Thermocouple module
CN309362364SActive Publication Date: 2025-07-01STARPOWER SEMICON LTD
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Patent Information
- Application Number
- CN202430669972.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-23
- Publication Date
- 2025-07-01
- Estimated Expiration
- 2039-10-23
Smart Images
Figure 000006_ABST
Abstract
1. Name of the design product: Thermocouple module. 2. Use of the design product: A thermocouple module mainly used for measuring the temperature of electronic components. 3. Design key points of the design product: Lies in the shape. 4. Picture or photo that best shows the design key points: Perspective view. 5. As it is an uncommon view, the rear view is omitted.
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