Power unit and high-voltage frequency converter

Abstract

The application discloses a power unit and a high-voltage frequency converter. The power unit comprises a shell, a power module assembly, a capacitor assembly and a board card unit. The shell comprises a first chamber and a second chamber. The first chamber and the second chamber are respectively located at opposite ends of the shell along a first direction. The power module assembly is arranged in the first chamber. The capacitor assembly is arranged in the second chamber. The capacitor assembly comprises a baffle plate arranged between the first chamber and the second chamber to block airflow from the second chamber to the first chamber. The board card unit is arranged in the first chamber. The board card unit and the power module assembly are arranged in layers in the shell along a second direction. The first direction and the second direction are arranged perpendicularly. The technical scheme of the application is modular in design, compact in internal structure, and beneficial to reducing the height of the power unit, thereby reducing the size of the whole machine, reducing the cost, facilitating installation, avoiding the influence of dust backflow on functional modules, and prolonging the service life of the functional modules.

Description

Technical Field

[0001] This application relates to the field of frequency converter technology, and in particular to a power unit and a high-voltage frequency converter. Background Technology

[0002] The size and performance of a power unit directly affect its application cost. In related technologies, power units often adopt a single-chamber layout within their housing, resulting in a large number of integrated components. This leads to complex internal wiring, low space utilization, and cumbersome assembly. When assembling internal functional modules, their positions must be adjusted one by one to avoid interference between them, resulting in low installation efficiency. Utility Model Content

[0003] This application provides a power unit and a high-voltage frequency converter with a modular design and compact internal structure. This design helps reduce the height of the power unit, facilitates installation, prevents dust backflow from affecting the functional modules, and helps extend the service life of the functional modules.

[0004] In a first aspect, embodiments of this application provide a power unit applied to a high-voltage frequency converter. The power unit includes a housing, a power module assembly, a capacitor assembly, and a circuit board unit. The housing includes a first chamber and a second chamber, which are located at opposite ends of the housing along a first direction. The capacitor assembly is disposed in the second chamber and includes a baffle plate disposed between the first and second chambers to block airflow from the second chamber to the first chamber. The circuit board unit is disposed in the first chamber. The circuit board unit and the power module assembly are arranged in layers inside the housing along a second direction, with the first direction perpendicular to the second direction.

[0005] This application's technical solution places the power module assembly in the first chamber and the capacitor assembly in the second chamber. The first and second chambers are located at opposite ends of the housing along a first direction. The circuit board units and power module assembly are arranged in layers inside the housing along a second direction, forming a three-dimensional spatial partitioned layout. This compact internal structure helps reduce the height of the power unit, thereby reducing the overall size and cost. The modular design of the power module assembly, capacitor assembly, and circuit board units facilitates installation. By placing a baffle between the first and second chambers, the airflow from the second chamber to the first chamber can be blocked, preventing dust carried by the airflow from adhering to the surface of the power module assembly and circuit board units, thus extending their service life.

[0006] According to the aforementioned embodiments of the first aspect of this application, the power module assembly includes a heat sink, and the capacitor assembly further includes a duct cover plate. The duct cover plate is located at the bottom of the capacitor assembly. The heat sink, the duct cover plate, and the housing together form a heat dissipation duct. A baffle plate is vertically disposed on the duct cover plate along a second direction. The housing includes a first panel and a second panel. The first panel is located on the side where the first chamber is located, and the second panel is located on the side where the second chamber is located. The air inlet of the heat dissipation duct is located at the lower part of the first panel, and the air outlet of the heat dissipation duct is located at the lower part of the second panel. The airflow in the heat dissipation duct flows in from the air inlet, flows through the heat sink and the duct cover plate in sequence, and is discharged from the air outlet. The technical solution of this application, by having the heat sink, the duct cover plate, and the housing together form a heat dissipation duct, with the air inlet of the heat dissipation duct located at the lower part of the first panel and the air outlet of the heat dissipation duct located at the lower part of the second panel, and the airflow in the heat dissipation duct flowing in from the air inlet, flowing through the heat sink and the duct cover plate in sequence, and being discharged from the air outlet, facilitates the dissipation of heat generated by the various functional modules inside the housing.

[0007] According to the aforementioned embodiments of the first aspect of this application, the housing further includes a frame structure. The first panel and the second panel are located on opposite sides of the frame structure along a first direction. The frame structure includes a bottom plate, a first side plate, and a second side plate. The first side plate and the second side plate are located at opposite ends of the bottom plate along a third direction. The power module assembly and the capacitor assembly are sequentially and spaced apart on the bottom plate along the first direction. The air duct cover and the heat sink are connected to the bottom plate through connectors, and a heat dissipation air duct is formed between the air duct cover and the bottom plate.

[0008] According to the aforementioned embodiments of the first aspect of this application, the duct cover includes a mounting plate and a bending plate. The bending plate is disposed on any side of the mounting plate along a third direction. The bending plate is bent relative to the mounting plate toward the side where the base plate is located. A heat dissipation duct is formed between the mounting plate, the bending plate, and the base plate.

[0009] According to the aforementioned embodiments of the first aspect of this application, the power module assembly further includes a rectifier module and an inverter module arranged at intervals. The rectifier module and the inverter module are sequentially arranged on the surface of the heat sink along a third direction. The output terminal of the rectifier module is electrically connected to the input terminal of the capacitor assembly, and the input terminal of the inverter module is electrically connected to the output terminal of the capacitor assembly. This technical solution, by sequentially arranging the rectifier module and the inverter module along a third direction on the surface of the heat sink, helps to improve the heat dissipation uniformity of the rectifier module and the inverter module, and avoids heat dissipation interference between the rectifier module and the inverter module.

[0010] According to the aforementioned embodiments of the first aspect of this application, the board unit includes a first board assembly and a second board assembly spaced apart along a second direction. The second board assembly is disposed near the heat sink, and the first board assembly is disposed away from the heat sink. The projections of the first and second board assemblies in the second direction coincide. The first and second board assemblies are connected by a connector. The first board assembly includes a power board and a control board, and the second board assembly includes two drive boards arranged sequentially along a third direction. The two drive boards are electrically connected to corresponding functional modules in the power module assembly. This technical solution, by setting the first and second board assemblies spaced apart along the second direction, with their projections coinciding in the second direction, the first board assembly including a power board and a control board, and the second board assembly including a drive board, facilitates shortening the drive line length between the first and second board assemblies, effectively reducing wiring interference.

[0011] According to the aforementioned embodiments of the first aspect of this application, the capacitor assembly further includes a plurality of capacitors and a capacitor connection busbar. The plurality of capacitors are arranged sequentially at intervals along a third direction on the surface of the air duct cover plate, and the plurality of capacitors are connected in parallel through the capacitor connection busbar.

[0012] According to any of the foregoing embodiments of the first aspect of this application, heat dissipation holes are provided on the first side plate, the second side plate, and / or the second panel, and the heat dissipation holes are connected to the heat dissipation duct. The technical solution of this application, by providing heat dissipation holes on the first side plate, the second side plate, and / or the second panel, and the heat dissipation holes being connected to the heat dissipation duct, facilitates further heat dissipation from the heat generated by the various functional modules inside the housing.

[0013] According to any of the foregoing embodiments of the first aspect of this application, the first panel includes an insulating plate. The side of the first panel facing the external environment includes a fuse, a handle, an observation window, and a copper busbar assembly. The fuse is connected in series with the input terminal of the power module assembly to form an overcurrent protection circuit. The observation window is provided at the location of the corresponding board unit. One end of the copper busbar assembly extends into the housing and is connected to the power module assembly, while the other end is exposed on the surface of the first panel for electrical connection with an external circuit.

[0014] Secondly, embodiments of this application provide a high-voltage frequency converter, including a power unit according to any of the foregoing embodiments of the first aspect of this application.

[0015] This application's technical solution incorporates a power unit within a high-voltage frequency converter. Within this power unit, power module components are housed in a first chamber, and capacitor components are housed in a second chamber. The first and second chambers are located at opposite ends of a housing along a first direction. The circuit board units and power module components are arranged in layers within the housing along a second direction, forming a three-dimensional spatial partitioned layout. This compact internal structure helps reduce the height of the power unit, thereby reducing the overall size of the unit, lowering costs, and minimizing the overall footprint of the high-voltage frequency converter. The modular design of the power module components, capacitor components, and circuit board units facilitates installation. A baffle plate between the first and second chambers blocks airflow from the second chamber to the first chamber, preventing dust carried by the airflow from adhering to the surfaces of the power module components and circuit board units, thus extending their service life. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a power unit according to an embodiment of this application; Figure 2 This is an exploded structural diagram of an embodiment of the power unit of this application; Figure 3 This is a schematic diagram of the structure of a power module assembly in one embodiment of the power unit of this application; Figure 4 This is a schematic diagram of the capacitor assembly in one embodiment of the power unit of this application; Figure 5 This is a schematic diagram of the structure of the first panel in one embodiment of the power unit of this application; Figure 6 This is a schematic diagram of the structure of the second panel in one embodiment of the power unit of this application.

[0017] Explanation of icon numbers: Housing - 100, power module assembly - 200, capacitor assembly - 300, board unit - 400; First chamber-110, second chamber-120, first panel-130, second panel-140, frame structure-150, top plate-160, heat sink-210, rectifier module-220, inverter module-230, current sensor-240, substrate-250, wind baffle-310, air duct cover-320, capacitor-330, capacitor connection busbar-340, first board assembly-410, second board assembly-420; Fuse-131, Handle-132, Observation window-133, Copper busbar assembly-134, First circuit protection component-141, Second circuit protection component-142, First side plate-151, Second side plate-152, Mounting plate-321, Bending plate-322, Power board-411, Control board-412, Drive board-421; First direction - S1, Second direction - S2, Third direction - S3, Air inlet - S4, Air outlet - S5, Airflow direction - S6, Heat dissipation hole - S7. Detailed Implementation

[0018] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0019] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0020] Furthermore, the use of terms such as "first" and "second" in this application is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed in this application.

[0021] This application provides a power unit and a high-voltage frequency converter with a modular design and compact internal structure. This helps to reduce the height of the power unit, thereby reducing the overall size and cost, facilitating installation, preventing dust backflow from affecting the functional modules, and extending the service life of the functional modules.

[0022] like Figures 1 to 2As shown in the figure, this application provides a power unit applied to a high-voltage frequency converter. The power unit includes a housing 100, a power module assembly 200, a capacitor assembly 300, and a board unit 400. The housing 100 includes a first chamber 110 and a second chamber 120, which are located at opposite ends of the housing 100 along a first direction S1, and airflow flows from the first chamber 110 to the second chamber 120. The capacitor assembly 300 is disposed in the second chamber 120 and includes a baffle plate 310, which is disposed between the first chamber 110 and the second chamber 120 to block airflow from the second chamber 120 to the first chamber 110. The board unit 400 is disposed in the first chamber 110, and the board unit 400 and the power module assembly 200 are arranged in layers inside the housing 100 along a second direction S2, with the first direction S1 and the second direction S2 being perpendicular.

[0023] The technical solution of this application arranges the power module assembly 200 in the first chamber 110 and the capacitor assembly 300 in the second chamber 120. The first chamber 110 and the second chamber 120 are located at opposite ends of the housing 100 along the first direction S1. The board unit 400 and the power module assembly 200 are arranged in layers inside the housing 100 along the second direction S2, forming a three-dimensional spatial partitioned layout. The internal structure is compact, which helps to reduce the height of the power unit, thereby reducing the overall size and cost. The modular design of the power module assembly 200, capacitor assembly 300, and board unit 400 facilitates installation. By setting a baffle plate 310 between the first chamber 110 and the second chamber 120, the baffle plate 310 divides the housing 100 into two parts, namely the first chamber 110 and the second chamber 120. It can block the airflow from the second chamber 120 to the first chamber 110. The cold air passing through the capacitor is blocked by the baffle plate 310 and discharged from the exhaust end of the second panel. The dust mixed in the airflow cannot flow back into the first chamber 110, thus preventing the dust carried by the airflow from adhering to the surface of the power module assembly 200 and the board unit 400, which helps to extend the service life of the power module assembly 200 and the board unit 400.

[0024] Preferably, the power module assembly 200, capacitor assembly 300, and board unit 400 are connected to the housing 100 via connectors or detachable clips, reducing welding dead spots and helping to shorten assembly time.

[0025] like Figures 2 to 3As shown, the power module assembly 200 includes a heat sink 210. Specifically, the heat sink 210 includes a toothed heat sink with multiple heat dissipation teeth to dissipate heat from the functional module. Those skilled in the art can also choose other forms of heat sink 210 according to actual needs, such as a heat spreader, finned structure, etc. This application does not limit the specific form of the heat sink 210. The heat sink 210 is fastened to the surface of the first chamber 110 of the base plate by a connector to ensure the fit between the heat sink 210 and the base plate to improve heat conduction efficiency.

[0026] like Figure 4 As shown, the capacitor assembly 300 also includes a duct cover 320, which is located at the bottom of the capacitor assembly 300. The heat sink 210, the duct cover 320, and the housing 100 together form a heat dissipation duct. The baffle plate 310 is vertically arranged on the duct cover 320 along the second direction S2. The housing 100 includes a first panel 130 and a second panel 140. The first panel 130 is located on the side where the first chamber 110 is located, and the second panel 140 is located on the side where the second chamber 120 is located. The air inlet S4 of the heat dissipation duct is located at the lower part of the first panel 130, and the air outlet S5 of the heat dissipation duct is located at the lower part of the second panel 140. The airflow in the heat dissipation duct flows in from the air inlet S4, flows through the gap of the teeth of the heat sink 210 and the duct cover 320 in sequence, and is discharged from the air outlet S5, realizing synchronous heat dissipation of the power module assembly 200 and the capacitor assembly 300. The technical solution of this application forms a heat dissipation duct by enclosing the heat sink 210, the air duct cover 320 and the housing 100 together. The air inlet S4 of the heat dissipation duct is located at the lower part of the first panel 130, and the air outlet S5 of the heat dissipation duct is located at the lower part of the second panel 140. The airflow in the heat dissipation duct flows in from the air inlet S4, flows through the gap of the teeth of the heat sink 210 and the air duct cover 320 in sequence, and finally is discharged from the air outlet S5, which is beneficial to dissipating the heat generated by the various functional modules inside the housing 100.

[0027] like Figure 2 As shown, the housing 100 also includes a frame structure 150. The first panel 130 and the second panel 140 are located on opposite sides of the frame structure 150 along the first direction S1. The frame structure 150 includes a bottom plate, a first side plate 151 and a second side plate 152. The first side plate 151 and the second side plate 152 are located at opposite ends of the bottom plate along the third direction S3. The power module assembly 200 and the capacitor assembly 300 are sequentially spaced on the bottom plate along the first direction S1. The air duct cover 320 and the heat sink 210 are connected to the bottom plate through connectors. A heat dissipation air duct is formed between the air duct cover 320 and the bottom plate.

[0028] Specifically, the frame structure 150 is U-shaped, and the bottom plate, the first side plate 151 and the second side plate 152 are combined to form an integrated U-shaped sheet metal part, and the first side plate 151 and the second side plate 152 form opposite side plates of the integrated U-shaped structure.

[0029] Specifically, the duct cover 320 is fixedly connected to the heat sink 210 and the frame structure 150 by screws. The first panel 130 is fixedly connected to the front edge of the frame structure 150 by hex socket screws, and the second panel 140 is fixed to the rear edge of the frame structure 150 by Phillips head countersunk screws, which facilitates disassembly and maintenance.

[0030] like Figure 4 As shown, the duct cover 320 includes a mounting plate 321 and a bending plate 322. The bending plate 322 is disposed on either side of the mounting plate 321 along a third direction S3. The bending plate 322 is bent relative to the mounting plate 321 toward the side where the base plate is located. A heat dissipation duct is formed between the mounting plate 321, the bending plate 322, and the base plate. Specifically, the mounting plate 321 and the bending plate 322 are integral structural components.

[0031] Furthermore, guide ribs can be set on the air duct cover 320 to optimize the air velocity distribution in the heat dissipation air duct, and dust screens and filter elements can be installed at the air inlet S4 and air outlet S5 to prevent dust from entering the heat dissipation air duct.

[0032] like Figure 3 As shown, the heat sink 210 also includes a substrate 250, and the power module assembly 200 includes a rectifier module 220 and an inverter module 230 spaced apart. The rectifier module 220 and the inverter module 230 are sequentially arranged along the third direction S3 on the surface of the substrate 250 of the heat sink 210. The output terminal of the rectifier module 220 is electrically connected to the input terminal of the capacitor assembly 300, and the input terminal of the inverter module 230 is electrically connected to the output terminal of the capacitor assembly 300. The technical solution of this application, by sequentially arranging the rectifier module 220 and the inverter module 230 along the third direction S3 on the surface of the substrate 250 of the heat sink 210, helps to improve the heat dissipation uniformity of the rectifier module 220 and the inverter module 230 and avoids heat dissipation interference between the rectifier module 220 and the inverter module 230.

[0033] like Figure 3 As shown, the power module assembly 200 also includes at least one current sensor 240, which is disposed on the front side of the rectifier module 220. The input copper busbar passes through the current sensor 240 and is electrically connected to the input terminal of the rectifier module 220 to detect the input current of the rectifier module 220 in real time.

[0034] Preferably, there are two current sensors 240, which are symmetrically distributed on both sides of the front of the rectifier module 220. The detection signals of both current sensors 240 are transmitted to the control board of the board unit 400 through signal cables, forming redundant detection of the input current of the rectifier module 220. When one current sensor 240 fails, the other current sensor 240 can still output a detection signal normally, improving the safety of the power unit operation.

[0035] Preferably, the rectifier module 220 and the inverter module 230 are respectively connected to the capacitor assembly 300 through a twisted pair structure. The outer layer of the twisted pair structure is provided with a shielding structure to reduce electromagnetic interference.

[0036] like Figure 2 As shown, the board unit 400 includes a first board assembly 410 and a second board assembly 420 spaced apart along the second direction S2. The second board assembly 420 is disposed near the heat sink 210, and the first board assembly 410 is disposed away from the heat sink 210. The projections of the first board assembly 410 and the second board assembly 420 in the second direction S2 coincide, and the first board assembly 410 and the second board assembly 420 are connected by a connector. The first board assembly 410 includes a power board 411 and a control board 412, and the second board assembly 420 includes two drive boards 421 arranged sequentially along the third direction S3. The two drive boards 421 are electrically connected to corresponding functional modules in the power module assembly 200. The technical solution of this application, by setting up a first board assembly 410 and a second board assembly 420 spaced apart along the second direction S2, with the projections of the first board assembly 410 and the second board assembly 420 overlapping in the second direction S2, allows for a shorter drive line length between the first board assembly 410 and the second board assembly 420. This effectively reduces wiring interference, lowers latency, and improves response speed. Furthermore, the board units 400 are layered, allowing for individual disassembly during maintenance without disassembling the overall structure, thus improving operational efficiency.

[0037] like Figure 4 As shown, the capacitor assembly 300 also includes multiple capacitors 330 and a capacitor connection busbar 340. The multiple capacitors 330 are arranged sequentially at intervals along the third direction S3 on the surface of the air duct cover 320, and the multiple capacitors 330 are connected in parallel through the capacitor connection busbar 340. Specifically, the capacitors 330 include filter capacitors.

[0038] Specifically, each capacitor 330 is fixed to the horizontal section surface of the duct cover 320 by a snap fastener or connector, and the positive terminals of all capacitors 330 are connected by bolts through a capacitor connecting busbar 340, and the negative terminals are connected by welding through another capacitor connecting busbar 340, forming a parallel structure to improve capacitance stability.

[0039] like Figure 2 As shown, the first side plate 151, the second side plate 152, and / or the second panel 140 are provided with arrayed heat dissipation holes S7. The heat dissipation holes S7 are connected to the heat dissipation duct and the second chamber 120 where the capacitor assembly 300 is located. Specifically, the first side plate 151 and the second side plate 152 are opposite side plates of an integrated U-shaped sheet metal part. The technical solution of this application, by providing heat dissipation holes S7 on the first side plate 151, the second side plate 152, and / or the second panel 140, and by providing heat dissipation holes S7 on the first side plate 151, the second side plate 152, and / or the second panel 140, and by providing heat dissipation holes S7 that are connected to the heat dissipation duct, is conducive to further dissipating the heat generated by the various functional modules inside the housing 100.

[0040] Furthermore, the aperture of the heat dissipation hole S7 can be gradually increased along the airflow direction of the heat dissipation channel to improve the heat dissipation efficiency of the capacitor 330 in the capacitor assembly.

[0041] The first panel 130 includes an insulating board. Specifically, the first panel 130 is a sheet molding compound, which combines insulation and lightweight properties. The first panel 130 isolates external electromagnetic interference. The twisted-pair structure and the outer shielding structure reduce coupling interference between strong and weak electrical signals. The layered arrangement of the board unit 400 shortens the length of the drive line, which helps to reduce the distortion rate of the control signal and improve the operational stability of the power unit.

[0042] like Figure 5 As shown, the first panel 130 facing the external environment includes a fuse 131, a handle 132, an observation window 133, and a copper busbar assembly 134. The fuse 131 is connected in series with the input terminal of the power module assembly 200 to form an overcurrent protection circuit, which can cut off the circuit when there is an overcurrent. The observation window 133 is set at the location of the board unit 400. One end of the copper busbar assembly 134 extends into the housing 100 and is connected to the power module assembly 200, while the other end is exposed on the surface of the first panel 130 to be electrically connected to the external circuit.

[0043] like Figure 6As shown, the second panel 140 facing the external environment includes a first circuit protection component 141 and a second circuit protection component 142. The first circuit protection component 141 is connected to the power module assembly 200, and the second circuit protection component 142 is electrically connected to the capacitor module. Specifically, the first circuit protection component 141 includes an aluminum-cased resistor, and the second circuit protection component 142 includes a crowbar resistor. When the power unit stops due to a fault, if the aluminum-cased resistor is not installed, the charge in the capacitor will remain. The aluminum-cased resistor is used to discharge the residual charge in the capacitor. The crowbar resistor is used when the power grid experiences a high voltage surge, that is, when the power grid voltage suddenly rises, the bus voltage will also rise. At this time, the crowbar resistor intervenes to maintain the bus voltage within the rated range, thereby protecting the power unit from damage.

[0044] This application also provides a high-voltage frequency converter, including a power unit according to any of the foregoing embodiments of this application.

[0045] like Figures 1 to 2 As shown, this application embodiment provides a power unit applied to a high-voltage frequency converter. The power unit includes: a housing 100, a power module assembly 200, a capacitor assembly 300, and a board unit 400. The housing 100 includes a first chamber 110 and a second chamber 120, which are located at opposite ends of the housing 100 along a first direction S1. The capacitor assembly 300 is disposed in the second chamber 120 and includes a baffle plate 310, which is disposed between the first chamber 110 and the second chamber 120 to block airflow from the second chamber 120 to the first chamber 110. The board unit 400 is disposed in the first chamber 110. The board unit 400 and the power module assembly 200 are arranged in layers inside the housing 100 along a second direction S2, with the first direction S1 and the second direction S2 being perpendicular.

[0046] This application's technical solution incorporates a power unit within a high-voltage frequency converter. Within this power unit, a power module assembly 200 is housed in a first chamber 110, and a capacitor assembly 300 is housed in a second chamber 120. The first chamber 110 and the second chamber 120 are located at opposite ends of a housing 100 along a first direction S1. A board unit 400 and the power module assembly 200 are arranged in layers within the housing 100 along a second direction S2, forming a three-dimensional spatial partitioned layout. This compact internal structure helps reduce the height of the power unit, thereby reducing the overall size of the unit, lowering costs, and reducing the overall footprint of the high-voltage frequency converter. The modular design of the power module assembly 200, capacitor assembly 300, and board unit 400 facilitates installation. A baffle 310 is installed between the first chamber 110 and the second chamber 120 to block airflow from the second chamber 120 to the first chamber 110, preventing dust carried by the airflow from adhering to the surfaces of the power module assembly 200 and board unit 400, thus extending their service life.

[0047] The above description is merely a preferred embodiment of this application and does not limit the patent scope of this application. Any equivalent structural transformations made based on the inventive concept of this application and the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this application.

Claims

1. A power unit, characterized in that, include: The housing includes a first chamber and a second chamber, wherein the first chamber and the second chamber are located at opposite ends of the housing along a first direction; A power module assembly is disposed in the first chamber; A capacitor assembly is disposed in the second chamber. The capacitor assembly includes a baffle plate disposed between the first chamber and the second chamber to block airflow from the second chamber to the first chamber. as well as A board unit is disposed in the first chamber. The board unit and the power module assembly are arranged in layers inside the housing along a second direction, with the first direction being perpendicular to the second direction.

2. The power unit as described in claim 1, characterized in that, The power module assembly includes a heat sink, and the capacitor assembly also includes a duct cover plate. The duct cover plate is located at the bottom of the capacitor assembly. The heat sink, the duct cover plate, and the housing together form a heat dissipation duct. The baffle plate is vertically disposed on the duct cover plate along the second direction. The housing includes a first panel and a second panel, the first panel being located on the side containing the first chamber, and the second panel being located on the side containing the second chamber. The air inlet of the heat dissipation duct is located at the lower part of the first panel, and the air outlet of the heat dissipation duct is located at the lower part of the second panel. The airflow in the heat dissipation duct flows in from the air inlet, flows through the heat dissipation component and the duct cover in sequence, and is discharged from the air outlet.

3. The power unit as described in claim 2, characterized in that, The housing further includes a frame structure, with the first panel and the second panel located on opposite sides of the frame structure along the first direction. The frame structure includes a base plate, a first side plate, and a second side plate, with the first side plate and the second side plate located at opposite ends of the base plate along a third direction. The power module assembly and the capacitor assembly are sequentially spaced apart on the base plate along the first direction. The air duct cover and the heat sink are connected to the base plate through connectors, and the heat dissipation air duct is formed between the air duct cover and the base plate.

4. The power unit as described in claim 3, characterized in that, The air duct cover includes a mounting plate and a bending plate. The bending plate is disposed on any side of the mounting plate along the third direction. The bending plate is bent relative to the mounting plate toward the side where the base plate is located. A heat dissipation air duct is formed between the mounting plate, the bending plate, and the base plate.

5. The power unit as described in claim 3, characterized in that, The power module assembly further includes a rectifier module and an inverter module arranged at intervals, the rectifier module and the inverter module being sequentially arranged on the surface of the heat sink along the third direction. The output terminal of the rectifier module is electrically connected to the input terminal of the capacitor assembly, and the input terminal of the inverter module is electrically connected to the output terminal of the capacitor assembly.

6. The power unit as described in claim 3, characterized in that, The board unit includes a first board assembly and a second board assembly spaced apart along the second direction. The second board assembly is disposed closer to the heat sink, and the first board assembly is disposed away from the heat sink. The projections of the first board assembly and the second board assembly in the second direction coincide. The first board assembly and the second board assembly are connected by a connector. The first board assembly includes a power board and a control board, and the second board assembly includes two drive boards arranged sequentially along the third direction, with the two drive boards respectively electrically connected to the corresponding functional modules in the power module assembly.

7. The power unit as described in claim 3, characterized in that, The capacitor assembly also includes multiple capacitors and capacitor connection busbars. The multiple capacitors are arranged sequentially at intervals along the third direction on the surface of the air duct cover plate, and the multiple capacitors are connected in parallel through the capacitor connection busbars.

8. The power unit as described in any one of claims 3 to 7, characterized in that, The first side plate, the second side plate, and / or the second panel are provided with heat dissipation holes, which are connected to the heat dissipation duct.

9. The power unit as described in any one of claims 3 to 7, characterized in that, The first panel includes an insulating board, and the side of the first panel facing the external environment includes a fuse, a handle, an observation window, and a copper busbar assembly. The fuse is connected in series with the input terminal of the power module assembly to form an overcurrent protection circuit. The observation window is set at the location of the board unit. One end of the copper busbar assembly extends into the housing and is connected to the power module assembly, while the other end is exposed on the surface of the first panel for electrical connection with external circuitry.

10. A high-voltage frequency converter, characterized in that, Includes the power unit as described in any one of claims 1 to 9.

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