Packaging Structure of Power Semiconductor Module

Abstract

1. Name of the product of this design: Encapsulation structure of a power semiconductor module. 2. Use of the product of this design: This product of the design is an encapsulation structure of a power semiconductor module for connecting large currents inside and outside. 3. Design key points of the product of this design: Lies in the shape. 4. Picture or photo that best shows the design key points: Perspective view.

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