A multilayer circuit board structure with built-in passive elements

Abstract

The utility model relates to the field of circuit board discloses a kind of multilayer circuit board structure of built-in passive component, including first substrate, second substrate, third substrate, installation component, pre-buried component and heat dissipation component, first substrate and second substrate between installation have first inner layer, second substrate and third substrate between installation have second inner layer, the inside of first inner layer and second inner layer is provided with blind hole;The installation component includes mounting plate, and the mounting plate is installed in the both sides of first substrate, second substrate and third substrate;The pre-buried component includes pre-buried passive component.This multilayer circuit board structure of built-in passive component is connected with other any layer by laser micropore, realizes extremely high wiring freedom and density, while pre-buried installation pre-buried passive component in first inner layer and second inner layer can save surface space, optimize electrical performance, solve the problem of less space and poor electrical performance.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, specifically to a multilayer circuit board structure with built-in passive components. Background Technology

[0002] Multilayer circuit boards are composite circuit boards consisting of three or more conductive layers. Each layer is isolated by an insulating dielectric layer and electrically connected by plated through-holes. Multilayer circuit boards are the core of modern high-density, high-performance electronic devices.

[0003] Traditional multilayer circuit boards present challenges in interlayer alignment, impedance control, signal integrity, and power integrity analysis. They also suffer from skin effect and increased dielectric loss at high frequencies, as well as prominent crosstalk and reflection issues, all of which negatively impact their electrical performance.

[0004] There is an urgent need for a multilayer circuit board structure with built-in passive components to solve the technical defects mentioned above. Utility Model Content

[0005] The purpose of this invention is to provide a multilayer circuit board structure with built-in passive components to solve the problems of limited space and poor electrical performance mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a multilayer circuit board structure with built-in passive components, comprising a first substrate, a second substrate, a third substrate, a mounting assembly, a pre-embedded assembly, and a heat dissipation assembly. A first inner layer is mounted between the first substrate and the second substrate, and a second inner layer is mounted between the second substrate and the third substrate. Blind vias are provided inside the first and second inner layers. The mounting assembly includes a mounting plate, which is mounted on both sides of the first substrate, the second substrate, and the third substrate. The pre-embedded assembly includes pre-embedded passive components, which are embedded inside the first and second inner layers. The heat dissipation assembly includes a heat dissipation duct, which is disposed inside the second substrate.

[0007] As a further technical solution of this utility model, the embedded component includes an insulating layer, which is disposed at the bottom end of the first substrate and the top end of the third substrate, and the insulating layer is coated with epoxy resin.

[0008] As a further technical solution of this utility model, the pre-embedded component includes laser micro-holes, which are disposed inside the first substrate and the second substrate.

[0009] As a further technical solution of this utility model, the mounting plate is threaded with mounting bolts, and bolt holes are provided on both sides of the second substrate. The mounting plate is tightly attached to the side of the second substrate and fixed by being embedded in the bolt holes with mounting bolts.

[0010] As a further technical solution of this utility model, a positioning rod is fixedly connected to the side of the mounting plate, and positioning holes are provided on both sides of the first substrate and the third substrate.

[0011] As a further technical solution of this utility model, the mounting plate is attached to both sides of the first substrate and the third substrate, and the positioning rod is embedded in the positioning hole.

[0012] As a further technical solution of this utility model, a miniature fan is installed inside the heat dissipation duct, and a temperature control start / stop module is installed inside the miniature fan. A heat distribution plate is fixedly installed at the top and bottom of the second substrate.

[0013] As a further technical solution of this utility model, heat dissipation holes are provided at both the front and rear ends of the second substrate, and the heat dissipation holes are connected to the heat dissipation air duct.

[0014] Compared with the prior art, the beneficial effects of this utility model are: the multi-layer circuit board structure with built-in passive components not only achieves the functions of saving space and improving electrical performance, and enhancing heat dissipation, but also achieves the function of easy disassembly and assembly.

[0015] (1) By setting up embedded components, insulating layers, laser micro-holes and embedded passive components, the first and third substrates of the multilayer circuit board can be connected to any other layer through laser micro-holes, achieving extremely high wiring freedom and density. At the same time, the embedded passive components installed in the first and second inner layers can save surface space and optimize electrical performance. The insulating layer outside the first and third substrates is coated with epoxy resin, which has a stronger ability to resist the formation of leakage traces under electric field and electrolyte contamination and can withstand higher voltage. This structure enhances the electrical performance of the circuit board.

[0016] (2) By setting up a heat dissipation duct, a micro fan, heat dissipation holes and a heat spreader, the second substrate is located in the middle of the multilayer circuit board. In order to improve its heat dissipation, a heat dissipation duct can be opened inside. A micro fan installed inside the heat dissipation duct can achieve self-heating. At the same time, the heat dissipation holes are connected to the heat dissipation duct and the heat spreader conducts heat evenly, which can enhance the uniformity of heat dissipation inside the second substrate. This structure enhances the heat dissipation effect of the circuit board.

[0017] (3) By setting a first substrate, a second substrate, a third substrate and a mounting assembly, the mounting plate is installed on both sides of the first substrate, the second substrate and the third substrate for combined positioning. During installation, the positioning rod on the mounting plate is inserted into the positioning holes of the first substrate and the third substrate, and then the mounting plate is fixed on the second substrate using mounting bolts. When disassembling, only the mounting bolts need to be removed. This structure realizes the function of easy disassembly and assembly. Attached Figure Description

[0018] Figure 1 This is a frontal cross-sectional view of the present invention.

[0019] Figure 2 This is a partial front view structural diagram of the first inner layer of this utility model;

[0020] Figure 3 For the present utility model Figure 1 Enlarged structural diagram at point A in the middle;

[0021] Figure 4 This is a partial front view of the first substrate of this utility model;

[0022] Figure 5 This is a partial front view of the structure of the second substrate of this utility model;

[0023] Figure 6 This is a front view structural diagram of the mounting plate of this utility model.

[0024] In the figure: 1. First substrate; 2. First inner layer; 3. Second substrate; 4. Second inner layer; 5. Third substrate; 6. Mounting assembly; 601. Mounting bolt; 602. Mounting plate; 603. Positioning hole; 604. Positioning rod; 7. Embedded assembly; 701. Insulating layer; 702. Laser micro-hole; 703. Embedded passive component; 8. Heat dissipation assembly; 801. Heat dissipation duct; 802. Micro fan; 803. Heat dissipation hole; 804. Heat spreader; 9. Blind hole. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. It should be noted that the described embodiments are only a part of the embodiments of the present utility model, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0026] Please see Figure 1-6This utility model provides an embodiment of a multilayer circuit board structure with built-in passive components, including a first substrate 1, a second substrate 3, a third substrate 5, a mounting assembly 6, a pre-embedded assembly 7, and a heat dissipation assembly 8. A first inner layer 2 is installed between the first substrate 1 and the second substrate 3, and a second inner layer 4 is installed between the second substrate 3 and the third substrate 5. Blind holes 9 are provided inside the first inner layer 2 and the second inner layer 4. The mounting assembly 6 includes a mounting plate 602, which is installed on both sides of the first substrate 1, the second substrate 3, and the third substrate 5. The pre-embedded assembly 7 includes a pre-embedded passive component 703, which is embedded inside the first inner layer 2 and the second inner layer 4. The heat dissipation assembly 8 includes a heat dissipation duct 801, which is disposed inside the second substrate 3.

[0027] The embedded component 7 includes an insulating layer 701, which is disposed at the bottom end of the first substrate 1 and the top end of the third substrate 5. The insulating layer 701 is coated with epoxy resin. The embedded component 7 includes a laser microhole 702, which is disposed inside the first substrate 1 and the second substrate 3.

[0028] Specifically, such as Figure 1 , Figure 2 and Figure 4 As shown, the first substrate 1 and the third substrate 5 of the multilayer circuit board can be connected to any other layer through laser micro-holes 702, achieving extremely high wiring freedom and density. At the same time, the pre-embedded passive components 703 installed in the first inner layer 2 and the second inner layer 4 can save surface space and optimize electrical performance. The insulating layer 701 on the outside of the first substrate 1 and the third substrate 5 is coated with epoxy resin, which has a stronger ability to resist the formation of leakage traces under electric field and electrolyte contamination and can withstand higher voltages.

[0029] A miniature fan 802 is installed inside the heat dissipation duct 801. A temperature control start / stop module is installed inside the miniature fan 802. A heat spreader 804 is fixedly installed at the top and bottom of the second substrate 3. Heat dissipation holes 803 are provided at the front and rear ends of the second substrate 3. The heat dissipation holes 803 are connected to the heat dissipation duct 801.

[0030] Specifically, such as Figure 1 and Figure 5 As shown, the second substrate 3 is located in the middle of the multilayer circuit board. In order to improve its heat dissipation, a heat dissipation channel 801 can be opened inside. A micro fan 802 is installed inside the heat dissipation channel 801 to achieve self-heating. At the same time, the heat dissipation hole 803 is connected to the heat dissipation channel 801 and the heat spreader 804 conducts heat evenly, which can enhance the uniformity of heat dissipation inside the second substrate 3.

[0031] Mounting plate 602 is threaded with mounting bolts 601. Bolt holes are provided on both sides of the second substrate 3. Mounting plate 602 is tightly attached to the side of the second substrate 3 and fixed by mounting bolts 601 embedded in the bolt holes. Positioning rods 604 are fixedly connected to the side of mounting plate 602. Positioning holes 603 are provided on both sides of the first substrate 1 and the third substrate 5. Mounting plate 602 is attached to both sides of the first substrate 1 and the third substrate 5. Positioning rods 604 are embedded in the positioning holes 603.

[0032] Specifically, such as Figure 1 , Figure 3 and Figure 6 As shown, the mounting plate 602 is installed on both sides of the first substrate 1, the second substrate 3 and the third substrate 5 for combined positioning. During installation, the positioning rod 604 on the mounting plate 602 is inserted into the positioning hole 603 of the first substrate 1 and the third substrate 5. Then, the mounting plate 602 is fixedly installed on the second substrate 3 using the mounting bolt 601. During disassembly, only the mounting bolt 601 needs to be removed.

[0033] Working principle: The first substrate 1 and the third substrate 5 of the multilayer circuit board can be connected to any other layer through laser micro-vias 702, achieving extremely high wiring freedom and density. Simultaneously, pre-embedded passive components 703 are installed in the first inner layer 2 and the second inner layer 4, saving surface space and optimizing electrical performance. The insulating layer 701 on the outside of the first substrate 1 and the third substrate 5 is coated with epoxy resin, which has a stronger ability to resist leakage traces under electric field and electrolyte contamination and can withstand higher voltages. The mounting plate 602 is installed on both sides of the first substrate 1, the second substrate 3, and the third substrate 5 for merging and positioning. During installation, the positioning rod 604 on the mounting plate 602 is inserted into the positioning hole 603 of the first substrate 1 and the third substrate 5. Then, the mounting plate 602 is fixedly installed on the second substrate 3 using the mounting bolt 601. The second substrate 3 is located in the middle of the multilayer circuit board. In order to improve its heat dissipation, a heat dissipation channel 801 can be opened inside. A micro fan 802 is installed inside the heat dissipation channel 801 to achieve self-heating. At the same time, the heat dissipation hole 803 is connected to the heat dissipation channel 801 and the heat spreader 804 conducts heat evenly, which can enhance the uniformity of heat dissipation inside the second substrate 3. This structure enhances the heat dissipation effect of the circuit board.

[0034] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A multilayer circuit board structure with built-in passive components, comprising a first substrate (1), a second substrate (3), a third substrate (5), a mounting assembly (6), a pre-embedded assembly (7), and a heat dissipation assembly (8), characterized in that: A first inner layer (2) is installed between the first substrate (1) and the second substrate (3), and a second inner layer (4) is installed between the second substrate (3) and the third substrate (5). Blind holes (9) are provided inside the first inner layer (2) and the second inner layer (4). The mounting assembly (6) includes a mounting plate (602) which is mounted on both sides of the first substrate (1), the second substrate (3) and the third substrate (5); The pre-embedded component (7) includes a pre-embedded passive element (703), which is embedded inside the first inner layer (2) and the second inner layer (4); The heat dissipation component (8) includes a heat dissipation duct (801) which is disposed inside the second substrate (3).

2. The multilayer circuit board structure with built-in passive components according to claim 1, characterized in that: The embedded component (7) includes an insulating layer (701) disposed at the bottom end of the first substrate (1) and the top end of the third substrate (5), and the insulating layer (701) is coated with epoxy resin.

3. The multilayer circuit board structure with built-in passive components according to claim 1, characterized in that: The pre-embedded component (7) includes a laser micro-hole (702), which is disposed inside the first substrate (1) and the second substrate (3).

4. The multilayer circuit board structure with built-in passive components according to claim 1, characterized in that: The mounting plate (602) is threaded with mounting bolts (601), and bolt holes are provided on both sides of the second substrate (3). The mounting plate (602) is tightly attached to the side of the second substrate (3) and fixed by being embedded in the bolt holes with mounting bolts (601).

5. A multilayer circuit board structure with built-in passive components according to claim 1, characterized in that: The mounting plate (602) is fixedly connected to a positioning rod (604) on its side, and positioning holes (603) are provided on both sides of the first substrate (1) and the third substrate (5).

6. A multilayer circuit board structure with built-in passive components according to claim 5, characterized in that: The mounting plate (602) is attached to both sides of the first substrate (1) and the third substrate (5), and the positioning rod (604) is embedded in the positioning hole (603).

7. A multilayer circuit board structure with built-in passive components according to claim 1, characterized in that: A miniature fan (802) is installed inside the heat dissipation duct (801), and a temperature control start / stop module is installed inside the miniature fan (802). A heat spreader (804) is fixedly installed at the top and bottom of the second substrate (3).

8. A multilayer circuit board structure with built-in passive components according to claim 1, characterized in that: The second substrate (3) has heat dissipation holes (803) at both its front and rear ends, and the heat dissipation holes (803) are connected to the heat dissipation duct (801).

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