IGBT and capacitor module assembly heat dissipation shell
Patent Information
- Application Number
- CN202522508987.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-26
- Publication Date
- 2026-11-03
- Estimated Expiration
- 2035-11-26
AI Technical Summary
The heat sinks of existing IGBT modules and their matching capacitors use ADC12 die-cast aluminum shells, which have problems such as difficulty in controlling air holes, low yield, high production costs, and severe corrosion of coolant.
The design features a split structure with a metal cooling plate and an insulating shell. The cooling plate is fixed to the IGBT module, and a sealed assembly is achieved using cooling water channels and sealing grooves. The cooling plate is made of extruded aluminum, while the insulating shell is made of injection molded material. Combined with sealing materials, this ensures heat dissipation and insulation performance.
It improves heat dissipation efficiency, reduces production costs, avoids uneven heat conduction and corrosion problems caused by pores, and extends service life.
Smart Images
Figure CN224935961U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of IGBT module assembly technology, specifically to a heat sink for assembling IGBT and capacitor modules. Background Technology
[0002] As a core control component in power electronic equipment, IGBT modules are widely used in high-power scenarios such as new energy vehicles, frequency converters, and energy storage systems. During operation, they generate a large amount of heat due to conduction and switching losses, so the heat dissipation effect of their housing is particularly important.
[0003] Currently, the heat sinks for IGBT modules and their associated capacitors utilize ADC12 die-cast aluminum shells with integrated IGBT cooling channels. However, controlling porosity during ADC12 die-casting is extremely challenging. Firstly, ADC12 often uses recycled aluminum as raw material, and waste recycling easily introduces impurities and gases. Secondly, during die casting, the molten metal fills the mold cavity at high speed, easily entraining air. If the mold's venting channels are poorly designed, the gas cannot escape in time and becomes trapped inside the casting. Simultaneously, the rapid solidification rate leaves insufficient time for gas to escape, and the brittle phases at grain boundaries hinder the feeding channels, further exacerbating porosity defects. These technical deficiencies result in low yield rates, consequently impacting production costs. Furthermore, when using ADC12 die-cast products, the internal coolant is often ethylene glycol-based. As an Al-Si-Cu alloy, ADC12 contains 2.0%-4.0% copper, which significantly exacerbates its electrochemical corrosion tendency. The pores and shrinkage cavities formed during die casting become channels for coolant penetration, accelerating localized corrosion and significantly reducing the actual service life. Utility Model Content
[0004] To address the shortcomings of existing technologies, the purpose of this invention is to provide a heat sink for IGBT and capacitor module assembly, which offers better heat dissipation, insulation, and corrosion resistance, while also reducing processing costs.
[0005] The technical solution adopted by this utility model is: a heat dissipation shell for assembling IGBTs and capacitor modules, including a metal cooling plate fixed to the IGBT module and an insulating shell for mounting the cooling plate; the cooling plate has cooling channels formed on the side opposite to the IGBT module, and the side is also provided with a sealing groove arranged around the cooling plate, and the edge of the cooling plate is provided with fixed parts arranged at intervals; the insulating shell is provided with an embedding groove for the cooling plate to be inserted, and the insulating shell is also provided with a mounting cavity for mounting the capacitor module below the embedding groove.
[0006] The heat dissipation and insulation shell provided by this technical solution adopts a split structure for installation with IGBT modules. A cooling plate is used to fix the IGBT module in place. During installation, the fixing part and sealing groove structure, combined with sealing material, ensure a sealed assembly between the cooling plate and the IGBT module mounting position. The cooling plate is made of metal, which improves thermal conductivity. The cooling plate also has cooling channels filled with cooling medium to further enhance the heat dissipation efficiency for the IGBT module. The insulation shell encapsulates the assembled cooling plate and can also house capacitor modules below the cooling plate, allowing for simultaneous heat dissipation from the capacitor modules. The split structure of the shell and cooling plate solves the technical problem of poor insulation in traditional one-piece metal shells, while also reducing manufacturing costs.
[0007] Preferably, the bottom of the cooling plate has a pair of spaced-apart cooling columns, and the cooling columns are provided with flow grooves that connect to the cooling water channels.
[0008] Preferably, the cooling columns are arranged diagonally along the cooling plate.
[0009] Preferably, the inner wall of the insulating shell is provided with a limiting part corresponding to the position of the cooling column, and the limiting part is provided with a limiting groove for the cooling column to be inserted.
[0010] Preferably, the fixing part is provided with fixing holes for installing fixing components.
[0011] Preferably, the cooling plate is made of extruded aluminum.
[0012] Preferably, the insulating outer shell is injection molded.
[0013] The beneficial effects of this utility model are as follows: In this utility model, the metal cooling plate is directly attached to the IGBT module, and the cooling water channel is in close contact with the heating surface of the IGBT. Heat can be directly transferred to the cooling water channel through the high thermal conductivity metal. With the circulation of the cooling medium, the heat dissipation efficiency is significantly improved. At the same time, the cooling plate is made of aluminum extrusion molding, which has a porosity much lower than that of die-cast aluminum, avoiding the problem of uneven heat conduction caused by air pores, ensuring stable heat transfer, and eliminating the need for subsequent complex machining, resulting in high production efficiency. The insulating shell is made of plastic injection molding, which has low mold cost and the injection molding process is suitable for mass production, greatly reducing the overall manufacturing cost and solving the problems of high cost and complex process in the prior art. It has high practical value. Attached Figure Description
[0014] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.
[0015] Figure 1 This is a perspective view of the cooling plate of the heat sink housing for the IGBT and capacitor module provided in the embodiment of this utility model.
[0016] Figure 2 This is a schematic diagram of the assembly of the heat sink for the IGBT and capacitor module provided in this embodiment of the utility model. Figure 1 .
[0017] Figure 3 This is a schematic diagram of the assembly of the heat sink for the IGBT and capacitor module provided in this embodiment of the utility model. Figure 2 .
[0018] Reference numerals in the drawings: cooling plate 100, cooling water channel 110, sealing groove 120, fixing part 130, fixing hole 131, cooling column 140, flow groove 141, insulating shell 200, mounting cavity 210, limiting part 220. Detailed Implementation
[0019] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings. These embodiments are merely illustrative of the present invention and should not be construed as limiting the scope of protection of the present invention.
[0020] It should be noted that, unless otherwise stated, the technical or scientific terms used in this application shall have the ordinary meaning as understood by one of ordinary skill in the art to which this utility model pertains.
[0021] like Figures 1 to 3 As shown in the figure, a specific embodiment of this utility model provides a heat sink housing for assembling an IGBT and a capacitor module, including a metal cooling plate 100 fixed to the IGBT module and an insulating shell 200 for mounting the cooling plate 100; the cooling plate 100 has a cooling water channel 110 formed on the side opposite to the IGBT module, and the side is also provided with a sealing groove 120 arranged around the cooling plate 100, and the edge of the cooling plate 100 is provided with a fixing part 130 arranged at intervals; the insulating shell 200 is provided with an embedding groove for the cooling plate 100 to be inserted, and the insulating shell 200 is also provided with a mounting cavity 210 for mounting the capacitor module below the embedding groove.
[0022] like Figures 1 to 3As shown, in this embodiment, the heat dissipation and insulation shell adopts a split design, mainly including a metal cooling plate 100 and an insulation shell 200, which respectively correspond to the heat dissipation of the IGBT module and the installation and overall insulation encapsulation of the capacitor module. The cooling plate 100 is fixedly installed with the IGBT module. During installation, the cooling plate 100 and the IGBT module are sealed together by means of the fixing part 130 and the sealing groove 120 structure combined with the sealing material. The fixing part 130 is provided with fixing holes 131 for installing fixing parts. In this way, the cooling plate 100 and the IGBT module can be fixed by inserting the fixing holes 131 with the help of nuts and other structures. The sealing groove 120 can be filled with sealing rings and other structures to ensure the sealing of the assembly. The sealing groove 120 is arranged around the outer periphery of the cooling water channel 110 and is used to embed fluororubber sealing rings. During assembly, the sealing rings are pressed by the cooling plate 100 and the IGBT module to achieve the sealing of the cooling water channel 110 and prevent medium leakage.
[0023] like Figures 1 to 3 As shown, the cooling plate 100 is made of metal, which is beneficial to improving the heat conduction effect. The cooling plate 100 also has a cooling channel 110, which is filled with a cooling medium to further improve the heat dissipation efficiency of the IGBT module. The insulating shell 200 is used to encapsulate the assembled cooling plate 100. At the same time, the capacitor module can be installed below the cooling plate 100, thereby implementing synchronous heat dissipation for the capacitor module.
[0024] In practical applications, the cooling plate 100 is made of aluminum and formed by extrusion. Compared with the traditional die-casting aluminum process, extrusion processing has a lower porosity and higher corrosion resistance. 6063 extruded profiles are preferred because the extruded profile matrix itself has extremely low hydrogen content. Under normal processing, the porosity defect rate of 6063 extruded profiles can be controlled below 0.1%. Even in scenarios such as welding with other materials, after simple pre-welding treatment, the porosity of the relevant joint profile can remain stable at a low level, and porosity will not affect the profile's performance. Furthermore, during the extrusion process, the metal is continuously formed under pressure, allowing for a greater chance of gas escaping from the profile. Even if a small number of pores appear, they are mostly surface or near-surface defects, easily removed during subsequent processing without creating a large number of new pores. Only the ingot quality needs to be controlled, thus offering a significant advantage in finished product quality. The insulating shell is injection molded. Injection-molded plastic has good insulation properties, and compared to the current one-piece die-casting aluminum structure, the mold cost is lower.
[0025] like Figures 1 to 3As shown, the heat generated by the operation of the IGBT module and capacitor module is dissipated through the cooling medium in the cooling channel 110. To achieve the circulation of the cooling medium, this embodiment requires a pair of spaced-apart cooling columns 140 at the bottom of the cooling plate 100 in the cooling channel 110. The cooling columns 140 are provided with flow grooves 141 that connect to the cooling channel 110. Thus, the cooling channel 110 can be located on the side of the cooling plate 100 opposite to the IGBT module (i.e., the upper surface), and is a rectangular groove used for the flow of cooling medium (such as an aqueous solution of ethylene glycol). The two ends of the flow channel are connected to external pipelines through the cooling columns 140 at the bottom of the cooling plate 100. In practical applications, the cooling columns 140 are arranged along the diagonal of the cooling plate 100, so that the low-temperature cooling medium is input from one end of the cooling channel 110 and the high-temperature cooling medium is output from the other end, thereby improving the cooling effect through circulation.
[0026] When this product is used in the automotive industry, ethylene glycol is commonly used as the base fluid for coolants. Products formed using 6063 extruded profiles can maintain extremely low corrosion levels. Specifically, a 90-day corrosion test was conducted in ethylene glycol coolant at 80℃ and a flow rate of 1.16 m / s. The results showed that the corrosion was mainly slight pitting, and the amount of aluminum ion dissolution decreased or stabilized over time, with an overall extremely low corrosion rate. Calculations show that under these conditions, the annual corrosion depth of 6063 is typically less than 1 μm / a. Even without special anti-corrosion treatment, it can maintain a stable low corrosion level for a long period, offering a significant service life advantage compared to traditional die-cast parts.
[0027] like Figure 3 As shown, in order to ensure the stability of the installation of the cooling plate 100, this embodiment provides a limiting part 220 on the inner wall of the insulating shell 200 corresponding to the position of the cooling column 140. The limiting part 220 is provided with a limiting groove for the cooling column 140 to be inserted. The cooling column 140 structure of the cooling plate 100 is fixed by the limiting groove to ensure the stability of the insulating shell 200 encapsulating the cooling plate 100.
[0028] This utility model, through its split structure design, combines the advantages of extruded aluminum cooling plate 100 and injection-molded insulating shell 200, effectively solving the problems of low efficiency, high cost, and poor insulation in existing heat dissipation methods. It is suitable for heat dissipation scenarios of high-power IGBT modules and matching capacitors, and has high industrial application value.
[0029] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model, and they should all be covered within the scope of the claims and specification of this utility model.
Claims
1. A heat sink housing for assembling IGBTs and capacitor modules, characterized in that; Includes a metal cooling plate (100) fixed to the IGBT module and an insulating housing (200) for mounting the cooling plate (100); The cooling plate (100) has a cooling channel (110) formed on the side opposite to the IGBT module. The side is also provided with a sealing groove (120) arranged around the cooling plate (100). The edge of the cooling plate (100) is provided with a fixed part (130) arranged at intervals. The insulating shell (200) is provided with an embedding groove for the cooling plate (100) to be inserted, and the insulating shell (200) is also provided with an installation cavity (210) for installing the capacitor module below the embedding groove.
2. The heat sink housing for assembling the IGBT and capacitor module according to claim 1, characterized in that; The bottom of the cooling plate (100) has a pair of spaced cooling columns (140), and the cooling columns (140) are provided with a flow groove (141) that connects to the cooling water channel (110).
3. The heat sink housing for assembling the IGBT and capacitor module according to claim 2, characterized in that... ； The cooling column (140) is arranged diagonally along the cooling plate (100).
4. The heat sink housing for the IGBT and capacitor module assembly according to claim 3, characterized in that; The inner wall of the insulating shell (200) is provided with a limiting part (220) corresponding to the position of the cooling column (140), and the limiting part (220) is provided with a limiting groove for the cooling column (140) to be inserted.
5. The heat sink housing for assembling the IGBT and capacitor module according to claim 1, characterized in that... ； The fixing part (130) is provided with fixing holes (131) for installing fixing members.
6. The heat sink housing for assembling the IGBT and capacitor module according to claim 1, characterized in that... ； The cooling plate (100) is made of extruded aluminum.
7. The heat sink housing for assembling the IGBT and capacitor module according to claim 1, characterized in that... ； The insulating outer shell (200) is formed by injection molding.