards the two sets of crucibles, and a metallization co-evaporation process is performed. A crystal oscillator detector probe is installed on each side of the two sets of crucibles to monitor the evaporation rate of the two evaporation materials in the metallization co-evaporation process, so as to control the proportion of co-evaporated alloy. A crystal oscillator detector probe is installed on one side of the top rotating workpiece disk to detect the total film thickness.
2. The linear co-evaporation electron beam evaporation coating equipment according to claim 1, characterized in that, The two linear electron gun mechanisms are integrated into one unit, containing two electron guns.
3. The linear co-evaporation electron beam evaporation coating equipment according to claim 2, characterized in that, The number of crucibles in each group should be 2 ≤ N ≤ 5, and the capacity of each crucible should be between 10 and 60 mL.
4. The linear co-evaporation electron beam evaporation coating equipment according to claim 3, characterized in that, The crucible running device is driven by an electric motor.
5. The linear co-evaporation electron beam evaporation coating equipment according to claim 4, characterized in that, The crucibles are positioned and locked using photoelectric switches, and the number of photoelectric switches is configured according to the number of crucibles in each group.
6. The linear co-evaporation electron beam evaporation coating equipment according to claim 5, characterized in that, The bottom and rear of the chamber are equipped with interfaces for installing the electron gun and crucible running device, and the interfaces are sealed by high-sealing rings.
7. The linear co-evaporation electron beam evaporation coating equipment according to claim 6, characterized in that, The metallization co-evaporation process chamber is also equipped with a vacuum system, a vacuum degree measurement system, a process chamber gas filling and venting system, a heating system, and an automatic control system.
8. The linear co-evaporation electron beam evaporation coating equipment according to claim 7, characterized in that, The automatic control system controls the start and stop of the operating components of the entire equipment, and includes a module for editing the automatic metallization co-evaporation process, a data setting and monitoring module, and an equipment interlock protection alarm module.
