Power conversion device

Abstract

The utility model discloses a power conversion device, include: base shell is equipped with direct current input component and alternating current output component, capacitor component is located in the base shell with direct current input component electricity is connected, transistor component is located in the base shell with capacitor component electricity is connected, radiator is connected with transistor component for transistor component heat dissipation, wherein, capacitor component with the projection of radiator in the up and down direction at least partially overlaps.

Description

Technical Field

[0001] This utility model belongs to the field of automated electronics and power equipment technology, and specifically relates to a power conversion device. Background Technology

[0002] Power conversion devices are core equipment in power systems that convert electrical energy into its form. In existing technologies, the layout of the various functional modules within power conversion devices is not very efficient, resulting in low space utilization, large size, and low power density. Therefore, it is necessary to improve existing technologies to overcome these shortcomings. Utility Model Content

[0003] Therefore, the technical problem to be solved by this utility model is to provide a power conversion device that can improve power density.

[0004] To solve the above-mentioned technical problems, this utility model provides a power conversion device, comprising: a base housing, having a DC input component and an AC output component; a capacitor assembly disposed within the base housing and electrically connected to the DC input component; a transistor assembly disposed within the base housing and electrically connected to the capacitor assembly; and a heat sink connected to the transistor assembly for heat dissipation of the transistor assembly; wherein the projections of the capacitor assembly and the heat sink in the vertical direction at least partially overlap.

[0005] In some disclosed embodiments, the capacitor assembly includes at least a plurality of first capacitors, the projections of the plurality of first capacitors in the vertical direction at least partially overlapping the projections of the heat sink in the vertical direction.

[0006] In some disclosed embodiments, the capacitor assembly is located above the heat sink.

[0007] In some disclosed embodiments, a second capacitor is provided at the junction of the capacitor assembly and the transistor assembly, the capacitor assembly and the transistor assembly are distributed vertically between them, and the second capacitor is located between the capacitor assembly and the transistor assembly.

[0008] In some disclosed embodiments, the projection of the second capacitor in the vertical direction at least partially overlaps with the projection of the capacitor assembly in the vertical direction; and / or,

[0009] The projection of the second capacitor in the vertical direction at least partially overlaps with the projection of the transistor assembly in the vertical direction.

[0010] In some disclosed embodiments, the power conversion device further includes a fan assembly disposed within the base housing, the fan assembly being configured to generate a cooling airflow passing through the heat sink, wherein the base housing is provided with an air inlet for the cooling airflow to enter and an air outlet for the cooling airflow to exit, the fan assembly being located below the heat sink, and the capacitor assembly being distributed closer to the air outlet than the heat sink and the transistor assembly.

[0011] In some disclosed embodiments, the power conversion device further includes a fan assembly that is retractable relative to the base housing to have an initial state located within the base housing and a retracted state at least partially exposed outside the base housing, wherein the base housing has a first clearance opening for circumventing the fan assembly, and the base housing is provided with a support member that cooperates with the fan assembly.

[0012] In some disclosed embodiments, an electrical connector is provided between the DC input component, the capacitor component, and the transistor component, the electrical connector being located on the same side of the capacitor component and the transistor component, wherein the side wall of the base shell near the electrical connector is detachably disposed relative to the base shell.

[0013] In some disclosed embodiments, the power conversion device further includes a main control board disposed within the base housing, the main control board being electrically connected to the transistor assembly, wherein the main control board is located on the front side of the base housing.

[0014] In some disclosed embodiments, the bottom of the base shell is provided with a trolley assembly, and the bottom of the trolley assembly is provided with wheels.

[0015] The technical solution provided by this utility model has the following advantages:

[0016] The capacitor assembly and the heat sink partially overlap in the width direction of the power conversion device, which can effectively utilize the space inside the base shell, improve space utilization, and reduce the width dimension of the power conversion device, thereby increasing the power density of the power conversion device. Attached Figure Description

[0017] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0018] Figure 1 A three-dimensional structural schematic diagram of the power conversion device provided by this utility model;

[0019] Figure 2 A side view of the power conversion device provided by this utility model;

[0020] Figure 3 A cross-sectional view of the power conversion device provided by this utility model;

[0021] Figure 4 for Figure 3 Enlarged structural diagram of region A in the middle;

[0022] Figure 5 One of the exploded views of a portion of the structure of the power conversion device provided by this utility model;

[0023] Figure 6 A second exploded view of a portion of the structure of the power conversion device provided by this utility model;

[0024] Figure 7 This is a schematic diagram showing the fan assembly in the pull-out position.

[0025] Figure 8 This is the third exploded view of a portion of the structure of the power conversion device provided by this utility model;

[0026] Figure 9 This is a schematic diagram of the exploded structure of the base shell;

[0027] Figure 10 This is a schematic diagram of the structure of the first cover plate. Detailed Implementation

[0028] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. The present utility model will be described in detail below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this utility model can be combined with each other.

[0029] It should be noted that the terms "first," "second," etc., in the specification, claims, and drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0030] In this utility model, unless otherwise stated, directional terms such as "upper," "lower," "top," and "bottom" are generally used in relation to the direction shown in the accompanying drawings, or in relation to the vertical, perpendicular, or gravitational direction of the component itself; similarly, for ease of understanding and description, "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not used to limit this utility model.

[0031] This utility model discloses a power conversion device, which, in one application scenario, is an inverter. For example... Figures 1 to 5 As shown, the power conversion device includes a base housing 100, a DC input component 130, an AC output component 140, a capacitor assembly 200, a transistor assembly 300, a heat sink 400, and a main control board 600. The DC input component 130 and the AC output component 140 are mounted on the base housing 100 and at least partially located on the outside of the base housing 100, facilitating operation. Alternatively, the DC input component 130 and the AC output component 140 can be housed within the base housing 100, with openings (not shown) on the base housing 100 corresponding to the DC input component 130 and the AC output component 140, to facilitate connection with external electrical components (not shown).

[0032] The DC input component 130 is located at the top of the base housing 100, and the AC output component 140 is located at the bottom of the base housing 100. The capacitor assembly 200 is located above the heat sink 400, so that the capacitor assembly 200 can be closer to the DC input component 130 for easy connection, reducing the size of the electrical connection between the DC input component 130 and the capacitor assembly 200, making the overall structure more compact.

[0033] The capacitor assembly 200 is electrically connected to the DC input assembly 130, the transistor assembly 300 is electrically connected to the transistor assembly 300, and the AC output assembly 140 is electrically connected to the transistor assembly 300. In this embodiment, the transistor assembly 300 is preferably an IGBT assembly, including multiple IGBTs (Insulated Gate Bipolar Transistors) and a driver board (not shown) disposed on the multiple IGBTs. A heat sink 400 is connected to the multiple IGBTs for heat dissipation. Of course, the heat sink 400 can also be used directly or indirectly for heat dissipation of the driver board.

[0034] The capacitor assembly 200, transistor assembly 300, and heat sink 400 are all housed within the base shell 100. Thus, the base shell 100 can protect the capacitor assembly 200, transistor assembly 300, and heat sink 400 inside, effectively avoiding the effects of external impacts or moisture and dirt in the external environment, and extending their service life.

[0035] In the internal structure of the power conversion device, the thickness of the capacitor assembly 200 and the heat sink 400 is greater than the thickness of the transistor assembly 300. In the prior art, the capacitor assembly 200 and the heat sink 400 are generally distributed on opposite sides of the transistor assembly 300. This results in a larger width of the power conversion device, leading to a larger overall structural size, lower power density, and higher space requirements, thus limiting its applicability.

[0036] In the embodiments disclosed herein, such as Figure 3 As shown, the projections of the capacitor assembly 200 and the heat sink 400 in the vertical direction at least partially overlap. That is, the capacitor assembly 200 and the heat sink 400 partially overlap in the width direction of the power conversion device, which can effectively utilize the space within the base shell 100, improve space utilization, and reduce the width dimension of the power conversion device, thereby increasing the power density of the power conversion device.

[0037] Specifically, the capacitor assembly 200 includes at least a plurality of first capacitors 210, the projections of the plurality of first capacitors 210 in the vertical direction at least partially overlapping the projections of the heat sink 400 in the vertical direction. Since the first capacitors 210 in the capacitor assembly 200 have a larger dimension in the width direction, and the at least partial overlap of the plurality of first capacitors 210 with the heat sink 400 in the width direction allows for better utilization of the space within the base shell 100 in the width direction, resulting in a more compact overall size.

[0038] In the embodiments disclosed herein, such as Figure 6 As shown, a second capacitor 800 is provided at the junction of the capacitor assembly 200 and the transistor assembly 300, and the second capacitor 800 is connected in parallel with the capacitor assembly 200. The second capacitor 800 is an absorption capacitor used to suppress parasitic inductance, fully exploit the potential of the transistor assembly 300, and maximize the power density in the same volume, currently reaching a power density of up to 5.47KW / L, while ensuring low cost.

[0039] The capacitor assembly 200 and the transistor assembly 300 are vertically distributed, and the second capacitor 800 is located between the capacitor assembly 200 and the transistor assembly 300. The projection of the second capacitor 800 in the vertical direction at least partially overlaps with the projection of the capacitor assembly 200 in the vertical direction; and / or, the projection of the second capacitor 800 in the vertical direction at least partially overlaps with the projection of the transistor assembly 300 in the vertical direction.

[0040] like Figure 7As shown, the power conversion device also includes a fan assembly 500 disposed within the housing 100. The fan assembly 500 is configured to generate a cooling airflow through the heat sink 400, thereby achieving efficient heat dissipation of the transistor assembly 300. The fan assembly 500 is located below the heat sink 400 and above the AC output assembly 140. The capacitor assembly 200 is distributed closer to the air outlet 150 than the heat sink 400 and the transistor assembly 300. That is, the capacitor assembly 200 is located downstream of the cooling airflow, which flows through the heat sink 400 and then through the capacitor assembly 200.

[0041] The base housing 100 is provided with an air inlet 160 for the intake of the aforementioned heat dissipation airflow and an air outlet 150 for the exhaust of the heat dissipation airflow. The air inlet 160 and air outlet 150 are holes or openings formed on the base housing 100. Further, the air inlet 160 is located at the bottom of the base housing 100, and the air outlet 150 is located at the top of the base housing 100. The DC input component 130 is located at the air outlet 150. The AC output component 140 is located on the rear side of the bottom of the base housing 100 and is set at approximately the same height as the air inlet 160. The term "rear side" refers to the side facing away from the operator in the usage environment; the front side of the base housing 100 is opposite to the rear side.

[0042] In this embodiment, the fan assembly 500 is retractable relative to the base housing 100, allowing the fan assembly 500 to have an initial state within the base housing 100 and a retracted state at least partially exposed outside the base housing 100. In the retracted state, an operator can clean the fan assembly 500, thereby helping to maintain the air intake efficiency of the fan assembly 500. The base housing 100 has a first clearance opening 101 for accommodating the fan assembly 500, located on the front end face of the base housing 100.

[0043] The fan assembly 500 includes a support frame 510, a plurality of fans 520 disposed on the support frame 510, and an end plate 530 disposed at one end of the support frame 510. When the fan assembly 500 is in its initial state, the end plate 530 can close the first clearance opening 101. The size of the end plate 530 is the same as the size of the first clearance opening 101, or the size of the end plate 530 is larger than the size of the first clearance opening 101. The plurality of fans 520 are arranged in an array on the support frame 510. A grip portion 540 is also provided on the outer wall of the end plate 530. The grip portion 540 can be a handle or a semi-open groove formed by recesses, allowing the operator's hand to penetrate into the groove to apply an external force along the length direction of the base shell 100, thereby enabling the fan assembly 500 to be pulled out.

[0044] like Figure 3 and Figure 4As shown, the base shell 100 is provided with a support member 170 that cooperates with the fan assembly 500. The support member 170 is used to support the fan assembly 500. There is a pair of support members 170, or there can be four. The four support members 170 are distributed at the four corners of the support frame 510.

[0045] The support member 170 can be an "L"-shaped strip provided on the inner wall of the base shell 100, or it can be a guide rail, or it can be a roller group composed of multiple rollers distributed at equal heights. The support member 170 is distributed along the length direction of the base shell 100, and the front end face where the first clearance opening 101 is located is the face where the width direction of the base shell 100 is located.

[0046] like Figure 4 As shown, in one embodiment, the support member 170 is provided in pairs. The support member 170 includes a vertical rib portion 171, a first horizontal rib portion 172 disposed at the bottom of the vertical rib portion 171, and a second horizontal rib portion 173 disposed at the top of the vertical rib portion 171. The first horizontal rib portion 172 is used to support the fan assembly 500 from the bottom, and the second horizontal rib portion 173 is used to limit the fan assembly 500 in the width direction. The width of the first horizontal rib portion 172 is greater than the width of the second horizontal rib portion 173.

[0047] When the fan assembly 500 is in its initial state, it is undesirable for it to be pulled out of the base housing 100 by external forces. Therefore, a locking structure 550 is provided between the fan assembly 500 and the base housing 100. In one embodiment, as... Figure 7 As shown, the locking structure 550 includes bolts and screw holes. For example, the base shell 100 is provided with screw holes, which are distributed at the edge of the first clearance opening 101. The end plate 530 is provided with through holes corresponding to the screw holes near its edge, and bolts are provided in the through holes. The end plate 530 is fastened to the base shell 100 by means of bolts and screw holes.

[0048] In another embodiment, the locking structure 550 includes a first magnetic part (not shown) and a second magnetic part (not shown), which engage with each other. The first magnetic part is fixed to the base shell 100 and located on the outer periphery of the first clearance opening 101. The second magnetic part is disposed on the inner wall of the end plate 530 and distributed near its edge, where the inner wall refers to the surface near the base shell 100. The first magnetic part and the second magnetic part have opposite magnetic properties. It is worth noting that when the base shell 100 is made of a magnetic material, the first magnetic part can be omitted, and the second magnetic part can be directly adsorbed onto the base shell 100.

[0049] like Figure 8 and Figure 9 As shown, the power conversion device also includes a main control board 600 disposed within the base housing 100, and the main control board 600 is electrically connected to the drive board in the transistor assembly 300. Preferably, the main control board 600 is located on the front side of the base housing 100 for easy maintenance by the operator.

[0050] Furthermore, the base shell 100 is detachably provided with a first cover plate 180 corresponding to the area of ​​the main control board 600, and the first cover plate 180 is located on the front side of the base shell 100. Specifically, the base shell 100 includes at least a main shell 190 and a first cover plate 180 detachably provided on the main shell 190. The main shell 190 is provided with a second clearance opening 102 that cooperates with the first cover plate 180, and the first cover plate 180 covers the second clearance opening 102 to close the second clearance opening 102. When the main control board 600 needs to be maintained, the first cover plate 180 can be removed from the main shell 190 to expose the second clearance opening 102.

[0051] To facilitate the installation of the first cover plate 180 onto the main housing 190, as follows: Figure 10 As shown, the first cover plate 180 is provided with a prepositioning structure 181, which is an insert located at the bottom of the inner wall of the first cover plate 180. The main housing 190 is provided with an installation hole 182 that mates with the insert.

[0052] When installing the first cover plate 180, the insert is first inserted into the mounting hole 182 to achieve the pre-positioning of the installation, and then the first cover plate 180 is fastened to the main housing 190 with bolts. Of course, the connection between the first cover plate 180 and the main housing 190 includes, but is not limited to, bolt connection, and can also be connected by snap-fit ​​(not shown).

[0053] In the embodiments disclosed herein, such as Figure 8 and Figure 9 As shown, the base shell 100 also includes a second cover plate 183, which is detachably mounted on the main shell 190. The main shell 190 has a third clearance opening 103, and the second cover plate 183 covers the third clearance opening 103. The third clearance opening 103 corresponds to the location of the radiator 400. After the second cover plate 183 is removed, the fins of the radiator 400 can be cleaned periodically through the third clearance opening 103, for example, to remove dust accumulated on the fins, thus ensuring the heat dissipation function of the radiator 400.

[0054] The second cover plate 183 and the main housing 190 can be detachably connected by fasteners (bolts, screws), clips, magnets, etc. Preferably, the second cover plate 183 and the main housing 190 are connected by multiple fasteners.

[0055] Electrical connections are provided between the DC input component 130, the capacitor component 200, and the transistor component 300. For example... Figure 6As shown, the DC input component 130, capacitor component 200, and transistor component 300 are connected via a first electrical connector 230, wherein the second capacitor 800 is located at the end of the first electrical connector 230 that connects to the IGBT. The transistor component 300 is connected to the AC output component 140 via a second electrical connector 240.

[0056] Electrical connectors (first electrical connector 230 and second electrical connector 240) are located on the same side of the capacitor assembly 200 and the transistor assembly 300. The side wall of the base housing 100 near the electrical connectors is detachably disposed relative to the base housing 100. Specifically, the main housing 190 of the base housing 100 is also provided with a third cover plate 184, and the main housing 190 is provided with a third clearance opening 104 that mates with the third cover plate 184. The electrical connectors, projected at least partially along the width direction of the base housing 100, are located within the third clearance opening 104 to facilitate maintenance by the operator. Furthermore, an insulating plate 185 is provided on the inner wall of the third cover plate 184. The insulating plate 185 isolates the electrical connectors from the third cover plate 184, effectively improving the safety and reliability of use.

[0057] The bottom of the base shell 100 is provided with a trolley assembly 700, and the bottom of the trolley assembly 700 is provided with wheels 710. The wheels 710 facilitate the movement of the power conversion device. Further, the trolley assembly 700 also includes a filter assembly 720, which is connected between the transistor assembly 300 and the AC output assembly 140. Preferably, the filter assembly 720 is a reactor. The shell wall of the trolley assembly 700 is at least partially perforated to facilitate heat dissipation. Further, some surfaces on the shell wall of the trolley assembly 700 are missing to improve heat dissipation.

[0058] It is worth noting that the above hardware layout structure is not only applicable to inverters, but also to rectifiers, choppers, frequency converters, drivers, controllers and other related products, which has flexible application versatility.

[0059] Obviously, the embodiments described above are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, those skilled in the art can make other variations or modifications without creative effort, and all such variations or modifications should fall within the protection scope of this utility model.

Claims

1. A power conversion device, characterized in that, include: The base (100) is provided with a DC input component (130) and an AC output component (140); A capacitor assembly (200) is disposed within the base housing (100) and electrically connected to the DC input assembly (130); A transistor assembly (300) is disposed within the base housing (100) and electrically connected to the capacitor assembly (200); A heat sink (400) is connected to the transistor assembly (300) for heat dissipation of the transistor assembly (300); The capacitor assembly (200) and the heat sink (400) at least partially overlap in the vertical direction.

2. The power conversion device as described in claim 1, characterized in that, The capacitor assembly (200) includes at least a plurality of first capacitors (210), the projections of the plurality of first capacitors (210) in the vertical direction at least partially overlap with the projections of the heat sink (400) in the vertical direction.

3. The power conversion device as described in claim 1, characterized in that, The capacitor assembly (200) is located above the heat sink (400).

4. The power conversion device as described in claim 1, characterized in that, A second capacitor (800) is provided at the junction of the capacitor assembly (200) and the transistor assembly (300). The capacitor assembly (200) and the transistor assembly (300) are distributed vertically between each other, and the second capacitor (800) is located between the capacitor assembly (200) and the transistor assembly (300).

5. The power conversion device as described in claim 4, characterized in that, The projection of the second capacitor (800) in the vertical direction at least partially overlaps with the projection of the capacitor assembly (200) in the vertical direction; And / or, The projection of the second capacitor (800) in the vertical direction at least partially overlaps with the projection of the transistor assembly (300) in the vertical direction.

6. The power conversion device as described in claim 1, characterized in that, It also includes a fan assembly (500) disposed within the base shell (100), the fan assembly (500) being configured to generate a cooling airflow passing through the heat sink (400), wherein the base shell (100) is provided with an air inlet end (160) for the cooling airflow to enter and an air outlet end (150) for the cooling airflow to exit, the fan assembly (500) being located below the heat sink (400), and the capacitor assembly (200) being distributed closer to the air outlet end (150) than the heat sink (400) and the transistor assembly (300).

7. The power conversion device as described in claim 1, characterized in that, It also includes a fan assembly (500) that is retractable relative to the base housing (100) to have an initial state located within the base housing (100) and a retractable state at least partially exposed outside the base housing (100), wherein the base housing (100) has a first clearance opening (101) for avoiding the fan assembly (500), and the base housing (100) is provided with a support member (170) that cooperates with the fan assembly (500).

8. The power conversion device as described in claim 1, characterized in that, An electrical connector is provided between the DC input component (130), the capacitor component (200), and the transistor component (300). The electrical connector is located on the same side of the capacitor component (200) and the transistor component (300). The side wall of the base shell (100) near the electrical connector is detachably disposed relative to the base shell (100).

9. The power conversion device as described in claim 1, characterized in that, It also includes a main control board (600) disposed within the base shell (100), the main control board (600) being electrically connected to the transistor assembly (300), wherein the main control board (600) is located on the front side of the base shell (100).

10. The power conversion device as claimed in claim 1, characterized in that, The bottom of the base shell (100) is provided with a trolley assembly (700), and the bottom of the trolley assembly (700) is provided with wheels (710).

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