A laser diode chip performance detection platform

Abstract

The utility model provides a kind of laser diode chip performance detection platform, it is related to laser diode chip detection technical field, including heating seat, heating seat side is equipped with strip heat conduction seat, so that strip heat conduction seat is heated by heating seat, heating seat both ends are installed on support frame body, U-shaped frame is equipped on the side of strip heat conduction seat away from heating seat, U-shaped frame both ends are connected with support frame body respectively, adjusting rod one end is equipped with arc clamping base, adjusting rod is movably placed in adjusting seat.In use, the utility model lets laser diode be pressed on the side of strip heat conduction seat by arc clamping base, and the temperature on strip heat conduction seat is directly transmitted to laser diode. With gradually increasing temperature, the light emitting state of each laser diode can be clearly observed, and it is convenient to observe the working condition of laser diode at different temperatures. If laser diode emits light normally, it can prove that the chips inside can work stably.

Description

Technical Field

[0001] This utility model relates to the field of laser diode chip testing technology, specifically a laser diode chip performance testing platform. Background Technology

[0002] The photoelectric performance of a laser diode is a key indicator for evaluating the quality of a product, and this performance is affected by ambient temperature and its own heat generation. Therefore, its photoelectric performance at high temperatures is also an important indicator for evaluating the quality of a laser diode product.

[0003] Existing methods for high-temperature testing of laser diodes use heating stages or constant-temperature chambers to simulate high-temperature environments. These temperature ranges typically cover the operating limits of the laser diode. Placing the laser diode on a heating stage makes it impossible to effectively fix the diode, while placing it in a constant-temperature chamber makes it difficult to observe the laser's emission. Therefore, we propose a laser diode chip performance testing platform. Utility Model Content

[0004] This invention provides a laser diode chip performance testing platform, which has the advantages of convenient fixing of laser diodes and convenient observation of light emission, and solves the problems mentioned in the background art.

[0005] The technical solution of this utility model is implemented as follows: A laser diode chip performance testing platform is designed, including a heating seat, a strip heat conduction seat is provided on one side of the heating seat so that the strip heat conduction seat is heated by the heating seat, the two ends of the heating seat are installed on the support frame, and a U-shaped frame is provided on the side of the strip heat conduction seat away from the heating seat. The two ends of the U-shaped frame are respectively connected to the support frame, and a certain distance is provided between the U-shaped frame and the strip heat conduction seat. It also includes multiple adjusting rods, one end of which is equipped with an arc-shaped retainer. The adjusting rod is movably placed inside the adjusting seat. The adjusting seat is equipped with fasteners that can position the adjusting rod. The arc-shaped retainer presses the laser diode onto the surface of the strip-shaped heat-conducting seat. The laser diode is connected to the control device through wires.

[0006] Preferably, the heating base includes a strip-shaped mounting base, a heating groove is provided in the middle of the strip-shaped mounting base, a heating element is installed in the heating groove, a through groove is provided at one end of the heating groove, and the wiring terminal of the heating element extends to the outside of the strip-shaped mounting base through the through groove.

[0007] Preferably, the strip-shaped heat-conducting seat is placed in the heating groove and sealed, and the edge of the strip-shaped heat-conducting seat is detachably connected to the strip-shaped mounting base.

[0008] Preferably, each adjustment seat is respectively set on the second U-shaped seat, the second U-shaped seat is movably placed on the U-shaped frame, and each second U-shaped seat is threaded with a positioning bolt.

[0009] Preferably, the support frame includes brackets connected to both ends of the strip mounting base, the bottom of the brackets are respectively mounted on the strip supports, and the two strip supports are connected by a reinforcing rod.

[0010] Preferably, the reinforcing rod is provided with multiple first U-shaped seats, each first U-shaped seat is threaded with a positioning bolt, and each first U-shaped seat is provided with a laser intensity detector on its top.

[0011] Preferably, the control device includes a housing, a controller is provided inside the housing, and the surface of the housing is provided with a display screen and operation buttons respectively connected to the controller. The controller is respectively connected to a laser intensity detector, a heating element, and a laser diode.

[0012] Preferably, the strip-shaped heat-conducting base is provided with a detection hole, and a temperature probe is provided in the detection hole. The temperature probe is connected to the controller.

[0013] Compared with existing technologies, this invention, during use, allows the laser diodes to be pressed against the side of the strip-shaped heat-conducting base by the arc-shaped bracket, enabling the heat from the strip-shaped heat-conducting base to be directly transferred to the laser diodes. As the temperature gradually increases, the luminous state of each laser diode can be clearly observed, and it is convenient to observe the working condition of the laser diodes at different temperatures. If the laser diodes emit light normally, it proves that the internal chips are all working stably. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0016] Figure 2 This is a partial structural schematic diagram of the present invention.

[0017] Figure 3 This is a schematic diagram of the U-shaped frame of this utility model.

[0018] Figure 4 This is a schematic diagram of a laser diode.

[0019] In the diagram: 1. Strip support; 2. First U-shaped seat; 3. Reinforcing rod; 4. Laser intensity detector; 5. Bracket; 6. Strip heat-conducting seat; 7. Strip mounting seat; 8. Housing; 9. Adjusting rod; 10. Second U-shaped seat; 11. U-shaped frame; 12. Mounting groove; 13. Positioning knob; 14. Adjusting seat; 15. Arc-shaped retaining seat; 16. Heating groove; 17. Heating element; 18. Temperature probe; 19. Through groove. Detailed Implementation

[0020] The technical solution of this utility model will be clearly and completely described below with reference to its embodiments. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0021] Reference Figures 1 to 3 This utility model provides a technical solution: a laser diode chip performance testing platform, including a heating base, which includes a strip-shaped mounting base 7. A heating groove 16 is provided in the middle of the strip-shaped mounting base 7, and a heating element 17 is installed inside the heating groove 16. The heating element 17 is a heating rod or a bent resistance wire. To facilitate wiring of the heating element, a through groove 19 is provided at one end of the heating groove 16. The wiring terminals of the heating element 17 extend to the outside of the strip-shaped mounting base 7 through the through groove 19, facilitating wiring.

[0022] A strip-shaped heat-conducting seat 6 is provided on one side of the heating base, allowing the strip-shaped heat-conducting seat 6 to be heated by the heating base. Specifically, the strip-shaped heat-conducting seat 6 is placed in the heating groove 16 and sealed. The edge of the strip-shaped heat-conducting seat 6 is detachably connected to the strip-shaped mounting base 7. Figure 1 and Figure 2 As shown, mounting grooves 12 are provided on the upper and lower edges of the strip-shaped heat-conducting base 6. Multiple bolts connected to the strip-shaped mounting base 7 are provided in the mounting grooves 12, which facilitates the disassembly of the strip-shaped heat-conducting base 6. The material of the strip-shaped heat-conducting base 6 is aluminum, copper or steel. When the heating element 17 heats up, the heating element 17 can directly heat the strip-shaped heat-conducting base 6, making the strip-shaped heat-conducting base 6 a uniformly heated heating element.

[0023] Following this, the application also includes a support frame with two brackets 5. The bottoms of the brackets 5 are respectively mounted on strip supports 1, and the two strip supports 1 are connected by reinforcing rods 3. Figure 1 As shown, the heating base is mounted on the support frame at both ends, that is, the two ends of the strip mounting base 7 are connected to the respective brackets 5.

[0024] Furthermore, a U-shaped frame 11 is provided on the side of the strip-shaped heat-conducting base 6 away from the heating base, and both ends of the U-shaped frame 11 are connected to the support frame, such as... Figure 1As shown, specifically, the two ends of the U-shaped frame 11 are connected to the bracket 5 respectively, and a certain distance is provided between the U-shaped frame 11 and the strip heat conduction seat 6; This application also includes multiple adjusting rods 9, one end of which is provided with an arc-shaped retainer 15. The size and dimensions of the arc-shaped retainer 15 match the size of the laser diode to be tested, that is, the laser diode can be placed inside the arc-shaped retainer 15, and the arc-shaped retainer 15 presses the laser diode tightly onto the surface of the strip-shaped heat-conducting seat 6. Here, elastic pads can be fixed on both sides of the arc-shaped retainer 15 to clamp the laser diode; or the two sides of the arc-shaped retainer 15 are provided with slots, and springs are provided in the slots, with pads at the ends of the springs so that the diode can be clamped in the arc-shaped retainer 15; of course, other forms can also be used, and any retainer that can clamp the laser diode is within the scope of this solution. The adjusting rod 9 is movably placed inside the adjusting seat 14, and the adjusting seat 14 is provided with a fastener that can position the adjusting rod 9. The fastener is a positioning knob 13 threaded on the top of the adjusting seat 14. The positioning knob 13 is a Torx bolt for easy hand gripping; like Figure 2 As shown, each adjustment seat 14 is respectively mounted on the second U-shaped seat 10, which is movably placed on the U-shaped frame 11. Each second U-shaped seat 10 is threaded with a positioning bolt, which is a Torx-shaped hand-tightening bolt for easy hand grip. The arc-shaped clamp 15 presses the laser diode onto the surface of the strip-shaped heat-conducting seat 6. It should be noted that before pressing the laser diode, it needs to be wired. That is, the laser diode pins can be connected to wires through wire clamps. Specifically, the laser diode is connected to the control device through wires. Since the light-emitting end of the laser diode is exposed, the light emitted by the laser diode can be directly observed when it is turned on. The control device includes a housing 8, which contains a controller. The controller is a PCB control board, and the surface of the housing 8 has a display screen and operation buttons connected to the controller.

[0025] Furthermore, such as Figure 1 As shown, multiple first U-shaped seats 2 are provided on the reinforcing rod 3. The U-shaped groove of the first U-shaped seat 2 is movably inserted into the reinforcing rod 3. The first U-shaped seat 2 is threaded with a positioning bolt. The positioning bolt is a Torx bolt for easy hand gripping. Each first U-shaped seat 2 is equipped with a laser intensity detector 4 at its top. The laser intensity detector 4 is located below the laser diode to be tested and is used to detect the intensity of the light emitted by the laser diode. The controller is connected to the laser intensity detector 4, the heating element 17, and the laser diode respectively.

[0026] Based on the above embodiments, the specific operation process is as follows: First, select the laser diode to be tested, connect the pins of each laser diode with a conductive clip, and provide a plug at the other end of the wire. The surface of the housing 8 is provided with multiple sockets corresponding to the plugs. The sockets are connected to the controller, and the plugs are inserted into the sockets. Secondly, laser diodes such as Figure 1 Place it on the side of the strip heat conduction base 6, and then clip a second U-shaped base 10 onto the U-shaped frame 11. That is, take out as many second U-shaped bases 10 as there are laser diodes to test. Adjust the adjusting rod 9 towards the laser diode so that the laser diode is pressed by the arc-shaped bracket 15. At the same time, push the adjusting rod 9 so that the arc-shaped bracket 15 firmly presses the laser diode onto the side of the strip heat conduction base 6. Then tighten the positioning knob 13. Then, move the laser intensity detector 4 below the laser diode and tighten the positioning bolt on the first U-shaped seat 2. Similar to the second U-shaped seat 10, the number of laser intensity detectors 4 corresponds to the number of laser diodes being tested. Finally, after all the above steps are completed, the laser diode can be activated by pressing the operation button. The moment of emission is detected by the laser intensity detector 4. At the same time, the heating element 17 is controlled to heat up by pressing the operation button, so that the heating element 17 heats the strip heat conduction seat 6, and the temperature on the strip heat conduction seat 6 is directly transferred to the laser diode. To facilitate temperature monitoring and control of the strip-shaped heat-conducting base 6, a detection hole is provided inside the base 6, and a temperature probe 18 is installed inside the detection hole. The temperature probe 18 is connected to the controller via a wire, thus forming a temperature feedback loop. Based on the temperature information sensed by the temperature probe 18, the controller automatically controls the heating element 17 to heat the strip-shaped heat-conducting base 6, maintaining a constant temperature. As the temperature gradually increases, the luminous state of each laser diode can be clearly observed, facilitating the observation of the laser diode's operation at different temperatures. If the laser diode emits light normally, it proves that the internal chips are operating stably.

[0027] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A laser diode chip performance testing platform, characterized in that, Includes a heating seat, and a strip heat-conducting seat (6) is provided on one side of the heating seat, so that the strip heat-conducting seat (6) is heated by the heating seat; The heating base is mounted on the support frame at both ends; A U-shaped frame (11) is provided on the side of the strip heat conduction seat (6) away from the heating seat. The two ends of the U-shaped frame (11) are connected to the support frame, and there is a certain distance between the U-shaped frame (11) and the strip heat conduction seat (6). It also includes multiple adjusting rods (9), one end of which is provided with an arc-shaped bracket (15), the adjusting rod (9) is movably placed in the adjusting seat (14), and the adjusting seat (14) is provided with fasteners that can position the adjusting rod (9); The arc-shaped holder (15) presses the laser diode onto the surface of the strip-shaped heat-conducting seat (6), and the laser diode is connected to the control device through a wire.

2. The laser diode chip performance testing platform as described in claim 1, characterized in that, The heating seat includes a strip mounting base (7), and a heating groove (16) is provided in the middle of the strip mounting base (7). A heating element (17) is installed in the heating groove (16). One end of the heating tank (16) is provided with a through groove (19), and the wiring terminal of the heating body (17) extends to the outside of the strip mounting base (7) through the through groove (19).

3. The laser diode chip performance testing platform as described in claim 2, characterized in that, The strip heat-conducting seat (6) is placed in the heating tank (16) and sealed thereunder. The edge of the strip heat-conducting seat (6) is detachably connected to the strip mounting seat (7).

4. The laser diode chip performance testing platform as described in claim 3, characterized in that, Each adjustment seat (14) is respectively set on the second U-shaped seat (10), the second U-shaped seat (10) is movably placed on the U-shaped frame (11), and each second U-shaped seat (10) is threaded with a positioning bolt.

5. The laser diode chip performance testing platform as described in claim 4, characterized in that, The support frame includes brackets (5) that are connected to both ends of the strip mounting base (7). The bottom of the brackets (5) is installed on the strip supports (1), and the two strip supports (1) are connected by a reinforcing rod (3).

6. The laser diode chip performance testing platform as described in claim 5, characterized in that, The reinforcing rod (3) is provided with multiple first U-shaped seats (2), and the first U-shaped seats (2) are threaded with positioning bolts. Each first U-shaped seat (2) is provided with a laser intensity detector (4) on its top.

7. The laser diode chip performance testing platform as described in claim 6, characterized in that, The control device includes a housing (8), a controller is provided inside the housing (8), and a display screen and operation buttons are provided on the surface of the housing (8) respectively connected to the controller. The controller is connected to the laser intensity detector (4), the heating element (17) and the laser diode respectively.

8. The laser diode chip performance testing platform as described in claim 7, characterized in that, The strip-shaped heat-conducting base (6) is provided with a detection hole, and a temperature probe (18) is provided in the detection hole. The temperature probe (18) is connected to the controller.

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