Sensor device

Abstract

The utility model relates to a kind of sensor devices, comprising: shell, with installation space;Thermal insulation, be in installation space, and first installation cavity and second installation cavity are divided into installation space;Mainboard, be in first installation cavity;Sensor assembly, setting in the inner wall of second installation cavity away from first installation cavity side, sensor assembly includes board and the vibration sensor and temperature sensor of setting in board, board is electrically connected with mainboard.Vibration sensor and temperature sensor can more quickly, accurately gather vibration information and temperature information, mainboard is in first installation cavity, thermal insulation can reduce the heat of measured object and second installation cavity by air heat radiation transmission to first installation cavity, to be able to reduce the ambient temperature of mainboard, avoid mainboard due to overheating and lead to signal anomaly or failure, improve the reliability of sensor device in high temperature scene, so that the sensor device can be suitable for the detection of high temperature object, expand the scope of application.

Description

Technical Field

[0001] This utility model relates to the field of sensor technology, and in particular to a sensor device. Background Technology

[0002] Multifunctional sensors can simultaneously collect multiple parameters such as temperature and vibration of the object being detected, and are widely used in fields such as mechanical equipment condition monitoring and fault diagnosis.

[0003] However, due to the limited temperature resistance of existing sensors, in order to prevent the internal components of the sensor from overheating and causing signal abnormalities or failures, the sensor cannot usually be directly installed on the surface of a high-temperature object for detection, which limits its application range. Utility Model Content

[0004] Therefore, it is necessary to provide a sensor device to address the above problems and improve the reliability of the sensor device in high-temperature scenarios.

[0005] This utility model provides a sensor device, comprising: a housing having an installation space; a heat insulation member disposed within the installation space, dividing the installation space into a first installation cavity and a second installation cavity; a main board disposed within the first installation cavity; and a sensor assembly disposed on the inner wall of the second installation cavity on the side away from the first installation cavity, the sensor assembly including a plate and a vibration sensor and a temperature sensor disposed on the plate, the plate being electrically connected to the main board.

[0006] In the aforementioned sensor device, the outer wall of the housing near the second mounting cavity is used to mount it onto the surface of the object being measured. The vibration sensor is used to collect vibration information of the object being measured, and the temperature sensor is used to collect temperature information of the object being measured. The board transmits the collected information to the main board, and the main board transmits data with external devices. The sensor assembly is located on the inner wall of the second mounting cavity near the object being measured, enabling the vibration sensor and temperature sensor to collect vibration and temperature information more quickly and accurately. The main board is located in the first mounting cavity, and the first and second mounting cavities are separated by a heat insulation component to reduce the transfer of heat from the object being measured and the second mounting cavity to the first mounting cavity through air thermal radiation. This reduces the ambient temperature of the main board, preventing signal abnormalities or failures due to overheating, and improving the reliability of the sensor device in high-temperature scenarios. This makes the sensor device suitable for detecting high-temperature objects, expanding its application range.

[0007] In one embodiment, the inner wall of the second mounting cavity away from the first mounting cavity is provided with a first mounting groove and a dispensing groove communicating with the bottom wall of the first mounting groove. At least a portion of the plate is embedded in the first mounting groove, and the vibration sensor and the temperature sensor are embedded in the dispensing groove, which is filled with modified epoxy resin adhesive.

[0008] This design allows the first mounting slot to be positioned easily by the user when installing the sensor assembly, preventing displacement of the sensor assembly relative to the housing. The modified epoxy resin has a high thermal conductivity, ensuring that the temperature sensor can quickly and accurately acquire the temperature signal of the object being measured, and also ensuring that the vibration sensor is reliably fixed to the housing, reducing vibration loss and ensuring that the vibration sensor can quickly and accurately acquire the vibration signal of the object being measured.

[0009] In one embodiment, the dispensing groove includes a dispensing section and an overflow section that are interconnected, wherein the depth of the overflow section is greater than the depth of the dispensing section.

[0010] This design allows the modified epoxy resin to flow better toward the overflow section and fill the gap between the sensor assembly and the inner wall of the dispensing tank, avoiding loss of temperature and vibration signals during transmission; it also reduces the difficulty of dispensing.

[0011] In one embodiment, the housing is provided with a pickup hole communicating with the first mounting cavity, and the sensor device further includes a sound sensor disposed in the first mounting cavity and arranged corresponding to the pickup hole, and the sound sensor is electrically connected to the motherboard.

[0012] With this setup, the sound sensor can directly collect the sound signal emitted by the object being measured through the pickup hole, and it can also reduce the ambient temperature of the sound sensor, preventing the sound sensor from becoming abnormal or malfunctioning due to overheating.

[0013] In one embodiment, the inner wall of the first mounting cavity is provided with a second mounting groove communicating with the pickup hole, and at least part of the sound sensor is sealed and embedded in the second mounting groove. The sensor device also includes a waterproof and sound-permeable membrane disposed between the bottom wall of the second mounting groove and the sound sensor.

[0014] This design allows the second mounting slot to be positioned easily by the user when installing the sound sensor, preventing the sound sensor from shifting relative to the housing; the waterproof and sound-permeable membrane can improve the reliability of the sensor device's protection while ensuring that the sound sensor can collect sound signals normally.

[0015] In one embodiment, a fixing post protrudes from the inner wall of the first mounting cavity away from the second mounting cavity, and the sensor device further includes a heat insulation pad attached to the end face of the fixing post, and the motherboard is pressed and fixed to the heat insulation pad by fasteners.

[0016] With this setup, the mounting posts support the motherboard; the heat insulation pads reduce the heat from the casing being transferred to the motherboard through the mounting posts, preventing the motherboard from overheating and causing signal abnormalities or failures.

[0017] In one embodiment, the housing is provided with a threaded hole communicating with the first mounting cavity, and the sensor device further includes a connector that is sealed to the threaded hole by a threaded engagement, the connector being electrically connected to the motherboard, and at least a portion of the connector being exposed outside the housing.

[0018] With this configuration, the part of the connector exposed above the housing is used for electrical connection with external equipment. The connector and the threaded hole are sealed together by threaded engagement, which gives the connector good anti-pull performance and also prevents glue from overflowing.

[0019] In one embodiment, the heat insulation component is a polymer material component; and / or, the heat insulation component is provided with wiring holes, and the plate body and the main board are electrically connected through cables passing through the wiring holes.

[0020] With this design, the low thermal conductivity of the polymer material reduces the heat transfer from the second mounting cavity to the first mounting cavity; the electrical connection between the board and the main board is simple and cost-effective.

[0021] In one embodiment, the housing includes a first shell, a second shell, and a seal, wherein the first shell and the second shell enclose the mounting space, and the seal is disposed between the first shell and the second shell; and / or, the cross-section of the housing is circular.

[0022] This design facilitates the disassembly and maintenance of components inside the housing. The seals ensure the housing remains airtight in the assembled state, improving the reliability of the sensor device's protection. The circular housing gives the sensor device a high degree of symmetry, resulting in more uniform mechanical properties in all directions and reducing measurement errors caused by the housing shape.

[0023] In one embodiment, the outer wall of the housing near the second mounting cavity is provided with a third mounting groove, and the sensor device further includes a high-temperature resistant magnetic component embedded in the third mounting groove; and / or, the outer wall of the housing near the second mounting cavity is provided with an assembly hole, and the outer peripheral wall of the housing is provided with an operating part, the cross-section of the operating part being a regular hexagon.

[0024] With this configuration, the housing can be stably attached to the surface of the object being measured by a high-temperature resistant magnetic component, ensuring a reliable connection between the sensor device and the object being measured while facilitating the assembly and disassembly of the sensor device; the housing can be fixed by mounting holes and screws, and the user can use auxiliary tools to tighten the operating part. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a partial exploded view of a sensor device according to one embodiment of the present invention; Figure 2 Provided by this utility model Figure 1 Exploded view of the internal structure of the second shell; Figure 3 Provided by this utility model Figure 1 Exploded view of the internal structure of the first shell; Figure 4 Provided by this utility model Figure 1 A cross-sectional view of the sensor device; Figure 5 Provided by this utility model Figure 2 A three-dimensional structural diagram of the second shell in the middle; Figure 6 Provided by this utility model Figure 5 Assembly diagram of the second shell and sensor assembly; Figure 7 Provided by this utility model Figure 5 A three-dimensional structural diagram of the second shell from another perspective; Figure 8 Provided by this utility model Figure 3 A three-dimensional structural diagram of the first shell in the middle; Figure 9 Provided by this utility model Figure 3 Cross-sectional view of the central seal; Figure 10 Provided by this utility model Figure 3 A three-dimensional structural diagram of the connecting component; Figure 11 Provided by this utility model Figure 2 A three-dimensional structural diagram of the sound sensor.

[0027] Reference numerals: 1. Housing; 11. First housing; 111. First mounting cavity; 112. Sound pickup hole; 113. Second mounting groove; 114. Fixing post; 115. Threaded hole; 116. Positioning hole; 12. Second housing; 121. Second mounting cavity; 122. First mounting groove; 123. Dispensing groove; 1231. Dispensing section; 1232. Overflow section; 124. Third mounting groove; 125. Assembly hole; 126. Positioning pin; 13. Seal Components; 131, First sealing section; 132, Second sealing section; 133, Third sealing section; 14, Operating part; 2, Heat insulation component; 21, Wiring hole; 3, Main board; 4, Sensor assembly; 41, Board body; 42, Vibration sensor; 43, Temperature sensor; 5, Sound sensor; 51, Rib; 52, Protective sleeve; 6, Waterproof and sound-permeable membrane; 7, Heat insulation pad; 8, Connector; 81, Threaded part; 82, Knob part; 9, High-temperature resistant magnetic component. Detailed Implementation

[0028] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0029] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application's specification are for illustrative purposes only and do not represent the only possible implementation.

[0030] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0031] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0032] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.

[0033] Multifunctional sensors can simultaneously collect multiple parameters of the object being detected, such as temperature and vibration, and are widely used in fields such as mechanical equipment condition monitoring and fault diagnosis. However, due to the limited temperature resistance of existing sensors, in order to prevent the internal components of the sensor from overheating and causing signal abnormalities or failures, the sensors cannot usually be directly mounted on the surface of high-temperature objects for detection, thus limiting their application range.

[0034] To solve the above problems, such as Figures 1 to 11 As shown, this utility model provides a sensor device to improve the reliability of the sensor device in high-temperature scenarios.

[0035] like Figure 1 and Figure 4 As shown, specifically, the sensor device includes a housing 1, a heat insulation component 2, a main board 3, and a sensor assembly 4, wherein: the housing 1 has an installation space; the heat insulation component 2 is disposed in the installation space and divides the installation space into a first installation cavity 111 and a second installation cavity 121; the main board 3 is disposed in the first installation cavity 111; the sensor assembly 4 is disposed on the inner wall of the second installation cavity 121 away from the first installation cavity 111, and the sensor assembly 4 includes a plate 41 and a vibration sensor 42 and a temperature sensor 43 disposed on the plate 41, and the plate 41 is electrically connected to the main board 3.

[0036] In the sensor device provided in this embodiment of the utility model, the outer wall of the housing 1 near the second mounting cavity 121 is used to install it onto the surface of the object being measured. The vibration sensor 42 is used to collect the vibration information of the object being measured, and the temperature sensor 43 is used to collect the temperature information of the object being measured. The plate 41 transmits the collected information to the main board 3, and transmits data with external devices through the main board 3. The sensor assembly 4 is disposed in the inner wall of the second mounting cavity 121 near the object being measured, so that the vibration sensor 42 and the temperature sensor 43 can collect vibration and temperature information more quickly and accurately. At the same time, the main board 3 is disposed in the first mounting cavity 111, and the first mounting cavity 111 and the second mounting cavity 121 are separated by the heat insulation component 2 to reduce the heat of the object being measured and the second mounting cavity 121 from being transferred to the first mounting cavity 111 through air thermal radiation. This reduces the ambient temperature of the main board 3 and prevents the main board 3 from overheating and causing signal abnormalities or failures. This improves the reliability of the sensor device in high-temperature scenarios, making the sensor device suitable for the detection of high-temperature objects and expanding its application range.

[0037] like Figures 2 to 4 As shown, the housing 1 includes a first housing 11, a second housing 12, and a sealing element 13. The first housing 11 and the second housing 12 enclose an installation space, and the sealing element 13 is disposed between the first housing 11 and the second housing 12. The first housing 11 and the second housing 12 are designed as separate structures, which facilitates the disassembly and maintenance of components inside the housing 1, such as the main board 3 and the sensor assembly 4. The sealing element 13 ensures the airtightness of the housing 1 in the assembled state, preventing external moisture or dust and other impurities from entering the installation space through the gap between the first housing 11 and the second housing 12, which could damage the components inside the housing 1, such as the main board 3 and the sensor assembly 4, thereby improving the reliability of the sensor device protection. The sealing element 13 can be made of elastic and high-temperature resistant materials such as silicone rubber; the housing 1 can be made of aluminum alloy, which has a high thermal conductivity, ensuring that the temperature sensor 43 can quickly and accurately acquire the temperature signal of the measured object. Alternatively, the housing 1 can also be made of stainless steel, other alloys, or other materials. Furthermore, the first shell 11 and the second shell 12 can be fixedly connected by screws, snap-fit, bolts, etc., as long as the stability and reliability of the connection between the two can be guaranteed. This embodiment of the utility model does not impose specific limitations here.

[0038] In the illustrated embodiment, the first shell 11 and the heat insulation member 2 enclose a first mounting cavity 111, and the second shell 12 and the heat insulation member 2 enclose a second mounting cavity 121. The outer wall of the end of the second shell 12 away from the first shell 11 is used for mounting to the surface of the object being measured. At this time, the sealing member 13 also has a certain heat insulation and shock absorption function, reducing heat conduction between the second shell 12 and the first shell 11, and also preventing the motherboard 3 from being subjected to excessive impact vibration, which could lead to signal abnormalities or failures. Of course, in other embodiments, the second shell 12 and the heat insulation member 2 can also enclose a first mounting cavity 111, and the first shell 11 and the heat insulation member 2 can enclose a second mounting cavity 121; or, the first shell 11 and the heat insulation member 2 can enclose a first mounting cavity 111, and the first shell 11, the second shell 12, and the heat insulation member 2 can enclose a second mounting cavity 121; or, the second shell 12 and the heat insulation member 2 can enclose a first mounting cavity 111, and the first shell 11, the second shell 12, and the heat insulation member 2 can enclose a second mounting cavity 121.

[0039] like Figure 5 and Figure 8 As shown, one of the first shell 11 and the second shell 12 is provided with a positioning hole 116, and the other is provided with a positioning pin 126 that can be inserted and engaged with the positioning hole 116, so as to facilitate the user to position the first shell 11 and the second shell 12 during assembly.

[0040] like Figure 4 and Figure 9 As shown, in one embodiment, the seal 13 includes a first sealing section 131, a second sealing section 132, and a third sealing section 133 that are interconnected to form a U-shaped axial cross-section. Thus, the seal 13 can wrap around the edge of the first shell 11 or the second shell 12, increasing the contact area between the seal 13 and the first shell 11 and the second shell 12, improving the sealing effect, and meeting the IP67 protection rating. Of course, in other embodiments, the seal 13 can also be an annular structure with a regular or irregular shape such as a circle or square axial cross-section. Furthermore, the shape of the radial cross-section of the seal 13 is adapted to the shape of the shell 1.

[0041] like Figure 1 As shown, in one embodiment, the cross-section of the housing 1 is circular. This makes the sensor device highly symmetrical overall, with more uniform mechanical properties in all directions. Consequently, the sensor device responds more stably and consistently when collecting vibration information of the measured object in different directions, reducing measurement errors caused by the shape of the housing 1. Of course, in other embodiments, the cross-section of the housing 1 can also be set to other regular or irregular shapes such as square, ellipse, and triangle, depending on actual needs. This embodiment of the present invention does not impose specific limitations here.

[0042] like Figure 2 , Figure 4 and Figure 7 As shown, the outer wall of the housing 1 near the second mounting cavity 121 has a third mounting groove 124. The sensor device also includes a high-temperature resistant magnetic component 9 embedded in the third mounting groove 124. The housing 1 can be stably adsorbed onto the surface of the object being measured by the high-temperature resistant magnetic component 9, ensuring a reliable connection between the sensor device and the object being measured while facilitating the assembly and disassembly of the sensor device. The high-temperature resistant magnetic component 9 can be made of high-temperature resistant magnetic materials such as neodymium iron boron, samarium cobalt, and alnico, for example, N52H neodymium iron boron, enabling it to operate stably for a long time at 120℃, ensuring that abnormal temperatures of the object being measured will not cause the high-temperature resistant magnetic component 9 to fail. The high-temperature resistant magnetic component 9 can be fixed in the third mounting groove 124 by adhesive, screwing, or snap-fitting. Furthermore, the end face of the high-temperature resistant magnetic component 9 facing away from the housing 1 can be flush with or slightly protrude from the outer wall of the housing 1 near the second mounting cavity 121.

[0043] like Figure 4 and Figure 7 As shown, the outer wall of the housing 1 near the second mounting cavity 121 has a mounting hole 125, and the outer peripheral wall of the housing 1 has a protruding operating part 14 with a regular hexagonal cross-section. When the surface of the object being measured has a fixing structure such as screws, the housing 1 can be fixed by engaging the screws through the mounting hole 125. Furthermore, the user can use a wrench or other auxiliary tools to tighten the operating part 14, thus ensuring a more reliable connection between the housing 1 and the screws, thereby ensuring that the sensor device can be more reliably fixed to the object being measured. The high-temperature resistant magnetic component 9 can be a ring structure, and the mounting hole 125 is located at the center of the high-temperature resistant magnetic component 9.

[0044] Of course, in other embodiments, the housing 1 may be fixed by either magnetic attraction of the high-temperature resistant magnetic component 9 to the object being measured or by screw fixing of the mounting hole 125; or, the housing 1 and the object being measured may be fixed and connected by other methods such as snap-fit ​​or adhesive, as long as the accuracy of the measurement results of the sensor device is ensured. This embodiment of the present invention does not impose specific limitations here.

[0045] In one embodiment, the heat insulation component 2 is made of a polymer material. Polymer materials have a low thermal conductivity, typically between 0.013 W / (m·K) and 0.045 W / (m·K), which can further reduce heat transfer from the second mounting cavity 121 to the first mounting cavity 111. Of course, in other embodiments, the heat insulation component 2 can also be made of ceramic materials, graphite-based materials, composite heat insulation materials, or other materials with heat insulation effects; this embodiment of the present invention does not impose specific limitations.

[0046] like Figures 1 to 2As shown, in one embodiment, the heat insulation component 2 is provided with a wiring hole 21, and the board 41 and the main board 3 are electrically connected through a cable passing through the wiring hole 21. This simplifies the electrical connection between the board 41 and the main board 3, facilitating the disassembly and maintenance of the sensor device, and reduces costs. Of course, in other embodiments, the board 41 and the main board 3 can also transmit signals wirelessly.

[0047] like Figures 4 to 6 As shown, in one embodiment, the inner wall of the second mounting cavity 121 away from the first mounting cavity 111 is provided with a first mounting groove 122 and a dispensing groove 123 communicating with the bottom wall of the first mounting groove 122. At least a portion of the plate 41 is embedded in the first mounting groove 122, and the vibration sensor 42 and the temperature sensor 43 are embedded in the dispensing groove 123, which is filled with modified epoxy resin. The first mounting groove 122 facilitates the user's positioning when installing the sensor assembly 4, and also prevents the sensor assembly 4 from shifting relative to the housing 1, thereby improving the stability and reliability of the sensor assembly 4. Modified epoxy resin adhesive refers to a material whose performance has been optimized by chemical or physical methods from ordinary epoxy resin adhesive. Modified epoxy resin adhesive has a high thermal conductivity, generally reaching 3W / (m·K), ensuring that the temperature sensor 43 can quickly and accurately collect the temperature signal of the object being measured. At the same time, after curing, the modified epoxy resin adhesive can reach a Shore D hardness of 90 and a bonding strength of 10MPa, which makes the vibration sensor 42 reliably fixed to the housing 1, reducing vibration loss and ensuring that the vibration sensor 42 can quickly and accurately collect the vibration signal of the object being measured.

[0048] like Figures 5 to 6 As shown, specifically, the dispensing groove 123 includes a dispensing section 1231 and an overflow section 1232 that are interconnected, with the depth of the overflow section 1232 being greater than the depth of the dispensing section 1231. After the plate 41 is installed into the first mounting groove 122 by means of screws, snap-fits, adhesives, etc., modified epoxy resin is injected into the dispensing groove 123 from the dispensing section 1231. The depth difference between the overflow section 1232 and the dispensing section 1231 allows the modified epoxy resin to flow better toward the overflow section 1232 and fill the gap between the sensor assembly 4 and the inner wall of the dispensing groove 123, avoiding the formation of air bubbles or incomplete filling in the dispensing groove 123, which would cause loss of temperature and vibration signals during transmission. Furthermore, the dispensing section 1231 and the overflow section 1232 can also reduce the difficulty of dispensing and improve the ease of assembling the sensor assembly 4.

[0049] Of course, in other embodiments, the depth of the overflow section 1232 can be equal to the depth of the dispensing section 1231; or, the plate 41 can be directly fixed to the inner wall of the side away from the first mounting cavity 111 by means of screws, snap-fit, adhesive, etc.

[0050] like Figures 3 to 4 As shown, in one embodiment, the housing 1 is provided with a pickup hole 112 communicating with the first mounting cavity 111. The sensor device also includes a sound sensor 5 disposed in the first mounting cavity 111 and arranged corresponding to the pickup hole 112. The sound sensor 5 is electrically connected to the motherboard 3. The sound sensor 5 can directly collect the sound signal emitted by the object being measured through the pickup hole 112, enabling the sensor device to simultaneously collect multiple parameters such as vibration signal, temperature signal, and sound signal. Furthermore, the sound sensor 5 is disposed in the first mounting cavity 111, which can reduce the ambient temperature of the sound sensor 5 and prevent the sound sensor 5 from overheating and causing signal abnormality or failure. Of course, in other embodiments, the sensor device may not have a separate sound sensor 5, but may instead use an algorithm to convert the vibration signal collected by the vibration sensor 42 into a sound signal.

[0051] like Figure 4 and Figure 8 As shown, in one embodiment, the inner wall of the first mounting cavity 111 is provided with a second mounting groove 113 communicating with the pickup hole 112. At least a portion of the sound sensor 5 is sealed and embedded in the second mounting groove 113. The sensor device also includes a waterproof and sound-permeable membrane 6 disposed between the bottom wall of the second mounting groove 113 and the sound sensor 5. The second mounting groove 113 facilitates the user's positioning when installing the sound sensor 5, and also prevents the sound sensor 5 from shifting relative to the housing 1, thereby improving the stability and reliability of the sound sensor 5. The waterproof and sound-permeable membrane 6 has an air permeability greater than 1000 ml / min / cm² and a sound attenuation less than 2 dB, meeting the IP67 protection level. This ensures that the sound sensor 5 can normally collect sound signals while preventing external moisture or dust and other impurities from entering the first mounting cavity 111 through the pickup hole 112, which could damage the mainboard 3 and the sound sensor 5 and other components in the first mounting cavity 111, thereby further improving the reliability of the sensor device's protection. Of course, in other embodiments, the sound sensor 5 can also be directly fixed to the inner wall of the first mounting cavity 111 by means of screws, snap-fit, adhesive, etc., and sealed by means of sealing rings, sealant, etc.

[0052] like Figure 11As shown, the outer peripheral wall of the sound sensor 5 is provided with at least one ring of raised ribs 51. The raised ribs 51 can be directly protruding from the outer peripheral wall of the sound sensor 5; alternatively, a silicone protective sleeve 52 can be fitted onto the outer peripheral wall of the sound sensor 5, with the raised ribs 51 protruding from the outer peripheral wall of the protective sleeve 52. The sound sensor 5 can achieve an interference fit with the second mounting groove 113 through the raised ribs 51 to ensure the sealing between the sound sensor 5 and the inner wall of the second mounting groove 113. After the sound sensor 5 is installed into the second mounting groove 113, glue is injected into the second mounting groove 113 for sealing to ensure the stability and reliability of the connection between the sound sensor 5 and the housing 1. At the same time, the raised ribs 51 can also prevent glue from overflowing from the pickup hole 112.

[0053] The number of sound sensors 5 can be two as shown in the figure. The two sound sensors 5 are arranged opposite each other on both sides of the housing 1 to ensure the sound pickup effect. The sound pickup hole 112 and the second mounting groove 113 are arranged one-to-one with the sound sensors 5. Alternatively, the number of sound sensors 5 can also be set to 1, 3, 4 or more according to actual needs. This embodiment of the present invention does not make specific limitations here.

[0054] like Figure 4 and Figure 8 As shown, in one embodiment, a fixing post 114 protrudes from the inner wall of the first mounting cavity 111 away from the second mounting cavity 121. The sensor device also includes a heat insulation pad 7 attached to the end face of the fixing post 114. The main board 3 is pressed and fixed to the heat insulation pad 7 by fasteners. The fixing post 114 is used to support the main board 3 and prevent the main board 3 from interfering with other components in the first mounting cavity 111, such as the sound sensor 5. The heat insulation pad 7 can reduce the heat transferred from the housing 1 to the main board 3 through the fixing post 114, avoiding signal abnormalities or failures caused by overheating of the main board 3, thereby further improving the reliability of the sensor device. The main board 3 and the fixing post 114 can be fixedly connected by fasteners such as screws. The heat insulation pad 7 can be made of ceramic material, which has good heat insulation and insulation properties; or, the heat insulation pad can also be made of polymer material, graphite-based material, composite heat insulation material, or other materials with heat insulation effect. This embodiment of the present invention does not impose specific limitations. Of course, in other embodiments, the motherboard 3 can also be directly fixed to the inner wall of the first mounting cavity 111 by means of screws, snap-fit, adhesive, etc.

[0055] The number of fixing posts 114 can be three as shown in the figure. The three fixing posts 114 are arranged at intervals along the circumference of the housing 1 to ensure the stability and reliability of the connection between the main board 3 and the housing 1. The heat insulation pad 7 is arranged in a one-to-one correspondence with the fixing posts 114. Alternatively, the number of fixing posts 114 can be set to one, two, four or more according to actual needs. This embodiment of the utility model does not impose specific limitations here.

[0056] like Figure 3 , Figure 8 and Figure 10 As shown, in one embodiment, the housing 1 has a threaded hole 115 communicating with the first mounting cavity 111. The sensor device also includes a connector 8 that is sealed to the threaded hole 115 via a threaded engagement. The connector 8 is electrically connected to the motherboard 3, and at least a portion of the connector 8 protrudes from the housing 1. The portion of the connector 8 protruding from the housing 1 is used for electrical connection with an external device. Specifically, the connector 8 includes a threaded portion 81 and a knob portion 82. The threaded portion 81 is sealed to the threaded hole 115 via a threaded engagement, and the knob portion 82 protrudes from the housing 1 to facilitate user installation of the connector 8. Furthermore, the end of the threaded portion 81 away from the knob portion 82 is electrically connected to the motherboard 3 via a cable, and the knob portion 82 is used for electrical connection with an external device. When installing connector 8, the threaded portion 81 is first pre-fixed to the threaded hole 115 using threads, and then glue is injected into the threaded hole 115 for sealing. This ensures the stability and reliability of the connection between connector 8 and housing 1, while also meeting the IP67 protection rating. This prevents external moisture or dust from entering the first mounting cavity 111 through the threaded hole 115, which could damage components within the first mounting cavity 111, such as the motherboard 3 and the sound sensor 5, thereby further improving the reliability of the sensor device's protection. Furthermore, the threaded engagement between the threaded portion 81 and the threaded hole 115 provides connector 8 with good anti-pull performance and prevents glue overflow. Of course, in other embodiments, connector 8 can also be fixedly connected to the mounting hole on housing 1 using screws, snap-fit ​​connections, etc., and sealed using sealing rings, etc.; alternatively, the motherboard 3 and external devices can also achieve signal transmission wirelessly.

[0057] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0058] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the patent protection scope of this application should be determined by the appended claims.

Claims

1. A sensor device, characterized in that, include: The housing (1) has an installation space; A heat insulation component (2) is disposed in the installation space, and the installation space is divided into a first installation cavity (111) and a second installation cavity (121). The motherboard (3) is disposed within the first mounting cavity (111); and, The sensor assembly (4) is disposed on the inner wall of the second mounting cavity (121) away from the first mounting cavity (111). The sensor assembly (4) includes a plate (41) and a vibration sensor (42) and a temperature sensor (43) disposed on the plate (41). The plate (41) is electrically connected to the main board (3).

2. The sensor device according to claim 1, characterized in that, The second mounting cavity (121) has a first mounting groove (122) and a dispensing groove (123) communicating with the bottom wall of the first mounting groove (122) on the inner wall away from the first mounting cavity (111). At least part of the plate body (41) is embedded in the first mounting groove (122). The vibration sensor (42) and the temperature sensor (43) are embedded in the dispensing groove (123). The dispensing groove (123) is filled with modified epoxy resin.

3. The sensor device according to claim 2, characterized in that, The dispensing groove (123) includes a dispensing section (1231) and an overflow section (1232) that are interconnected, and the depth of the overflow section (1232) is greater than the depth of the dispensing section (1231).

4. The sensor device according to claim 1, characterized in that, The housing (1) is provided with a pickup hole (112) communicating with the first mounting cavity (111). The sensor device also includes a sound sensor (5) disposed in the first mounting cavity (111) and arranged corresponding to the pickup hole (112). The sound sensor (5) is electrically connected to the motherboard (3).

5. The sensor device according to claim 4, characterized in that, The inner wall of the first mounting cavity (111) is provided with a second mounting groove (113) that communicates with the pickup hole (112). At least part of the sound sensor (5) is sealed and embedded in the second mounting groove (113). The sensor device also includes a waterproof and sound-permeable membrane (6) disposed between the bottom wall of the second mounting groove (113) and the sound sensor (5).

6. The sensor device according to claim 1, characterized in that, A fixing post (114) protrudes from the inner wall of the first mounting cavity (111) away from the second mounting cavity (121). The sensor device also includes a heat insulation pad (7) attached to the end face of the fixing post (114). The main board (3) is pressed and fixed to the heat insulation pad (7) by fasteners.

7. The sensor device according to claim 1, characterized in that, The housing (1) is provided with a threaded hole (115) communicating with the first mounting cavity (111). The sensor device also includes a connector (8) that is sealed to the threaded hole (115) by threaded engagement. The connector (8) is electrically connected to the motherboard (3), and at least part of the connector (8) is exposed outside the housing (1).

8. The sensor device according to claim 1, characterized in that, The heat insulation component (2) is a polymer material component; and / or, The heat insulation component (2) is provided with a wiring hole (21), and the plate (41) and the main board (3) are electrically connected through a cable passing through the wiring hole (21).

9. The sensor device according to claim 1, characterized in that, The housing (1) includes a first housing (11), a second housing (12), and a seal (13). The first housing (11) and the second housing (12) enclose the installation space, and the seal (13) is disposed between the first housing (11) and the second housing (12); and / or, The shell (1) has a circular cross-section.

10. The sensor device according to claim 1, characterized in that, The outer wall of the housing (1) near the second mounting cavity (121) is provided with a third mounting groove (124), and the sensor device further includes a high-temperature resistant magnetic component (9) embedded in the third mounting groove (124); and / or, The outer wall of the housing (1) near the second mounting cavity (121) is provided with an assembly hole (125), and the outer peripheral wall of the housing (1) is provided with an operating part (14), the cross section of the operating part (14) is a regular hexagon.

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