Chip wire bonding carrier heating transport device

Abstract

The chip lead bonding carrier heating transmission device disclosed in the application is used for placing a plurality of processed chip tubes on a carrier; the transmission assembly comprises a feeding transmission belt, a processing transmission belt and a discharging transmission belt arranged in sequence; the inner side of the processing transmission belt is provided with a first heating assembly, the first heating assembly is located below the carrier, a first lifting assembly is arranged below the first heating assembly, the first heating assembly and the first lifting assembly are fixedly connected, and the first lifting assembly can be extended or retracted in the vertical direction to lift or lower the first heating assembly. The plurality of chip tubes are placed on the carrier, batch heating and batch processing can be carried out, and during the processing, the operator can place another batch of chip tubes to be processed on another carrier, so that after the processing of the previous batch of chip tubes is completed, the next batch can immediately start heating and processing, ensuring the continuity of processing, improving the work efficiency and improving the automation level.

Description

Technical Field

[0001] This utility model relates to the field of chip tooling technology, specifically to a carrier heating and transmission device for chip wire bonding. Background Technology

[0002] Wire bonding uses metal wires, such as gold, aluminum, or copper wires, as a bridge to achieve metal-to-metal connection between chip pads and substrate pads through hot pressing, ultrasonic waves, or thermo-ultrasonic energy, thus completing the transmission of electrical signals.

[0003] Existing wire bonding processes using hot pressing all employ a heating table built into a manual bonding machine to fix and heat the chip casing. Only one chip casing can be heated and processed at a time, and manual loading and unloading of each chip casing is required. This process is complex, inefficient, and lacks automation. Utility Model Content

[0004] The purpose of this invention is to provide a carrier heating and transmission device for chip wire bonding, which effectively solves the problems of complex operation, low work efficiency and low level of automation in the wire bonding process.

[0005] To address the aforementioned issues, this utility model discloses a carrier heating and transfer device for chip wire bonding, comprising a frame, a transfer assembly, a first heating assembly, a first lifting assembly, and a carrier; the transfer assembly is disposed on the frame, and the carrier is placed on the transfer assembly, the carrier being used to hold multiple chip shells to be processed; the transfer assembly consists of two sets of oppositely arranged conveyor belt structures. The conveying assembly includes a feeding conveyor belt, a processing conveyor belt, and an output conveyor belt arranged in sequence. The first heating component is located on the inner side of the processing conveyor belt and below the carrier. The first lifting component is located below the first heating component and is fixedly connected to it. The first lifting component can extend and retract vertically to raise or lower the first heating component. When the first lifting component raises the first heating component, the carrier on the processing conveyor belt is lifted by the first heating component. The feeding conveyor belt, the processing conveyor belt, and the output conveyor belt are each driven by a drive motor.

[0006] Optionally, the delivery conveyor belt includes a conveyor belt and a preheating conveyor belt arranged in sequence; The preheating conveyor belt is provided with a second heating component on its inner side; the second heating component is located below the carrier, and a second lifting component is provided below the second heating component. The second heating component and the second lifting component are fixedly connected. The second lifting component can extend and retract in the vertical direction to raise or lower the second heating component; when the second lifting component raises the second heating component, the carrier on the preheating conveyor belt is lifted by the second heating component. The conveyor belt and the preheating conveyor belt rotate synchronously, and the conveyor belt and the preheating conveyor belt are connected by a first connecting belt.

[0007] Optionally, the outgoing conveyor belt includes a buffer conveyor belt and a connecting conveyor belt; All the conveying components rotate in one direction, and are arranged sequentially along the rotation direction of the conveying components as the conveying conveyor belt, the preheating conveyor belt, the processing conveyor belt, the buffer conveyor belt, and the connecting conveyor belt; The buffer conveyor belt and the connecting conveyor belt rotate synchronously, and the buffer conveyor belt and the connecting conveyor belt are connected by a second connecting belt.

[0008] Optionally, cylinder stoppers are also included; The cylinder stop is disposed between the processing conveyor belt and the output conveyor belt; The cylinder stop includes an intercepting cylinder and a baffle. The intercepting cylinder is fixed on the frame, the piston of the intercepting cylinder is vertically upward, and the baffle is disposed on the piston. When the piston retracts, the baffle is below the top of the processing conveyor belt; when the piston extends, the baffle is above the top of the processing conveyor belt.

[0009] Optionally, the first heating component and the second heating component have the same structure, both including a heating plate, a heating rod and a temperature sensor. The temperature sensor and the heating rod are both disposed in the heating plate. There are multiple heating rods, and the multiple heating rods are evenly disposed in the heating plate.

[0010] Optionally, the first lifting assembly and the second lifting assembly have the same structure, both including a lifting cylinder, a lifting plate and a heat insulation pad. The piston of the lifting cylinder is vertically upward, the lifting plate is disposed above the piston and fixedly disposed with the piston, the lifting plate is fixedly connected to the heating plate, and the heat insulation pad is disposed between the lifting plate and the heating plate.

[0011] Optionally, it also includes a control module and multiple position sensors. The multiple position sensors are electrically connected to the control module to drive the feeding conveyor belt, the processing conveyor belt and the output conveyor belt. The drive motors are electrically connected to the control module. The control module receives the signal data from the position sensors and controls the start and stop of the drive motors according to the signal data.

[0012] Optionally, multiple position sensors are respectively disposed below the conveyor belt, below the connecting conveyor belt, and on one side of the processing conveyor belt; the position sensor located on one side of the processing conveyor belt at least partially overlaps with the horizontal projection of the carrier.

[0013] Optionally, a stop plate is also included, which is disposed at the end of the output conveyor belt away from the processing conveyor belt. The stop plate is fixedly connected to the frame, and the height of the stop plate is higher than the height of the carrier.

[0014] Beneficial effects: This utility model provides a heating and transfer device for a chip wire bonding carrier, comprising a frame, a transfer assembly, a first heating assembly, a first lifting assembly, and a carrier. The transfer assembly is mounted on the frame, and the carrier is placed on the transfer assembly. The carrier is used to hold multiple chip shells to be processed. The transfer assembly consists of two sets of oppositely arranged conveyor belts. The transfer assembly includes a feeding conveyor belt, a processing conveyor belt, and an output conveyor belt arranged sequentially. The first heating assembly is located on the inner side of the processing conveyor belt and is positioned below the carrier. The first lifting assembly is located below the first heating assembly. The first heating assembly and the first lifting assembly are fixedly connected. The first lifting assembly can extend and retract in the vertical direction to raise or lower the first heating assembly. When the first lifting assembly raises the first heating assembly, the carrier on the processing conveyor belt is lifted by the first heating assembly. The feeding conveyor belt, the processing conveyor belt, and the output conveyor belt are each driven by a drive motor. This application enables batch heating and processing of multiple chip shells by placing them on a carrier. During the processing, the operator can place another batch of chip shells to be processed on a separate carrier, so that the next batch can start heating and processing as soon as the previous batch is completed. This ensures the continuity of processing, improves work efficiency, and enhances the level of automation. Attached Figure Description

[0015] The accompanying drawings, which form part of this utility model, are used to provide a further understanding of the utility model. The illustrative embodiments of the utility model and their descriptions are used to explain the utility model and do not constitute an undue limitation of the utility model. In the drawings: Figure 1 This is a schematic diagram of the overall structure of the chip wire bonding carrier heating and transmission device disclosed in this utility model. Figure 2 This is a schematic diagram of the internal structure of the chip wire bonding carrier heating and transmission device disclosed in this utility model. Figure 3 This is an exploded structural diagram of the chip wire bonding carrier heating and transmission device disclosed in this utility model. Figure 4 This is a schematic diagram of the structure of the first heating component or the second heating component disclosed in this utility model.

[0016] Explanation of reference numerals in the attached figures: 1. Frame; 2. First heating assembly; 21. Heating plate; 22. Heating rod; 23. Temperature sensor; 31. Lifting cylinder; 32. Lifting plate; 33. Heat insulation pad; 4. Carrier; 5. Feeding conveyor belt; 51. Conveying conveyor belt; 52. Preheating conveyor belt; 6. Processing conveyor belt; 7. Output conveyor belt; 71. Buffer conveyor belt; 72. Connecting conveyor belt; 8. Drive motor; 9. Second heating assembly; 10. Stop plate; 11. First connecting belt; 12. Second connecting belt; 13. Interception cylinder; 14. Baffle; 15. Position sensor. Detailed Implementation

[0017] It should be understood that in the description of this utility model, the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used solely for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0018] It should be noted that, in the description of this utility model, unless otherwise explicitly specified and limited, the terms "set," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0019] The technical solution of this utility model will be further illustrated below through specific embodiments. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. The content of the embodiments does not constitute a limitation on this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0020] like Figures 1-4 As shown, this utility model discloses a heating and transfer device for chip wire bonding carrier 4. This device is used for batch transfer and heating of chip shells, so that the chip shells are heated and then wire bonded. That is, metal wires are used as bridges to achieve metal-to-metal connection between chip pads and substrate pads through hot pressing.

[0021] The chip wire bonding carrier 4 heating and transfer device includes a frame 1, a transfer assembly, a first heating assembly 2, a first lifting assembly, and a carrier 4. The transfer assembly is mounted on the frame 1, and the carrier 4 is placed on the transfer assembly. The carrier 4 is used to hold multiple chip shells to be processed. The transfer assembly consists of two sets of oppositely arranged conveyor belt structures. The transfer assembly is arranged in a straight line.

[0022] Specifically, the conveying assembly includes a feeding conveyor belt 5, a processing conveyor belt 6, and an output conveyor belt 7 arranged sequentially. The feeding conveyor belt 5, the processing conveyor belt 6, and the output conveyor belt 7 all rotate in one direction, causing the carrier 4 to pass through the feeding conveyor belt 5, the processing conveyor belt 6, and the output conveyor belt 7 in sequence.

[0023] A first heating component 2 is provided on the inner side of the processing conveyor belt 6. The first heating component 2 is located below the carrier 4. A first lifting component is provided below the first heating component 2. The first heating component 2 and the first lifting component are fixedly connected. The first lifting component can extend and retract in the vertical direction to raise or lower the first heating component 2. When the first lifting component raises the first heating component 2, the carrier 4 on the processing conveyor belt 6 is lifted by the first heating component 2. The feeding conveyor belt 5, the processing conveyor belt 6, and the output conveyor belt 7 are each driven by a drive motor 8. Specifically, the drive motor 8 is fixed to one side of the frame 1.

[0024] In actual operation, multiple chip shells to be processed are first placed on carrier 4, which is then placed on conveyor belt 5. Conveyor belt 5 transports carrier 4 to processing conveyor belt 6. The first lifting component lifts the first heating component 2, which in turn heats carrier 4 while lifting it. The chip shells on carrier 4 are also heated. The heated chip shells are then wire-bonded using thermoforming. After processing, the first lifting component lowers, causing carrier 4 to fall onto processing conveyor belt 6. Processing conveyor belt 6 transports carrier 4 to output conveyor belt 7. The operator unloads carrier 4 from output conveyor belt 7, thus completing one processing operation.

[0025] In this application, the carrier 4 is made of a material that conducts heat easily, such as aluminum, iron, stainless steel, etc.

[0026] Specifically, the conveyor belt 5 includes a conveyor belt 51 and a preheating conveyor belt 52 arranged sequentially. The conveyor belt 51 and the preheating conveyor belt 52 rotate synchronously and are connected by a first connecting belt 11. The drive motor 8 can be located on one side of the conveyor belt 51, driving the preheating conveyor belt 52 to rotate; alternatively, the drive motor 8 can be located on one side of the preheating conveyor belt 52, driving the conveyor belt 51 to rotate.

[0027] To ensure that the conveyor belt 51 and the preheating conveyor belt 52 rotate synchronously, rotating shafts are respectively installed on the conveyor belt 51 and the preheating conveyor belt 52, and drive wheels are respectively installed on the two rotating shafts. The first connecting belt 11 is connected to the two drive wheels, thereby ensuring that the conveyor belt 51 and the preheating conveyor belt 52 can rotate synchronously.

[0028] A second heating component 9 is provided on the inner side of the preheating conveyor belt 52. The second heating component 9 is located below the carrier 4, and a second lifting component is provided below the second heating component 9. The second heating component 9 and the second lifting component are fixedly connected. The second lifting component can extend and retract in the vertical direction to raise or lower the second heating component 9. When the second lifting component raises the second heating component 9, the carrier 4 on the preheating conveyor belt 52 is lifted by the second heating component 9.

[0029] The purpose of the second heating component 9 in this application is to preheat the chip casings on the carrier 4. When the carrier 4 on the processing conveyor belt 6 is being heated and processed, subsequent carriers 4 carrying chip casings to be processed are conveyed to the preheating conveyor belt 52, where the second heating component 9 preheats the carrier 4. The heating method is the same as that of the first heating component 2. That is, the second lifting component lifts the second heating component 9, and the second heating component 9 lifts the carrier 4 for preheating. After the chip casings on the processing conveyor belt 6 are processed and conveyed to the output conveyor belt 7, the second lifting component lowers, lowering the carrier 4 to the preheating conveyor belt 52, and then conveying it to the processing conveyor belt 6 for heating and processing.

[0030] Furthermore, the output conveyor belt 7 includes a buffer conveyor belt 71 and a connecting conveyor belt 72. In this application, all conveying components rotate in one direction, and are arranged sequentially along the rotation direction of the conveying components as a conveyor belt 51, a preheating conveyor belt 52, a processing conveyor belt 6, a buffer conveyor belt 71, and a connecting conveyor belt 72.

[0031] The drive motor 8 located on the output conveyor belt 7 can be set on one side of the buffer conveyor belt 71, and the buffer conveyor belt 71 drives the connecting conveyor belt 72 to rotate; of course, the drive motor 8 can also be set on one side of the connecting conveyor belt 72, and the connecting conveyor belt 72 drives the buffer conveyor belt 71 to rotate.

[0032] The buffer conveyor belt 71 and the connecting conveyor belt 72 rotate synchronously, and are connected by a second connecting belt 12. To ensure synchronous rotation, rotating shafts are installed on both belts, and drive wheels are mounted on each shaft. The second connecting belt 12 is connected to the two drive wheels, thus ensuring synchronous rotation of the buffer conveyor belt 71 and the connecting conveyor belt 72. When a carrier 4 on the connecting conveyor belt 72 is not unloaded by the operator in time, the subsequent carrier 4 is transferred to the buffer conveyor belt 71, and the output conveyor belt 7 stops rotating to prevent the carriers 4 from being squeezed or stacked.

[0033] Specifically, such as Figure 4 As shown, the first heating assembly 2 and the second heating assembly 9 have the same structure, both including a heating plate 21, a heating rod 22, and a temperature sensor 23. The temperature sensor 23 and the heating rod 22 are both disposed within the heating plate 21, which is made of a thermally conductive metal or non-metal material. Multiple heating rods 22 are provided, evenly distributed within the heating plate 21. The temperature sensor 23 detects the temperature of the heating plate 21 in real time to control the heating temperature of the chip casing within a specified range. In this application, the heating range of the first heating assembly 2 and the second heating assembly 9 is 100°C-400°C. The specific heating temperature can be controlled according to actual needs.

[0034] Furthermore, the first lifting component and the second lifting component have the same structure, such as... Figure 2 and Figure 3 As shown, each component includes a lifting cylinder 31, a lifting plate 32, and a heat insulation pad 33. The piston of the lifting cylinder 31 is vertically upward, and the lifting plate 32 is positioned above and fixedly attached to the piston. The lifting plate 32 is fixedly connected to the heating plate 21. The heat insulation pad 33 is positioned between the lifting plate 32 and the heating plate 21 to prevent heat transfer from the heating plate 21 to the lifting plate 32. The lifting cylinder 31 includes multiple cylinder bodies, each containing a piston. The extended ends of the multiple pistons are fixedly connected by a connecting plate. The lifting plate 32 is fixedly attached to the connecting plate.

[0035] Preferably, this application also includes a cylinder stop, which is disposed between the processing conveyor belt 6 and the output conveyor belt 7. The cylinder stop includes an intercepting cylinder 13 and a baffle 14. The intercepting cylinder 13 is fixed to the frame 1, and the piston of the intercepting cylinder 13 is vertically upward. The baffle 14 is fixed to the piston. When the piston retracts, the baffle 14 is lower than the top of the processing conveyor belt 6; when the piston extends, the baffle 14 is higher than the top of the processing conveyor belt 6. When the carrier 4 is transferred to the processing conveyor belt 6, the piston drives the baffle 14 to rise, and the carrier 4 is intercepted and positioned by the baffle 14, stopping its further movement. The first lifting component lifts the carrier 4 to a specified height. At the same time, the piston retracts, the baffle 14 descends, and then the chip shell is heated and processed. After processing is completed, the first lifting component descends, placing the carrier 4 onto the processing conveyor belt 6. The processing conveyor belt 6 transfers the carrier 4 to the output conveyor belt 7, where it is unloaded by the operator.

[0036] This application also includes a control module and multiple position sensors 15. The multiple position sensors 15 are electrically connected to the control module to drive the feeding conveyor belt 5, the processing conveyor belt 6 and the output conveyor belt 7. The drive motor 8 is electrically connected to the control module. The control module receives the signal data from the position sensors 15 and controls the start and stop of the drive motor 8 according to the signal data.

[0037] Specifically, multiple position sensors 15 are respectively installed below the conveyor belt 51, below the connecting conveyor belt 72, and on one side of the processing conveyor belt 6. Among them, two position sensors 15 are installed on one side of the processing conveyor belt 6, located at both ends of the processing conveyor belt 6. The two position sensors 15 located on one side of the processing conveyor belt 6 at least partially overlap with the horizontal projection of the carrier 4.

[0038] When the position sensor 15 located below the conveyor belt 51 detects that the carrier 4 has been placed on the conveyor belt 51, the control module controls the conveyor belt 51 to rotate, conveying the carrier 4 to the preheating conveyor belt 52, and controls the second heating component 9 and the second lifting component to preheat. When the position sensor 15 on one side of the processing conveyor belt 6 detects that the carrier 4 has been conveyed away, the control module controls the carrier 4 on the preheating conveyor belt 52 to stop preheating and convey it to the processing conveyor belt 6. When the position sensor 15 on one side of the processing conveyor belt 6 detects that a new carrier 4 has been conveyed, the control module controls the cylinder stop to lift, intercepting and positioning the carrier 4, while controlling the first heating component 2 and the first lifting component to heat. When the position sensor 15 located below the connecting conveyor belt 72 detects that the carrier 4 has not yet been unloaded, the control module controls the output conveyor belt 7 to stop rotating. When the carrier 4 is detected to have been unloaded, the control module controls the output conveyor belt 7 to continue rotating.

[0039] Preferably, this application also includes a stop plate 10, which is located at the end of the output conveyor belt 7 away from the processing conveyor belt 6. Two stop plates 10 are provided, each located at one end of the output conveyor belt 7. The stop plates 10 are fixedly connected to the frame 1, and the height of the stop plates 10 is higher than the height of the carrier 4. When the carrier 4 is conveyed to the stop plate 10, the stop plate 10 intercepts the carrier 4 to prevent it from continuing to be conveyed forward and detaching from the device.

[0040] The applicant declares that the above are only specific embodiments of this utility model, but the protection scope of this utility model is not limited thereto. Those skilled in the art should understand that any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model fall within the protection and disclosure scope of this utility model.

Claims

1. A carrier heating and transfer device for chip wire bonding, characterized in that, It includes a frame (1), a conveying assembly, a first heating assembly (2), a first lifting assembly, and a carrier (4); the conveying assembly is disposed on the frame (1), the carrier (4) is placed on the conveying assembly, and the carrier (4) is used to place multiple chip shells to be processed; the conveying assembly is a structure of two sets of conveyor belts arranged opposite to each other; The conveying assembly includes a feeding conveyor belt (5), a processing conveyor belt (6), and an output conveyor belt (7) arranged in sequence. The first heating component (2) is provided on the inner side of the processing conveyor belt (6). The first heating component (2) is located below the carrier (4). The first lifting component is provided below the first heating component (2). The first heating component (2) and the first lifting component are fixedly connected. The first lifting component can extend and retract in the vertical direction to lift or lower the first heating component (2). When the first lifting component lifts the first heating component (2), the carrier (4) on the processing conveyor belt (6) is lifted by the first heating component (2). The feeding conveyor belt (5), the processing conveyor belt (6) and the output conveyor belt (7) are respectively provided with drive motors (8) for driving.

2. The carrier heating and transfer device for chip wire bonding according to claim 1, characterized in that, The delivery conveyor belt (5) includes a conveyor belt (51) and a preheating conveyor belt (52) arranged in sequence. The preheating conveyor belt (52) is provided with a second heating component (9) on its inner side; the second heating component (9) is located below the carrier (4), and a second lifting component is provided below the second heating component (9). The second heating component (9) and the second lifting component are fixedly connected. The second lifting component can extend and retract in the vertical direction to lift or lower the second heating component (9); when the second lifting component lifts the second heating component (9), the carrier (4) on the preheating conveyor belt (52) is lifted by the second heating component (9). The conveyor belt (51) and the preheating conveyor belt (52) rotate synchronously, and the conveyor belt (51) and the preheating conveyor belt (52) are connected by a first connecting belt (11).

3. The carrier heating and transfer device for chip wire bonding according to claim 2, characterized in that, The outgoing conveyor belt (7) includes a buffer conveyor belt (71) and a connecting conveyor belt (72). The conveying components all rotate in one direction, and are arranged sequentially along the rotation direction of the conveying components as the conveying conveyor belt (51), the preheating conveyor belt (52), the processing conveyor belt (6), the buffer conveyor belt (71) and the connecting conveyor belt (72). The buffer conveyor belt (71) and the connecting conveyor belt (72) rotate synchronously, and the buffer conveyor belt (71) and the connecting conveyor belt (72) are connected by a second connecting belt (12).

4. The carrier heating and transfer device for chip wire bonding according to claim 3, characterized in that, This also includes cylinder stoppers; The cylinder stop is disposed between the processing conveyor belt (6) and the output conveyor belt (7); The cylinder stop includes an intercepting cylinder (13) and a baffle (14). The intercepting cylinder (13) is fixed on the frame (1). The piston of the intercepting cylinder (13) is vertically upward, and the baffle (14) is disposed on the piston. When the piston retracts, the baffle (14) is lower than the top of the processing conveyor belt (6), and when the piston extends, the baffle (14) is higher than the top of the processing conveyor belt (6).

5. The carrier heating and transfer device for chip wire bonding according to claim 4, characterized in that, The first heating component (2) and the second heating component (9) have the same structure, both including a heating plate (21), a heating rod (22) and a temperature sensor (23). The temperature sensor (23) and the heating rod (22) are both disposed in the heating plate (21). There are multiple heating rods (22), and the multiple heating rods (22) are evenly disposed in the heating plate (21).

6. The carrier heating and transfer device for chip wire bonding according to claim 5, characterized in that, The first lifting assembly and the second lifting assembly have the same structure, both including a lifting cylinder (31), a lifting plate (32) and a heat insulation pad (33). The piston of the lifting cylinder (31) is set vertically upward. The lifting plate (32) is set above the piston and fixedly set with the piston. The lifting plate (32) is fixedly connected to the heating plate (21). The heat insulation pad (33) is set between the lifting plate (32) and the heating plate (21).

7. A carrier heating and transfer device for chip wire bonding according to claim 6, characterized in that, It also includes a control module and multiple position sensors (15). The multiple position sensors (15) are electrically connected to the control module to drive the feeding conveyor belt (5), the processing conveyor belt (6) and the output conveyor belt (7). The drive motor (8) is electrically connected to the control module. The control module receives the signal data from the position sensors (15) and controls the start and stop of the drive motor (8) according to the signal data.

8. The carrier heating and transfer device for chip wire bonding according to claim 7, characterized in that, Multiple position sensors (15) are respectively disposed below the conveyor belt (51), below the connecting conveyor belt (72), and on one side of the processing conveyor belt (6); the position sensor (15) located on one side of the processing conveyor belt (6) at least partially overlaps with the projection of the carrier (4) in the horizontal direction.

9. A carrier heating and transfer device for chip wire bonding according to claim 8, characterized in that, It also includes a stop plate (10), which is located at one end of the output conveyor belt (7) away from the processing conveyor belt (6). The stop plate (10) is fixedly connected to the frame (1), and the height of the stop plate (10) is higher than the height of the carrier (4).

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