Interface device and automatic detection apparatus

Abstract

The embodiment of the present application relates to the technical field of test, and discloses an interface device and automatic detection equipment, the interface device includes socket board, main control board, flexible circuit board and switching assembly, the socket board has the installation surface;The switching assembly is electrically connected with the socket board, and the switching assembly is also in electrical communication with the flexible circuit board;The main control board has the first surface, the second surface and the third surface, the first surface and the third surface are opposite, one end of the second surface is connected with the first surface, the other end of the second surface is connected with the third surface, the first surface is provided with the first conductive area, and the third surface is provided with the second conductive area;The flexible circuit board is provided with the third conductive area matched with the first conductive area of the main control board, and the fourth conductive area matched with the second conductive area of the main control board, and the flexible circuit board is in electrical communication with the first conductive area and the second conductive area of the switching assembly and the main control board. Through the above mode, the present application can reduce the occupied space of the interface device.

Description

Technical Field

[0001] This application relates to the field of testing technology, and in particular to an interface device and an automatic testing equipment. Background Technology

[0002] During the manufacturing process of circuit boards or electronic devices, electrical testing is required to determine whether the circuit boards or electronic devices are in good working order.

[0003] Automatic testing equipment is used to test circuit boards or electronic devices (collectively referred to as devices under test). It typically includes a main control board with test interfaces. Electrical connection between the automatic testing equipment and the device under test is achieved by plugging the connector of the device under test into the test interface. In existing technology, the test interface is located on the front of the main control board (i.e., the largest surface area of ​​the main control board), resulting in an excessively thick main control board. Utility Model Content

[0004] The main technical problem solved by the embodiments of this application is to provide an interface device and an automatic testing equipment for connecting devices under test, which can reduce the size of the interface device in the thickness direction of the main control board, thus reducing the space occupied by the interface device.

[0005] To solve the above-mentioned technical problems, one technical solution adopted in this application embodiment is as follows: An interface device is provided, including a socket board, a main control board, a flexible circuit board, and an adapter assembly. The socket board has a mounting surface for fixing a device under test (DUT). One end of the adapter assembly is electrically connected to the side of the socket board opposite to the mounting surface, and the other end of the adapter assembly is electrically connected to the flexible circuit board. The main control board has a first surface, a second surface, and a third surface, with the first and third surfaces facing each other. One end of the second surface is connected to the first surface, and the other end of the second surface is connected to the third surface. The first surface has a first conductive area, and the third surface has a second conductive area. The flexible circuit board has a third conductive area matching the first conductive area of ​​the main control board, and a fourth conductive area matching the second conductive area of ​​the main control board. The flexible circuit board electrically connects the adapter assembly and the first and second conductive areas of the main control board.

[0006] In some embodiments, the projected area of ​​the first conductive region in the normal direction of the first surface and the projected area of ​​the second conductive region in the normal direction of the first surface do not overlap at least partially.

[0007] In some embodiments, the interface device further includes a support member, which includes a support block and a support rod. The support block has a first sub-surface and a second sub-surface disposed opposite to each other. The support rod has a first end face and a first side face disposed adjacent to each other. The first end face of the support rod is disposed on the second sub-surface of the support block. The first sub-surface of the support rod abuts against the flexible circuit board. The second sub-surface of the support block abuts against the second surface of the main control board. The first side face of the support rod abuts against the first surface or the third surface of the main control board.

[0008] In some embodiments, the flexible circuit board has a fifth conductive region electrically connected to a third conductive region, and a sixth conductive region electrically connected to a fourth conductive region; both the fifth and sixth conductive regions are electrically connected to the transition component; or The flexible circuit board includes a first sub-flexible circuit board and a second sub-flexible circuit board. The third and fifth conductive regions are both disposed on the first sub-flexible circuit board, and the fourth and sixth conductive regions are both disposed on the second sub-flexible circuit board. The fifth and sixth conductive regions are electrically connected to the adapter component.

[0009] In some embodiments, the interface device further includes a first reinforcement member, which is fixed to one end of the flexible circuit board and at least partially fixed to the main control board.

[0010] In some embodiments, the adapter assembly includes a main body, a plurality of first pins and a plurality of second pins. The main body is detachably connected to the main control board. Each first pin and each second pin passes through the main body. One end of each first pin is configured to abut against a fifth conductive area, and one end of each second pin is configured to abut against a sixth conductive area. The ends of each first pin and each second pin facing away from the main control board are configured to be electrically connected to the socket board.

[0011] In some embodiments, the interface device further includes a screw connector, the main body is provided with a mounting hole, the screw connector passes through the mounting hole, and the screw connector is fixed to the support member.

[0012] In some embodiments, the first surface includes a first chip region, a second chip region, and a first conductive region, the second surface includes a second conductive region, the first chip region is provided with a first chip, the first conductive region is disposed in the first conductive region and electrically connected to the first chip, the second chip region is provided with a second chip, and the second chip is electrically connected to the second conductive region.

[0013] In some embodiments, the first chip and the first conductive area are electrically connected through the internal circuit lines of the main control board, and the second chip and the second conductive area are electrically connected through the internal circuit lines of the main control board.

[0014] To solve the above-mentioned technical problems, another technical solution adopted in this application embodiment is: to provide an automatic detection device, including multiple interface devices as described above, wherein the main control boards of each interface device are arranged at intervals along the normal direction of the first surface.

[0015] In some embodiments, the automatic detection device further includes a plurality of cooling plates located between two main control boards, with one end of the cooling plate abutting against a first surface of one of the main control boards and the other end of the cooling plate abutting against a first surface of the other main control board.

[0016] The beneficial effects of this application embodiment are as follows: Unlike the prior art, in this application embodiment, by setting a flexible circuit board, the third conductive area of ​​the flexible circuit board matches the first conductive area on the first surface of the main control board, and the fourth conductive area of ​​the flexible circuit board matches the second conductive area on the second surface of the main control board. The flexible circuit board electrically connects the adapter component and the first conductive area, and also electrically connects the adapter component and the second conductive area. This allows the device under test to be detected from the side of the main control board (i.e., the second surface), which helps to reduce the size of the interface device in the thickness direction of the main control board (i.e., the direction perpendicular to the first surface), thus reducing the space occupied by the interface device. Furthermore, since the adapter component and the third conductive area, and the adapter component and the fourth conductive area, both need to be connected via wiring within the flexible circuit board, if only the first conductive area is set on the first surface of the main control board, without setting the second conductive area on the third surface, the wiring inside the flexible circuit board will be concentrated near the first surface of the main control board. The portion of the flexible circuit board near the third surface will be unable to have wiring, wasting the internal space of the flexible circuit board and easily leading to a low data transmission rate. Therefore, by setting a first conductive area on the first surface of the main control board and a second conductive area on the third surface of the main control board, this application can make fuller use of the internal space of the flexible circuit board for wiring, which is beneficial to improving the data transmission rate of the flexible circuit board and thus improving the detection rate of the interface device. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the accompanying drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.

[0018] Figure 1 This is a schematic diagram of the interface device and the device under test provided in the embodiments of this application; Figure 2 This is a schematic diagram of the structure of the interface device provided in this application embodiment when it includes a first sub-flexible circuit board and a second sub-flexible circuit board; Figure 3 This is a schematic diagram of the interface device provided in the embodiments of this application when the support member includes a support rod and a support block; Figure 4 This is a schematic diagram of the structure of the automatic detection device provided in the embodiments of this application; Figure 5 This is a schematic diagram of the structure of the adapter component provided in the embodiments of this application; Figure 6 This is a schematic diagram of the main control board provided in the embodiments of this application from a first-view perspective. Figure 7 This is a schematic diagram of the main control board provided in the embodiments of this application from a second-view perspective; Figure 8 This is a cross-sectional view of the main control board provided in the embodiments of this application; Figure 9 This is a schematic diagram of the interface device provided in the embodiments of this application.

[0019] Attached icon number 1000. Automatic testing equipment; 100. Interface device; 200. Cooling plate; 1. Main control board; 11. First surface; 111. First pad; 112. First chip area; 1121. First chip; 113. Second chip area; 1131. Second chip; 114. First conductive area; 12. Second surface; 13. Third surface; 131. Second pad; 132. Second conductive area; 14. Via; 2. Flexible circuit board; 21. Fourth surface; 22. First sub-flexible circuit board; 221. Third conductive area; 222. Fifth conductive area; 23. Second sub-flexible circuit board; 231. Fourth conductive area; 232. Sixth conductive area; 3. Support component; 31. Support rod; 311. Through hole; 312. First side; 32. Support block; 321. First sub-surface; 322. Second sub-surface; 4. Adapter assembly; 41. Main body; 411. Mounting hole; 42. First ejector pin; 43. Second ejector pin; 5. First reinforcement component; 6. Second reinforcement component; 7. Socket plate; 71. Mounting surface. Detailed Implementation

[0020] To facilitate understanding of this application, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as "connected" to another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "upper," "lower," "inner," "outer," "vertical," "horizontal," etc., used in this specification indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0021] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.

[0022] Furthermore, the technical features involved in the different embodiments of this application described below can be combined with each other as long as they do not conflict with each other.

[0023] Please see Figure 1 The interface device 100 includes a main control board 1, a flexible circuit board 2, an adapter assembly 4, and a socket board 7. The main control board 1 is equipped with electronic components (not shown) such as chips, processors, memory, resistors, and capacitors. These electronic components are electrically connected according to required connection relationships, enabling the main control board 1 to detect the device under test (DUT). The socket board 7 has a mounting surface 71 for fixing the DUT. The flexible circuit board 2 is electrically connected to the main control board 1. One end of the adapter assembly 4 is electrically connected to the side of the socket board 7 opposite to the mounting surface 71, and the other end of the adapter assembly 4 is electrically connected to the flexible circuit board 2. The adapter assembly 4 is used for electrical connection with the DUT, allowing the main control board 1 to sequentially connect to the DUT through the flexible circuit board 2 and the adapter assembly 4, thereby enabling the detection of the DUT.

[0024] For the main control board 1 mentioned above, please refer to Figure 1The main control board 1 has a first surface 11, a second surface 12, and a third surface 13. One end of the second surface 12 is connected to the first surface 11, and the other end of the second surface 12 is connected to the third surface 13. The first surface 11 and the third surface 13 are opposite to each other. The first surface 11 is provided with a first conductive area 114, and the third surface 13 is provided with a second conductive area 132. The flexible circuit board 2 is provided with a third conductive area 221 and a fourth conductive area 231. Along the extension direction of the flexible circuit board 2, the third conductive area 221 and the fourth conductive area 231 are close to the two ends of the flexible circuit board 2, respectively. The third conductive area 221 matches the first conductive area 114, and the third conductive area 221 is welded to the first conductive area 114 to form an electrical connection. The flexible circuit board 2 is wrapped around the second surface 12 and then abuts and is fixed to the third surface 13. Specifically, the fourth conductive area 231 of the flexible circuit board 2 matches the second conductive area 132 of the third surface 13, and the fourth conductive area 231 is welded to the second conductive area 132 to form an electrical connection, thereby realizing the fixation between the flexible circuit board 2 and the main control board 1 and forming an electrical connection. In this embodiment, by setting a flexible circuit board 2, the third conductive area 221 of the flexible circuit board 2 matches the first conductive area 114 on the first surface 11, and after the flexible circuit board 2 is wrapped around the second surface 12, it abuts against and is fixed to the third surface 13. The fourth conductive area 231 of the flexible circuit board 2 matches the second conductive area 132, so that the device under test can be detected from the side of the main control board 1 (i.e., the second surface 12). This is beneficial to reduce the size of the interface device 100 in the thickness direction of the main control board 1 and reduce the space occupied by the interface device 100. In addition, the signal transmission using the flexible circuit board 2 has higher transmission efficiency and shorter transmission distance compared to the transmission method using coaxial cable or copper wire. Furthermore, since electrical connections between the adapter component 4 and the third conductive area 221, and between the adapter component 4 and the fourth conductive area 231, require wiring within the flexible circuit board 2, if only the first conductive area 114 is provided on the first surface 11 of the main control board 1, without providing the second conductive area 132 on the third surface 13 of the main control board 1, the wiring within the flexible circuit board 2 will be concentrated near the first surface 11 of the main control board 1, leaving the portion of the flexible circuit board 2 near the third surface 13 unwired. This wastes internal space of the flexible circuit board 2 and can easily lead to a low data transmission rate. Therefore, this application provides the first conductive area 114 on the first surface 11 of the main control board 1 and the second conductive area 132 on the third surface 13 of the main control board 1, which allows for more efficient use of the internal space of the flexible circuit board 2 for wiring, thereby improving the data transmission rate of the flexible circuit board 2 and ultimately increasing the detection rate of the interface device.

[0025] It is worth noting that since some of the circuits inside the main control board 1 need to be connected to the first conductive area 114 and other circuits need to be connected to the second conductive area 132, if the projection areas of the first conductive area 114 and the second conductive area 132 in the normal direction of the first surface 11 completely overlap, it is easy to cause the circuits inside the main control board 1 to be too dense, which can easily lead to internal short circuits in the main control board 1. Furthermore, the internal circuit design and manufacturing of the main control board 1 are difficult.

[0026] To at least partially solve the above problems, in some embodiments, please combine Figure 6 and Figure 7 The projection area of ​​the first conductive region 114 in the normal direction of the first surface 11 and the projection area of ​​the second conductive region 132 in the normal direction of the first surface 11 do not overlap at least partially. This arrangement helps to stagger the internal circuits of the main control board 1, reducing the risk of internal short circuits in the main control board 1, and also reducing the design difficulty of the internal circuits and the manufacturing difficulty of the main control board 1.

[0027] In some embodiments, the projection area of ​​the first conductive region 114 in the normal direction of the first surface 11 and the projection area of ​​the second conductive region 132 in the normal direction of the first surface 11 are staggered, which can further reduce the risk of internal short circuit of the main control board 1, further reduce the design difficulty of the internal circuit of the main control board 1 and reduce the processing difficulty of the main control board 1.

[0028] In some embodiments, please refer to Figure 1 and Figure 6 The first conductive area 114 is provided with a plurality of first pads 111 spaced apart from each other, and the third conductive area 221 of the flexible circuit board 2 is provided with a plurality of first welding parts (unlabeled) spaced apart from each other. A first pad 111 is welded and fixed to a first welding part, thereby realizing the electrical connection between the first conductive area 114 and the third conductive area 221.

[0029] In some embodiments, please refer to Figure 1 and Figure 7 The second conductive area 132 is provided with a plurality of mutually spaced third pads 131, and the fourth conductive area 231 of the flexible circuit board 2 is provided with a plurality of mutually spaced second welding parts (unlabeled). A third pad 131 is welded and fixed to a second welding part, thereby realizing the electrical connection between the second conductive area 132 and the fourth conductive area 231.

[0030] In some embodiments, please refer to Figure 4The interface device 100 also includes a first reinforcement member 5, which is fixed to one end of the flexible circuit board 2. The first reinforcement member 5 is at least partially in contact with the first surface 11 or the third surface 13 of the main control board 1, and the first reinforcement member 5 is bonded and fixed to the first surface 11 or the third surface 13. This arrangement is beneficial to improving the connection strength between the flexible circuit board 2 and the main control board 1.

[0031] It is understood that there can be two first reinforcing members 5 (not shown in the figure). One first reinforcing member 5 is fixed to the end of the flexible circuit board 2 near the first conductive area 114, and this first reinforcing member 5 is also fixed to the first surface 11 of the main control board 1. The other first reinforcing member 5 is fixed to the end of the flexible circuit board 2 near the second conductive area 132, and this first reinforcing member 5 is also bonded to the third surface 13 of the main control board 1. In this embodiment, by providing two first reinforcing members 5, the connection strength between the flexible circuit board 2 and the main control board 1 can be further improved.

[0032] In some embodiments, please refer to Figure 1 The interface device 100 also includes a support member 3, which is disposed between the second surface 12 and the fourth surface 21. One end of the support member 3 abuts against the second surface 12, and the other end of the support member 3 abuts against the flexible circuit board 2, thereby providing support for the flexible circuit board 2. In this embodiment, by disposing the support member 3 between the second surface 12 and the flexible circuit board 2, the support member 3 can provide support for the flexible circuit board 2, reducing the shaking of the flexible circuit board 2 during the process of connecting the device under test to the adapter assembly 4 or during the process of removing the device under test after testing.

[0033] In some embodiments, please refer to Figure 3 and Figure 9 The support member 3 includes a support rod 31 and a support block 32. The support block 32 has a first sub-surface 321 and a second sub-surface 322 disposed opposite to each other. The support rod 31 has a first end face (not labeled) and a first side face 312 disposed adjacent to each other. The first end face of the support rod 31 is located on the second sub-surface 322 of the support block 32, that is, the first end face is connected to the second sub-surface 322. The first sub-surface 321 abuts against the side of the flexible circuit board 2 near the second surface 12, and the second sub-surface 322 abuts against the second surface 12, so that the support block 32 can support the flexible circuit board 2. The first side face 312 of the support rod 31 abuts against the first surface 11 or the third surface 13 of the main control board 1. The support rod 31 is used to support the support block 32, so that the support block 32 is fixed to the second surface 12.

[0034] In some embodiments, the support rod 31 is provided with a through hole 311 for a screw (not shown) to pass through. After passing through the through hole 311, the screw is screwed onto the main control board 1, thereby fixing the support block 32 to the second surface 12. The flexible circuit board 2 described above passes around the first sub-surface 321 of the support block 32 from the first surface 11 and is then fixed to the third surface 13 of the main control board 1.

[0035] In some embodiments, please refer to Figure 9 The interface device 100 further includes a second reinforcing member 6, which is located between the flexible circuit board 2 and the second surface 12 of the main control board 1. One end of the second reinforcing member 6 is bonded and fixed to the first sub-surface 321 of the support block 32, and the other end of the second reinforcing member 6 facing away from the second surface 12 is bonded and fixed to the flexible circuit 2. In this embodiment, by providing the second reinforcing member 6, the connection strength between the support block 32 and the flexible circuit board 2 is improved, and the support capacity of the support block 32 for the flexible circuit board 2 is enhanced.

[0036] In some embodiments, please refer to Figure 1 The fourth surface 21 of the flexible circuit board 2 is provided with a fifth conductive region 222 and a sixth conductive region 232. The fifth conductive region 222 is electrically connected to the third conductive region 221, and the sixth conductive region 232 is electrically connected to the fourth conductive region 231. This allows electrical signals emitted by the main control board 1 to be transmitted sequentially through the first conductive region 114 and the third conductive region 221 to the fifth conductive region 222, and electrical signals emitted by the main control board 1 to be transmitted sequentially through the second conductive region 132 and the fourth conductive region 231 to the sixth conductive region 232. The fourth surface 21 is the surface of the flexible circuit board 2 that faces away from the second surface 12. Both the fifth conductive region 222 and the sixth conductive region 232 are removably connected to one end of the adapter component 4. The other end of the adapter component 4 is configured to be electrically connected to the device under test (DUT), so that the electrical signals of the fifth conductive region 222 and the sixth conductive region 232 can be transmitted to the DUT through the adapter component 4.

[0037] It is worth noting that, since the flexible circuit board 2 needs to go from the first surface 11 around the second surface 12 to the third surface 13, that is, the flexible circuit board 2 needs to go through two bends of about 90°, the internal stress of the flexible circuit board 2 is too large, which affects the stability of the connection between the flexible circuit board 2 and the main control board 1, and makes the processing difficult.

[0038] To at least partially address the above problems, in some embodiments, please refer to Figure 2The flexible circuit board 2 includes a first sub-flexible circuit board 22 and a second sub-flexible circuit board 23. Both the first and second sub-flexible circuit boards 22 and 23 are approximately inverted L-shaped. A third conductive region 221 and a fifth conductive region 222 are both disposed on the first sub-flexible circuit board 22, and a fourth conductive region 231 and a sixth conductive region 232 are both disposed on the second sub-flexible circuit board 23. The first sub-flexible circuit board 22 is at least partially located on the side of the support block 32 facing away from the second surface 12, and the second sub-flexible circuit board 23 is at least partially located on the side of the support block 32 facing away from the second surface 12. The fifth conductive region 222 is disposed on the side of the first sub-flexible circuit board 22 facing away from the second surface 12, and the sixth conductive region 232 is disposed on the side of the second sub-flexible circuit board 23 facing away from the second surface 12. The surfaces of the first and second sub-flexible circuit boards 22 and 23 facing away from the second surface 12 together constitute the fourth surface 21. In this embodiment, by setting a first sub-flexible circuit board 22 and a second sub-flexible circuit board 23, both the first sub-flexible circuit board 22 and the second sub-flexible circuit board 23 only need to be bent once, which helps to reduce the internal stress of the flexible circuit board 2 and thus improve the stability of the connection between the flexible circuit board 2 and the main control board 1. In addition, during the processing, the first sub-flexible circuit board 22 can be installed first and then the second sub-flexible circuit board 23 can be installed, which helps to reduce the processing difficulty.

[0039] In some embodiments, please refer to Figure 4 The main control board 1 has a first surface 11 with multiple first conductive areas 114. Multiple flexible circuit boards 2 are spaced apart, and each flexible circuit board 2 is welded and fixed to at least one first conductive area 114. Each flexible circuit board 2 is wound around a second surface 12, and each flexible circuit board 2 is at least partially abutted and fixed to a third surface 13. The third surface 13 of the main control board 1 has multiple second conductive areas 132. Multiple flexible circuit boards 2 are spaced apart, and each flexible circuit board 2's third conductive area 221 is welded and fixed to at least one first conductive area 114. Each flexible circuit board 2 is wound around a second surface 12, and each flexible circuit board 2 is at least partially abutted and fixed to the third surface 13. Each flexible circuit board 2's fourth conductive area 231 is welded and fixed to at least one second conductive area 132. Multiple adapter components 4 are included. One end of an adapter component 4 is used for electrical connection to a fifth conductive area 222 of a flexible circuit board 2, and the other end of an adapter component 4 is used for electrical connection to a device under test. In this embodiment, by setting multiple flexible circuit boards 2, multiple devices under test can be tested simultaneously, which helps to improve the testing efficiency of the devices under test.

[0040] In some embodiments, there are multiple support members 3. One support member 3 is disposed between the fourth surface 21 of a flexible circuit board 2 and the second surface 12 of the main control board 1. One end of each support member 3 abuts against the second surface 12, and the other end of each support member 3 abuts against a flexible circuit board 2. When there are multiple support members 3, if multiple flexible circuit boards 2 are supported by only one support member 3, the surface flatness requirement of the support member 3 is relatively high. Otherwise, it will easily affect the assembly of each flexible circuit board 2. Therefore, in this application, by setting multiple support members 3, one support member 3 corresponds to one flexible circuit board 2, so that the support member 3 can provide support to the corresponding flexible circuit board 2, the surface flatness of the support member 3 can be appropriately reduced, and the processing cost can be reduced.

[0041] For the aforementioned adapter component 4, please refer to... Figure 1 and Figure 2 The adapter assembly 4 includes a main body 41, a plurality of first pins 42, and a plurality of second pins 43. The main body 41 and the main control board 1 are detachably connected. The plurality of first pins 42 pass through the main body 41, and both ends of each first pin 42 protrude from the main body 41. When the main body 41 is connected to the main control board 1, one end of each first pin 42 abuts against the fifth conductive area 222, and each first pin 42 is electrically connected to the fifth conductive area 222. The end of each first pin 42 facing away from the main control board 1 is configured to be electrically connected to the device under test. The plurality of second pins 43 pass through the main body 41, and both ends of each second pin 43 protrude from the main body 41. When the main body 41 is connected to the main control board 1, one end of each second pin 43 abuts against the sixth conductive area 232, and each second pin 43 is electrically connected to the sixth conductive area 232. The end of each second pin 43 facing away from the main control board 1 is configured to be electrically connected to the device under test. When the device under test (DUT) establishes a connection with the adapter assembly 4, several first pins 42 and several second pins 43 are respectively connected to the interface of the DUT one-to-one, realizing the electrical connection between the DUT and the interface device 100. In this embodiment, the main body 41 and the main control board 1 are detachably connected. When it is necessary to change the type or model of the DUT, the original adapter assembly 4 is removed, and the corresponding model or type of DUT is installed on the main control board 1, so that the interface device 100 can be used to test various models or types of DUTs, which helps to reduce costs.

[0042] In some embodiments, please refer to Figure 5 The interface device also includes a screw connector (not shown in the figure). The main body 41 is provided with a mounting hole 411. The screw connector passes through the mounting hole 411 and the flexible circuit board 2 and is fixed to the main control board 1, thereby realizing a detachable connection between the adapter component 4 and the main control board 1.

[0043] Furthermore, not shown in the figure, a screw hole (not shown) can be provided at the end of the support member 3 away from the main control board 1. The screw connector passes through the mounting hole 411 and the flexible circuit board 2 in sequence and is screwed into the screw hole. Since the support member 3 is fixed to the main control board 1, the fixing between the adapter component 4 and the main control board 1 can be realized.

[0044] In some embodiments, please refer to Figure 6 and Figure 7 The first surface 11 includes a first chip region 112 and a second chip region 113, which are spaced apart from each other. A first chip 1121 is disposed in the first chip region 112, and the first chip 1121 is electrically connected to a first pad 111 of a first conductive region 114. A second chip 1131 is disposed in the second chip region 113, and the second chip 1131 is electrically connected to a second pad 131 of a second conductive region 132. The first chip 1121 and the second chip 1131 are used together for testing the device under test. In this embodiment, since the first chip 1121 and the second chip 1131 are prone to heat generation during operation, a cooling plate 200 is required to dissipate heat from the first chip 1121 and the second chip 1131 (the structure of the cooling plate 200 will be described below). In this embodiment, the first chip 1121 is placed in the first chip area 112 and the second chip 113 is placed in the second chip area 113. That is, both the first chip 1121 and the second chip 1131 are placed on the first surface 11 of the main control board 1. Therefore, the cooling plate 200 only needs to be placed on one side of the main control board 1, which facilitates the cooling plate 200 to dissipate heat from the main control board 1.

[0045] In some embodiments, please refer to Figure 8 The main control board 1 is provided with a via 14. One end of the via 14 is connected to the second chip area 113, and the other end of the via 14 is connected to the second conductive area 132. The via 14 is filled with conductive material so that the second chip 1131 in the second chip area 113 and the second conductive area 132 in the second conductive area 132 can be electrically connected through the conductive material in the via 14.

[0046] In some embodiments, please refer to Figure 6 The first conductive area 114 is closer to the second surface 12 of the main control board 1 than the first chip area 112. This arrangement helps to shorten the length of the flexible circuit board 2 and save costs.

[0047] In some embodiments, please refer to Figure 6 and Figure 7 The second conductive area 132 is closer to the second surface 12 of the main control board 1 than the second chip area 113. Since the flexible circuit board 2 needs to bypass the support member 3, this arrangement helps to shorten the length of the flexible circuit board 2 and save costs.

[0048] In this embodiment, by setting a flexible circuit board 2, the third conductive area 221 of the flexible circuit board 2 matches the first conductive area 114 on the first surface 11, and after the flexible circuit board 2 is wrapped around the second surface 12, it abuts against and is fixed to the third surface 13. The fourth conductive area 231 of the flexible circuit board 2 matches the second conductive area 132, so that the device under test can be detected from the side of the main control board 1 (i.e., the second surface 12). This is beneficial to reduce the size of the interface device 100 in the thickness direction of the main control board 1 and reduce the space occupied by the interface device 100. In addition, the signal transmission using the flexible circuit board 2 has higher transmission efficiency and shorter transmission distance compared to the transmission method using coaxial cable or copper wire. Furthermore, since electrical connections between the adapter component 4 and the third conductive area 221, and between the adapter component 4 and the fourth conductive area 231, require wiring within the flexible circuit board 2, if only the first conductive area 114 is provided on the first surface 11 of the main control board 1, without providing the second conductive area 132 on the third surface 13 of the main control board 1, the wiring within the flexible circuit board 2 will be concentrated near the first surface 11 of the main control board 1, leaving the portion of the flexible circuit board 2 near the third surface 13 unwired. This wastes internal space of the flexible circuit board 2 and can easily lead to a low data transmission rate. Therefore, this application provides the first conductive area 114 on the first surface 11 of the main control board 1 and the second conductive area 132 on the third surface 13 of the main control board 1, which allows for more efficient use of the internal space of the flexible circuit board 2 for wiring, thereby improving the data transmission rate of the flexible circuit board 2 and ultimately increasing the detection rate of the interface device.

[0049] This application also provides 1000 embodiments of automatic detection equipment; please refer to [link / reference]. Figure 4 The automatic testing equipment 1000 includes multiple interface devices 100 as described above. The main control board 1 of the multiple interface devices 100 is arranged at intervals along the normal direction of the first surface 11. Each interface device 100 can independently test the device under test. With this arrangement, multiple devices under test can be tested simultaneously, which is beneficial to improving testing efficiency.

[0050] In some embodiments, the automatic testing device 1000 further includes a plurality of cooling plates 200 located between two main control boards 1. One end of the cooling plate 200 abuts against the first surface 11 of one of the main control boards 1, and the other end of the cooling plate 200 abuts against the first surface 11 of the other main control board 1, so that the cooling plate 200 can cool both main control boards 1 simultaneously, which helps to reduce the number of cooling plates 200 and lower the cost of the automatic testing device 1000. Specifically, the cooling plate 200 abuts against the first chip 1121 and the second chip 1131 on the main control board 1, so that the cooling plate 200 dissipates heat from the first chip 1121 and the second chip 1131.

[0051] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. An interface device for connecting a device under test, characterized in that, Includes socket board, adapter assembly, flexible circuit board and main control board; The socket board has a mounting surface for fixing the device under test; One end of the adapter assembly is electrically connected to the side of the socket plate opposite to the mounting surface, and the other end of the adapter assembly is electrically connected to the flexible circuit board. The main control board has a first surface, a second surface, and a third surface. The first surface and the third surface are opposite to each other. One end of the second surface is connected to the first surface, and the other end of the second surface is connected to the third surface. The first surface is provided with a first conductive area, and the third surface is provided with a second conductive area. The flexible circuit board is provided with a third conductive area that matches the first conductive area of ​​the main control board and a fourth conductive area that matches the second conductive area of ​​the main control board. The flexible circuit board electrically connects the adapter component and the first conductive area and the second conductive area of ​​the main control board.

2. The interface device according to claim 1, characterized in that, The projection area of ​​the first conductive region in the normal direction of the first surface does not overlap with the projection area of ​​the second conductive region in the normal direction of the first surface at least partially.

3. The interface device according to claim 1, characterized in that, The interface device further includes a support member, which includes a support block and a support rod. The support block has a first sub-surface and a second sub-surface disposed opposite to each other. The support rod has a first end face and a first side face disposed adjacent to each other. The first end face of the support rod is disposed on the second sub-surface of the support block. The first sub-surface of the support rod abuts against the flexible circuit board. The second sub-surface of the support block abuts against the second surface of the main control board. The first side face of the support rod abuts against the first surface or the third surface of the main control board.

4. The interface device according to claim 3, characterized in that, The flexible circuit board has a fifth conductive region electrically connected to the third conductive region and a sixth conductive region electrically connected to the fourth conductive region; both the fifth and sixth conductive regions are electrically connected to the adapter assembly; or The flexible circuit board includes a first sub-flexible circuit board and a second sub-flexible circuit board. The third conductive area and the fifth conductive area are both disposed on the first sub-flexible circuit board, and the fourth conductive area and the sixth conductive area are both disposed on the second sub-flexible circuit board. The fifth conductive area and the sixth conductive area are electrically connected to the adapter component.

5. The interface device according to claim 2, characterized in that, It also includes a first reinforcing member, which is fixed to one end of the flexible circuit board and is at least partially fixed to the main control board.

6. The interface device according to claim 4, characterized in that, The adapter assembly includes a main body, a plurality of first pins and a plurality of second pins. The main body is detachably connected to the main control board. Each first pin and each second pin passes through the main body. One end of each first pin is configured to abut against the fifth conductive area, and one end of each second pin is configured to abut against the sixth conductive area. The ends of each first pin and each second pin facing away from the main control board are configured to be electrically connected to the socket board.

7. The interface device according to claim 6, characterized in that, The interface device further includes a screw connector. The main body is provided with a mounting hole, the screw connector passes through the mounting hole, and the screw connector is fixed to the support member.

8. The interface device according to claim 1, characterized in that, The first surface includes a first chip area, a second chip area, and a first conductive area. The second surface includes a second conductive area. The first chip area is provided with a first chip. The first conductive area is disposed in the first conductive area and is electrically connected to the first chip. The second chip area is provided with a second chip and is electrically connected to the second conductive area.

9. The interface device according to claim 8, characterized in that, The first chip and the first conductive area are electrically connected through the internal circuit lines of the main control board, and the second chip and the second conductive area are electrically connected through the internal circuit lines of the main control board.

10. An automatic detection device, characterized in that, It includes multiple interface devices as described in any one of claims 1-9, wherein the main control boards of each interface device are arranged at intervals along the normal direction of the first surface.

11. The automatic detection device according to claim 10, characterized in that, The automatic detection device also includes multiple cooling plates, which are located between the two main control boards. One end of the cooling plate abuts against the first surface of one of the main control boards, and the other end of the cooling plate abuts against the first surface of the other main control board.

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