Light panel assembly and backlight module

Abstract

A lamp plate assembly includes a flexible circuit substrate, a plurality of light emitting elements, and a reinforcement plate. The flexible circuit substrate has opposite first and second side surfaces. The light emitting elements are disposed on the first side surface. The reinforcement plate is disposed on the second side surface and overlaps the light emitting elements. The utility model also provides a backlight module with the lamp plate assembly. The lamp plate assembly and the backlight module can improve yield.

Description

Technical Field

[0001] This utility model relates to a light source assembly, and more particularly to a lamp panel assembly, and a backlight module having the above-mentioned lamp panel assembly. Background Technology

[0002] The main components of an LCD monitor include a backlight module, a display panel, and a frame. Based on the direction of the light source, backlight modules can be divided into edge-lit backlight modules and direct-lit backlight modules. Direct-lit backlight modules have the advantage of better uniformity of surface light sources and are beneficial for achieving local dimming functionality.

[0003] Generally, direct-lit backlight modules use a lamp board as the light source. Some direct-lit backlight modules use flexible circuit boards (PCBs) to hold the light-emitting elements, allowing for adaptation to different installation spaces. However, flexible circuit boards are more prone to deformation than printed circuit boards (PCBs), causing the light-emitting elements to easily detach from the PCB during manufacturing or experience electrical malfunctions. Therefore, in known technologies, lamp boards and backlight modules using flexible circuit boards still suffer from poor yield rates.

[0004] The "Background Art" paragraph is only used to help understand the content of this utility model. Therefore, the content disclosed in the "Background Art" paragraph may include some known technologies that are not known to those skilled in the art. The content disclosed in the "Background Art" paragraph does not mean that the content or the problems to be solved by one or more embodiments of this utility model were known or recognized by those skilled in the art prior to this application. Utility Model Content

[0005] This invention provides a lamp panel assembly to improve yield.

[0006] This invention provides a backlight module to improve yield.

[0007] Other objects and advantages of this utility model can be further understood from the technical features disclosed herein.

[0008] To achieve one, some, or all of the above-mentioned objectives, or other objectives, one embodiment of the present invention provides a lamp panel assembly, including a flexible circuit board, a plurality of light-emitting elements, and a reinforcing plate. The flexible circuit board has opposing first and second side surfaces. The light-emitting elements are disposed on the first side surface. The reinforcing plate is disposed on the second side surface and overlaps the light-emitting elements.

[0009] To achieve one or more of the above objectives, or other objectives, an embodiment of the present invention provides a backlight module, including the aforementioned lamp panel assembly and a backplate. The backplate supports the lamp panel assembly.

[0010] In this invention, the reinforcing plate of the lamp panel assembly is fixed to the second side surface of the flexible circuit board and overlaps the light-emitting element, thereby supporting the area of ​​the flexible circuit board where the light-emitting element is fixed. In this way, the flexible circuit board can be more easily kept flat by the support of the reinforcing plate, significantly reducing the problem of the light-emitting element detaching from the flexible circuit board or experiencing electrical abnormalities during the manufacturing process. Therefore, the lamp panel assembly of this invention can effectively improve the yield. The backlight module of this invention uses the above-described lamp panel assembly, thus effectively improving the yield.

[0011] To make the above and other objects, features and advantages of this utility model more apparent and understandable, specific embodiments are described below in conjunction with the accompanying drawings for detailed explanation. Attached Figure Description

[0012] Figure 1 This is a cross-sectional schematic diagram of a lamp panel assembly according to an embodiment of the present invention.

[0013] Figure 2 yes Figure 1 A top view of the light panel assembly.

[0014] Figure 3 yes Figure 2 An enlarged schematic diagram of region Z1 of the lamp panel assembly.

[0015] Figure 4 yes Figure 1 A bottom view of the light panel assembly.

[0016] Figure 5 This is a cross-sectional schematic diagram of a lamp panel assembly according to another embodiment of the present invention.

[0017] Figure 6 yes Figure 5 A top view of the light panel assembly.

[0018] Figure 7 This is a partial top view of a lamp panel assembly according to another embodiment of the present invention.

[0019] Figure 8 yes Figure 5 A partially enlarged schematic diagram of the lamp panel assembly.

[0020] Figure 9 This is a top view schematic diagram of a lamp panel assembly according to another embodiment of the present invention.

[0021] Figure 10 yes Figure 9 A bottom view of the light panel assembly.

[0022] Figure 11 This is a top view schematic diagram of a lamp panel assembly according to another embodiment of the present invention.

[0023] Figure 12 yes Figure 11 A bottom view of the light panel assembly.

[0024] Figure 13 This is a top view schematic diagram of a lamp panel assembly according to another embodiment of the present invention.

[0025] Figure 14 This is a cross-sectional schematic diagram of a lamp panel assembly according to another embodiment of the present invention.

[0026] Figure 15 This is a top view schematic diagram of a lamp panel assembly according to another embodiment of the present invention.

[0027] Figure 16 This is a cross-sectional schematic diagram of a backlight module according to an embodiment of the present invention.

[0028] Figure 17 This is a cross-sectional schematic diagram of a backlight module according to another embodiment of the present invention.

[0029] Figure 18 This is a cross-sectional schematic diagram of a backlight module according to another embodiment of the present invention.

[0030] Explanation of reference numerals in the attached figures:

[0031] 100, 100a, 100b, 100c, 100d, 100e: Light panel assembly

[0032] 110, 110c, 110c1, 110c2, 110e: Flexible circuit boards

[0033] 111: Insulation section

[0034] 112, 112a, 112b: Electrical connection parts

[0035] 113: Substrate

[0036] 120, 120d: Light-emitting element

[0037] 121: Peripheral light-emitting element

[0038] 121d: Light-emitting part

[0039] 122: Intermediate light-emitting element

[0040] 122d: Drive unit

[0041] 130, 130c, 130d: Reinforcing plates

[0042] 131: Support surface

[0043] 132, 132c, 132d: Part One

[0044] 133, 133c, 133d: Part Two

[0045] 140: Protect electronic components

[0046] 200, 200a, 200b: Backlight modules

[0047] 210: Backplate

[0048] 211: Base Plate

[0049] 212: Side panel section

[0050] 213: Avoidance Structure

[0051] 220: Wavelength conversion layer

[0052] 230: Filter layer

[0053] 240: Frame

[0054] 250, 250b: diffusion sheet

[0055] 251: Light scattering particles

[0056] 1110, 1120: Surface

[0057] 1121, 1121a: Electrical connection parts

[0058] A1: Zone 1

[0059] A2: Second District

[0060] B: Distribution boundary

[0061] C: External part

[0062] E: Outer edge

[0063] G: Spacing

[0064] M: Microstructure

[0065] N: Normal direction

[0066] O: Opening

[0067] P: Orthographic projection

[0068] R: Reflective layer

[0069] R1: First reflector

[0070] R2: Second reflector

[0071] S: Side view

[0072] S1: First side surface

[0073] S2: Second side surface

[0074] S3: Third Surface

[0075] S4: Fourth Surface

[0076] T, T1: Thickness. Detailed Implementation

[0077] The foregoing description and other technical contents, features, and effects of this utility model will be clearly presented in the following detailed description of one of the preferred embodiments with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as up, down, left, right, front, or back, are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for illustrative purposes and not for limiting the scope of this utility model.

[0078] Figure 1 This is a cross-sectional schematic diagram of a lamp panel assembly according to an embodiment of the present invention. Figure 2 yes Figure 1 A top view of the light panel assembly. Figure 3 yes Figure 2 An enlarged schematic diagram of region Z1 of the lamp panel assembly. Figure 4 yes Figure 1 A bottom view diagram of the light panel assembly. Please refer to the diagram first. Figure 1 and Figure 2 The lamp panel assembly 100 includes a flexible circuit board 110, a plurality of light-emitting elements 120, and a reinforcing plate 130. The flexible circuit board 110 has opposing first side surfaces S1 and second side surfaces S2. The light-emitting elements 120 are disposed on the first side surface S1. The reinforcing plate 130 is disposed on the second side surface S2 and overlaps the light-emitting elements 120.

[0079] The flexible circuit board 110 provides electrical connections for the light-emitting element 120. Specifically, the flexible circuit board 110 may include an insulating portion 111, a circuit layer 112, and a substrate 113, wherein the circuit layer 112 has a plurality of electrical connection portions 1121. The insulating portion 111 is located on the substrate 113 and is disposed opposite to the reinforcing plate 130. The circuit layer 112 is located between the insulating portion 111 and the substrate 113, and the insulating portion 111 exposes the plurality of electrical connection portions 1121 of the circuit layer 112. It should be noted that, in this embodiment, the first side surface S1 may include the surface 1110 of the insulating portion 111 opposite to the reinforcing plate 130 and the surface 1120 of the circuit layer 112 exposed from the insulating portion 111. The light-emitting element 120 is electrically connected to the electrical connection portions 1121 exposed from the insulating portion 111. Further details can be found by referring to… Figure 1 and Figure 3The insulating portion 111 may cover the circuit layer 112 of the flexible circuit board 110 and has multiple openings O to expose multiple areas of the circuit layer 112 for electrical connection of the light-emitting element 120, wherein the multiple areas are electrical connection portions 1121. In one embodiment, the flexible circuit board 110 may include a flexible printed circuit (FPC), the material of the insulating portion 111 may include polyimide (PI), and the material of each electrical connection portion 1121 may include copper, but the present invention is not limited thereto.

[0080] Please refer to this again. Figure 1 and Figure 2 In this embodiment, the light-emitting element 120 includes, for example, a light-emitting diode (LED), but other embodiments are not limited thereto. Incidentally, the light-emitting element 120 may be arranged in an array on the flexible circuit board 110, but the present invention does not impose many restrictions on the specific arrangement.

[0081] The reinforcing plate 130 can be disposed and fixed to the second side surface S2 of the flexible circuit board 110, and can overlap all the light-emitting elements 120 in the normal direction N of surfaces 1110 and 1120, wherein surfaces 1110 and 1120 can be substantially parallel. Thus, the reinforcing plate 130 can support the area of ​​the flexible circuit board 110 where all the light-emitting elements 120 are fixed, thereby keeping the area of ​​the flexible circuit board 110 where the light-emitting elements 120 are fixed flat. Specifically, the reinforcing plate 130 can have a support surface 131, and the support surface 131 can be disposed and fixed to the second side surface S2. All the light-emitting elements 120 are located within the orthographic projection P of the outer edge E of the support surface 131 on the first side surface S1. In other words, the reinforcing plate 130 can substantially overlap all the light-emitting elements 120 in the normal direction N. In this way, in addition to further strengthening the area of ​​the flexible circuit board 110 that fixes the light-emitting elements 120, it can also leave a margin to allow for errors in the installation position of the reinforcing plate 130, thereby further improving the yield of the lamp board assembly 100.

[0082] To elaborate further, please refer to Figure 2 and Figure 4The light-emitting element 120 may include a plurality of peripheral light-emitting elements 121 and at least one intermediate light-emitting element 122. This embodiment exemplifies nine intermediate light-emitting elements 122, with the peripheral light-emitting elements 121 surrounding the nine intermediate light-emitting elements 122. Each peripheral light-emitting element 121 has a side surface S facing away from the intermediate light-emitting element 122, and the side surfaces S are arranged to form the distribution boundary B of the light-emitting element 120. For example, each peripheral light-emitting element 121 located at a corner may have two side surfaces S, while each peripheral light-emitting element 121 located between two said corners may have one side surface S. The distance G between the outer edge E and the distribution boundary B is, for example, between 0.1 mm and 1 mm. In short, the outer edge E of the support surface 131 may extend beyond the distribution boundary B of the light-emitting element 120 by approximately 0.1 mm to 1 mm. In one embodiment, the distance G may be approximately between 0.5 mm and 1 mm, but this invention does not impose further limitations on this. In another embodiment, the thickness T of the reinforcing plate 130 can be between 0.1 mm and 2 mm to further strengthen the support of the reinforcing plate 130 for the flexible circuit board 110. Incidentally, the reinforcing plate 130 in this embodiment may include, for example, a metal plate or a plastic plate, wherein the metal plate may include, for example, a stainless steel plate or an aluminum plate, and the plastic plate may include a polyimide (PI) plate or a polyethylene terephthalate (PET) plate; however, this invention does not impose specific material limitations.

[0083] Compared to known technologies, in this embodiment, the reinforcing plate 130 of the lamp panel assembly 100 is fixed to the second side surface S2 of the flexible circuit board 110 and overlaps with the light-emitting element 120, so as to support the area of ​​the flexible circuit board 110 where the light-emitting element 120 is fixed via the reinforcing plate 130. Thus, the flexible circuit board 110 can be more easily maintained flat by the support of the reinforcing plate 130, significantly reducing the problem of the light-emitting element 120 detaching from the flexible circuit board 110 or experiencing electrical abnormalities during the manufacturing process. Therefore, the lamp panel assembly 100 of this embodiment can effectively improve the yield rate.

[0084] For example, in known technologies, a flexible circuit board is fixed to a glass stage using an adhesive to maintain flatness, and the light-emitting element is bonded to the flexible circuit board via mass transfer. However, during the mass transfer process, the high temperature generated by the laser alters the material properties of the adhesive, making it impossible to remove the flexible circuit board from the glass stage. In this case, forcibly detaching the flexible circuit board from the glass stage can cause the light-emitting element to detach from the flexible circuit board or result in electrical abnormalities, leading to known poor yield of lamp board assemblies. However, in an embodiment of the present invention, the lamp board assembly 100 uses a reinforcing plate 130 to maintain the flatness of the area of ​​the flexible circuit board 110 where the light-emitting element 120 is fixed, and transfers the light-emitting element onto the flexible circuit board 110 through a mass transfer process. In this way, the problem caused by the high temperature of the laser in the known technology can be avoided, thereby significantly improving the disadvantages of the light-emitting element 120 detaching from the flexible circuit board 110 or experiencing electrical abnormalities, and effectively improving the yield of the lamp board assembly 100.

[0085] Figure 5 This is a cross-sectional schematic diagram of a lamp panel assembly according to another embodiment of the present invention. Figure 6 yes Figure 5 A top view of the light panel assembly. Figure 7 This is a partial top view of a lamp panel assembly according to another embodiment of the present invention. Figure 8 yes Figure 5 A partially enlarged schematic diagram of the lamp panel assembly. The structure and advantages of the lamp panel assembly 100a in this embodiment are similar to those of the lamp panel assembly. Figure 1 The following describes only the differences in the embodiments. Please refer to [the previous text]. Figure 5 and Figure 6The flexible circuit board 110 includes, for example, a reflective layer R. The reflective layer R covers a first side surface S1 and surrounds each light-emitting element 120 to improve light utilization. Specifically, the reflective layer R may cover an insulating portion 111 and a circuit layer 112 exposed by the insulating portion 111; for example, the reflective layer R may cover an electrical connection portion 1121 and the first side surface S1 of a block without circuit layer 112 traces between two adjacent electrical connection portions 1121 to expose the light-emitting element 120. Furthermore, the reflective layer R may include a first reflective portion R1 and a second reflective portion R2. The first reflective portion R1 covers the insulating portion 111, and the second reflective portion R2 covers the circuit layer 112 exposed by the first reflective portion R1; for example, the second reflective portion R2 may cover an electrical connection portion 1121 and the block without circuit layer 112 traces between two adjacent electrical connection portions 1121. Furthermore, the first reflective portion R1 can extend from the insulating portion 111 to the circuit layer 112 to cover the electrical connection portion 1121 exposed by the insulating portion 111 and the area without circuit layer 112 traces between adjacent electrical connection portions 1121. The other portion of the electrical connection portion 1121 and the other portion of the area without circuit layer 112 traces between adjacent electrical connection portions 1121 are covered by the second reflective portion R2. In one embodiment, the second reflective portion R2 can be spaced apart from each light-emitting element 120 by a distance of approximately 20 μm, but the present invention is not limited thereto. Incidentally, Figure 6 To clearly illustrate the first reflective portion R1 and the second reflective portion R2, the electrical connection portion 1121 is shown in a simplified shape, but the specific shape of the electrical connection portion 1121 is not limited to this. Figure 6 As shown. For example, please refer to... Figure 7 The electrical connection portion 1121a may be irregular in shape and extend outward from near the light-emitting element 120.

[0086] Please refer to Figure 5 , Figure 6 and Figure 8The first reflective portion R1 and the second reflective portion R2 may be made of different materials. Specifically, the first reflective portion R1 and the second reflective portion R2 can be formed through different processes, thus they can use different materials. For example, the material of the first reflective portion R1 may include solder resist ink, and it can be formed by printing on the insulating portion 111 and the portion exposed by the insulating portion 111. The portion exposed by the insulating portion 111 may include electrical connection portions 1121 and areas without circuit layer 112 traces between adjacent electrical connection portions 1121. The solder resist ink includes, for example, a two-component developing solder resist ink, but is not limited thereto. On the other hand, the material of the second reflective portion R2 may include ink, and it can be formed by inkjet printing on another portion of the electrical connection portions 1121 exposed by the insulating portion 111 and another portion of areas without circuit layer 112 traces between adjacent electrical connection portions 1121. The ink includes, for example, a water-based environmentally friendly latex ink, but is not limited thereto. Incidentally, since the second reflective portion R2 is formed by inkjet printing, it may partially cover the first reflective portion R1, but this invention does not impose further limitations on this detail. In one embodiment, the reflectivity of the first reflective portion R1 may be greater than 70%, while the second reflective portion R2 may have a different reflectivity than the first reflective portion R1. The reasons for the different reflectivities of the first reflective portion R1 and the second reflective portion R2 include material differences or thickness differences, and this invention does not impose further limitations on these factors. Furthermore, this invention does not impose further limitations on the specific numerical values ​​of the aforementioned reflectivity.

[0087] Incidentally, please continue to refer to... Figure 8 In this embodiment, the flexible circuit board 110 is, for example, a double-layer circuit board, meaning that the flexible circuit board 110 may have a circuit layer 112a and a circuit layer 112b. In one embodiment, circuit layer 112a is the control lines and power supply (VCC) for the column, and circuit layer 112b is the control lines and ground (GND) for the row, but this is not limited to this. The flexible circuit board 110 in other embodiments of this utility model can also be the aforementioned double-layer circuit board.

[0088] Figure 9 This is a top view schematic diagram of a lamp panel assembly according to another embodiment of the present invention. Figure 10 yes Figure 9 A bottom view of the light panel assembly. Figure 11 This is a top view schematic diagram of a lamp panel assembly according to another embodiment of the present invention. Figure 12 yes Figure 11 A bottom view of the lamp panel assembly. The structure and advantages of lamp panel assemblies 100b and 100c are similar. Figure 1 The following describes only the differences in the embodiments. Please refer to [the previous text]. Figure 9 and Figure 10The first side surface S1 may have a first region A1 and a second region A2 spaced apart from each other, and a plurality of light-emitting elements 120 are respectively disposed in the first region A1 and the second region A2. The reinforcing plate 130 has a first portion 132 and a second portion 133. The first portion 132 overlaps the first region A1, and the second portion 133 overlaps the second region A2. The first portion 132 and the second portion 133 are, for example, an integral structure. That is, in this embodiment, a single reinforcing plate 130 supports a plurality of light-emitting elements 120 located in the first region A1 and the second region A2 from the second side surface S2 of the flexible circuit board 110, thereby simplifying the assembly steps of the lamp board assembly 100b. Incidentally, the lamp board assembly 100b of this embodiment can be applied to virtual reality headsets, but the present invention is not limited thereto.

[0089] In one embodiment, for example Figure 11 and Figure 12 As shown, the first portion 132c and the second portion 133c of the reinforcing plate 130c can be separated from each other. For example, the first portion 132c supports the light-emitting element 120 located in the first region A1, while the second portion 133c supports the light-emitting element 120 located in the second region A2. This reduces the area of ​​the flexible circuit board 110 overlapping the reinforcing plate 130c, thereby preserving more leeway for bending the flexible circuit board 110 and making the lamp panel assembly 100c more easily adaptable to different installation spaces. Incidentally, in another embodiment, for example... Figure 13 As shown, where Figure 13 and Figure 11 The difference is that the first region A1 and the second region A2 can be located on different flexible circuit substrates 110c1 and 110c2 respectively, and the first part 132d of the reinforcing plate 130d can be disposed on the flexible circuit substrate 110c1, while the second part 133d can be disposed on the flexible circuit substrate 110c2.

[0090] Figure 14 This is a cross-sectional schematic diagram of a lamp panel assembly according to another embodiment of the present invention. The structure and advantages of the lamp panel assembly 100d in this embodiment are similar to those of the present invention. Figure 1 The following describes only the differences in the embodiments. Please refer to... Figure 14Each light-emitting element 120d may have a light-emitting portion 121d and a driving portion 122d, with the driving portion 122d electrically connected to the flexible circuit board 110. The light-emitting portion 121d is electrically connected to the driving portion 122d and is located on the side of the driving portion 122d facing away from the flexible circuit board 110. Therefore, each light-emitting portion 121d can be individually controlled by its respective driving portion 122d, increasing the number of dimming zones in the lamp panel assembly 100d and also offering the advantage of low power consumption. Specifically, within the same light-emitting element 120d, the driving portion 122d can control the emitted light brightness of the light-emitting portion 121d according to the received signal, enabling each light-emitting element 120d to form its own dimming zone. The driving portion 122d may include, for example, a driving circuit, while the light-emitting portion 121d may include a light-emitting chip. Further, in one embodiment, the driving portion 122d may include a complementary metal-oxide-semiconductor driving circuit, but the present invention is not limited thereto. In another embodiment, an optical cover may be provided on the side of the light-emitting part 121d that is opposite to the driving part 122d to change the light emission path of the light-emitting part 121d, but the present invention does not impose any restrictions on this.

[0091] Figure 15 This is a top view schematic diagram of a lamp panel assembly according to another embodiment of the present invention. The structure and advantages of the lamp panel assembly 100e in this embodiment are similar to those of other lamp panel assemblies. Figure 1 The following describes only the differences in the embodiments. Please refer to... Figure 15 The lamp panel assembly 100e may also include a protective electronic component 140. The flexible circuit board 110e has an external connection C. The light-emitting element 120 is electrically connected to the flexible circuit board 110e, and the protective electronic component 140 is electrically connected to the external connection C and the light-emitting element 120 to prevent damage to each light-emitting element 120 from excessive instantaneous voltage. Specifically, the protective electronic component 140 may be connected in parallel between the external connection C and the light-emitting element 120, and can disconnect power in case of excessive instantaneous voltage, which may be caused by static electricity. In this embodiment, the protective electronic component 140 includes an ESD diode, and the external connection C may include the bonding fingers of the flexible circuit board 110e. Figure 15The light-emitting elements 120 are arranged in a 5x5 array as an example. Each row of light-emitting elements 120 is connected to the same row control line, and each column of light-emitting elements 120 is also connected to the same column control line. Therefore, in this embodiment, there are five row control lines and five column control lines. The five row control lines converge onto a flexible flat cable and are divided into five gold fingers (i.e., external connectors C). The five column control lines converge onto another flexible flat cable and form five gold fingers. Therefore, the number of external connectors C is ten, located on the two flexible flat cables respectively. Each row control line and each column control line must have a corresponding parallel-connected protective electronic element 140. Therefore, the number of protective electronic elements 140 is ten, but this invention does not impose any restrictions on the number of protective electronic elements 140 and external connectors C.

[0092] Figure 16 This is a cross-sectional schematic diagram of a backlight module according to an embodiment of this utility model. Please refer to it. Figure 16 The backlight module 200 includes a lamp panel assembly 100 and a backplate 210. The backplate 210 supports the lamp panel assembly 100.

[0093] The backplate 210 may have a bottom plate portion 211 and a side plate portion 212. The bottom plate portion 211 carries the second side surface S2 of the flexible circuit board 110. The side plate portion 212 connects to the bottom plate portion 211 and surrounds the lamp panel assembly 100. The backplate 210 may have, for example, a clearance structure 213, wherein the clearance structure 213 is located in the bottom plate portion 211, and the reinforcing plate 130 is located within the clearance structure 213, so as to reduce the thickness and weight of the backlight module 200 by means of the clearance structure 213. Alternatively, the lamp panel assembly 100 may also be fixed to the backplate 210 by means of the clearance structure 213. For example, in this embodiment, the clearance structure 213 may be a through hole penetrating the bottom plate portion 211 to facilitate processing. In the normal direction N, the thickness T1 of the bottom plate portion 211 may be greater than the thickness T of the reinforcing plate 130, so that the reinforcing plate 130 does not protrude from the through hole, thereby maintaining the surface flatness of the bottom plate portion 211. Incidentally, the opening width of the perforation may be slightly larger than the width of the reinforcing plate 130 to facilitate the installation and alignment of the reinforcing plate 130 with the back plate 210. In one embodiment, the clearance structure 213 may be a groove, and the present invention is not limited thereto.

[0094] In this embodiment, the backlight module 200 may further include a wavelength conversion layer 220 and a filter layer 230, with the lamp panel assembly 100 and the wavelength conversion layer 220 located on opposite sides of the filter layer 230. Specifically, the filter layer 230 is located in the beam path of the light-emitting element 120. The filter layer 230 allows the light beam emitted by the light-emitting element 120 to pass through and reflects the light beam whose wavelength has been converted by the wavelength conversion layer 220, thereby preventing the light beam converted by the wavelength conversion layer 220 from incident on the lamp panel assembly 100 and being absorbed or scattered by the lamp panel assembly 100. For example, in one embodiment, the light-emitting element 120 may generate a blue light beam. The filter layer 230 allows blue light beams within a specific wavelength range to pass through and be incident on the wavelength conversion layer 220. The wavelength conversion layer 220 can then convert the blue light beam into a green light beam and a red light beam. The filter layer 230 can further reflect the green light beam and red light beam converted by the wavelength conversion layer 220. The wavelength conversion layer 220 in this embodiment may include a quantum dot film or a fluorescent film, and other embodiments are not limited to this.

[0095] Compared to known technologies, the backlight module 200 of this embodiment uses the aforementioned lamp panel assembly 100, thus effectively improving yield. In other embodiments, the backlight module 200 may use lamp panel assemblies 100a, 100b, 100c, 100d, or 100e.

[0096] Incidentally, the backlight module 200 of this embodiment may also include a frame 240. The frame 240 is disposed between the side panel portion 212 and the lamp panel assembly 100. For example, the frame 240 may be located inside the side panel portion 212 and surround the lamp panel assembly 100. The frame 240 may include a plastic frame, but the present invention is not limited thereto.

[0097] Figure 17 This is a cross-sectional schematic diagram of a backlight module according to another embodiment of the present invention. The structure and advantages of the backlight module 200a are similar to those of the present invention. Figure 17 The following describes only the differences in the embodiments. Please refer to... Figure 17 The backlight module 200a also includes, for example, a diffuser 250, with the lamp panel assembly 100 located between the diffuser 250 and the backplate 210 to improve light uniformity. For instance, the diffuser 250 may be located on the side of the wavelength conversion layer 220 facing away from the lamp panel assembly 100, while in one embodiment, the diffuser 250 may be located between the filter layer 230 and the lamp panel assembly 100. In this embodiment, the diffuser 250 may contain a plurality of light-scattering particles 251 to scatter incident light.

[0098] Figure 18 This is a cross-sectional schematic diagram of a backlight module according to another embodiment of the present invention. The structure and advantages of the backlight module 200b are similar to those of the present invention. Figure 17 The following describes only the differences in the embodiments. Please refer to... Figure 18The diffuser 250b has opposing third surfaces S3 and fourth surfaces S4. The fourth surface S4 faces the lamp panel assembly 100. The third surface S3 and / or the fourth surface S4, for example, have multiple microstructures M to scatter incident light through the microstructures M. In this embodiment, the fourth surface S4 is exemplified by having multiple microstructures M. Specifically, the shape of the microstructures M may be generally a quadrangular pyramid, but the invention is not limited thereto. In one embodiment, the interior of the diffuser 250b may be provided with... Figure 18 Multiple light-scattering particles 251.

[0099] In summary, the lamp panel assembly and backlight module of the present invention have at least one of the following advantages. In the present invention, the reinforcing plate of the lamp panel assembly is fixed to the second side surface of the flexible circuit board and overlaps the light-emitting element, so as to support the area of ​​the flexible circuit board for fixing the light-emitting element via the reinforcing plate. Thus, the flexible circuit board can be more easily kept flat by the support of the reinforcing plate, thereby significantly reducing the problem of the light-emitting element detaching from the flexible circuit board or experiencing electrical abnormalities during the manufacturing process. Therefore, the lamp panel assembly of the present invention can effectively improve the yield. The backlight module of the present invention uses the above-described lamp panel assembly, so it can effectively improve the yield.

[0100] The above description is merely a preferred embodiment of this utility model and should not be construed as limiting the scope of this utility model. Any simple equivalent changes and modifications made in accordance with the claims and content of this utility model shall still fall within the scope of this utility model patent. Furthermore, no embodiment or claim of this utility model needs to achieve all the objectives, advantages, or features disclosed in this utility model. In addition, the abstract and title of the utility model are only used to assist in patent document retrieval and are not intended to limit the scope of this utility model. Furthermore, the terms "first," "second," etc., mentioned in this specification or claims are only used to name elements or distinguish different embodiments or scopes, and are not used to limit the upper or lower limit of the number of elements.

Claims

1. A light panel assembly, characterized in that, The lamp panel assembly includes a flexible circuit board, multiple light-emitting elements, and a reinforcing plate, wherein: The flexible circuit board has opposing first and second side surfaces; The plurality of light-emitting elements are disposed on the first side surface; and The reinforcing plate is disposed on the second side surface and overlaps the plurality of light-emitting elements.

2. The lamp panel assembly according to claim 1, characterized in that, The flexible circuit board includes a reflective layer that covers the first side surface and surrounds each of the plurality of light-emitting elements.

3. The lamp panel assembly according to claim 2, characterized in that, The flexible circuit board has an insulating portion and a plurality of electrical connection portions, and the insulating portion exposes the plurality of electrical connection portions. The plurality of light-emitting elements are respectively electrically connected to the plurality of electrical connection portions. The reflective layer includes a first reflective portion and a second reflective portion, the first reflective portion covering the insulating portion and the second reflective portion covering the plurality of electrical connection portions.

4. The lamp panel assembly according to claim 3, characterized in that, The first reflective part and the second reflective part are made of different materials.

5. The lamp panel assembly according to claim 1, characterized in that, The first side surface has a first region and a second region separated from each other, and the plurality of light-emitting elements are respectively disposed in the first region and the second region. The reinforcing plate has a first part and a second part, the first part overlaps the first region, and the second part overlaps the second region. The first part and the second part are integral structures or separate from each other.

6. The lamp panel assembly according to claim 1, characterized in that, The reinforcing plate has a supporting surface, and the supporting surface is fixed to the second side surface. The plurality of light-emitting elements are located within the orthographic projection range of the outer edge of the supporting surface on the first side surface.

7. The lamp panel assembly according to claim 6, characterized in that, The plurality of light-emitting elements includes a plurality of peripheral light-emitting elements and at least one intermediate light-emitting element, wherein the plurality of peripheral light-emitting elements surround the at least one intermediate light-emitting element, each of the peripheral light-emitting elements has a side facing away from the at least one intermediate light-emitting element, and the plurality of side faces are arranged to form the distribution boundary of the plurality of light-emitting elements, and the distance between the outer edge and the distribution boundary is between 0.1 mm and 1 mm.

8. The lamp panel assembly according to claim 1, characterized in that, The thickness of the reinforcing plate is between 0.1 mm and 2 mm.

9. The lamp panel assembly according to claim 1, characterized in that, The reinforcing plate may be a metal plate or a plastic plate.

10. The lamp panel assembly according to claim 1, characterized in that, Each of the plurality of light-emitting elements has a light-emitting part and a driving part, wherein the driving part is electrically connected to the flexible circuit substrate, the light-emitting part is electrically connected to the driving part, and is located on the side of the driving part opposite to the flexible circuit substrate.

11. The lamp panel assembly according to claim 10, characterized in that, The driving unit includes a complementary metal-oxide-semiconductor driving circuit.

12. The lamp panel assembly according to claim 1, characterized in that, The lamp panel assembly also includes protective electronic components, wherein the flexible circuit board has an external portion, the plurality of light-emitting elements are electrically connected to the flexible circuit board, and the protective electronic components are electrically connected to the external portion and the plurality of light-emitting elements.

13. A backlight module, characterized in that, The backlight module includes a lamp panel assembly and a backplate, wherein: The lamp panel assembly includes a flexible circuit board, multiple light-emitting elements, and a reinforcing plate, wherein: The flexible circuit board has opposing first and second side surfaces; The plurality of light-emitting elements are disposed on the first side surface; and The reinforcing plate is disposed on the second side surface and overlaps the plurality of light-emitting elements; and The back plate supports the lamp panel assembly.

14. The backlight module according to claim 13, characterized in that, The back plate has a clearance structure, and the reinforcing plate is located within the clearance structure.

15. The backlight module according to claim 13, characterized in that, The backlight module further includes a wavelength conversion layer and a filter layer, wherein the lamp panel assembly and the wavelength conversion layer are located on opposite sides of the filter layer.

16. The backlight module according to claim 13, characterized in that, The backlight module also includes a diffuser sheet, wherein the lamp panel assembly is located between the diffuser sheet and the backplate.

17. The backlight module according to claim 16, characterized in that, The diffuser sheet contains multiple light-scattering particles.

18. The backlight module according to claim 16, characterized in that, The diffuser sheet has opposing third and fourth surfaces, the fourth surface facing the lamp panel assembly, and the third and / or fourth surfaces have multiple microstructures.

19. The backlight module according to claim 13, characterized in that, The backlight module also includes a frame, wherein the back plate has a bottom plate portion and a side plate portion, the bottom plate portion carries the second side surface, the side plate portion is connected to the bottom plate portion and surrounds the lamp panel assembly, and the frame is disposed between the side plate portion and the lamp panel assembly.

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