Memory module heat sink shell
CN309233095SActive Publication Date: 2025-04-11黄榕樟
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- CN202430590175.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-14
- Publication Date
- 2025-04-11
- Estimated Expiration
- 2039-09-14
Smart Images
Figure 000007_ABST
Abstract
1. The name of this design product: memory module heat sink shell. 2. The purpose of this design product: used as the outer shell of the memory module heat sink. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the key points of the design: 3D drawing of Design 1. 5. Designate Design 1 as the base design.
Need to check novelty before this filing date? Find Prior Art