Packaging structure

Abstract

The application provides a packaging structure, comprising a substrate, the substrate comprising a clamping structure on the upper surface of the substrate; and a solder assembly, the solder cooperating with the clamping structure to fix the solder assembly on the substrate, the solder assembly being in contact with the upper surface of the substrate. The application has the advantages that: it does not need to rely on external jigs, simplifying the production process; it reduces the production cost and management cost; it improves the connection strength of the solder and the substrate; it helps to optimize the welding quality and reduce the product failure rate caused by connection failure; it enhances the joint strength, shear resistance and pullout resistance; and it improves the ability to resist shock and vibration.

Description

Technical Field

[0001] This application relates to the semiconductor field, and more specifically, to a packaging structure. Background Technology

[0002] Reflow soldering is a crucial step in electronics manufacturing. It involves melting solder at high temperatures to securely connect electronic components to circuit boards, and it is widely used in electronics manufacturing, communications, computers, home appliances, automotive electronics, and other fields. Before reflow soldering, pre-made solder is usually fixed to ensure its accurate positioning during the soldering process, thereby guaranteeing soldering quality.

[0003] Figure 1 A schematic diagram of a prior art packaging structure is shown. Figure 2 It shows the use of, as Figure 1 The diagram shows a top view of a prior art packaging structure. Figure 1 and Figure 2 As shown, a common method in the prior art is to use a limiting fixture 903 to fix the pre-made solder 902 onto the substrate 901. However, this method has some obvious drawbacks. First, the limiting fixture 903 needs to be manufactured separately, increasing production costs. Second, the use of the limiting fixture 903 is inconvenient, requiring time and manpower for installation and removal. Especially for small-scale or batch production, the use of the limiting fixture 903 is inefficient, requiring a production halt for each installation and removal, severely impacting production progress and easily creating process bottlenecks. Therefore, a new technology is urgently needed to solve the problem of fixing the pre-made solder 902 before the reflow process, in order to improve production efficiency and reduce production costs.

[0004] With the continuous development of the electronics industry, electronic products are gradually moving towards miniaturization and high precision, which places higher demands on solder fixation technology in the reflow process. On the one hand, miniaturized electronic products require smaller solder and more precise fixation methods to ensure efficient use of circuit board space and soldering quality; on the other hand, the demands of mass production also require fixation technology to be more efficient and convenient to meet the needs of large-scale production. Furthermore, when the process requires multiple reflows, existing technologies require repeated placement of limiting fixtures, making the workflow more cumbersome.

[0005] In summary, there is a need in the art to provide a packaging structure that can overcome the shortcomings of the prior art. Utility Model Content

[0006] This application provides a packaging structure that can solve the problems of the prior art. The objective of this application is achieved through the following technical solution.

[0007] One embodiment of this application provides a packaging structure including a substrate, the substrate including a snap-fit ​​structure located on the upper surface of the substrate; and a solder assembly, wherein the solder assembler is fixedly disposed on the substrate by cooperating with the snap-fit ​​structure, and the solder assembly is in contact with the upper surface of the substrate.

[0008] In some alternative embodiments, the packaging structure provided according to one embodiment of this application above, wherein the engaging structure is a groove.

[0009] In some alternative embodiments, the packaging structure provided according to one embodiment of the present application includes a solder assembly comprising a first part and a second part. The solder assembly is fixedly disposed on a substrate via a groove. The first part is connected to the second part. The first part is located above the second part. The second part is disposed within the groove. In a side view, the width of the first part is greater than the width of the second part. The bottom surface of the first part is in contact with the upper surface of the substrate.

[0010] In some optional embodiments, the packaging structure provided according to one embodiment of the present application includes a substrate comprising a first metal layer, a ceramic layer, and a second metal layer, wherein the first metal layer, the ceramic layer, and the second metal layer are disposed sequentially from top to bottom, and a groove is disposed on the upper surface of the first metal layer, wherein the depth of the groove is less than the thickness of the first metal layer.

[0011] In some alternative embodiments, the packaging structure provided according to one of the above embodiments of this application, wherein, in the side view direction, the groove is rectangular, trapezoidal with a wider top and narrower bottom, or a combination of a rectangle and a trapezoidal with a wider top and narrower bottom.

[0012] In some alternative embodiments, according to the packaging structure provided by one embodiment of the present application, the upper surface of the substrate is provided with a plurality of grooves, and a plurality of solder components are fixedly disposed on the substrate through the grooves.

[0013] In some alternative embodiments, according to the packaging structure provided by one embodiment of the present application, a solder assembly is fixedly disposed on a substrate via a groove.

[0014] In some alternative embodiments, according to the packaging structure provided by one embodiment of the present application, one solder assembly is fixedly disposed on a substrate by a plurality of grooves.

[0015] In some alternative embodiments, the packaging structure provided according to one embodiment of the present application, wherein, in the side view direction, the thickness of the first metal layer is greater than or equal to 0.3 mm and less than or equal to 1 mm.

[0016] In some alternative embodiments, the packaging structure provided according to one embodiment of the present application, wherein in a side view, the first portion is rectangular and the edge of the lower surface of the first portion contacts the upper surface of the substrate.

[0017] In some alternative embodiments, the packaging structure provided according to one embodiment of this application above has a second portion that is rectangular or trapezoidal with a wider top and narrower bottom.

[0018] In some alternative embodiments, the packaging structure provided according to one embodiment of the present application includes a solder assembly comprising a plurality of second portions, a first portion connected to the plurality of second portions, the first portion being located above the plurality of second portions, and each second portion being disposed in a groove.

[0019] The advantages of the packaging structure according to the embodiments of this application are: no need to rely on external fixtures, simplifying the production process: the solder is stably fixed by the cooperation of the T-shaped pre-made solder (or other self-locking structure of suitable shape) and the substrate locking structure, completely eliminating the dependence on traditional limiting fixtures. This design eliminates the alignment, placement, and removal processes of fixtures, avoiding process time extensions caused by adding related stations and significantly reducing production complexity. It is particularly suitable for small-scale or batch production scenarios, effectively eliminating process bottlenecks caused by traditional fixtures. It also reduces production and management costs: by simplifying the design and production process, there is no need to manufacture or maintain additional fixtures or configure fixture-related auxiliary equipment, significantly reducing the overall cost of production equipment and fixtures, while also reducing the manpower and time investment required for fixture management. Furthermore, it enhances the connection strength between the solder and the substrate: the solder's structural design increases the contact area between the solder and the substrate, forming a more robust solder joint during the reflow process, significantly improving the connection strength between the solder and the substrate, helping to optimize soldering quality and reduce product defect rates due to connection failures. It also enhances bonding strength, shear resistance, and pull-out resistance; and can simultaneously resist vertical and lateral vibrations, preventing fractures from concentrating on the same contact surface, thus improving resistance to vibration and impact. Attached Figure Description

[0020] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings.

[0021] Figure 1 A schematic diagram of a prior art packaging structure is shown; Figure 2 It shows the use of, as Figure 1 The diagram shown is a top view of a prior art packaging structure; Figure 3 A schematic diagram of a packaging structure according to an embodiment of this application is shown; Figure 4 It shows the use of, as Figure 3 The diagram shown is a top view of a packaging structure according to an embodiment of this application; Figure 5 A schematic diagram of a solder assembly according to a first embodiment of this application is shown; Figure 6 A schematic diagram of the packaging structure according to a second embodiment of this application is shown; Figure 7 A schematic diagram of a solder assembly according to a second embodiment of this application is shown; Figure 8 A schematic diagram of a solder assembly according to a third embodiment of this application is shown; Figure 9 As shown Figure 1 The diagram shown is a manufacturing process flow chart of a packaging structure according to an embodiment of this application.

[0022] Labels and component names: 1-substrate, 2-solder assembly, 3-groove, 11-first metal layer, 12-ceramic layer, 13-second metal layer, 21-second part, 22-first part, 901-substrate, 902-solder, 903-limiting fixture. Detailed Implementation

[0023] The specific embodiments of this application are described below with reference to the accompanying drawings and examples. Through the content described in this specification, those skilled in the art can clearly and completely understand the technical solution, the technical problem solved, and the resulting technical effects of this application. It is understood that the specific embodiments described herein are only for explaining this application and not for limiting it. Furthermore, for ease of description, only the parts related to this application are shown in the accompanying drawings.

[0024] It should be readily understood that the meanings of “on,” “above,” and “on top of” in this application should be interpreted in the broadest sense, such that “on” means not only “directly on something,” but also “on something” including intermediate components or layers existing between the two.

[0025] Furthermore, for ease of description, spatial relative terms such as “below,” “under,” “lower,” “above,” and “upper” may be used herein to describe the relationship of one element or component to another element or component shown in the accompanying drawings. In addition to the orientations described in the figures, spatial relative terms are also intended to cover different orientations of the device during use or operation. The device may be oriented in other ways (rotated 90° or otherwise), and the spatial relative descriptive terms used herein may be interpreted accordingly.

[0026] It should be noted that the structures, proportions, sizes, etc., depicted in the accompanying drawings are only for illustrative purposes to aid those skilled in the art and to facilitate understanding and reading of the contents described in the specification. They are not intended to limit the scope of this application and therefore have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to the size, without affecting the effects and objectives of this application, should still fall within the scope of the technical content disclosed in this application. Furthermore, terms such as "above," "first," "second," and "a" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.

[0027] As used herein, the term "layer" refers to a portion of material comprising a region of a certain thickness. A layer may extend over the entirety of an underlying or upper layer structure, or may have a extent smaller than that of the underlying or upper layer structure. Furthermore, a layer may be a region of a homogeneous or heterogeneous continuous structure with a thickness less than that of the continuous structure. For example, a layer may be located between the top and bottom surfaces of a continuous structure, or between any pair of horizontal planes therebetween. A layer may extend horizontally, vertically, and / or along a tapered surface. A layer may be a single layer, which may include one or more layers, and / or may have one or more layers on, above, and / or below it. A single layer may include multiple layers. For example, a semiconductor layer may include one or more doped or undoped semiconductor layers, and may have the same or different materials.

[0028] Furthermore, where there is no conflict, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0029] Figure 3 A schematic diagram of a packaging structure according to an embodiment of this application is shown. Figure 4 It shows the use of, as Figure 3 The diagram shown is a top view of a packaging structure according to an embodiment of this application. Figure 5 A schematic diagram of a solder assembly according to a first embodiment of this application is shown. Figure 3 , Figure 4 and Figure 5 As shown, the packaging structure includes: a substrate 1, the substrate 1 including a snap-fit ​​structure located on the upper surface of the substrate 1; and a solder assembly 2, the solder and the snap-fit ​​structure cooperating to fix the solder assembly 2 on the substrate 1 in a removable manner, the solder assembly 2 being in contact with the upper surface of the substrate 1.

[0030] In some alternative embodiments, the packaging structure provided according to one embodiment of this application above includes a groove 3 as the engaging structure.

[0031] In some alternative embodiments, the packaging structure provided according to one embodiment of the present application above, wherein the substrate 1 is a ceramic copper-clad substrate; preferably, the substrate 1 is an active metal brazing (AMB) substrate.

[0032] In some optional embodiments, according to the packaging structure provided by one embodiment of the present application, the solder assembly 2 includes a first part 22 and a second part 21. The solder assembly 2 is fixedly disposed on the substrate 1 through a groove 3. The first part 22 is connected to the second part 21. The first part 22 is located above the second part 21. The second part 21 is disposed in the groove 3. In the side view direction, the width of the first part 22 is greater than the width of the second part 21. The bottom surface of the first part 22 is in contact with the upper surface of the substrate 1.

[0033] In some alternative embodiments, the packaging structure provided according to one embodiment of the present application is wherein the solder assembly 2 is T-shaped in the side view direction.

[0034] In some optional embodiments, according to the packaging structure provided by one embodiment of the present application, the substrate 1 includes a first metal layer 11, a ceramic layer 12 and a second metal layer 13, the first metal layer 11, the ceramic layer 12 and the second metal layer 13 are arranged sequentially from top to bottom, and a groove 3 is disposed on the upper surface of the first metal layer 11, the depth of the groove 3 being less than the thickness of the first metal layer 11.

[0035] In some alternative embodiments, the packaging structure provided according to one embodiment of this application, wherein the material of the ceramic layer 12 includes, but is not limited to, AlN, Si3N4, and Al2O3.

[0036] In some alternative embodiments, the packaging structure provided according to one embodiment of this application above, wherein the first metal layer 11 and the second metal layer 13 are made of copper.

[0037] In some alternative embodiments, according to the packaging structure provided by one embodiment of the present application, a plurality of grooves 3 are provided on the substrate 1, and a solder assembly 2 is fixedly disposed on the substrate 1 through one groove 3.

[0038] In some alternative embodiments, according to the packaging structure provided by one embodiment of the present application, the upper surface of the substrate 1 is provided with a plurality of grooves 3, and a plurality of solder components 2 are fixedly disposed on the substrate 1 through the grooves 3.

[0039] In some alternative embodiments, the packaging structure provided according to one embodiment of the present application has a rectangular groove 3 in the side view direction.

[0040] In some alternative embodiments, the packaging structure provided according to one embodiment of the present application, wherein, in the side view direction, the thickness of the first metal layer 11 is greater than or equal to 0.3 mm and less than or equal to 1 mm.

[0041] In some alternative embodiments, the packaging structure provided according to one embodiment of the present application, wherein in a side view, the first portion 22 is rectangular and the edge of the lower surface of the first portion 22 contacts the upper surface of the substrate 1.

[0042] Figure 6 A schematic diagram of the packaging structure according to a second embodiment of this application is shown. Figure 6 As shown, in the side view, the groove 3 is a rectangle, a trapezoid that is wider at the top and narrower at the bottom, or a combination of a rectangle and a trapezoid that is wider at the top and narrower at the bottom.

[0043] Figure 7 A schematic diagram of a solder assembly according to a second embodiment of this application is shown. Figure 7 As shown, the solder assembly 2 includes a plurality of second parts 21, a first part 22 connected to the plurality of second parts 21, the first part 22 being located above the plurality of second parts 21, and each second part 21 being disposed in a groove 3.

[0044] In some alternative embodiments, the packaging structure provided according to one embodiment of the present application cooperates with the solder assembly 2 having a plurality of first portions 22, and the solder assembly 2 is fixedly disposed on the substrate 1 by a plurality of grooves 3.

[0045] Figure 8 A schematic diagram of a solder assembly according to a third embodiment of this application is shown. Figure 8 As shown, in the side view, the second part 21 is rectangular or trapezoidal with a wider top and a narrower bottom.

[0046] Figure 9 As shown Figure 1 The diagram shown is a manufacturing process flow chart of a packaging structure according to an embodiment of this application. Figure 9 As shown, the manufacturing process of the packaging structure includes multiple steps: Step 1001: Provide a substrate, drill holes in the substrate to form a groove; prepare a solder assembly according to the shape and size of the groove; wherein, the solder assembly includes a first part and a second part, the first part is located above the second part, and the shape and size of the second part matches the shape and size of the groove; Step 1002: Fix the solder assembly onto the substrate; wherein the second part is embedded in the groove; Step 1003: Perform reflow soldering; and Step 1004: Test the product strength.

[0047] The advantages of the packaging structure according to the embodiments of this application are: no need to rely on external fixtures, simplifying the production process: the solder is stably fixed by the cooperation of the T-shaped pre-made solder (or other self-locking structure of suitable shape) and the substrate locking structure, completely eliminating the dependence on traditional limiting fixtures. This design eliminates the alignment, placement, and removal processes of fixtures, avoiding process time extensions caused by adding related stations and significantly reducing production complexity. It is particularly suitable for small-scale or batch production scenarios, effectively eliminating process bottlenecks caused by traditional fixtures. It also reduces production and management costs: by simplifying the design and production process, there is no need to manufacture or maintain additional fixtures or configure fixture-related auxiliary equipment, significantly reducing the overall cost of production equipment and fixtures, while also reducing the manpower and time investment required for fixture management. Furthermore, it enhances the connection strength between the solder and the substrate: the solder's structural design increases the contact area between the solder and the substrate, forming a more robust solder joint during the reflow process, significantly improving the connection strength between the solder and the substrate, helping to optimize soldering quality and reduce product defect rates due to connection failures. It also enhances bonding strength, shear resistance, and pull-out resistance; and can simultaneously resist vertical and lateral vibrations, preventing fractures from concentrating on the same contact surface, thus improving resistance to vibration and impact.

[0048] Although this application has been described and illustrated with reference to specific embodiments thereof, such descriptions and illustrations are not intended to limit the application. It will be readily understood by those skilled in the art that various changes can be made and equivalent elements can be substituted within embodiments without departing from the scope of protection of this application as defined by the claims. Differences may exist between the technical representation in this application and actual equipment due to variables in the manufacturing process, etc. Other embodiments of this application may exist that are not specifically described. The specification and illustrations should be considered illustrative rather than restrictive, and modifications can be made to suit the purpose and spirit of this application, all of which are within the scope of the claims. While the methods disclosed herein have been described with reference to specific operations performed in a particular order, it should be understood that these operations can be rearranged, subdivided, or arranged to form equivalent methods without departing from the teachings of this application. Therefore, unless specifically indicated herein, the order and grouping of operations do not limit the application.

Claims

1. A packaging structure, characterized in that, include: A substrate, the substrate including a snap-fit ​​structure located on the upper surface of the substrate; A solder assembly, wherein the solder assembly is fixedly mounted on a substrate by cooperating with the snap-fit ​​structure, and the solder assembly is in contact with the upper surface of the substrate; The engaging structure is a groove; The solder assembly includes a first part and a second part. The solder assembly is disposed on the substrate through the groove. The first part is connected to the second part. The first part is located above the second part. The second part is disposed in the groove. In a side view, the width of the first part is greater than the width of the second part. The bottom surface of the first part is in contact with the upper surface of the substrate.

2. The packaging structure according to claim 1, characterized in that, The substrate includes a first metal layer, a ceramic layer, and a second metal layer, which are arranged sequentially from top to bottom. The groove is disposed on the upper surface of the first metal layer, and the depth of the groove is less than the thickness of the first metal layer.

3. The packaging structure according to claim 1, characterized in that, In a side view, the groove is rectangular, trapezoidal with a wider top and narrower bottom, or a combination of a rectangle and a trapezoidal shape with a wider top and narrower bottom.

4. The packaging structure according to claim 1, characterized in that, The upper surface of the substrate is provided with a plurality of grooves, and a plurality of solder components are disposed on the substrate through the grooves.

5. The packaging structure according to claim 4, characterized in that, One of the solder components is disposed on the substrate via one of the grooves.

6. The packaging structure according to claim 2, characterized in that, In a side view, the thickness of the first metal layer is greater than or equal to 0.3 mm and less than or equal to 1 mm.

7. The packaging structure according to claim 1, characterized in that, In a side view, the first portion is rectangular, and the edge of the lower surface of the first portion contacts the upper surface of the substrate.

8. The packaging structure according to claim 1, characterized in that, In a side view, the second part is rectangular or trapezoidal, wider at the top and narrower at the bottom.

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